JPH05259332A - Cooling structure of integrated circuit - Google Patents

Abstract

PURPOSE:To simplify the shape of a cold plate, and to cool each integrated circuit efficiently regardless of the calorific values of each integrated circuit. CONSTITUTION:Structure, in which the bores of blow-off nozzles are gradually made small to the degree corresponding to integrated circuits by cooling structure, in which a cold plate 6 with the integrated circuits 2 mounted to a substrate 1 a substrate frame 3 holding the substrate and spot facing holes 5 corresponding to the size of a plurality of the integrated circuits, a plurality of the blow-off nozzles 12 straightly directed toward the floor faces of the spot facing holes and exhaust nozzles 13 selecting and discharging a refrigerant from said spot facing holes to a discharging introducing chamber 11 are set up and the refrigerant is forwarded from an intake 8 to an extraction port 9, is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an integrated circuit, and more particularly to a cooling structure for an LSI package which can efficiently remove heat generated from a semiconductor chip to the outside of the device.

[0002]

2. Description of the Related Art Conventionally, in a cooling structure for an integrated circuit, a cold plate is opposed to the integrated circuit, and a counterbore hole is provided at a position corresponding to the integrated circuit on the bottom surface of the cold plate. I was directing one.
The conventional cooling structure shown in this (JP-A-2-5451) will be described.

FIG. 3 is a cross-sectional view of a conventional integrated circuit cooling structure. When the refrigerant 24 flows from the inlet 26 of the cooling container 28, the suction chamber 30 is filled with the refrigerant 24 and the first nozzle 25 at the left end of the cold plate 23. It collides with the bottom surface of the counterbore hole 22. The colliding refrigerant 24 flows through the second nozzle 29, sequentially flows to the first nozzle 25 on the right side, and finally is discharged to the outside from the counterbore hole at the right end of the cooling container 28 to the outlet 27.

The directly connected portion of the nozzles 25 and 29 is the suction chamber 30.
Since it is located inside, it is constantly immersed in the refrigerant 24.
Therefore, the nozzle 29 is heated after being heated by the integrated circuit.
The refrigerant 24 flowing into the nozzle is cooled by the refrigerant 24 in the suction chamber 30 in the nozzle by the jet flow in the next counterbore 22, and the refrigerant 24 at a substantially constant temperature is constantly circulated to pass through the cold plate 23. Integrated circuit 2 on substrate 20
1 was cooled evenly.

[0005]

In the above-mentioned conventional cooling structure, the counterbore hole of the bottom surface of the cold plate facing the integrated circuit and the jet nozzle directly facing this have a 1: 1 correspondence. However, there is a disadvantage that the counterbore is required for the number of integrated circuits and the shape of the cold plate becomes complicated. Further, there is a drawback that it cannot be handled unless the heat generation amount of each integrated circuit is substantially uniform.

In view of the above problems, it is an object of the present invention to provide a cooling structure for an integrated circuit which simplifies the shape of the cold plate and can cope with the heat generation amount of each integrated circuit.

[0007]

A cooling structure for an integrated circuit according to the present invention comprises: an integrated circuit mounted on a substrate; a substrate frame for holding the substrate;
A cold plate having countersunk holes on the opposite side of the integrated circuit for the size of a plurality of integrated circuits, a suction chamber into which the refrigerant flows from a refrigerant inlet provided at a position corresponding to the countersunk holes, and a refrigerant collector. A cooling container that has a discharge chamber connected to the outlet and that closely adheres to the cold plate to seal the countersink hole, and a bottom of the suction chamber that faces the bottom surface of the countersink hole, and the diameter gradually decreases as it corresponds to the integrated circuit. It is equipped with a plurality of ejection nozzles having the shape described above and a discharge nozzle for discharging the refrigerant into the discharge chamber through the counterbore.

Further, the jet nozzle has a shape in which the distance between the tip of the jet outlet and the bottom face of the counterbore gradually becomes shorter.

[0009]

According to the above structure, the refrigerant flowing from the intake port is discharged from the suction chamber toward the bottom surface of the counterbore hole which is provided in the cold plate and covers the plurality of integrated circuits. And the integrated circuit is cooled and then discharged from the discharge nozzle.

This jet nozzle is installed so that the bore diameter becomes narrower for each counterbore corresponding to the integrated circuit, or that the distance between the tip of the nozzle and the bottom surface of the counterbore becomes closer for each counterbore with the same bore diameter. Therefore, the number of counterbore holes of the cold plate can be reduced, the structure can be simplified, and it is possible to efficiently cope with the cooling of various integrated circuits having different heat generation amounts.

[0011]

The present invention will be described below with reference to the drawings.

FIG. 1 is a vertical sectional view of an embodiment of the present invention.

Referring to FIG. 1, 1 is a substrate and 2 is a substrate 1.
Is an integrated circuit mounted on. The outer peripheral edge of the substrate 1 is firmly fixed to the substrate frame 3. Also, the cold plate 6 has an outer peripheral edge portion attached to the substrate frame 3, and the cold plate 6 is opposed to the upper surface of the integrated circuit 2 with a minute gap,
In addition, on the opposite side of the integrated circuit 2, there are provided a plurality of counterbored holes 5 each having a size such that the bottom surface encloses the positions corresponding to the plurality of integrated circuits. A compound 4 having excellent thermal conductivity is applied between the integrated circuit 2 and the cold plate 6.

The cold plate 6 is provided with an inlet 8 and an outlet 9 for the refrigerant 7, a refrigerant suction chamber 10 is provided at a position corresponding to the counterbore 5, and the refrigerant is discharged in the vicinity of the refrigerant outlet 9. A cooling container 14 provided with a chamber 11 is attached. At the bottom of the suction chamber 10, there are a jet nozzle 12 and a discharge nozzle 13 which serve as a flow path for the refrigerant so as to face the bottom surface of the counterbore 5.

The jet nozzle 12 is located in parallel with the flow of the refrigerant.

Next, the operation will be described. Now, when the refrigerant 7 is introduced from the inlet 8 of the cooling container 14, the refrigerant is filled in the suction chamber 10 corresponding to each integrated circuit 2, and the jet nozzle 12 at the bottom of the suction chamber causes the inside of the counterbore hole 5 of the cold plate 6. And is collided with the bottom surface of the counterbore 5. The colliding refrigerant 7 passes through the discharge nozzle 13, is collected in the discharge chamber 11, and is discharged to the outside through the outlet 9. The arrow in the figure indicates the flow of the refrigerant. The jet nozzle 12 has diameters d ₁ and d
_Since the flow rate of the refrigerant 7 ejected from the ejection nozzles changes because the diameters become gradually smaller as ₂ , ₂ , d ₃ , and d ₄ , the cooling effect for each integrated circuit does not change even if the heat generation amount of the integrated circuit 2 is different. This is suitable for a line in which the integrated circuit on the left has a large amount of heat generation and the integrated circuit on the right has a small amount of heat.

FIG. 2 is a vertical sectional view showing a second embodiment of the present invention. In FIG. 2, the distances between the tip of the jet nozzle of the jet nozzle 12 having the same diameter and the bottom surface of the counterbore 5 are h ₁ , h ₂ , and h.
_The operation is the same as that of the first embodiment shown in FIG. 1 except that the width is gradually reduced to ₃ and h ₄ . This is suitable for the case where the integrated circuit on the left side has a small amount of heat generation and the right side has a large amount of heat.

In the embodiment of the present invention, two integrated circuits 2 are provided.
1 for each of the counterbore 5 and cold plate 6
Although provided inside, a counterbore may be provided at a ratio of one to three or more integrated circuits.

[0019]

As described above, according to the present invention, the shape of the cold plate can be simplified by providing the cold plate with counterbore holes corresponding to a plurality of integrated circuits. In addition, by changing the nozzle diameter in sequence and changing the distance between the nozzle and the counterbore, it is not affected by the heat generation of the integrated circuit, and the thermal resistance between the integrated circuit and the refrigerant can be kept low and discharged efficiently outside the equipment. There is.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a cooling structure for an integrated circuit according to an exemplary embodiment of the present invention.

FIG. 2 is a vertical sectional view of a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a conventional cooling structure.

[Explanation of symbols]

1 substrate 2 integrated circuit 3 substrate frame 4 compound 5 counterbore 6 cold plate 7 refrigerant 8 inlet 9 outlet 10 inlet chamber 11 exhaust chamber 12 jet nozzle 13 exhaust nozzle 14 cooling container d ₁ d ₂ d ₃ d ₄ jet nozzle diameter h ₁ h ₂ h ₃ h ₄ Distance between jet nozzle and counterbore

Claims (2)

[Claims] 1. An integrated circuit mounted on a substrate, a substrate frame that holds the substrate, and a top surface of the integrated circuit that face each other with a minute gap therebetween, and a plurality of integrated circuits on the opposite side of the integrated circuit. A cold plate having a countersunk hole, a suction chamber into which a refrigerant flows from a refrigerant inlet provided at a position corresponding to the countersink hole, and a discharge chamber connected to a refrigerant outlet are provided in close contact with the cold plate. A cooling container for hermetically closing the counterbore, and a plurality of ejection nozzles at the bottom of the suction chamber that are directed toward the bottom surface of the counterbore and have a diameter that gradually decreases in correspondence with the integrated circuit. A cooling structure for an integrated circuit, comprising: a discharge nozzle that discharges a coolant from the counterbore to the discharge chamber. 2. The cooling structure for an integrated circuit according to claim 1, further comprising an ejection nozzle having a shape in which the distance between the tip of the ejection port and the bottom surface of the counterbore is gradually reduced.