JP2658301B2 - Integrated circuit cooling structure - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure of an integrated circuit, and more particularly, to a cooling structure of an LSI package capable of efficiently discharging heat generated from a semiconductor chip to the outside of a device.

[Conventional technology]

Conventionally, the cooling structure of an integrated circuit has a cold plate opposed to the integrated circuit, a counterbore is provided at a position on the bottom surface of the cold plate opposite to the integrated circuit, and a discharge nozzle and a discharge nozzle for the refrigerant are respectively directed directly to the counterbore. (June 1988
(See "Cooling Structure for Integrated Circuits" filed on April 22).

[Problems to be solved by the invention]

In the cooling structure of the conventional integrated circuit described above, the counterbore on the cold plate bottom facing the integrated circuit and the jet nozzle facing directly correspond to 1: 1, so the counterbore is integrated. There is a disadvantage that the number of circuits is required and the shape of the cold plate becomes complicated.

[Means for solving the problem]

An integrated circuit cooling structure according to the present invention includes an integrated circuit mounted on a substrate, a substrate frame holding the substrate, and a plurality of opposing opposing upper surfaces of the integrated circuit with a small distance therebetween and opposite to the integrated circuit. A cold plate having a counterbore for the size of the integrated circuit, and a suction port at a position corresponding to the counterbore provided with an inlet and an outlet for the refrigerant in close contact with the cold plate so as to close the counterbore. A discharge chamber for discharging the refrigerant is provided at the outlet of the refrigerant, and a plurality of ejection nozzles are provided at the bottom of the suction chamber at a bottom of a corresponding one of the counterbores, and the refrigerant is supplied from the counterbore through the suction chamber. And a cooling container for discharging a refrigerant from the inlet of the refrigerant to any of the suction chambers, provided with a discharge nozzle for discharging the refrigerant into the discharge chamber other than the one corresponding to the counterbore. That.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of one embodiment of the present invention. Referring to FIG. 1, reference numeral 1 denotes a substrate, and 2 denotes an integrated circuit mounted on the substrate 1. The outer peripheral green portion of the substrate 1 is firmly fixed to the substrate frame 3. A cold plate 6 is also provided with an outer peripheral green portion on the substrate frame 3. The cold plate 6 is opposed to the upper surface of the integrated circuit 2 with a small interval, and a plurality of cold plates are formed on the opposite side of the integrated circuit 2 to the bottom surface. It has a counterbore 5 for the size of the integrated circuit. A compound 4 having excellent thermal conductivity is applied between the integrated circuit 2 and the cold plate 6.

An outlet 9 for an inlet 8 for the refrigerant 7 is provided on the cold plate 6, a suction chamber 10 for the refrigerant is provided at a position corresponding to the counterbore 5, and a discharge chamber 11 is provided near the outlet 9 for the refrigerant. The provided cooling container 14 is attached. At the bottom of the suction chamber 10, a jet nozzle 12 and a discharge nozzle 13 serving as a refrigerant flow path are provided so as to be directed directly to the bottom surface of the counterbore 5.

When the refrigerant 7 flows in from the inlet 8 of the cooling container 14, since it is partitioned by the partition wall 15, it fills the suction chamber 10 and is jetted from the jet nozzle 12 into the counterbore 5 of the cold plate 6, 5 hits the bottom. The collided refrigerant 7 is
It flows to the next suction chamber 10 through the discharge nozzle 13. This is sequentially repeated, and the refrigerant 7 finally collects in the discharge chamber 11 and is discharged to the outside through the outlet 9. The arrows in the figure indicate the flow of the refrigerant.

〔The invention's effect〕

As described above, the present invention provides a counterbore corresponding to a plurality of integrated circuits in a cold plate, thereby simplifying the shape of the cold plate and providing heat generated from a semiconductor chip on the cold plate. This has the effect that the refrigerant is jet-collimated with the hole, the thermal resistance between the integrated circuit and the refrigerant is suppressed low, and the refrigerant can be efficiently discharged to the outside of the device.

[Brief description of the drawings]

FIG. 1 is a sectional view of one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... board | substrate 2, ... integrated circuit, 3 ... board frame, 4 ... compound, 5 ... counterbore hole, 6 ... cold plate, 7 ... refrigerant | coolant, 8 ... inlet, 9 ... outlet ,Ten……
Suction chamber, 11 ... discharge chamber, 12 ... ejection nozzle, 13 ... discharge nozzle, 14 ... cooling vessel, 15 ... partition.

Claims (1)

(57) [Claims] An integrated circuit mounted on a substrate, a substrate frame for holding the substrate, and a plurality of integrated circuits which are opposed to an upper surface of the integrated circuit at a small distance and are opposite to the integrated circuit. A cold plate having a counterbore; and a refrigerant inlet and an outlet which are in close contact with the cold plate so as to close the counterbore, and a suction chamber is provided at a position corresponding to the counterbore to provide a suction port for the refrigerant. A discharge chamber for discharging the refrigerant is provided at the outlet, and a plurality of ejection nozzles and a refrigerant are directed to the bottom of the corresponding one of the counter holes at the bottom of the suction chamber. An integrated circuit, comprising: a discharge nozzle that discharges a refrigerant other than the corresponding one or the discharge chamber, and a cooling container that discharges the refrigerant from the intake of the refrigerant to any of the suction chambers. Retirement structure.