JPH0722982B2 - Paper base laminate - Google Patents
Paper base laminateInfo
- Publication number
- JPH0722982B2 JPH0722982B2 JP1191619A JP19161989A JPH0722982B2 JP H0722982 B2 JPH0722982 B2 JP H0722982B2 JP 1191619 A JP1191619 A JP 1191619A JP 19161989 A JP19161989 A JP 19161989A JP H0722982 B2 JPH0722982 B2 JP H0722982B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- paper
- paper base
- impregnated
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は、紙基材積層板に関するものである。さらに
詳しくは、この発明は、パンチング加工時に低温でも穴
間にクラックが発生しない高信頼性の紙基材積層板に関
するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a paper base laminate. More specifically, the present invention relates to a highly reliable paper base laminated plate in which cracks do not occur between holes even at low temperature during punching.
（従来の技術） 従来より、プリント配線板用の積層板には、ガラスシー
ト、ガラスマット等のガラス基材、あるいは樹脂シート
等とともにクラフト原紙にフェノール樹脂やエポキシ樹
脂を含浸させた樹脂含浸紙基材を用いることが知られて
いる。(Prior Art) Conventionally, a laminated board for a printed wiring board has a glass base material such as a glass sheet or a glass mat, or a resin-impregnated paper base obtained by impregnating a kraft base paper with a phenol resin or an epoxy resin together with a resin sheet or the like. It is known to use wood.
この紙基材はその使用が簡便で、かつ安価であるという
特徴を有している。This paper base material has features that it is easy to use and inexpensive.
この紙基材も、ガラス基材を用いる場合と同様にして、
たとえば第１図に示したように、 （ａ） クラフト原紙（ア）にフェノール樹脂またはエ
ポキシ樹脂等の樹脂を含浸させ、 ｂ） この樹脂含浸紙基材（イ）の所要枚数を重ね、回
路形成用の銅、アルミニウム等の金属箔（ウ）を積層
し、 （ｃ） これらを加熱および加工して積層一体化して所
定のプリント配線板用の積層板とする。This paper substrate is also the same as when using a glass substrate,
For example, as shown in FIG. 1, (a) a kraft base paper (a) is impregnated with a resin such as a phenol resin or an epoxy resin, and (b) a required number of the resin-impregnated paper base materials (a) are stacked to form a circuit. A metal foil (c) of copper, aluminum or the like is laminated, and (c) these are heated and processed to be laminated and integrated to obtain a laminate for a predetermined printed wiring board.
このようにして製造した積層板は、ついで （ｄ） エッチング等によって金属箔（ウ）から回路
（エ）を形成し、また、スルーホール（オ）形成のため
にパンチング加工等を行っている。The laminated plate thus manufactured is then subjected to (d) etching or the like to form a circuit (d) from the metal foil (c), and punching or the like for forming a through hole (e).
（発明が解決しようとする課題） しかしながら、このような従来の紙基材積層板の場合に
は、スルーホール形成のための打抜き加工に際し、パン
チング穴間に表面クラックが発生しやすいという欠点が
あった。(Problems to be Solved by the Invention) However, in the case of such a conventional paper substrate laminate, there is a drawback that surface cracks are likely to occur between punching holes during punching for forming a through hole. It was
積層板は最近パターンの高密度化が進み、パンチング穴
の径および穴間隔も狭くなり、しかもより低温度での打
抜加工へのニーズが高まっていることから、このような
パターンの高密度化と低温加工にともなって、紙基材積
層板の上記の欠点は顕在化し、積層板の品質、信頼性を
損う原因となっている。Since the pattern density of laminated plates has recently increased, the diameter of punching holes and hole spacing have become narrower, and the need for punching at lower temperatures has increased. With the low-temperature processing, the above-mentioned drawbacks of the paper-based laminated board become apparent, which causes the quality and reliability of the laminated board to be impaired.
このため、パンチング時の剪断力に対する柔軟性を付与
するためにパンチング温度を、たとえば70〜80℃程度に
高くすることが考えられているが、この場合には打抜加
工の操作が面倒なものとなり、積層板の品質に影響を及
ぼし、しかも必ずしもクラックの発生を抑止することは
できなかった。For this reason, it has been considered to increase the punching temperature to, for example, 70 to 80 ° C in order to impart flexibility to the shearing force during punching, but in this case, the punching operation is troublesome. Therefore, the quality of the laminated plate was affected, and the occurrence of cracks could not always be suppressed.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来の紙基材積層板の欠点を解消し、低温での打
抜加工においても表面クラックの発生のない、高信頼性
の樹脂含浸紙基材積層板を提供することを目的としてい
る。The present invention has been made in view of the circumstances as described above, eliminates the drawbacks of the conventional paper base laminate, does not cause surface cracks even in punching at low temperature, and has high reliability. An object is to provide a resin-impregnated paper base laminate.
（課題を解決するための手段） この発明は、上記の課題を解決するものとして、基材の
全層を縦1.5％以上，横2.8％以上の伸び率を有するクラ
フト原紙とし、これに樹脂を含浸させた樹脂含浸紙基材
を金属箔と積層一体化してなることを特徴とする紙基材
積層板を提供する。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a kraft base paper having an elongation rate of 1.5% or more in the longitudinal direction and 2.8% or more in the lateral direction on all layers of a base material, on which a resin is added. Provided is a paper base laminate, which is obtained by laminating and impregnating a resin-impregnated paper base with a metal foil.
この伸び率が縦1.5％以上で、横2.8％以上という規定
は、紙の引張り強度試験において切れるまでの伸び率を
示すものである。この発明においては、上記伸び率を有
するクラフト原紙を基材の全層に用い、これに樹脂を含
浸させて樹脂含浸紙基材とし、金属箔と積層一体化する
ことを特徴としている。The provision that the elongation is 1.5% or more in the longitudinal direction and 2.8% or more in the lateral direction indicates the elongation rate until breakage in the tensile strength test of paper. The present invention is characterized in that the kraft base paper having the above-mentioned elongation rate is used for all layers of the base material, and the base material is impregnated with a resin to form a resin-impregnated paper base material, which is laminated and integrated with a metal foil.
クラフト原紙としてはこれまで一般的に使用される品質
のものをはじめとして各種のものを用いることができ
る。また、この紙基材には樹脂を含浸するが、この際に
用いる樹脂としては、フェノール樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂などが例示されるが、紙基材と
の組合せ、およびその特性とコストの点からはフェノー
ル樹脂が特に適したものとして例示される。As the kraft base paper, various kinds can be used including those having a quality generally used so far. Further, the paper base material is impregnated with a resin, and as the resin used at this time, phenol resin, epoxy resin,
An unsaturated polyester resin and the like are exemplified, but a phenol resin is exemplified as a particularly suitable resin in combination with a paper base material, and its properties and cost.
この樹脂の含浸は、広い重量比の範囲とすることができ
るが、一般的には40〜80重量％程度とすることができ
る。硬化剤、硬化助剤、増粘剤、無機添加剤などを配合
してもよいことはいうまでもない。The resin can be impregnated in a wide range of weight ratio, but generally can be about 40 to 80% by weight. It goes without saying that a curing agent, a curing aid, a thickener, an inorganic additive and the like may be added.
積層一体化する金属箔としては、銅、アルミニウム、鉄
などの各種の金属あるいは合金を用いることができる。As the metal foil to be laminated and integrated, various metals or alloys such as copper, aluminum and iron can be used.
樹脂含浸基材の所要枚数と金属箔とを、従来と同様にし
て、たとえば第１図に示した工程に沿って加熱加圧して
所定の厚さの片面または両面金属張積層板を製造する。
この時の温度としては、140〜180℃、圧力としては80〜
140kg/cm2程度とすることができる。The required number of resin-impregnated base materials and the metal foil are heated and pressed in a conventional manner, for example, in the process shown in FIG. 1 to produce a single-sided or double-sided metal-clad laminate having a predetermined thickness.
At this time, the temperature is 140-180 ℃, and the pressure is 80-180 ℃.
It can be about 140 kg / cm 2 .
（作 用） この発明においては、基材の全層に縦1.5％以上，横2.8
以上の伸び率を有するクラフト原紙を用いることによ
り、このクラフト原紙に樹脂含浸させ、金属箔と積層一
体化した積層板は、パンチング時の剪断力に対して柔軟
に対応し、低温、たとえば40〜50℃の加工時にも穴間の
クラック発生を抑止することができる。積層板は、従来
に比べはるかに高品質で高信頼性を有する。(Working) In this invention, 1.5% or more in height and 2.8 in width for all layers of the base material.
By using the kraft base paper having the above elongation rate, the kraft base paper is impregnated with a resin, and the laminated plate laminated and integrated with the metal foil flexibly responds to the shearing force during punching, and at a low temperature, for example, 40 to It is possible to prevent cracks between holes even during processing at 50 ° C. The laminated plate has much higher quality and higher reliability than the conventional one.
伸び率が上記の範囲以下の紙基材を用いる場合には、パ
ンチング時のクラック発生が避けられず、プリント配線
板用積層板の品質を低下させる。When a paper base material having an elongation rate of not more than the above range is used, cracking is unavoidable during punching and the quality of the printed wiring board laminate is deteriorated.
以下、実施例に示してさらに詳しくこの発明の紙基材積
層板について説明する。Hereinafter, the paper base laminate of the invention will be described in more detail with reference to Examples.
（実施例） 表１に示した各種の伸び率のクラフト紙（厚さ0.2mm）
に樹脂量50重量％のフェノール樹脂ワニスを、乾燥後の
樹脂量50重量％となるように含浸させた。(Example) Kraft paper with various elongations shown in Table 1 (thickness 0.2 mm)
A phenol resin varnish having a resin amount of 50% by weight was impregnated with the resin so that the resin amount after drying was 50% by weight.
乾燥後、この樹脂含浸紙基材を６枚重ね、最上層に厚さ
0.035mmの銅箔を接着剤を介して圧力100kg/cm2、濃度16
0℃の条件で60分間積層成形した。After drying, 6 sheets of this resin-impregnated paper base material are stacked, and the thickness is set on the top layer.
0.035mm copper foil pressure 100kg / cm 2 with adhesive, concentration 16
Lamination molding was performed for 60 minutes under the condition of 0 ° C.
厚さ1.6mmの片面銅張フェノール樹脂含浸紙基材積層板
を得た。A 1.6 mm-thick single-sided copper-clad phenolic resin-impregnated paper base laminate was obtained.
この積層板について表面クラックの発生を評価した。こ
の時の評価方法は次の通りとした。なお、伸び率につい
ては引張強度試験における切断までの伸び率とした。The occurrence of surface cracks was evaluated for this laminate. The evaluation method at this time was as follows. The elongation rate was the elongation rate until cutting in the tensile strength test.
＜表面クラック試験法＞ 250×200mmに試料を切断後、より過酷な試験とするため
に全面エッチングしてプリント配線板を得る。<Surface crack test method> After cutting a sample into 250 x 200 mm, the entire surface is etched to obtain a printed wiring board for a more severe test.
所定の温度（40℃）において、パンチングする。この時
の金型には、穴径0.9mm、穴間1.8mmピッチで150ヶ所の
ミシン目があり、穴間の表面のクラック発生個数を測定
する。Punch at a predetermined temperature (40 ° C). At this time, the mold has 150 perforations with a hole diameter of 0.9 mm and a hole interval of 1.8 mm, and the number of cracks on the surface between the holes is measured.
これらの評価結果も表１に示した。The results of these evaluations are also shown in Table 1.
この発明の実施例においては、伸び率が縦1.5％および
横2.8％以下の従来のものからなる比較例に比べて、パ
ンチング時のクラックの発生は著しく抑止される。In the examples of the present invention, the occurrence of cracks during punching is remarkably suppressed, as compared with the comparative example made of a conventional one having elongations of 1.5% in the longitudinal direction and 2.8% in the transverse direction.
これによって、この発明の積層板は品質が高く、信頼性
に優れていることがわかる。From this, it can be seen that the laminated plate of the present invention has high quality and excellent reliability.
（発明の効果） この発明により、プリント配線板製造時のパンチングに
よる穴間のクラック発生のない紙基材積層板が得られ
る。 (Effects of the Invention) According to the present invention, it is possible to obtain a paper base laminate without cracks between holes due to punching during manufacturing of a printed wiring board.
低温加工でもクラック発生はなく、高品質な紙基材積層
板がこの発明により提供される。The present invention provides a high quality paper base laminate without cracking even at low temperature processing.
第１図は、従来公知の紙基材積層板の製造とその加工法
について例示した工程断面図である。FIG. 1 is a process cross-sectional view illustrating the production of a conventionally known paper base laminate and its processing method.
Claims (2)
伸び率を有するクラフト原紙とし、これに樹脂を含浸さ
せた樹脂含浸紙基材を金属箔と積層一体化してなること
を特徴とする紙基材積層板。1. A kraft base paper having an elongation of 1.5% or more in the longitudinal direction and 2.8% or more in the lateral direction, and a resin-impregnated paper substrate impregnated with a resin is laminated and integrated with a metal foil. A paper-based laminated board characterized by the above.
（１）記載の紙基材積層板。2. The paper base laminate according to claim 1, which is impregnated with a phenol resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1191619A JPH0722982B2 (en) | 1989-07-25 | 1989-07-25 | Paper base laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1191619A JPH0722982B2 (en) | 1989-07-25 | 1989-07-25 | Paper base laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0355240A JPH0355240A (en) | 1991-03-11 |
| JPH0722982B2 true JPH0722982B2 (en) | 1995-03-15 |
Family
ID=16277650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1191619A Expired - Lifetime JPH0722982B2 (en) | 1989-07-25 | 1989-07-25 | Paper base laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722982B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757655A (en) * | 1980-09-24 | 1982-04-06 | Kanegafuchi Chemical Ind | Method of continuously manufacturing laminated plate for electricity or metallic foil lined laminated plate |
| JPS57176788A (en) * | 1981-04-23 | 1982-10-30 | Shin Kobe Electric Machinery | Metal foil laminated board |
-
1989
- 1989-07-25 JP JP1191619A patent/JPH0722982B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0355240A (en) | 1991-03-11 |
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