JPH07208955A - Lead measuring apparatus - Google Patents

Abstract

PURPOSE:To provide a lead measuring apparatus in which a lead for a component is measured correctly. CONSTITUTION:A lead for a component is measured by a lead sensor 25, a transfer head 21, a laser I/O control part 30, a body control part 10 and the like. When a measuring error is generated, an initial lead scanning-line position SP is moved sequentially to the outside by a prescribed distance (n) from an outer end part GT for the component up to positions at a distance L-n, a distance L-2n and a distance L-3n until it is distinguished that the number of remeasuring operations has exceeded a prescribed number of operations or it is distinguished that a measurement has been normal. In addition, when a distance 'L-ion' [where (i) =1, 2,...] is 0, the lead is moved sequentially to the inside by the distance (n) from the initial scanning-line position SP at a distance L+n, a distance L+2n and the like, and it is measured again. Thereby, a measuring mistake due to flaw, rust and the like of a lead measuring position is avoided, and it is possible to prevent the generation of a waste that a good product is mistaken for a defective product so as to be thrown away.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead measuring device for measuring the state of leads of electronic parts.

[0002]

2. Description of the Related Art Conventionally, an IC, a resistor,
There is a component mounting device that mounts a large number of chip-shaped electronic components such as capacitors. A chip-shaped electronic component (hereinafter, simply referred to as a component) mounted on a printed circuit board (hereinafter simply referred to as a substrate) by this component mounting device is externally exposed from a side surface of a mold (a protective shell member covering an internal circuit). Many have multiple leads (electrodes) protruding. In this case, if the plurality of leads are not correctly arranged according to the standard, even if the component is mounted, the lead of the component is not properly connected to the wiring of the substrate, and the completed substrate unit becomes defective. Therefore, normally, before mounting the component, the lead arrangement state of the component to be mounted is measured by an image pickup device, a sensor, or the like and collated with the data of the component standard table stored in advance in the memory or the like to determine whether the component is good or bad. I was trying to judge.

FIG. 9 shows a state in which a component is measured using a laser sensor. The transfer head 1 shown in the figure is located above the main body device and can move freely up and down and front and back and left and right, and by the suction nozzle 2, from the component mounting table on the base of the main body device to the component 3 Is picked up and the component 3 is automatically mounted at a predetermined position on the substrate that is automatically loaded into the main body device. At this time, a laser sensor 5 is arranged in the movement path of the transfer head 1 that sucks and transfers the component 3, and the state of the component 3 is measured by the laser sensor 5. The laser sensor 5 includes an irradiation port 6 and a light receiving portion 7, and when the transfer head 1 that has adsorbed the component 3 moves in the X-axis direction shown by arrow A in the figure, it passes through a measurement point B ′. The lead 4 is irradiated with a laser beam from the irradiation port 6 as shown by a folded arrow B in the figure, and the light reflected by the lead 4 is received by the light receiving portion 7. Then, the array of the leads 4 is recognized by the incident light of the reflected light, and the laser sensor 5 of the lead 4 is recognized based on the position of the light receiving portion in the light receiving portion 7 of the incident light.
Recognize the distance from. Based on these measurement (recognition) results, the control unit of the main unit determines whether the lead floats, bends,
A defect such as a dropout is detected.

The above laser sensor 5 is fixed to the main body device, and therefore, in order to measure the component 3, the component 3 is moved. FIG. 10 is a diagram showing an example of a method of moving the component 3 to be measured. As shown in the figure, the suction nozzle 2 moves in a square around the fixed measuring point B '. That is, when the suction nozzle 2 first moves from the position 2-1 to the position 2-2 in the upward direction shown by the arrow C in the figure, the plurality of leads 4 arranged on one side of the component 3 that is being sucked. The tip portion S1 (the portion surrounded by the dotted line) also moves in the direction of the arrow C ', passes through the measurement point B', and the array position thereof is scanned. Next, when the suction nozzle 2 moves from the position 2-2 to the position 2-3 in the leftward direction shown by the arrow D in the figure, the tip portions of the leads 4 arranged on the other sides of the component 3 this time. S2 (the part surrounded by the dotted line) moves in the direction of the arrow D'and passes the measurement point B '. Similarly, the suction nozzle 2 sequentially moves from the position 2-3 to the downward position 2-4 indicated by the arrow E, and further from the position 2-4 to the first rightward position 2-1 indicated by the arrow F. As a result, the tip portions S3 and S4 of the plurality of leads 4 arranged on the remaining two sides of the component 3 respectively move in the arrow E ′ direction and the arrow F ′ direction and sequentially pass the measurement point B ′. The array positions are scanned. In this way, the control system
It is possible to know the arrangement state of the leads 4 on all four sides of the component 3, and by this, the degree of vertical deviation from the correct position of each lead 4 (displacement amount, that is, lead floating), bending (pitch interval) Defective), missing, etc. are detected.

By the way, as shown in the side view of FIG. 11 (b), the lead 4 of the above-mentioned component projects laterally from the middle of the side surface of the mold, bends downward from the middle thereof, and its tip portion is further bent. It is bent sideways (horizontally). The tip of the horizontally bent lead pin 4 is a portion to be soldered to the substrate when the substrate is mounted, and the laser sensor 5 scans the arrangement state of this portion to recognize whether it is normal or not. At this time, scanning the tip of the lead may cause a detection error.Therefore, as shown in the plan view of FIG. 2A, the tip position of the lead (the outline registered in the data file for component identification is usually used. A measurement position (laser scan point) is set inside by a predetermined distance G from the outer end portion of the dimension, and this portion is scanned.

[0006]

However, FIG.
As shown in (a) and (b), if the laser scan point of the lead 4 has a flaw 4 ', the laser light is reflected irregularly and chattering occurs in the output of the laser sensor 5, or
Alternatively, the laser light is diffusely reflected, and the reflection of a normal amount of light does not enter the light receiving portion 7 of the laser sensor 5. Therefore, it is erroneously recognized that the lead is missing, that is, it is determined as a defective part. This means that even if there is no defect, for example, rust is often found at the laser scan point when the component has passed the time, and in this case also, accurate lead measurement cannot be performed. In this way, since the parts whose leads cannot be measured normally are determined to be defective products, in the above example, there is a problem that they are all discarded based on the determination that they are defective products although they are good products. There was a problem.

In view of the above conventional circumstances, the object of the present invention is to
It is an object of the present invention to provide a lead measuring device that correctly performs lead measurement and does not accidentally discard good parts.

[0008]

The structure of the present invention will be described below. INDUSTRIAL APPLICABILITY The present invention is applied to a lead measuring device that uses a laser sensor to measure the state of a lead of an electronic component sucked by a suction nozzle of a transfer head.

The lead measuring apparatus of the present invention comprises a measuring means for scanning and measuring a predetermined lead scanning position of the electronic component, and a judging means for judging the content of a defect when the measurement by the measuring means is defective. Based on the determination made by the determining means, a setting means for newly setting the lead scanning position of the measuring means by a predetermined distance and a measurement by the measuring means are performed at the lead scanning position newly set by the setting means. And a measurement control means for controlling the measurement.

The setting means sets the lead scanning position of the electronic component by shifting a predetermined distance in the positive direction of an axis perpendicular to the scanning direction, as in the second aspect. Further, for example, as set forth in claim 3, it is set by shifting a predetermined distance in a direction opposite to the positive direction of the axis perpendicular to the scanning direction.

Further, the measurement control means may measure the lead state by the measurement means until a normal measurement result is obtained or a predetermined number of remeasurements is exceeded, as described in claim 4,
The determination unit repeatedly determines the defect content and the setting unit sets a new read scanning position.

The measuring means is, for example, a laser displacement meter or the like, the determining means is, for example, a laser I / O control section or the like, and the setting means and the determining means are, for example, CP.
A U (Central Processing Unit), a drive system controller of the transfer head, and the like.

[0013]

According to the present invention, the measuring means scans and measures a predetermined lead scanning position of the electronic component. If the measurement is defective, the determining means determines the content of the defect, and based on the determination by the determining means. Then, the setting means shifts the lead scanning position of the electronic component by a predetermined distance in the positive direction or the opposite direction of the axis perpendicular to the scanning direction to newly set the position. Then, until the measurement control means obtains a normal measurement result at the newly set read scanning position or exceeds a predetermined number of remeasurements,
The measurement by the measuring means, the judgment by the judging means, and the new setting by the setting means are repeatedly performed.

As a result, it is possible to avoid waste of discarding non-defective parts due to a lead measurement error.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration block diagram of a component mounting apparatus according to an embodiment. In the figure, the component mounting apparatus includes a main body control unit 10, a laser displacement meter 20 as a lead measuring device, and a laser I / O control unit 30.

The main body control unit 10 has a main CPU (central processing unit) 11 for controlling the entire apparatus, and the CPU 11 has an I / F control unit 12 and a drive system control unit 1.
3 is connected. An input / output port 14 is connected to the drive system controller 13, and an X-axis servomotor 15 and a Y-axis servomotor 16 are connected to the input / output port 14. C
The PU 11 outputs a drive signal for moving the transfer head 21 that transfers the component to the drive system control unit 13, and the drive system control unit 13 decodes the drive signal and outputs it to the input / output port 14. The input / output port 14 outputs the input drive signal to the X-axis servomotor 15 and the Y-axis servomotor 1.
Assign to 6. The X-axis servomotor 15 rotates in both the forward and reverse directions to move the transfer head 21 in the X-axis direction (substrate transfer direction).
The Y-axis servo motor 16 also rotates in both forward and backward directions to move the transfer head 21 forward and backward in the Y-axis direction (a direction perpendicular to the substrate transport direction and horizontal). At this time, X
The servo motor encoder X15 'and the servo motor encoder Y16' respectively attached to the rotary shafts of the axis servo motor 15 and the Y axis servo motor 16 drive the input / output port 14 and the pulse signal indicating the rotation speed of each servo motor. Main CPU 1 via control unit 13
Output to 1. The main CPU 11 counts these pulse signals to calculate the X-axis servomotor 15 and the Y-axis servo motor 15.
The drive of the axis servo motor 16 is controlled. Further, although not particularly shown, a pulse motor that rotationally drives the transfer head 21 and a pulse motor that vertically drives the transfer head 21 are respectively connected to the input / output port 14, and these pulse motors are also similar. The drive is controlled by the main CPU 11. Further, a vacuum pump for sucking / releasing the component 23 by the suction nozzle 22 of the transfer head 21 is also connected, and is similarly driven and controlled by the main CPU 11. Then, the I / F control unit 12 of the main body control unit 10 converts the control signal input from the main CPU 11 from a parallel signal to a serial signal, and the interface RS232
It outputs to the laser I / O control unit 30 via C.

The laser displacement meter 20 includes a laser sensor 25 and a displacement meter controller 28. The laser sensor 25 measures the component 23 adsorbed by the transfer head 21 for reference recognition, and scans the placement position of the lead 24 of the component 23 which is being transferred during mounting work. The displacement gauge controller 28 controls the output of the laser sensor 25, displays and notifies the result of measurement or scanning of the laser sensor 25, and outputs the result data to the laser I / O control unit 30.

The laser I / O control unit 30 has a built-in RAM (Random-Access-Memory), which is not particularly shown, and stores a component information master file as a component identification data file in this RAM. . And laser I /
The O control unit 30 receives a control signal input from the main CPU 11 via the interface RS232C and a servo motor encoder X input via the drive system control unit 13.
The operation timing of the laser displacement meter 20 is controlled based on the pulse signal count value of 15 'and the servo motor encoder Y16', and the measurement or scanning result data input from the laser displacement meter 20 is stored in the RAM as a component information master file. The lead 2 of the component 23 as compared with the corresponding information data of
The displacement amount of each of the four is calculated, and the calculation result is output to the main CPU 11 via the interface RS232C.

The main CPU 11 also has a built-in memory, and a pass / fail judgment data file showing an allowable range of the measured displacement amount is provided in this memory, and the displacement amount of the read information input from the laser I / O control unit 30 is the above-mentioned allowable amount. Whether or not it is within the range, that is, whether or not the measured lead arrangement state of the component is normal, that is, whether or not the component is non-defective is determined.

The operation of this embodiment for performing the read array state measurement process in this configuration will be described with reference to the flow charts shown in FIGS. Note that this processing is performed by the main CPU 11 of the main body control unit 10 as shown in the flowchart of FIG. 2 and by the laser I / O control unit 30 as shown in the flowchart of FIG. The present embodiment is characterized by the lead measuring method performed by the laser I / O control unit 30 under the control of the main CPU 11.

In the flow chart shown in FIG. 2, the main CPU 11 first performs the origin operation process (step M1). This process is a process of driving each drive system in the X-axis direction, the Y-axis direction, the rotation direction, the up-down direction, and the like to set and stop the transfer head 21 at the reference position at the start of operation when the power is turned on. Is.

Then, the laser I / O control unit 30
A laser I / O initialization command A is output via the F control unit 12 (step M2). This allows the laser I
The / O control unit 30 performs an initial mode setting process, which will be described later, and finishes the initial mode setting by the main C.
Notify PU11.

After confirming the completion of the initial mode setting (step M3), the main CPU 11 moves the transfer head 21 to a component mounting table (not shown), and the suction nozzle 2
2 picks up a predetermined part 23 and performs image recognition processing for rough centering of the part 23 (step M
4).

In this processing, the transfer head 21 is moved above the image recognition camera arranged near the guide rail for guiding the substrate on the main body base, and the suctioned state of the sucked component 23. Is imaged by the image recognition camera, the image of the component 23 obtained by the imaging is recognized, and the component 23
Is a process of rotationally correcting the transfer head 21 so that each side of the component 23 faces the X-axis direction and the Y-axis direction, respectively, and further correcting the position of the center of the component 23 deviated from the center of the reference visual field. This completes the preparation for scanning the lead 24 of the component 23.

Next, the laser I / O controller 30 is provided with a servo motor encoder X1 for moving the transfer head 21.
A displacement amount measurement command B at the position where the lead 24 is arranged is output together with the pulse number data of 5 '(step M5). As a result, the laser I / O control unit 30 notifies the main CPU 11 of the start of a lead displacement amount measurement process, which will be described later, executes the lead displacement amount measurement process, and then terminates the lead displacement amount measurement. To notify.

After confirming the start of lead displacement amount measurement by the laser I / O control unit 30 (step M6), the main CPU 11 drives the X-axis servomotor 15 (or Y-axis servomotor 16) by a predetermined number of pulses. The transfer head 21 is moved (step M7). As a result, as in the case where the suction nozzle 2 moves from the position 2-1 to the position 2-2 during the read scanning shown in FIG. 10, the suction nozzle 22 of the transfer head 21 moves to the suction nozzle 22. The lead 24 on one side of the attracted component 23 is scanned by the laser sensor 25 of the laser displacement meter 20.

Then, it is confirmed that the laser I / O control unit 30 has finished measuring the lead displacement amount (step M8), and it is determined whether or not the scanning of the leads 24 on the four sides of the component 23 has been completed (step S8). M9). In this processing, for example, "4" is set in the subtraction register built in the main CPU 11 and
This is a process of subtracting "1" every time the side scanning process is completed and determining whether or not the subtraction register has become "0".

When the scanning of the leads 24 on the four sides is not yet completed, the process returns to the step M5 and the steps M5 to M9 are repeated. In step M5, the pulse number data for the movement of the transfer head 21 output together with the displacement amount measurement command B is the pulse number data of the servo motor encoder X15 'and the servo motor encoder Y16' for each side scanning process. The pulse number data, the reverse rotation pulse number data of the servo motor encoder X15 'again, and the reverse rotation pulse number data of the servo motor encoder Y16' are sequentially changed.

In this way, the leads 24 on the four sides are scanned, and after the completion of the scanning on the four sides is confirmed in step M9, the laser I / O control unit 30 is supplied with the measurement (scan) data of the leads 24. The read measurement data determination command C is output so as to output the determination result (step M10). As a result, the laser I / O control unit 30 performs a read measurement data determination process, which will be described later, and outputs the result of the process to the main CPU 1.
Notify 1.

The main CPU 11 confirms that the read measurement data determination result has been input from the laser I / O control unit 30 (step M11), and executes processing based on the input result (step M12). In this process, if the displacement amount of the lead placement position determined by the laser I / O control unit 30 is within the allowable value, the process of mounting the component 23 on the board is executed, while the lead placement position Displacement is
When the allowable value is exceeded, the process of discarding the part 23 is executed.

Next, the processing performed by the laser I / O control unit 30 based on the command from the main CPU 11 will be described. In the flowchart shown in FIG. 3, first, the main CPU 1
The initialization command A input from 1 is awaited (step S1).

When the initialization command A is input, the initial mode is set (step S
2). This processing is processing such as clearing the built-in counter and memory and setting the laser sensor 25 in the read scanning mode.

After the above processing is completed, the lead displacement amount measurement command B input from the main CPU 11 is awaited (step S3). When the lead displacement amount measurement command B is input, the lead displacement amount measurement is executed (step S
4). This processing sets the pulse number data of the servo motor encoder, which is input together with the lead displacement amount measurement command B, in the register and notifies the main CPU 11 of the start of the lead displacement amount measurement, while the displacement meter of the laser displacement meter 20 is measured. The controller 28 outputs a control signal to cause the laser sensor 25 to start laser irradiation to start scanning of the lead 24, capture the reflected light thereof, and measure the lead position based on the reflected light data. , The lead arrangement position data obtained by the measurement is stored in a memory, and the processing thereof is input through the drive system control unit 13 of the main body control unit 10 to the pulse number data of the servo motor encoder X15 'or Y16' and the register. Repeat until the pulse number data stored in is matched.If both pulse number data match, the measurement is finished. , By turning off the laser irradiation, a process of notifying the completion of the measurement process to the main CPU 11.

After the above processing is completed, the CPU waits for the read measurement data determination command C input from the main CPU 11 (step S5). When the lead measurement data determination command C is input, the lead measurement data determination processing is executed (step S6). In this process, the lead measurement data (positional data of the lead 24) obtained by scanning is read from the memory, and the read lead measurement data read from the component information master file of the RAM for each side is read. Compared with the information, lead number error such as loss or breakage, lead pitch error, and displacement amount of lead 24 placement position (floating and bending error)
Is a process for calculating.

In this way, the measured error content is transferred from the laser I / O control unit 30 to the interface RS2.
It is output to the main CPU 11 of the main body control unit 10 via the 32C and the I / F control unit 12. The main CPU 11
In step M12 of FIG. 9, the component 23 is re-measured based on this error content, and the quality of the component is judged based on this result.

FIG. 4 is a flow chart showing details of the processing in step M12. As shown in the figure, first, it is determined whether or not all the measurement results input from the laser I / O control unit 30 indicate normal (step S11). If all measurements are normal and completed (S
(11, Yes), the process ends immediately.

Then, the final processing in step M12, that is, the quality determination processing and the discardability determination processing of the relevant part are performed. On the other hand, when the measurement is not normally completed (S11, No), the content of the error which is not normally completed is checked. That is, first, it is determined whether or not the measured number of leads has an error (step S12).

If there is a read number error (S1
(2, Yes), error processing A described later in detail is performed (step 19), and when there is no read number error (S1)
2, No), and then it is determined whether or not there is an error in the lead pitch (step S13).

In this determination, if there is an error in the lead pitch (S13, Yes), error processing B described later in detail is also performed (step 20), and if there is no lead pitch error (S13, No), further, Then, it is determined whether or not there is a lead floating error (step S14).

If there is a lead floating error (S1
4, Yes), the error processing C described later is performed (step 21), and if there is no lead floating error (S14, N).
o), and next, it is determined whether or not there is a lead bending error (step S15).

If there is a lead bending error (S1
5, Yes), the error processing D described later is performed (step 22), and if there is no lead bending error (S15, N).
o), other error processing than the above error is performed (step 16), and then it is determined whether or not the measurement is normally completed by this error processing (step 17).

As described above, it is sequentially determined whether or not there is a lead number error, a lead pitch error, a lead floating error, a lead bending error, or another error, and if there is an error, an error corresponding to the type of the error. Processing A, B,
Perform C, D or E. Then, by these error processes, it is determined again whether or not the measurement can be normally completed, and if the re-measurement by the error process is normally completed (S17, Yes), the normal end is stored in the memory. The data is recorded in the predetermined area, and the process ends. When the remeasurement by the error processing is not normally completed (S17, No),
It is determined whether or not the number of remeasurements exceeds the allowable number of remeasurements (the number of retries) set in the memory (step 18). If not (S18, No), the process returns to step 12 above. Then again, steps S12 to S
Repeat 18.

If the number of re-measurements exceeds the number of retries (S18, Yes), the emergency end is recorded in a predetermined area of the memory and the process ends. In this way, if there is an error, an error process (error relief process) described later corresponding to the type of the error is performed, the error determination is performed again, and if there is an error, a predetermined number of times (retry) is set in advance. Repeat the above error processing up to (number). As a result, normal parts are relieved from disposal due to measurement error (misidentification).

Next, the error processes A, B, C, D and E will be sequentially described with reference to the flow charts shown in FIGS. Figure 5 (a) shows the error processing A for the number of reads.
Is a flow chart of step S3 of FIG.
It is a flowchart which shows the processing content of 1-S34.

In FIG. 4A, first, the measurement position used in the measurement process of FIG. 3 is set for the first side (SIDE1) of the component 23 (step S31). In this process, the external dimension of the component 23 is recognized by the component information master file, and as shown in FIG. 8, the external dimension GT of the external dimension is inward by a predetermined distance L preset for this component. Then, the scanning line position (scan point) SP for measuring and scanning the lead 24 of the component 23 is set.

Then, the processing shown in FIG. That is, first, it is determined whether or not the read number error has occurred due to a shortage of the number of reads (step S41). This process is a process of comparing the measured number of leads with the specified number of leads read from the component information master file.

If the measured number of leads is not insufficient (S41, No), it is then determined whether the measured number of leads is abnormally larger than the specified number of leads (step S42). This process is a process of determining whether chattering has occurred in the output of the laser sensor 25 in the lead measurement.

If chattering has not occurred, the processing is terminated without changing the scan point SP set above. If chattering has occurred in step S42, the scan point SP is moved to the outer end portion G by a predetermined distance n (for example, 3/100 millimeters).
The setting is shifted to the T side (step S44), and the process ends. As a result, as also shown in FIG. 8, the scan point SP, which is set inward by the distance L in advance from the outer end GT, moves to the distance L-n.

If it is determined in step S41 that the measured number of leads is insufficient, step S44 is similarly performed and the process is terminated. In this way, the process of step S31 of FIG. 5A is performed, and step S31 is performed in exactly the same manner.
32, the second side (SIDE2) is processed,
Hereinafter, in step S33, the third side (SIDE
3) In step S34, the fourth side (SIDE4) is processed.

Subsequently, a warning indicating that there is a read number error is issued (step S35), and re-measurement is performed at the newly set scan point SP (step S).
36). As a result, again, step M5 to step M12 in FIG. 2 and step S3 in FIG.
~ S6 is performed.

In this way, when the read number error occurs in step S12 of FIG. 4, until it is determined in step S17 that the measurement is normal, or in step S1.
In step S19, that is, in the processing of FIGS. 5 (a) and 5 (b), the scan point SP shown in FIG. 8 is moved from the outer end GT until it is determined that the number of re-measurements has exceeded the predetermined number in 8. The positions are sequentially moved to the positions of the distances L-n, L-2n, and L-3n, and the distance "L-i.n" (i =
If 1, 2, ...) Is 0, the distance is moved to the inner side from the scan point SP at the time of initialization such as L + n and L + 2n, and the measurement is performed again. As a result, measurement errors due to flaws in the lead measurement position, rust, etc. can be avoided, and it is possible to prevent waste of misidentifying good parts as defective and discarding them.

Next, the error processing B in step S20 of FIG. 4 will be described with reference to FIGS. 6 (a) and 6 (b).
6A is a flowchart of the lead pitch error processing B, and FIG. 6B is a flowchart showing the processing contents of steps S51 to S54.

In FIG. 10A, first, the scan point SP that has been initialized is set for the first side (SIDE1) of the component 23 (step S51), and then the procedure shown in FIG. To do. That is, first, it is determined whether or not the lead pitch error is one in which pitch determination cannot be performed (undetected leads exist and the pitch interval is abnormally wide) (step S61). This process is a process of comparing the measured lead arrangement pitch with a prescribed lead arrangement pitch read from the component information master file.

If the measured lead arrangement pitch is not abnormally wide (S61, No), it is then determined whether or not the measured lead arrangement pitch is abnormally narrower than the prescribed lead arrangement pitch ( Step S62). This process also applies to the output of the laser sensor 25 in the lead measurement.
This is processing for determining whether chattering has occurred.

If chattering has not occurred, the processing ends without changing the set scan point SP. If chattering has occurred in step S62, the scan point SP is set by shifting the scan point SP toward the outer end GT by a predetermined distance n (step S64), and the process ends.

If the measured lead arrangement pitch is abnormally wide in step S61, step S64 is similarly performed and the process is terminated. Thus, FIG.
The process of step S61 of (a) is performed, and in exactly the same manner, the process of the second side (SIDE2) is performed in step S62, and thereafter, the third side (SIDE3) is sequentially processed in step S63, and the fourth side is processed in step S64. Th side (SID
E4) is processed.

Then, a warning indicating that there is an error in the lead arrangement pitch is issued (step S55), and re-measurement is performed at the newly set scan point SP (step S56). As a result, again in this case, steps M5 to M12 of FIG. 2 and steps S3 to S6 of FIG. 3 are performed again.

In this way, when a lead pitch error occurs in step S13 of FIG. 4, step S17
Until it is determined in step S18 that the measurement is normal, or until it is determined in step S18 that the number of re-measurements exceeds the predetermined number, in step S20, that is, in the processing of FIGS. As in the case of the read number error described above, the scan point SP shown in FIG. 8 is sequentially moved outward from the outer end GT to the positions of the distances L-n, L-2n, and L-3n, and the distance is changed. “L−i · n” (i = 1, 2,
...) is 0, the distances L + n and L + 2n are sequentially moved to the inner side from the scan point SP at the time of initial setting,
Perform remeasurement. As a result, measurement errors due to flaws in the lead measurement position, rust, etc. can be avoided, and it is possible to prevent waste of misidentifying good parts as defective and discarding them.

Next, the lead floating error processing C in step S21 of FIG. 4 and the lead bending error processing D in step S22 will be described with reference to FIG. 7A. The error processes C and D are performed in the same procedure.

In FIG. 7A, first, if the lead floating error occurs, a warning notification indicating that the lead floating error occurs,
If it is a lead bending error, a warning notification indicating that it is a lead bending error is issued (step S71), and then the same scan point SP is set (step S71).
72), the process ends.

In this way, step S14 or S in FIG.
When the lead floating error or the lead bending error occurs in 15, it is determined that there is no error in the lead detection itself, and the scan point SP is not changed until it is determined in step S17 that the measurement is normal,
Alternatively, re-measurement is performed until it is determined in step S18 that the number of re-measurements has exceeded a predetermined number, and non-defective parts are remedied from a measurement error.

Next, the other error processing E in step S16 of FIG. 4 will be described. FIG. 7B is a flowchart of other error processing E. As shown in the figure, first, the scan point SP is moved by the distance n (step S81). Next, a warning notification indicating that the error is another error is given (step S82),
Then, the re-measurement similar to the above is performed by the newly set scan point SP.

As described above, when another error occurs, it is assumed that the measurement is wrong, and the scan point SP is sequentially changed by the distance n until the normal measurement is performed or a predetermined number of times. Repeat the measurement until.

As a result, measurement errors due to flaws in the lead measurement position, rust, etc. can be avoided, and it is possible to prevent waste of misidentifying good parts as defective and discarding them.

[0065]

As described in detail above, according to the present invention,
When a measurement error occurs, the measurement scanning position of the laser sensor is automatically changed and re-measurement is repeated until normal measurement is performed or a specified number of times, so measurement errors due to flaws, rust, etc. at the lead measurement position are avoided. Therefore, it is possible to prevent waste from occurring by misidentifying non-defective parts as defective and discarding them, thereby improving economic efficiency.

[Brief description of drawings]

FIG. 1 is a configuration block diagram of a component mounting apparatus according to an embodiment.

FIG. 2 is a flowchart showing an operation of a lead measurement process performed by a main CPU of a main body control unit.

FIG. 3 is a flowchart showing an operation of a lead measurement process performed by a laser I / O control unit.

FIG. 4 is a flowchart showing details of result processing of FIG.

5A is a flowchart showing details of error processing A, and FIG. 5B is a flowchart showing processing contents of steps S31 to S34.

6A is a flowchart showing details of error processing B, and FIG. 6B is a flowchart showing processing contents of steps S51 to S54.

7A is a flowchart showing details of error processing C or error processing D, and FIG. 7B is a flowchart showing details of error processing E.

FIG. 8 is a diagram illustrating a method of setting and changing a lead measurement scanning line position (scan point) of a component.

FIG. 9 is a diagram showing a state when a component is measured using a conventional laser sensor.

FIG. 10 is a diagram showing an example of a method of moving the measured component of FIG.

11A is a plan view for explaining a measurement position of a conventional component, and FIG. 11B is a side view thereof.

[Explanation of symbols]

1, 21 Transfer head 2, 22 Suction nozzle 2-1, 2-2, 2-3, 2-4 Moving position of suction nozzle 3, 23 Parts 4, 24 Leads 4-1, 4-2, 4-3 , 4-4, 4-5, 4-6 Lead measurement position 5, 25 Laser sensor 6 Irradiation port 7 Light receiving part 10 Main body control part 11 Main CPU 12 I / F control part 13 Drive system control part 14 Input / output port 15 X Axis Servo Motor 15 'Servo Motor Encoder X 16 Y Axis Servo Motor 16' Servo Motor Encoder Y 20 Laser Displacement Gauge 28 Displacement Gauge Controller 30 Laser I / O Controller S1, S2, S2, S3 Lead Scanning Area GT Outside Parts Edge SP Scan line position L Initial scan line position determination distance

Claims (4)

[Claims] 1. A lead measuring device for measuring a lead state of an electronic component sucked by a suction nozzle of a transfer head using a laser sensor, wherein a measuring means for scanning and measuring a predetermined lead scanning position of the electronic component. And a determination means for determining the content of the defect when the measurement by the measurement means is defective, and a setting for newly setting the lead scanning position of the measurement means by shifting a predetermined distance based on the determination by the determination means. A lead measuring apparatus comprising: a measuring unit; and a measuring control unit that causes the measuring unit to perform the measurement at the lead scanning position newly set by the setting unit. 2. The lead measuring apparatus according to claim 1, wherein the setting unit shifts the lead scanning position of the electronic component by a predetermined distance in a positive direction of an axis perpendicular to the scanning direction. 3. The setting means shifts and sets a lead scanning position of the electronic component by a predetermined distance in a direction opposite to a positive direction of an axis perpendicular to the scanning direction. Lead measuring device. 4. The measuring control means measures the lead state by the measuring means, determines the content of the defect by the determining means, and sets the measuring means until a normal measurement result is obtained or a predetermined number of times of re-measurement is exceeded. 4. The lead measuring device according to claim 1, wherein the setting of a new lead scanning position is repeated.