JPH07205025A - Grinding method and device for electrolytic inprocess dressing - Google Patents

Abstract

PURPOSE:To keep the form of a grinding tool and to prevent damages due to transfer of fallen grinding particle by diffusing electrolytic effect owing to chamfering of the outer peripheral edge part of an electrically conductive grinding tool, and adjusting a chamfering amount according to the wear of the grinding tool. CONSTITUTION:The positive electrode of a power supply device 8 is connected to a rotary electrically conductive grinding tool 1. The negative electrode of the power supply device 8 is connected to ring-formed electrode 5 for holding a member 4 to be processed while keeping a certain distance from the processing surface of the grinding tool 1. The member 4 to be processed is relatively rocked along the processing surface of the grinding tool 1. Processing is made by supplying coolant 7 from a coolant nozzle 6 across the grinding tool 1 and the electrode 5. In this case, by chamfering the outer peripheral edge part of the grinding tool 1, electrolytic effect is diffused and the elution of bond is reduced. A chambering tool 2 is attached to the chamfering part via an adjusting member 3 and chamfering is continuously performed according to the wear of the grinding tool 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for grinding a workpiece such as a lens by an electrolytic in-process dressing method.

[0002]

2. Description of the Related Art In general, a workpiece such as a lens is ground by rotating a grinding tool and swinging the workpiece on the grinding tool. However, there is a problem in that the grinding tool is clogged and the grinding ability is reduced, which requires a long time for grinding.

Therefore, in order to solve the above problem, conventionally, as described in Japanese Patent Laid-Open No. 5-16064, grinding is performed while electrolytically dressing. 14 and 15 show this grinding apparatus. An electrically conductive grinding tool 102 is integrally formed at the tip of a rotary shaft 101 connected to a drive device (not shown). The grinding tool 102 is formed by bonding abrasive grains such as diamond powder with a conductive bond, and its tip is formed on a hemispherical processed surface 103, and the processed surface 103 has a corresponding processed surface. The processed member (workpiece) 104 is abutted. The member to be processed 104 is held by the holding tray 105.

A concave portion is formed in the central portion of the upper surface of the holding plate 105, and the concave portion has a substantially rod-like shape with a spherical tip at its center 1.
The knapsack 106 having 06a is engaged. The upper end of the kanzashi 106 is connected to the pressure device 107, and the pressure device 107 is connected to the swing drive device 108.

The outer peripheral wall of the holding tray 105 has a member 10 to be processed.
A ring-shaped electrode 109 surrounding 4 is vertically provided, and the electrolytic surface 109a of the electrode 109 is provided so as to have a slight gap L with the processing surface 103 of the grinding tool 102.

A DC power supply 110 for generating a pulse voltage for electric discharge machining is installed near the holding tray 105. The (+) pole of the DC power supply 110 is applied to the grinding tool 102 via the brush 111 that contacts the outer peripheral surface of the rotating shaft 101. Further, the (-) pole of the DC power supply 110 is
6 and is connected to the electrode 109 via the holding pan 105.
Is being applied to.

DC power supply 110 and the swing drive device 108
Are connected to and controlled by the controller 112. Electrode 10
In the vicinity of 9, a pipe 113 connected to a water supply device (not shown)
Is provided, and the coolant (cooling medium) 114 is supplied to the gap L between the electrode 109 and the grinding tool 102.

In FIG. 14, the position on the machined surface 103 of the grinding tool 102 facing the electrolytic surface 109a of the electrode 109 is O, and the machined surface 10 is when the connector 106 is in the neutral position.
The rotation center of 3 is C, and the outer peripheral point of the grinding tool 102 is e. On the other hand, when the member 104 to be processed is tilted most to the right due to the swing, the position on the processed surface 103 facing the electrolytic surface 109a is P. On the other hand, by swinging, the workpiece 104
When Q is most inclined to the left, the position on the processed surface 103 that faces the electrolytic surface 109a is Q. The center of swing (center of curvature) of the workpiece 104 is A.

∠QAO is a half-angle θ of the swing angle 2θ of the Kanzashi 106, and ∠CAQ is a working surface 1 facing the electrolytic surface 109a when the workpiece 104 is swung by the half-angle θ from the neutral position.
The angle between the position Q on 03 and the rotation center C of the machined surface 103 is δ.

In the lens grinding using the grinding apparatus having the above-mentioned structure, the holding plate 104 is driven to swing and the grinding tool 102 is rotated, and at the same time, the machining surface 103 of the grinding tool 102 and the electrolytic surface 109a of the electrode 109 are moved. Coolant 11 in the gap L
Supply 4. Then, the voltage applied to the grinding tool 102 and the electrode 109 by the DC power supply 110 causes electrolysis on the processing surface (abrasive grain surface) 103 of the grinding tool 102 to dress the grinding tool 102.

Oscillation during grinding is performed by the controller 112, and the timing of voltage application by the DC power source 110 is also controlled by the controller 112. Kanzashi 106
The ball center 106a of No. 1 starts swinging (moves to the right side in the drawing) from the state of FIG. 14 and eventually reaches + θ. Next is the ball center 10
6a swings in the opposite direction (moves to the left in the figure) and reaches -θ. Further, the swing of the spherical center 106a proceeds to − (θ + δ) where the electrolytic surface 109a of the electrode 109 and the rotation center C of the grinding tool 102 overlap. Then, the grinding tool 102 stays for at least one rotation, and a voltage is applied, and the grinding tool 102 swings again to O °. This series of swings is repeated a predetermined number of times to complete the processing.

In the above operation, when the swing is − (θ + δ),
That is, the electrode 109 is formed at the center of the processing surface 103 of the grinding tool 102.
When there is the electrolytic surface 109a, the electrolytic surface 109a uniformly dresses the processed surface 103 of the grinding tool 102. The rocking drive device 108 may be controlled to further rock the kanzashi 106 by δ at a rate of a plurality of reciprocations (one reciprocation is 4θ), and dressing may be performed at this δ. 1 round trip (4θ + 2
You may dress every δ).

Further, the voltage is applied only when the electrolytic surface 109a of the electrode 109 is in the center of the machined surface 103 of the grinding tool 102, but effective dressing is performed when it is in the center of the machined surface 103. To energize the machined surface 1
When it is out of the center of 03, weak energization may be performed (dressing is hardly performed).

[0014]

However, in the above-mentioned prior art, the ring-shaped electrode 109 shown in FIG. 16 is used.
As shown in the partial cross-sectional view of the grinding tool 102 and the grinding tool 102, the coolant 114 is rotated along with the electrode 109 that is driven to rotate,
The outer peripheral edge portion (point K in the figure) of the machined surface 103 intervenes outside due to centrifugal force or surface tension of the grinding tool 102. The electrolytic action concentrates on the current-carrying part at the shortest distance, and also concentrates on the protrusion.

Therefore, the electrolytic action is dispersed on the processing surface 103 corresponding to the inside of the intersection G of the electrode 109 on the extension of the straight line connecting the center of curvature O ₁ and the point K. But,
Point G to H of electrode 109 (perpendicular to rotation axis 101, K
The electrolytic action generated up to the point H where the intersection of the straight line passing through the point and the electrode 109 is located) is concentrated on the edge portion (point K) of the grinding tool 102 which is the shortest distance and is a protrusion. To do. Further, depending on the circulation of the coolant 114, the coolant 114 also concentrates from the outside of the point H.

Therefore, the edge portion (K
In the point), bond elution is promoted more than the processed surface on the inner side. When bond elution becomes active, the shape of the grinding tool 102 collapses from the outer periphery, and the tool diameter of the grinding tool 102 decreases. Generally, in the profile grinding, the workpiece 104 and the grinding tool 1
As the grinding process progresses due to the relative motion with 02,
The stability condition is set by adjusting the relative motion. This maintains the shape accuracy of the workpiece 104. However, as described above, when the tool diameter gradually decreases, the stability condition changes, and the shape accuracy of the workpiece 104 deteriorates.

Further, due to excessive bond elution, abrasive grains are more likely to fall off, and the dropped abrasive grains are present in the gap between the workpiece 104 and the grinding tool 102. Further, the bond becomes a hydroxide or an oxide, and this lump (including abrasive grains) is peeled off as if crushed by the contact with the workpiece 104.
At this time, the broken pieces are interposed between the workpiece 104 and the grinding tool 102.

The grinding tool 102 is hard because it holds the abrasive grains with a metal bond, and the grinding tool 102 does not have an effective cushioning action due to the elastic force against the intervening abrasive grains and the like. Therefore, abrasive grains or the like are pressed against the member 104 to be processed, which causes a problem of deep scratches.

The present invention has been made in view of the above-mentioned problems of the prior art, and prevents the concentration of electrolysis on the edge portion of the grinding tool to maintain the shape of the grinding tool and remove the abrasive grains, An object of the present invention is to provide an electrolytic in-process dressing grinding method and apparatus capable of preventing the occurrence of scratches caused by rolling of scraps.

[0020]

FIG. 1 shows the basic structure of the present invention, in which the rotating conductive grinding tool 1 is connected to the anode of a power supply device 8 and is fixed to the machined surface of the conductive grinding tool 1. The cathode of the power supply device 8 is connected to the ring-shaped electrode 5 that maintains the distance and holds the workpiece 4. Further, the workpiece 4 is relatively swung along the machining surface of the conductive grinding tool 1, and the coolant 7 is supplied from the coolant nozzle 6 between the conductive grinding tool 1 and the electrode 5 for machining. When the electrolytic surface of the electrode 5 and the center of the processed surface of the conductive grinding tool 1 overlap, the conductive grinding tool 1 is rotated at least once while applying a voltage to the electrode 5 and the conductive grinding tool 1. .

The electroconductive grinding tool 1 is set to have a diameter larger than the machining surface required for machining, and the peripheral edge portion (outside the diameter for obtaining the necessary machining surface) of this grinding tool is chamfered to obtain a chamfering tool. 2 is applied to this chamfered surface from the direction of the rotation axis of the conductive grinding tool 1, and the soft adjusting member 3 holding the chamfering tool 2 contacts the machined surface of the grinding tool at this position.

According to the grinding apparatus configured as described above, by chamfering the outer peripheral edge portion of the conductive grinding tool 1, the electrolytic action concentrated in the edge portion is dispersed in the chamfered portion. This reduces bond elution.

As the machining progresses, the abrasion of the conductive grinding tool 1 gradually progresses and the chamfered portion decreases. When the chamfered portion is reduced, the electrolytic action is concentrated on the edge portion. In order to prevent this, the chamfering tool 2 is applied and chamfering is continuously performed even if the conductive grinding tool 1 is worn. Further, the chamfering amount can be adjusted by the chamfering tool 2 by bringing the adjusting member 3 into contact with the processing surface. Therefore, the chamfered portion can be maintained at a constant amount and the electrolytic action can be dispersed regardless of wear of the conductive grinding tool 1.

[0024]

Embodiment 1 FIG. 2 shows Embodiment 1 of the present invention. In this embodiment, a grinding tool 12 having conductivity and having a spherical upper surface, that is, a machined surface, is integrally formed at the tip of a rotatable rotary shaft 11 connected to a drive source device (not shown). There is. The grinding tool 12 is formed by bonding abrasive grains such as diamond powder with a conductive bond, and its tip is formed on a hemispherical processed surface 13. Further, a chamfered portion 12a is provided on the outer peripheral portion of the grinding tool. A processed member (work) 14 having a processed surface having a corresponding shape on the processed surface 13.
Are abutted. The member to be processed 14 is held by a holding tray 15. A recess is formed in the center of the upper surface of the holding plate 15, and a hook 16 having a spherical center 16a with a rod-shaped tip is engaged with the recess. The upper end of the kanzashi 16 is connected to the pressurizing device 17, and the pressurizing device 17 is connected and held to the swing drive device 18.

A ring-shaped electrode 19 is vertically provided on the outer peripheral wall of the holding plate 15, and the electrolytic surface 19a of the electrode 19 is provided so as to have a slight gap d with the processing surface 13 of the grinding tool 12. .

A DC power source 20 for generating a pulse current is arranged near the holding plate 15. The anode of the DC power supply 20 is applied to the grinding tool 12 via a brush 21 that contacts the outer peripheral surface of the rotary shaft 11. Further, the cathode of the DC power supply 20 is connected to the kanzashi 16, and is applied to the electrode 19 via the holding dish 15.

The DC power source 20 and the swing drive device 18 are connected to a control device 22 to control ON / OFF of electrolysis. A pipe 23 connected to a water supply device (not shown) is provided near the electrode 19, and the electrode 19 and the grinding tool 1 are provided.
The coolant 24 is supplied to the gap d between the coolant 24 and the coolant. A chamfering tool 27 is applied to the side of the chamfered portion 12a of the grinding tool that does not interfere with the workpiece 14 (right side in the drawing).
The chamfering tool 27 is formed by bonding abrasive grains of powder such as diamond with a bond.

A side surface of the chamfering tool 27 is linearly swingably held by a guide 29 via a table 28, and the swing is arranged in the same direction as the rotary shaft 11. The chamfering tool 27 has one end pulled downward by a tension spring 30 fixed to the main body. Further, a shaft 25 is fixed to the surface of the chamfering tool 27 on the side of the member to be processed 14, and a roller 26 is rotatably held at its tip,
The outer peripheral surface of the roller 26 is pressed against the processing surface 13 by the tension spring 30.

In the above structure, the coolant 24 is supplied to the gap d between the processing surface 13 of the grinding tool 12 and the electrolytic surface 19a of the electrode 19 at the same time when the holding tray 15 is driven to swing and the grinding tool 12 is driven to rotate. Then, the voltage applied to the grinding tool 12 and the electrode 19 by the DC power supply 20 causes electrolysis on the machined surface 13 of the grinding tool 12 and the chamfered portion 12a.

Oscillation during grinding is performed by the oscillation drive device 18, and the control device 22 controls the timing of voltage application by the DC power supply 20. The voltage is applied so that the electrolytic surface 19a of the electrode 19 coincides with the rotation center of the grinding tool 12, or
It is done only in the vicinity. The chamfered portion 12a is provided on the outer periphery of the grinding tool 12, and the amount of concentration of electrolytic action is reduced accordingly. The tension force of the tension spring 30 acts so that the roller 26 and the chamfering tool 27 come into contact with the machined surface 13 and the chamfered portion 12a, respectively. The ratio of this force contributes to the amount of wear of the machined surface 13. Processing progresses, grinding tool 12
The chamfered portion 12a decreases as the wear of the chamfer advances, but this force is applied to the chamfering tool 27 by the roller 26, whereby the chamfering process is performed. At this time, the processing direction of chamfering is defined by the guide 29, and proceeds in the same direction as the rotating shaft 11. As the processing proceeds to the initial chamfered portion 12a, the force is gradually applied to the roller 26, and the chamfering processing almost stops.

By continuously performing such an operation, the chamfered portion 12a can last semi-permanently until the life of the grinding tool 12.

Next, the reduction amount of the electrolytic action concentrated on the edge portion of the grinding tool 12 will be described. FIG. 3 shows a grinding tool 12
FIG. 4 shows a model of a partial cross-sectional view of the grinding tool 12 and the electrode 19 when the grinding tool 12 is not chamfered, and FIG. 4 shows a model of a partial cross-sectional view of the grinding tool 12 and the electrode 9 when the grinding tool 12 is chamfered.

In FIG. 3, the machined surface 13 of the grinding tool 12
Let R _{0 be} the radius of curvature, and D be the tool diameter of the grinding tool 12.
The electrolytic action at the outer peripheral edge (point K) of the grinding tool 12 occurs between the GH of the electrode 19. A point G on the electrode 19 is an intersection point on an extension of a line segment passing from the center of curvature O ₁ to the point K, and H
The point is a line perpendicular to the rotation axis 11 and is an intersection point on an extension of a line segment passing through the point K. At each point on the electrolytic surface 19a outside the point H, the outer peripheral surface of the grinding tool 12 becomes a current-carrying portion having the shortest distance. However, it is a precondition that the coolant 24 is interposed therebetween, and when the coolant 24 is not interposed, each point is also concentrated at the K point. Further, even if it acts, it is less affected by the wide gap and the action being dispersed.

GH is calculated. When a perpendicular line is drawn from the point K to the rotating shaft 11 and the intersection with the axis of the rotating shaft 11 is T and the intersection with the electrolytic surface 19a on the axis of the rotating shaft 11 is O ₂ , the formula 1 is obtained.

[0035]

[Equation 1]

Now, from KT = D / 2, O ₁ K = R ₀ , Equation 1
Becomes equations 2 and 3.

[0037]

[Equation 2]

[0038]

[Equation 3]

Further, the equation 4 is established.

[0040]

[Equation 4]

Then, KT = D / 2, O ₁ H = R ₀ + d
From Equation 3 and Equation 4, Equation 4 becomes Equation 5.

[0042]

[Equation 5]

HT is calculated by the equation 6.

[0044]

[Equation 6]

∠O ₂ O ₁ H = θ ₂ , ∠O ₂ O ₁ G = θ ₁
Then, Equation 7 is obtained.

[0046]

[Equation 7]

Since GH = HO ₂ −GO ₂ , GH is given by
Is calculated by

[0048]

[Equation 8]

Therefore, the length of this GH is the radius of curvature R
_It is determined by ₀ , the tool diameter D, and the gap d between the electrode 19 and the processing surface 13. Next, the amount of concentration of electrolytic action when the grinding tool is chamfered will be shown. In FIG. 4, the tool diameter is a chamfering margin of D +, which is chamfered at an angle of θ ₃ from the tangent line at the point K.

On the electrolytic surface 19a outside the point G, the point at which the point K is at the shortest distance is the intersection point (point I) with the electrolytic surface 19a when it is extended perpendicularly to the chamfered line (plane) from the point K. )
Is. Outside the point I, the chamfered line (face) is at the shortest distance than the point K. Therefore, it is the range between the GIs that concentrates on the K point.

The gap d is much smaller than the radius of curvature R ₀ . Therefore, GI can be approximated to GI = d × sin (θ ₃ ).

For example, when the radius of curvature R ₀ = 100 mm, the gap d = 0.1 mm, and the chamfering angle θ ₃ = 20 degrees, the relationship between the amount of electrolysis concentrated at the outer peripheral edge (point K) and the tool diameter D is shown. 5 shows. From this figure, it can be seen that the concentration of electrolysis is smaller when chamfering is performed than when chamfering is not performed. In this figure, the tool diameter D is actually 50 mm
At that time, the presence or absence of chamfering was compared. As a result, FIG.
When the chamfering is not performed, the member 14 to be processed had deep scratches as shown in FIG. On the other hand, when chamfered, scars were scarcely seen as shown in FIG. Further, the change in shape of the member to be processed 14 was smaller than that when the member 14 was not chamfered.

By chamfering in this manner, the electrolytic action concentrated on the outer periphery of the grinding tool is reduced, the shape is maintained, and the accuracy of the workpiece can be maintained. Further, since the amount of abrasive grains and the like that fall off is reduced, it is possible to prevent deep scratches due to rolling of the abrasive grains. In addition, the chamfered portion 12a of the chamfering tool 27
Even if the contact surface with is spherical, the same effect can be obtained. Further, as shown in FIG. 8, when the processing surface 13 of the grinding tool 12 is concave, the inclination (θ) of the chamfering tool and the roller 26
The same effect can be obtained by adjusting.

[0054]

Second Embodiment FIG. 9 is a front view showing a second embodiment. In this embodiment, the disc-shaped ring tool 37 is applied to the processing surface 13 without providing the chamfering tool 27 in the first embodiment. The ring tool 37 is rotatably held by a holder 39 via a bearing 38. The holder is table 2
8 and is different from the first embodiment in that the shaft 25 holding the roller 26 rotatably is fixed to the holder 39, and the other configurations are the same as those of the first embodiment. The same numbers are given to the parts, and the description thereof is omitted.

The ring tool 37 in this embodiment is formed by bonding powder of diamond or the like to the surface facing the chamfered portion 12a by a bond, and the chamfering process is carried out by rotating the chamfered portion 12a with this surface. This chamfering process is adjusted depending on how the roller 26 hits the processed surface, so that the area of the chamfered portion 12a can be maintained. In the first embodiment, since the chamfering process is accompanied by the chamfering portion 12a and the ring tool 37, it is possible to prevent an increase in heat generation and an increase in vibration even when the grinding tool 12 rotates at a high speed.
Extends the life of.

[0056]

Third Embodiment FIG. 10 is a front view showing a third embodiment. In the present embodiment, the cup-type grinding tool 47 is applied to the processing surface 13 without providing the ring tool 27 in the second embodiment,
The difference is that the cup-type grinding tool 47 can be freely rotated by a motor 48, and the other components are the same components. The same components are designated by the same reference numerals and the description thereof is omitted.

The cup-type grinding tool 47 in this embodiment has a powder such as diamond bonded to the surface facing the chamfered portion 12a by a bond, and the chamfered portion 12a is chamfered by forced rotation using a motor 48 as a drive source. To process.
Further, the contact (processing) with the chamfered portion 12a is made at two positions, the front side and the other side.

According to this embodiment, since the chamfering is forcibly performed, the working efficiency is high. Therefore, the grinding tool 12 is worn quickly and is effective when high-speed chamfering is required. Further, when the coolant is supplied to the contact point between the cup-type grinding tool 47 and the grinding tool 12, the removal of machining scraps is further ensured.

[0059]

Fourth Embodiment FIG. 11 is a front view of the fourth embodiment, and FIG. 12 is an enlarged view of a rod-shaped tool. In the present embodiment, the same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, a large number of insulating rod-shaped tools 57 are held on the outer peripheral surface of the electrode 19, and abrasive grains are embedded in the subordinate rotation side (right side surface in the figure) (FIG. 12). In addition, the tip of the rod-shaped tool 57 has a protruding member 5 excellent in lubricity.
9 is held and is set to project to the subordinate rotation side (right side surface in the drawing). Further, the grinding tool 12 was changed from a hemispherical shape (convex shape) to a planar shape.

When the machining is started, the workpiece 14 is subordinately rotated due to the relative speed difference between the grinding tool 12 and the machining surface 13. In conjunction with this, the holding pan 15, the electrode 19, the rod-shaped tool 5
7 also rotates. At this time, the bar-shaped tool 57 moves the chamfer 12
The chamfering process is performed with the abrasive grains 58 in contact with a. After that, when the rod-shaped tool 57 rotates up to the machining surface 13, the protruding member 5
9 contacts the machining surface 13, and the rod-shaped tool 57 rotates on the machining surface 13 in a non-contact manner to prevent machining on the machining surface 13 by the abrasive grains 58.

Further, if the thickness of the member to be processed 14 is constant, even if the grinding tool 12 is worn, the holding plate 15 follows it, so that chamfering can be controlled. According to this embodiment, since the tool is fixed to the holding tray, chamfering can be performed extremely easily. Further, the protruding member may be a rotating body.

[0064]

Fifth Embodiment FIG. 13 is a front view showing a fifth embodiment. In the present embodiment, the same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, the rotary shaft 11
A tool pedestal 60 is held on the upper surface of, and the upper surface has a planar shape. A large number of chamfered pellet tools 61 are attached to this surface. The upper surface of the pellet tool 61 has the same shape as that of the workpiece 11.

According to this embodiment, since the tool is chamfered until the end of its service life, it is not necessary to carry out chamfering. Further, in the present embodiment, the flat-shaped pellet tool is used, but the same effect can be obtained even with the spherical shape. Even when the electrode shape and the processing method are different, similar effects can be obtained when the electrolysis is concentrated on the edge portion of the grinding tool.

[0066]

As described above, according to the present invention,
By preventing the electrolysis from concentrating on the edge part of the grinding tool, it is possible to maintain the shape of the grinding tool and prevent the occurrence of scratches due to the rolling of the dropped abrasive grains.

[Brief description of drawings]

FIG. 1 is a front view of the basic configuration of the present invention.

FIG. 2 is a front view of the first embodiment.

FIG. 3 is a partial front view showing the processing of the first embodiment.

FIG. 4 is a partial front view showing the processing of the first embodiment.

FIG. 5 is a characteristic diagram of the amount of electrolysis and the tool diameter.

FIG. 6 is a characteristic diagram showing a scratch.

FIG. 7 is a characteristic diagram when there is no scratch.

FIG. 8 is a front view of a modified example of the first embodiment.

FIG. 9 is a front view of the second embodiment.

FIG. 10 is a front view of the third embodiment.

FIG. 11 is a front view of the fourth embodiment.

FIG. 12 is an enlarged view of the fourth embodiment.

FIG. 13 is a front view of the fifth embodiment.

FIG. 14 is a front view of a conventional device.

FIG. 15 is a plan view of grinding of a conventional device.

FIG. 16 is a diagram illustrating grinding of a conventional device.

[Explanation of symbols]

 1 Conductive grinding tool 2 Chamfering tool 3 Adjusting member 4 Workpiece member 5 Electrode 6 Coolant

Claims (3)

[Claims] 1. A grinding method in which an electrode holding a member to be processed is used as a cathode, a rotating conductive grinding tool is used as an anode, and working is performed while supplying a coolant between the conductive grinding tool and the electrode. An electrolytic in-process dressing grinding method, which comprises chamfering an outer peripheral edge portion of a conductive grinding tool on the side of a workpiece, and adjusting the chamfering amount according to wear of the conductive grinding tool. 2. An electrode that holds a work piece and is applied to a cathode, a conductive grinding tool that grinds a work piece by rotation and is applied to an anode, and between the conductive grinding tool and the electrode. A coolant supply means for supplying a coolant to the chamfering tool, a chamfering tool that chamfers the outer peripheral edge portion by contacting the outer peripheral edge portion of the conductive grinding tool on the workpiece side, and a chamfering tool in contact with the conductive abrasive tool. And an adjusting member for adjusting the chamfering amount of the electrolytic in-process dressing grinding apparatus. 3. An electrode applied to a cathode while holding a member to be processed, a rotating body which is rotated to be applied to an anode, and a chamfered outer periphery which is attached to the rotating body to grind the processed member. An electrolytic in-process dressing grinding apparatus, comprising: an abrasive pellet to be used; and a coolant supply means for supplying a coolant between the abrasive pellet and a workpiece.