JP3304163B2 - Electrolytic in-process dressing grinding machine - Google Patents
Electrolytic in-process dressing grinding machineInfo
- Publication number
- JP3304163B2 JP3304163B2 JP10734193A JP10734193A JP3304163B2 JP 3304163 B2 JP3304163 B2 JP 3304163B2 JP 10734193 A JP10734193 A JP 10734193A JP 10734193 A JP10734193 A JP 10734193A JP 3304163 B2 JP3304163 B2 JP 3304163B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding tool
- grinding
- electrolytic
- workpiece
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、レンズ等の被加工物の
倣い研削加工等において、研削工具のドレッシングのム
ラを防止できる電解インプロセスドレッシング研削装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic in-process dressing grinding apparatus which can prevent unevenness in dressing of a grinding tool in profile grinding of a workpiece such as a lens.
【0002】[0002]
【従来の技術】一般に、レンズ等の被加工物の研削加工
は、研削工具を回転するとともに、被加工物を研削工具
で揺動して行っている。しかし、研削工具が目詰まりを
起こして研削能力が低下し、研削に長時間を要する問題
があった。そこで、上記問題を解決するため、研削工具
の加工面を電解インプロセスドレッシングしつつ研削加
工を行う方法が案出され、かかる研削方法を実施するた
めの装置としては、例えば特開平5−16064号公報
に開示されている。2. Description of the Related Art Generally, grinding of a workpiece such as a lens is performed by rotating a grinding tool and swinging the workpiece with the grinding tool. However, there has been a problem that the grinding tool is clogged, the grinding ability is reduced, and grinding takes a long time. In order to solve the above problem, a method has been devised in which grinding is performed while electrolytically in-process dressing the processing surface of a grinding tool. As an apparatus for performing such a grinding method, for example, Japanese Patent Application Laid-Open No. HEI 5-16064 has been proposed. It is disclosed in the gazette.
【0003】図7は、上記研削装置を示す概略構成図
で、不図示の駆動装置と連結した回転軸1の先端に導電
性を有する研削工具2が一体的に形成されている。研削
工具2はダイヤモンド粉末等の砥粒を導電性のボンドで
結合構成したもので、その先端は半球形状の加工面3に
形成されており、加工面3には対応する形状の被加工面
を有した被加工部材(ワーク)4が当接されている。被
加工部材4は保持皿5により保持されている。FIG. 7 is a schematic configuration diagram showing the above-mentioned grinding apparatus. A grinding tool 2 having conductivity is integrally formed at the tip of a rotating shaft 1 connected to a driving device (not shown). The grinding tool 2 is formed by bonding abrasive grains of diamond powder or the like with a conductive bond, and the tip is formed on a hemispherical processing surface 3. The member to be processed (work) 4 is in contact therewith. The workpiece 4 is held by a holding plate 5.
【0004】保持皿5の上面中央部には凹部が形成さ
れ、凹部には略棒形状でその先端が球形をした球心6a
を有するカンザシ6が係合している。カンザシ6の上端
は加圧装置7に接続されており、加圧装置7は揺動駆動
装置8に連結保持されている。保持皿5の外周壁には被
加工部材4を囲繞するリング形状の電極9が垂設されて
おり、電極9の電解面9aは研削工具2の加工面3と僅
かな隙間lを有するように設けられている。A concave portion is formed in the center of the upper surface of the holding plate 5, and the concave portion has a substantially bar-shaped spherical core 6a having a spherical tip.
Is engaged. The upper end of the kansashi 6 is connected to a pressurizing device 7, which is connected to and held by a swing drive device 8. A ring-shaped electrode 9 surrounding the workpiece 4 is suspended from the outer peripheral wall of the holding plate 5, and the electrolytic surface 9 a of the electrode 9 has a slight gap 1 with the processing surface 3 of the grinding tool 2. Is provided.
【0005】保持皿5の近傍には放電加工用のパルス電
圧を発生する直流電源10が設置されている。直流電源
10の(+)極は回転軸1の外周面と接触するブラシ1
1を介して研削工具2に接続されている。また、直流電
源10の(−)極はカンザシ6、保持皿5を介して電極
9に接続されている。この直流電源10と前記揺動駆動
装置8は制御装置12に接続されて制御される。A DC power supply 10 for generating a pulse voltage for electric discharge machining is provided near the holding plate 5. The (+) pole of the DC power supply 10 is a brush 1 that contacts the outer peripheral surface of the rotating shaft 1.
1 is connected to a grinding tool 2. The (−) pole of the DC power supply 10 is connected to the electrode 9 via the wrench 6 and the holding plate 5. The DC power supply 10 and the swing driving device 8 are connected to and controlled by a control device 12.
【0006】電極9の近傍には不図示の給水装置と連結
したパイプ13が設けられており、電極9と研削工具2
との隙間lにクーラント(冷却媒体)14を供給できる
ように構成されている。[0006] A pipe 13 connected to a water supply device (not shown) is provided near the electrode 9, and the electrode 9 and the grinding tool 2 are provided.
Is provided so that a coolant (cooling medium) 14 can be supplied to the gap 1 between the two.
【0007】以上の構成からなる研削装置を用いて被加
工部材4を研削加工する際、保持皿5の揺動駆動(揺動
中心O)と研削工具2の回転駆動と同時に、研削工具2
の加工面3と電極9の電解面9aとの隙間lにクーラン
ト14を供給する。そして、直流電源10により研削工
具2と電極9とに印加した電圧によって、研削工具2の
加工面(砥粒面)3に電解を生じさせ、研削工具2の加
工面全面をドレッシングする。なお、研削工具中の揺動
は制御装置12によって行われ、直流電源10による電
圧の印加のタイミングも制御装置12によって行われ
る。When the workpiece 4 is ground by using the grinding apparatus having the above configuration, the driving of the holding plate 5 (oscillation center O) and the rotation of the grinding tool 2 are simultaneously performed, and the grinding tool 2 is rotated.
The coolant 14 is supplied to a gap 1 between the processed surface 3 of the electrode 9 and the electrolytic surface 9a of the electrode 9. Then, by the voltage applied to the grinding tool 2 and the electrode 9 by the DC power source 10, electrolysis is generated on the processing surface (abrasive surface) 3 of the grinding tool 2, and the entire processing surface of the grinding tool 2 is dressed. The swing in the grinding tool is performed by the control device 12, and the timing of the application of the voltage by the DC power supply 10 is also performed by the control device 12.
【0008】[0008]
【発明が解決しようとする課題】しかし、上記従来の研
削装置においては、研削工具2のエッジ部に電解作用が
集中し、他の部分よりもボンド突出が促進される問題が
あった。すなわち、図8のリング形状の電極9と研削工
具2の部分断面図に示すように、研削工具2の外周面2
aの延長上における電極面9aのP点より外側部におい
てもクーラント14が介在するため、電解面9aと最短
距離にある研削工具2のエッチング部2bとの間で電解
が集中的に発生し、電解量に応じてエッジ部2bのドレ
ッシングが他の部分よりも多く行われる。そのため、エ
ッジ部2bにおいて必要以上にボンド溶出が起こり、研
削工具2の外周から形状が崩れ、それにならって被加工
部材4の形状精度が低下する問題があった。また、ボン
ド溶出により砥粒の脱落も促進されるので、研削工具2
と被加工部材4との隙間に介在する脱落した砥粒の量が
増加し、被加工部材4にキズが入るという問題があっ
た。However, in the above-mentioned conventional grinding apparatus, there is a problem that the electrolytic action is concentrated on the edge portion of the grinding tool 2 and the bond protrusion is promoted more than other portions. That is, as shown in the partial sectional view of the ring-shaped electrode 9 and the grinding tool 2 in FIG.
Since the coolant 14 also intervenes on the outer side of the point P of the electrode surface 9a on the extension of a, electrolysis occurs intensively between the electrolytic surface 9a and the etching portion 2b of the grinding tool 2 at the shortest distance, Dressing of the edge portion 2b is performed more than other portions in accordance with the amount of electrolysis. For this reason, there is a problem that bond elution occurs more than necessary at the edge portion 2b, the shape is broken from the outer periphery of the grinding tool 2, and the shape accuracy of the workpiece 4 is reduced accordingly. In addition, the removal of the abrasive grains is promoted by the bond elution, so that the grinding tool 2
There is a problem that the amount of the dropped abrasive grains interposed in the gap between the workpiece 4 and the workpiece 4 increases, and the workpiece 4 is scratched.
【0009】本発明は、上記従来技術の問題点に鑑みて
なされたもので、研削工具のエッジ部に電解が集中する
ことを防止し、研削工具の形状を維持するとともに、脱
落した砥粒の転動による被加工部材のキズを生じさせる
ことなく研削加工を行うことができる電解インプロセス
ドレッシング研削装置を提供することを目的とする。The present invention has been made in view of the above-mentioned problems of the prior art, and prevents the concentration of electrolysis at the edge of the grinding tool, maintains the shape of the grinding tool, and reduces the size of the dropped abrasive grains. It is an object of the present invention to provide an electrolytic in-process dressing grinding apparatus capable of performing grinding without causing scratches on a workpiece due to rolling.
【0010】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、直流電源の陽極に接続した回転可能な導
電性研削工具と、直流電源の陰極に接続し、上記導電性
研削工具の加工面に対向して配置可能な電極との間にク
ーラントを供給し、上記加工面を電解ドレッシングする
電解インプロセスドレッシング研削装置において、上記
導電性研削工具の周面に金属あるいは樹脂に金属粉を混
入したペーストからなる導電層を設けた。In order to achieve the above object, the present invention relates to a rotatable conductive grinding tool connected to an anode of a DC power supply, and a conductive grinding tool connected to a cathode of a DC power supply. In an electrolytic in-process dressing grinding apparatus for supplying a coolant between an electrode that can be arranged opposite to a processing surface of the conductive grinding tool and electrolytically dressing the processing surface, a metal powder or a metal powder is formed on a peripheral surface of the conductive grinding tool. A conductive layer made of a paste mixed with is provided.
【0011】[0011]
【作用】上記構成によれば、電極と導電性研削工具との
間に電圧を印可しつつ、導電性研削工具を回転させるこ
とにより、導電性研削工具の加工面を電解ドレッシング
する。このとき、導電性研削工具の周面に設けた金属あ
るいは導電層に電解が集中し、金属あるいは導電層の溶
出が上記加工面よりも促進されるため、導電性研削工具
のエッジ部に電解が集中せずに加工面の電解ドレッシン
グが行われる。According to the above construction, while the voltage is applied between the electrode and the conductive grinding tool, the conductive grinding tool is rotated to electrolytically dress the work surface of the conductive grinding tool. At this time, the electrolysis concentrates on the metal or the conductive layer provided on the peripheral surface of the conductive grinding tool, and the elution of the metal or the conductive layer is promoted more than the above-mentioned processed surface. Electrolytic dressing of the processed surface is performed without concentration.
【0012】[0012]
【実施例1】まず、本発明の具体的な実施例を説明する
前に、本発明の概要を説明する。本発明の概要は、直流
電源の陽極に接続した導電性研削工具を回転自在に設
け、直流電源の陰極に接続したリング形状の電極を前記
導電性研削工具の加工面に対向自在に設けるとともに、
前記導電性研削工具と電極との間にクーラントを供給す
る手段を設けた電解インプロセスドレッシング研削装置
において、前記導電性研削工具の周面に金属あるいは樹
脂に金属粉を混入したペーストからなる導電層を設けて
構成した。上記構成によれば、導電性研削工具の加工面
に沿って被加工部材を相対的に揺動させるとともに、導
電性研削工具の加工面と電極(電解面)との間にクーラ
ントを供給しつつ被加工部材を研削加工する。そして、
電解面と上記加工面の中央とが重なっているときに、電
極と導電性研削工具との間に電圧を印加しつつ導電性研
削工具を少なくとも1回転させ、上記加工面の電解ドレ
ッシングを行う。このとき、導電性研削工具の周面に設
けた導電層に電解が集中、導電層の溶出が他の部分(加
工面)より促進され、導電性研削工具のエッジ部に集中
せずに加工面全面の電解ドレッシングが行われる。次
に、本発明の具体的な実施例を図に基づいて説明する。
図1は、本発明の実施例1の電解インプロセスドレッシ
ング研削装置(以下、研削装置という)を一部断面にし
て示す概略構成図、図2は、図1のA矢視図である。本
実施例の研削装置には、導電性を有し、その上面、すな
わち加工面21aを球面形状に形成した研削工具21
が、図示を省略した駆動源装置と連結した回転軸22の
先端に一体的に設けられている。回転軸22は、加工面
21aの曲率中心O1を支点に球心揺動運動自在に設け
られ、ベアリング23を介して下軸べース24により軸
心回りに回転自在に保持されている。Embodiment 1 First, before describing a specific embodiment of the present invention, an outline of the present invention will be described. The outline of the present invention is to provide a conductive grinding tool rotatably connected to the anode of the DC power supply, and to provide a ring-shaped electrode connected to the cathode of the DC power supply so as to be able to oppose the processing surface of the conductive grinding tool,
In an electrolytic in-process dressing grinding apparatus provided with a means for supplying a coolant between the conductive grinding tool and the electrode, a conductive layer made of a paste obtained by mixing metal or resin with metal powder on a peripheral surface of the conductive grinding tool. Was provided. According to the above configuration, the workpiece is relatively swung along the working surface of the conductive grinding tool, and the coolant is supplied between the working surface of the conductive grinding tool and the electrode (electrolytic surface). Grind the workpiece. And
When the electrolytic surface and the center of the processing surface overlap, the conductive grinding tool is rotated at least once while applying a voltage between the electrode and the conductive grinding tool to perform electrolytic dressing of the processing surface. At this time, electrolysis concentrates on the conductive layer provided on the peripheral surface of the conductive grinding tool, elution of the conductive layer is promoted from other portions (processed surface), and the processed surface is not concentrated on the edge portion of the conductive grinding tool. Electrolytic dressing of the entire surface is performed. Next, a specific embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing a partial cross section of an electrolytic in-process dressing grinding device (hereinafter, referred to as a grinding device) according to a first embodiment of the present invention, and FIG. The grinding apparatus according to the present embodiment has a grinding tool 21 having conductivity and having an upper surface, that is, a processing surface 21a formed in a spherical shape.
Are integrally provided at the tip of the rotary shaft 22 connected to a drive source device (not shown). Rotary shaft 22, the center of curvature O 1 of the processing surface 21a as a fulcrum mounted for spherical center swinging motion, and is rotatably held about the axis by the lower shaft base over scan 24 via a bearing 23.
【0013】研削工具21の加工面21aの上方には、
加工面21aと対応した形状の被加工面25aを有する
被加工部材25を、加工面21aと被加工面25aとを
当接させた状態で保持する保持具26が設けられてい
る。保持具26の保持部である下面は、被加工面25a
の反対側面と同形状に形成され、この反対側面を保持す
るようなっている。この保持具26は、その上面中心に
形成した球形状の凹部内に、棒形状のカンザシ27の先
端球形部を係合した状態でカンザシ27により保持され
ている。カンザシ27は、図示を省略した加圧装置に接
続されている。これにより、被加工部材21は、保持具
26を介してカンザシ27によって加圧されるととも
に、保持具26の上面中心を支点として加工面21a上
で揺動されるようになっている。Above the processing surface 21a of the grinding tool 21,
A holder 26 is provided for holding a workpiece 25 having a workpiece surface 25a having a shape corresponding to the workpiece surface 21a in a state where the workpiece surface 21a and the workpiece surface 25a are in contact with each other. The lower surface, which is a holding portion of the holder 26, is a work surface 25a.
And is formed in the same shape as the opposite side surface of the device to hold the opposite side surface. The holder 26 is held by the wrench 27 in a state where the tip spherical portion of the bar-shaped wrench 27 is engaged in a spherical recess formed at the center of the upper surface. The kansashi 27 is connected to a pressurizing device (not shown). As a result, the workpiece 21 is pressed by the wrench 27 via the holder 26 and swings on the processing surface 21a with the center of the upper surface of the holder 26 as a fulcrum.
【0014】保持具26の外周面には、リング状の電極
28が固定され、その電解面28aが研削工具21の加
工面21aと所定の隙間を介して非接触で対向配置され
るように設けられている。上記カンザシ27には、直流
電源29の陰極が接続され、電極28は、保持具26を
介して直流電源29の陰極と電気的に接続されている。A ring-shaped electrode 28 is fixed to the outer peripheral surface of the holder 26, and is provided such that its electrolytic surface 28a is opposed to the processing surface 21a of the grinding tool 21 through a predetermined gap in a non-contact manner. Have been. The cathode of the DC power supply 29 is connected to the Kansashi 27, and the electrode 28 is electrically connected to the cathode of the DC power supply 29 via the holder 26.
【0015】直流電源29の陽極は、回転軸22の外周
面と接触する給電ブラシ30、端子31およびガイド3
2に配設した導電部32aを介して研削工具21と電気
的に接続されている。端子31は、回転軸22と平行な
位置で下軸ベース24上に固定され、かつ回転軸22と
連動して球心揺動自在なアーム33の先端に固定されて
いる。The anode of the DC power supply 29 is connected to the power supply brush 30, the terminal 31 and the guide 3
2 is electrically connected to the grinding tool 21 via the conductive portion 32a. The terminal 31 is fixed on the lower shaft base 24 at a position parallel to the rotation shaft 22, and is fixed to a tip end of an arm 33 that can swing around a spherical center in conjunction with the rotation shaft 22.
【0016】ガイド32は、端子31と対向するように
して装置本体のガイド保持部34に固定されている。こ
のガイド32には、直流電源29の陽極に接続した導電
部32aと絶縁部32bとが設けられ、導電部32a
は、研削工具21の回転中心における加工面21a上の
位置と電極28の電解面28aが一致、あるいはその近
傍に位置したときに端子31と接触するように配設され
ている。The guide 32 is fixed to a guide holding portion 34 of the apparatus main body so as to face the terminal 31. The guide 32 is provided with a conductive portion 32a connected to the anode of the DC power supply 29 and an insulating portion 32b.
Is disposed such that the terminal 31 is in contact when the position on the processing surface 21a at the center of rotation of the grinding tool 21 and the electrolytic surface 28a of the electrode 28 coincide with each other or are located in the vicinity thereof.
【0017】研削工具21の外周面には、銅合金層35
が形成され、研削工具21を介して直流電源29の陽極
と電気的に接続されている。図中、36は、研削工具2
1の加工面21aと電極28の電解面28aとの隙間に
クーラント37を供給するクーラントノズルである。A copper alloy layer 35 is provided on the outer peripheral surface of the grinding tool 21.
Is formed, and is electrically connected to the anode of the DC power supply 29 via the grinding tool 21. In the figure, 36 is a grinding tool 2
The coolant nozzle supplies the coolant 37 to a gap between the first processing surface 21a and the electrolytic surface 28a of the electrode 28.
【0018】上記構成における研削装置にあっては、ク
ーラントノズル36からクーラント37を供給するとと
もに、研削工具21を回転かつ球心揺動運動することに
より、保持具26で保持した被加工部材25の被加工面
25aが研削工具21の加工面21aにより研削加工さ
れる。そして、回転軸22の球心揺動に連動して、アー
ム33の先端に固定した端子31が加工面21aの曲率
中心O1 を支点に球心揺動する。この揺動中に、端子3
1がガイドの導電部32aと接触したときのみ電流が流
れ、電極28と研削工具21、銅合金層35との間で電
解作用が発生する。端子31と導電部32aとが接触す
るときは、加工面21aの回転中心と電解面28aとが
一致あるいは近接した場合であるので、加工面21aの
全面が電解ドレッシングされる。In the grinding apparatus having the above-described structure, the coolant 37 is supplied from the coolant nozzle 36, and the grinding tool 21 is rotated and oscillatingly moved to rotate the grinding tool 21. The work surface 25a is ground by the work surface 21a of the grinding tool 21. The terminal 31 fixed to the tip of the arm 33 swings around the center of curvature O 1 of the processing surface 21 a in conjunction with the swing of the rotating shaft 22. During this swing, the terminal 3
Electric current flows only when 1 contacts the conductive portion 32a of the guide, and an electrolytic action occurs between the electrode 28, the grinding tool 21, and the copper alloy layer 35. When the terminal 31 and the conductive portion 32a come into contact with each other, the rotation center of the processing surface 21a and the electrolytic surface 28a coincide with or approach each other. Therefore, the entire processing surface 21a is electrolytically dressed.
【0019】このとき、研削工具21の外周面は銅合金
層35で覆われているので、電解作用は銅合金層35の
エッジ部35aに集中する。このため、銅合金層35の
溶出は促進されるが、研削工具21の端面におけるボン
ド溶出は、他の加工面21a部分と同レベルになり、加
工面21aの全面の電解が均等に行われる。At this time, since the outer peripheral surface of the grinding tool 21 is covered with the copper alloy layer 35, the electrolytic action is concentrated on the edge 35a of the copper alloy layer 35. For this reason, the elution of the copper alloy layer 35 is promoted, but the bond elution at the end face of the grinding tool 21 is at the same level as the other processing surface 21a, and the entire surface of the processing surface 21a is evenly electrolyzed.
【0020】本実施例によれば、研削工具21の端面に
電解作用が集中せず、加工面21aの全面の電解ドレッ
シングを均等に行うことができるので、加工面21aの
形状を維持できるため、被加工部材25を高精度に加工
できるとともに、砥粒の脱落量が減少するので砥粒転動
によって被加工部材25にキズが生じるのを防ぐことが
できる。また、銅合金層35に被加工部材21が接触し
ても、酸化物がクッションの役目をしてキズが入ること
はない。According to this embodiment, since the electrolytic action is not concentrated on the end face of the grinding tool 21 and the electrolytic dressing of the entire surface of the processing surface 21a can be performed uniformly, the shape of the processing surface 21a can be maintained. The workpiece 25 can be machined with high precision, and the amount of the abrasive grains falling off can be reduced, so that it is possible to prevent the workpiece 25 from being scratched by the rolling of the abrasive grains. Further, even when the workpiece 21 contacts the copper alloy layer 35, the oxide serves as a cushion and does not scratch.
【0021】また、銅合金に代えて、アルミ合金を使用
しても同様な効果が得られる。さらに、被加工部材21
の接触時の摩擦を減少させるために、潤滑剤として微細
な砥粒(ダイヤモンド、酸化セリウム、アルミナ)を合
金に混入してもよい。Similar effects can be obtained by using an aluminum alloy instead of a copper alloy. Further, the workpiece 21
Fine abrasive grains (diamond, cerium oxide, alumina) may be mixed into the alloy as a lubricant in order to reduce friction at the time of contact.
【0022】[0022]
【実施例2】図3は、本発明の実施例2を一部断面にし
て示す概略構成図である。本実施例は、前記実施例1に
おける銅合金35に代えて、研削工具21の外周面に低
融点金属層40を配設した点と、被加工部材25を凹形
状から凸形状に変更し、それに合わせて研削工具21の
加工面21aを凸形状から凹形状に変更した点が異な
り、その他の構成は同一の構成部分から成るもので同一
構成部分には同一番号を付し、その説明を省略する。低
融点金属層40を形成する低融点金属としては、例え
ば、Bi−Sn系金属、Zn系金属を用いることができ
る。[Embodiment 2] FIG. 3 is a schematic configuration diagram showing a second embodiment of the present invention in partial cross section. In the present embodiment, instead of the copper alloy 35 in the first embodiment, the point that the low melting point metal layer 40 is disposed on the outer peripheral surface of the grinding tool 21 and the workpiece 25 is changed from a concave shape to a convex shape, The difference is that the machining surface 21a of the grinding tool 21 is changed from a convex shape to a concave shape accordingly, and the other components are composed of the same components, and the same components are denoted by the same reference numerals and description thereof is omitted. I do. As the low melting point metal forming the low melting point metal layer 40, for example, a Bi-Sn based metal or a Zn based metal can be used.
【0023】本実施例にあっては、研削工具21の凹形
状の加工面21aに被加工部材25の凸形状の被加工面
25aに当接し、加工面21aの曲率中心O2 を支点に
球心揺動して実施例1と同様に被加工部材25に研削加
工を施す。この研削加工に際し、電極28には実施例1
と同様の位置にて通電し、被加工面25aの電解ドレッ
シングが行われ、このとき、実施例1と同様に低融点金
属層40のエッジ部40aに電解作用が集中する。In this embodiment, the concave processing surface 21a of the grinding tool 21 is brought into contact with the convex processing surface 25a of the workpiece 25, and the center of curvature O 2 of the processing surface 21a is used as a fulcrum. The workpiece 25 is ground by swinging the heart in the same manner as in the first embodiment. At the time of this grinding, the electrode 28 is provided with the first embodiment.
Is applied at the same position as described above, and the electrolytic dressing of the processing surface 25a is performed. At this time, the electrolytic action is concentrated on the edge portion 40a of the low melting point metal layer 40 as in the first embodiment.
【0024】本実施例によれば、実施例1と同様に研削
工具21の形状崩れを防止することができる。また、低
融点金属層40は、研削工具21のメタルボンド(鉄
系、ブロンズ系、ニッケル系)と比較して柔らかいの
で、被加工部材25との摩擦によるキズの発生防止に大
きな効果がある。また、低融点金属は研削工具の焼結
後、低温で焼結するこどができるので、製法上容易にな
る。なお、被加工部材25の接触時の摩擦を減少させる
ための潤滑剤として、微細な砥粒(ダイヤモンド、酸化
セリウム、アルミナ)を低融点金属に混入してもよい。According to the present embodiment, as in the first embodiment, the shape of the grinding tool 21 can be prevented from collapsing. Further, since the low-melting metal layer 40 is softer than the metal bond (iron, bronze, nickel) of the grinding tool 21, it has a great effect in preventing scratches due to friction with the workpiece 25. In addition, since the low melting point metal can be sintered at a low temperature after the sintering of the grinding tool, it becomes easy in the production method. Note that fine abrasive grains (diamond, cerium oxide, alumina) may be mixed into the low melting point metal as a lubricant for reducing friction when the workpiece 25 contacts.
【0025】図4は、実施例2における研削工具の変形
例を示す断面図である。変形例の研削工具21は、研削
工具22の中心に孔41を設け、この孔41からクーラ
ントを供給しつつ研削加工を行う場合に用いられるもの
で、外周面と同様に孔41の内周面にも低融点金属層4
0が設けられている。このため、外周面と同様に加工面
21aの中心部の形状崩れを防止でき、砥粒による被加
工部材のキズ発生を防ぐことができる。FIG. 4 is a sectional view showing a modification of the grinding tool according to the second embodiment. The grinding tool 21 of the modification is used when a hole 41 is provided at the center of the grinding tool 22 and grinding is performed while supplying coolant from the hole 41, and the inner peripheral surface of the hole 41 is similar to the outer peripheral surface. Low melting metal layer 4
0 is provided. For this reason, similarly to the outer peripheral surface, it is possible to prevent the shape of the central portion of the processing surface 21a from being deformed, and it is possible to prevent the generation of scratches on the workpiece by abrasive grains.
【0026】[0026]
【実施例3】図5は、本発明の実施例3を一部断面にし
て示す概略構成図である。本実施例は、前記実施例1に
おける被加工部材25を1個貼りから多数個貼りに変更
し、それに伴い、電極28、保持具26に代えて、多数
個保持具51を配設した点と、銅合金層35に代えて研
削工具21の外周面に銀ペースト50を配設した点とが
異なり、その他の構成は同一の構成部分から成るもので
同一構成部分には同一番号を付し、その説明を省略す
る。Third Embodiment FIG. 5 is a schematic configuration diagram showing a third embodiment of the present invention in a partial cross section. This embodiment is different from the first embodiment in that the number of the workpieces 25 to be processed is changed from one to many, and a plurality of holders 51 are provided instead of the electrodes 28 and the holders 26. , Except that the silver paste 50 is provided on the outer peripheral surface of the grinding tool 21 in place of the copper alloy layer 35, and the other components are composed of the same components, and the same components are given the same numbers, The description is omitted.
【0027】研削工具21の外周面に設けた銀ペースト
50は、エポキシ樹脂に銀粉末を導電性が得られる程度
混入して形成されている。また、多数個の被加工部材2
5を保持する多数個保持具51は、カンザシ27を介し
て通流電源29の陰極と電気的に接続され、実施例1の
電極28の役目を兼ねるように構成されている。The silver paste 50 provided on the outer peripheral surface of the grinding tool 21 is formed by mixing silver powder into epoxy resin to the extent that conductivity can be obtained. Also, a large number of workpieces 2
The multi-piece holder 51 for holding 5 is electrically connected to the cathode of the flow-through power supply 29 through the screwdriver 27 and is configured to also serve as the electrode 28 of the first embodiment.
【0028】本実施例にあっては、銀ペースト50のエ
ッジ部50aに電解作用が集中する。その他の作用は実
施例1と同様である。In this embodiment, the electrolytic action concentrates on the edge 50a of the silver paste 50. Other operations are the same as those of the first embodiment.
【0029】本実施例によれば、銀ペースト50の強度
は樹脂強度にほぼ等しいので、非常に柔らかく、脆いの
で、被加工部材25との摩擦によるキズの発生防止に大
きな効果がある。また、通常のメタルボンドの研削工具
の完成品に塗り、150度程度で接着することができ
る。なお、被加工部材25の接触時の摩擦を減少させる
ための潤滑剤として、微細な砥粒(ダイヤモンド、酸化
セリウム、アルミナ)を銀ペースト50に混入してもよ
い。According to the present embodiment, since the strength of the silver paste 50 is substantially equal to the resin strength, it is very soft and brittle, so that it has a great effect in preventing the occurrence of scratches due to friction with the workpiece 25. Further, it can be applied to a finished product of a normal metal bond grinding tool and bonded at about 150 degrees. Note that fine abrasive grains (diamond, cerium oxide, alumina) may be mixed into the silver paste 50 as a lubricant for reducing friction when the workpiece 25 contacts.
【0030】[0030]
【実施例4】図6は、本発明の実施例4を一部断面にし
て示す概略構成図である。本実施例では、前記実施例1
における研削工具21に代えて、多数個のペレット研削
工具61を貼付け治具60に貼付けて構成し、ペレット
研削工具61のそれぞれの外周面に銅合金層62を配設
した点が異なり、他の構成は同一の構成部分から成るも
ので同一構成部分には同一番号を付し、その説明を省略
する。Fourth Embodiment FIG. 6 is a schematic structural view showing a fourth embodiment of the present invention in a partial cross section. In this embodiment, the first embodiment is used.
Instead of the grinding tool 21 in the above, a large number of pellet grinding tools 61 are attached to an attaching jig 60, and the difference is that a copper alloy layer 62 is provided on each outer peripheral surface of the pellet grinding tools 61. The configuration is composed of the same components, and the same components are denoted by the same reference numerals and description thereof will be omitted.
【0031】本実施例にあっては、貼付け治具60を介
して回転軸に保持された多数個のペレット研削工具61
を揺動中心O1 を支点に球心揺動させて被加工部材25
の研削加工が行われる。そして、貼付け治具60の表面
における回転中心に電極28が一致、あるいはその近傍
に位置したときに端子31と導電部32aが接触し、各
ペレット研削工具61の加工面が実施例1と同様に電解
ドレッシングされる。このとき、銅合金層62のエッジ
部62aに電解作用が集中し、実施例1の1個の研削工
具21と同様に電解ドレッシングが行われる。In this embodiment, a large number of pellet grinding tools 61 held on a rotating shaft via an attaching jig 60
Is swung around the swing center O 1 as a fulcrum, and the workpiece 25 is swung.
Grinding is performed. Then, when the electrode 28 coincides with or is located near the center of rotation on the surface of the bonding jig 60, the terminal 31 and the conductive portion 32a contact each other, and the processing surface of each pellet grinding tool 61 is the same as in the first embodiment. Electrolytic dressing. At this time, the electrolytic action concentrates on the edge portion 62a of the copper alloy layer 62, and the electrolytic dressing is performed as in the case of the single grinding tool 21 of the first embodiment.
【0032】本実施例によれば、研削工具に多数個貼り
のペレット研削工具61を用いて、実施例1と同様な効
果を得ることができる。According to the present embodiment, the same effect as in the first embodiment can be obtained by using a large number of pellet grinding tools 61 as the grinding tools.
【0033】[0033]
【発明の効果】以上のように、本発明の電解インプロセ
スドレッシング研削装置によれば、研削工具の周面に導
電層を設け、研削工具の加工面の電解ドレッシング時に
導電層上に電解作用を集中させることができるため、研
削工具のエッジ部に電解が集中するのを防止し、加工面
全面の均一な電解ドレッシングを施すことができる。こ
れにより、研削工具の形状を維持し、かつ余分な砥粒の
脱落を防いで脱落した砥粒の転動によって被加工部材が
キズ付くのを防止しつつ研削加工を行うことができる。As described above, according to the electrolytic in-process dressing grinding apparatus of the present invention, the conductive layer is provided on the peripheral surface of the grinding tool, and the electrolytic action is applied to the conductive layer during the electrolytic dressing of the processing surface of the grinding tool. Since the concentration can be performed, it is possible to prevent the electrolysis from being concentrated on the edge portion of the grinding tool, and to perform a uniform electrolytic dressing on the entire surface of the processing surface. Thus, it is possible to perform the grinding while maintaining the shape of the grinding tool, preventing the removal of the excessive abrasive grains, and preventing the workpiece from being scratched by the rolling of the dropped abrasive grains.
【図1】本発明の実施例1を一部断面にして示す概略構
成図である。FIG. 1 is a schematic configuration diagram showing a first embodiment of the present invention in a partial cross section.
【図2】図1のA矢視図である。FIG. 2 is a view taken in the direction of arrow A in FIG. 1;
【図3】本発明の実施例2を一部断面にして示す概略構
成図である。FIG. 3 is a schematic configuration diagram showing a second embodiment of the present invention in a partial cross section.
【図4】本発明の実施例2における研削工具の変形例を
示す断面図である。FIG. 4 is a sectional view showing a modification of the grinding tool according to the second embodiment of the present invention.
【図5】本発明の実施例3を一部断面にして示す概略構
成図である。FIG. 5 is a schematic configuration diagram showing a third embodiment of the present invention in a partial cross section.
【図6】本発明の実施例4を一部断面にして示す概略構
成図である。FIG. 6 is a schematic configuration diagram showing a fourth embodiment of the present invention in a partial cross section.
【図7】従来の電解インプロセスドレッシング研削装置
を示す概略構成図である。FIG. 7 is a schematic configuration diagram showing a conventional electrolytic in-process dressing grinding apparatus.
【図8】従来の電解インプロセスドレッシング研削装置
の問題点を説明するための説明図である。FIG. 8 is an explanatory diagram for describing a problem of a conventional electrolytic in-process dressing grinding device.
21 研削工具 25 被加工部材 28 電極 29 直流電源 35,62 銅合金層 40 低融点金属層 50 銀ペースト 61 ペレット研削工具 21 Grinding Tool 25 Workpiece 28 Electrode 29 DC Power 35,62 Copper Alloy Layer 40 Low Melting Metal Layer 50 Silver Paste 61 Pellet Grinding Tool
Claims (1)
電性研削工具と、直流電源の陰極に接続し、上記導電性
研削工具の加工面に対向して配置可能な電極との間にク
ーラントを供給し、上記加工面を電解ドレッシングする
電解インプロセスドレッシング研削装置において、 上記導電性研削工具の周面に金属あるいは樹脂に金属粉
を混入したペーストからなる導電層を設けたことを特徴
する電解インプロセスドレッシング研削装置。1. A coolant between a rotatable conductive grinding tool connected to an anode of a DC power supply and an electrode connected to a cathode of the DC power supply and capable of being arranged facing a processing surface of the conductive grinding tool. And an electrolytic in-process dressing grinding apparatus for electrolytically dressing the machined surface, wherein an electroconductive layer made of a paste obtained by mixing metal or resin with metal powder is provided on a peripheral surface of the electroconductive grinding tool. In-process dressing grinding device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10734193A JP3304163B2 (en) | 1993-04-09 | 1993-04-09 | Electrolytic in-process dressing grinding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10734193A JP3304163B2 (en) | 1993-04-09 | 1993-04-09 | Electrolytic in-process dressing grinding machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06297314A JPH06297314A (en) | 1994-10-25 |
JP3304163B2 true JP3304163B2 (en) | 2002-07-22 |
Family
ID=14456603
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Application Number | Title | Priority Date | Filing Date |
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JP10734193A Expired - Fee Related JP3304163B2 (en) | 1993-04-09 | 1993-04-09 | Electrolytic in-process dressing grinding machine |
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JP (1) | JP3304163B2 (en) |
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WO2015068500A1 (en) * | 2013-11-11 | 2015-05-14 | オリンパス株式会社 | Polishing tool, polishing method, and polishing device |
CN115284176B (en) * | 2022-05-30 | 2024-06-18 | 南京茂莱光学科技股份有限公司 | Rapid trimming method for surface type precision of lens polishing die |
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1993
- 1993-04-09 JP JP10734193A patent/JP3304163B2/en not_active Expired - Fee Related
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