JPH07202079A - Ic socket - Google Patents

Abstract

PURPOSE:To provide an IC socket by which the electric property can be checked accurately by improving the electric contact. CONSTITUTION:This IC socket comprises a contact pin 8 which has a first contact face 8a touching and grazes a device lead 6 with a specified force, being provided in the position corresponding to the device lead 6 of a device 5 placed, and a second contact face 8b contacting with the position where the first contact face 8a contacts of the device lead 6 at energization.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket,
In particular, it relates to the structure of the contact portion of the contact pin that contacts the lead of the device.

[0002]

2. Description of the Related Art FIG. 4 is a sectional view showing the structure of a conventional IC socket, and FIG. 5 is a sectional view showing the operation of contact between a contact pin and a device lead of the IC socket shown in FIG. In the figure, reference numeral 1 denotes an IC socket main body in which a slit 1a is provided at a position corresponding to a device lead described later,
Reference numeral 2 is a contact pin which is provided in the slit 1a and is made of a leaf spring having one end fixed to the IC socket body 1 and the contact surface 2a formed at the tip of the other end.

Reference numeral 3 indicates a spring 4 on the bottom of the IC socket body 1.
The pedestal 5 supported on the pedestal 5, the device mounted on the pedestal 3, the device lead 6 of the device 5, and the device lead 7 movably provided up and down on the contact surface 2a of the contact pin 2. It is a lead presser that holds down.

Next, the conventional I constructed as described above is used.
The operation of the C socket will be described. First, device 5
Is placed on the pedestal 3 and the device lead 6 is brought into contact with the contact surface 2a of the contact pin 2 as shown in FIG. Next, a predetermined force is applied to the lead retainer 7 to move it downward as shown in FIG. 5 (b), and the contact pin 2 is pushed downward. At this time, since the contact pin 2 is formed of a leaf spring and the surface of the device lead 6 is rubbed by the contact surface 2a, the solder on the surface of the device lead 6 is peeled off and wiped.

The device lead 6 is electrically contacted with the contact surface 2a at the wiped position and electrically connected to an apparatus (not shown), and from this apparatus to the device 5 via the device lead 6. The electrical signal is transmitted and the electrical characteristics of the device 5 are checked.

[0006]

Since the conventional IC socket is constructed as described above, the solder scrap produced when the contact surface 2a wipes the solder on the surface of the device lead 6 may adhere to the contact surface 2a. Alternatively, if a foreign matter is attached to the contact portion between the device lead 6 and the contact surface 2a, the foreign matter may be caught during wiping and the like.
There is a problem in that the electrical contact between a and the device lead 6 is hindered, a contact failure occurs, and the electrical characteristics cannot be accurately checked.

The present invention has been made to solve the above problems, and an object thereof is to provide an IC socket in which electrical contact is favorably performed and electrical characteristics are accurately checked. There is.

[0008]

An IC socket according to claim 1 of the present invention is a first contact which is provided at a position corresponding to a lead of a mounted device and which comes into contact with the lead with a predetermined force to rub it. And a contact pin having a second contact surface that contacts the first contact surface of the lead when the surface is energized.

An IC socket according to a second aspect of the present invention is provided with a first contact pin which is provided at a position corresponding to a lead of a mounted device and which comes into contact with the lead with a predetermined force to scrape it, and a lead of the device. And a second contact pin that is provided at a position corresponding to and that comes into contact with the position where the first contact pin of the lead makes contact when energized.

[0010]

The first contact surface of the IC socket according to the first aspect of the present invention wipes the solder on the surface of the lead of the device by contacting and rubbing the surface of the lead of the device with a predetermined force.

The first contact pin of the IC socket according to the second aspect of the present invention wipes the solder on the surface of the device lead by contacting and rubbing the surface of the device lead with a predetermined force.

[0012]

【Example】

Example 1. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an operation of contact between a contact pin and a device lead of an IC socket of Embodiment 1 of the present invention. In the figure, the same parts as those in the conventional case are designated by the same reference numerals, and the description thereof will be omitted. 8 is provided in the slit 1a, one end side is embedded and fixed in the IC socket body 1, the tip is exposed from the IC socket body 1 to form a terminal, and the other end side tip has a first contact surface 8a and A second contact surface 8b is formed on the rear side, and both contact surfaces 8a and 8b are contact pins made of a spring material urged by a predetermined force on the upper side.

Next, an embodiment 1 constructed as described above
The operation of the IC socket will be described. First, the device 5 is placed on the IC socket, and the device lead 6 is attached to the first contact surface 8a of the contact pin 8 as shown in FIG.
Abut. Next, when the lead retainer 7 is moved downward as shown in FIG. 1 (b) and the contact pin 8 is pushed downward, both contact surfaces 8a and 8b rotate about the position where the contact pin 8 is fixed as a fulcrum. Therefore, the second contact surface 8b comes into contact with the portion of the device lead 6 which the first contact surface 8a was in contact with in the state of FIG. 1 (a).

At this time, the contact pin 8 is urged upward by a predetermined force, and the surface of the device lead 6 is rubbed by the first contact surface 8a, so that the solder on the surface of the device lead 6 is peeled off and wiped. . Then, the device lead 6 has the second contact surface 8b at the wiped position.
The device is electrically connected to the device (not shown) as in the conventional case, and an electrical signal is transmitted from the device to the device 5 through the device lead 6 to check the electrical characteristics of the device 5. Is done.

As described above, according to the first embodiment, the first contact surface 8a for wiping the device lead 6 and the second contact surface 8b for electrically connecting to the device lead 6 are separately provided. Therefore, solder debris, foreign matter, etc. do not adhere to the second contact surface 8b, the device lead 6 and the contact pin 8 can be satisfactorily contacted, and the electrical characteristics can be accurately checked.

Example 2. FIG. 2 is a sectional view showing the operation of contact between a contact pin of an IC socket and a device lead in Embodiment 2 of the present invention, and FIG. 3 is a sectional view of each contact pin taken along line III-III shown in FIG. It is a top view. In the figure, the same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. 9 has one end fixed to the fulcrum side of the contact pin 2 and the other end having the contact pin 2
Is a second contact pin that extends so as to surround the second contact surface 9a and has a second contact surface 9a formed at the tip thereof, and the second contact surface 9a is formed of a spring material biased upward by a predetermined force. .

Next, a second embodiment constructed as described above
The operation of the IC socket will be described. First, the device 5 is placed on the IC socket, and the device lead 6 is brought into contact with the second contact surface 9a of the second contact pin 9 as shown in FIG. Next, as shown in FIG.
When the contact pins 2 and 9 are moved downward and pushed downward as shown in (b), the second contact pin 9 is pushed downward, and the contact surface 2a of the contact pin 2 is pushed from this interval.
Is projected.

At this time, the second contact pin 9 is urged upward by a predetermined force, and the surface of the device lead 6 is rubbed by the second contact surface 9a, so that the solder on the surface of the device lead 6 is peeled off. And then wiped. Then, the device lead 6 contacts the contact surface 2 at this wiped position.
a is electrically connected to a device (not shown), and an electrical signal is transmitted from the device to the device 5 through the device lead 6 to check the electrical characteristics of the device 5. .

As described above, according to the second embodiment, the second contact point 9a for wiping the device lead 6 to each of the separate contact pins 2 and 9 and the contact surface 2a for electrically contacting the device lead 6 are provided. I decided to set each one, so
Of course, the contact surface 2a is free of solder scraps, foreign matter, etc., and the device lead 6 and the contact pin 2 can be satisfactorily contacted with each other, so that the electrical characteristics can be accurately checked. Since the second contact surface 9a is formed on the second contact pin 9 which is different from the contact pin 2 on which the contact surface 2a is formed, the solder scrap scraped when the second contact pin 9 is moved up and down is second. Contact surface 9
Since it does not fall from a and does not adversely affect the contact surface 2a of the contact pin 2, it is possible to more accurately check the electrical characteristics.

[0020]

As described above, according to the first aspect of the present invention, the first contact surface which is provided at a position corresponding to the lead of the mounted device and which comes into contact with the lead with a predetermined force and rubs against each other, and Since the contact pin having the second contact surface that contacts the position where the first contact surface of the lead contacts at the time of energization is provided, good electrical contact is made and the electrical characteristics can be accurately checked. It is possible to provide a known IC socket.

According to a second aspect of the present invention, there is provided a first contact pin which is provided at a position corresponding to the lead of the mounted device and which comes into contact with the lead with a predetermined force to scrape it.
The device is provided with a second contact pin which is provided at a position corresponding to the device lead and which comes into contact with a position where the first contact pin of the lead comes into contact when electricity is applied, so that good electrical contact is made and the electrical characteristics are improved. It is possible to provide an IC socket that can be accurately checked.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the operation of contact between a contact pin of an IC socket and a device lead according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an operation of contacting each contact pin of the IC socket and the device lead in Embodiment 2 of the present invention.

3 is a plan view taken along line III-III shown in FIG.

FIG. 4 is a sectional view showing a configuration of a conventional IC socket.

5 is a cross-sectional view showing an operation of contact between a contact pin and a device lead of the IC socket shown in FIG.

[Explanation of symbols]

 1 IC Socket Main Body 2, 8 Contact Pins 5 Device 6 Device Lead 8a First Contact Surface 8b, 9a Second Contact Surface 9 Second Contact Pin

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[Procedure amendment]

[Submission date] April 19, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction content]

[Document name] Statement

Title of invention IC socket

[Claims]

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket,
In particular, it relates to the structure of the contact portion of the contact pin that contacts the lead of the device.

[0002]

BACKGROUND ART FIG. 4 is a sectional view showing the configuration of a conventional IC socket, FIG. 5 is a sectional view showing an operation in which the contact pin <br/> down and rie de of the IC socket shown in FIG. 4 contacts is there. In FIG, 1 is described to lapis over de with the corresponding IC socket body slit 1a is provided at a position, 2 slit 1a
The contact pin is a leaf spring that is provided inside and has one end fixed to the IC socket body 1 and a contact surface 2a formed at the tip of the other end.

Reference numeral 3 indicates a spring 4 on the bottom of the IC socket body 1.
Supported pedestal in the device 5 is placed on the pedestal 3, 6 rie de of the device 5, 7 movably disposed et Re contacting rie de 6 contact pins 2 vertically Surface 2a
It is a lead retainer that is pressed against.

Next, the conventional I constructed as described above is used.
The operation of the C socket will be described. First, device 5
It is allowed to contact the rie de 6 the contact surface 2a of the contact pin 2 as shown in mounted to Figure 5 (a) to the pedestal 3. Next, a predetermined force is applied to the lead retainer 7 to move it downward as shown in FIG. 5 (b), and the contact pin 2 is pushed downward. At this time, the contact pins 2 are formed by leaf springs, and since scraping the surface of the rie de 6 at the contact surfaces 2a, solder surface rie de 6 is wiped is peeled.

[0005] Then, the contact surface 2a and the electrical contact is rie de 6 at the wiping position, is connected shown to have no device electrically, via the device or rally de 6 An electric signal is transmitted to the device 5, and the electric characteristic of the device 5 is checked.

[0006]

Since INVENTION Problems to be Solved conventional IC socket is constructed as described above, the solder debris adheres to the contact surface 2a that occurs when wiping the solder surfaces of the contact surfaces 2a gully over de 6 or, or, the contact surface 2a with rie de 6
And when there adhesion of foreign matter to the contact portion equal involving foreign matter into the wiping of the exact electrical electrical characteristics occur between becomes loose hinder contact between the contact surfaces 2a and rie de 6 There was a problem that the check was not performed.

The present invention has been made to solve the above problems, and an object thereof is to provide an IC socket in which electrical contact is favorably performed and electrical characteristics are accurately checked. There is.

[0008]

An IC socket according to claim 1 of the present invention is a first contact which is provided at a position corresponding to a lead of a mounted device and which comes into contact with the lead with a predetermined force to rub it. in which the first contact surface of Men及beauty rie de is provided with a contact pin having a second contact surface in contact again at a position in contact.

An IC socket according to a second aspect of the present invention is provided with a first contact pin which is provided at a position corresponding to a lead of a mounted device and which comes into contact with the lead with a predetermined force to scrape it, and a lead of the device. Provided at a position corresponding to
Re in which first contact pin rie de has a second contact pins again <br/> contacts the position in contact.

[0010]

The first contact surface of the IC socket according to the first aspect of the present invention wipes the solder on the surface of the lead of the device by contacting and rubbing the surface of the lead of the device with a predetermined force.

The first contact pin of the IC socket according to the second aspect of the present invention wipes the solder on the surface of the device lead by contacting and rubbing the surface of the device lead with a predetermined force.

[0012]

EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. Figure 1 is a sectional view showing an operation of contacting the contact pin and rie de of the IC socket first embodiment of the invention. In the figure, the same parts as those in the conventional case are designated by the same reference numerals, and the description thereof will be omitted. 8 is provided in the slit 1a, one end side is embedded and fixed in the IC socket body 1, the tip is exposed from the IC socket body 1 to form a terminal, and the other end side tip has a first contact surface 8a and A second contact surface 8b is formed on the rear side, and both contact surfaces 8a and 8b are contact pins made of a spring material urged by a predetermined force on the upper side.

Next, an embodiment 1 constructed as described above
The operation of the IC socket will be described. First, place the device 5 to the IC socket, to a re <br/> over de 6 as shown in FIG. 1 (a) in contact with the first contact surface 8a of the contact pins 8. Next, when the lead retainer 7 is moved downward as shown in FIG. 1 (b) and the contact pin 8 is pushed downward, both contact surfaces 8a and 8b rotate about the position where the contact pin 8 is fixed as a fulcrum. to order, so that the second contact surface 8b comes into contact with the portion of the rie de 6 first contact surface 8a is in contact at the time of the state FIG. 1 (a).

[0014] At this time, the contact pins 8 biased by a predetermined force upwards, moreover solder surface rie de 6 is stripped by the scraping of the surface of the rie de 6 in the first contact surface 8a Wiped. Then, rie de 6 is a second contact surface 8b and in electrical contact with the wiping position, the conventional case and also shown to have no device electrically connected to either the device Lari An electrical signal is transmitted to the device 5 via the card 6 to check the electrical characteristics of the device 5.

[0015] According to the Example 1, first the contact surface 8a, a second contact surface 8b and as a separately provided electrically connected to rie de 6 wiping the rie de 6 since the there is no adhesion such as solder scraps and foreign matter in the second contact surface 8b, can be accurately checked for electrical characteristics can be performed satisfactorily contact with rie de 6 and the contact pins 8 Become.

Example 2. Figure 2 is a sectional view showing an operation of the contact pin and rie de of the IC socket contacts in the second embodiment of the present invention, the line III shown in FIG. 3 FIGS. 2 (a)
FIG. 6 is a plan view of each contact pin as viewed along the line III. In the figure, the same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. One end of the contact pin 9 is fixed to the fulcrum side of the contact pin 2, and the other end of the contact pin 2 extends so as to surround the contact pin 2.
Is formed, and the second contact surface 9a is a second contact pin made of a spring material urged by a predetermined force.

Next, a second embodiment constructed as described above
The operation of the IC socket will be described. First, place the device 5 to the IC socket, it is brought into contact with Li <br/> over de 6 as shown in FIG. 2 (a) to the second contact surface 9a of the second contact pins 9. Next, when the lead retainer 7 is moved downward as shown in FIG. 2 (b) and each contact pin 2, 9 is pushed downward, the second contact pin 9 is pushed downward and the contact pin 2 The contact surface 2a is projected.

[0018] At this time, the second contact pin 9 biased by a predetermined force upwards, and since scraping the surface of the rie de 6 in the second contact surface 9a, the solder surfaces of rie de 6 Is stripped and wiped. Then, the contact surface 2a and the electrical contact is rie de 6 at the wiping position, is connected shown to have no device electrically, via the device or slurry <br/> over de 6 The electrical signal is transmitted to the device 5 to check the electrical characteristics of the device 5.

[0019] According to the Example 2, and the second contact point 9a wiping the rie de 6 to separate the contact pins 2,9, contact surface 2a in electrical contact with rie de 6
Having preparative be provided respectively, no adhesion such as solder scraps and foreign matter on the contact surface 2a, an accurate check of the electrical characteristics can be performed satisfactorily contact with rie de 6 and the contact pins 2 Of course, this is possible because the second contact surface 9a is formed on the second contact pin 9 different from the contact pin 2 on which the contact surface 2a is formed. Since the solder scraps wiped at the time of vertical movement do not drop from the second contact surface 9a and adversely affect the contact surface 2a of the contact pin 2, it is possible to more accurately check the electrical characteristics.

[0020]

As described above, according to the first aspect of the present invention, the first contact surface which is provided at a position corresponding to the lead of the mounted device and which contacts the lead with a predetermined force and scrapes br /> since及beauty first contact surface of rie de is to comprise a contact pin having a second contact surface in contact again in a position to contact electrical characteristic electrical contact is made good It is possible to provide an IC socket that can be accurately checked.

According to a second aspect of the present invention, there is provided a first contact pin which is provided at a position corresponding to the lead of the mounted device and which comes into contact with the lead with a predetermined force to scrape it.
Second again into contact with the position where the first contact pins of providing al Re rie de to lead to the corresponding position of the device are in contact
Since it is provided with the contact pin, it is possible to provide an IC socket in which electrical contact is favorably made and electrical characteristics are accurately checked.

[Brief description of drawings]

1 is a cross-sectional view showing the operation of the contact pin and rie de of the IC socket contacts in the first embodiment of the present invention.

2 is a sectional view showing an operation of each contact pin and rie de of the IC socket contacts in the second embodiment of the present invention.

FIG. 3 is a plan view taken along line III-III shown in FIG.

FIG. 4 is a sectional view showing a configuration of a conventional IC socket.

5 is a contact pin of the IC socket shown in FIG.
And is a cross-sectional view showing the operation of contact between rie de.

[Explanation of symbols] 1 IC socket body, 2, 8 contact pins, 5
Device, 6 rie de, 8a first contact surface, 8b, 9
a 2nd contact surface, 9 2nd contact pin.

Claims (2)

[Claims] 1. A first contact surface provided at a position corresponding to a lead of a mounted device and contacting and rubbing the lead with a predetermined force, and the first contact surface of the lead when energized. An IC socket comprising a contact pin having a second contact surface that comes into contact with a position to be contacted. 2. A first contact pin, which is provided at a position corresponding to the lead of the mounted device and which contacts the lead with a predetermined force to rub them, and a position provided at a position corresponding to the lead of the device when energized. An IC socket comprising: a second contact pin that comes into contact with a position of the lead that comes into contact with the first contact pin.