JP2696203B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used for a mounting test of a multi-terminal IC package.

[0002]

2. Description of the Related Art At present, leads of IC packages tend to have higher densities. The contact pins of an IC socket for performing an IC package mounting test or the like must also be densified in accordance with this. However, it is very difficult to densely implant the thin metallic contact pins 14 as shown in FIG. Therefore,
For example, an IC socket as shown in FIG. 4 has been considered. In such an IC socket, the conductive rubber is formed into a film shape.
As the conductive layer 15 so as to end surface is exposed, the end faces in the same manner by the insulating rubber and film form are exposed to
The insulating layer 16 thus formed is connected to the lead 2 of the IC package.
By mounting the respective film surfaces mutually contact member formed by the product <br/> layer IC socket body 10 in accordance with the pitch of the, so that corresponding to the IC package with a high density of lead 2 .

On the other hand, instead of the contact member consisting of the conductive layer 15 and the insulating layer 16, a thin metal wire 18 is inserted into an insulating elastic body 17 as shown in FIG. There are also known ones in which a contact member buried at an interval corresponding to the above or a contact member in which a flexible circuit board is adhered to an insulating elastic body is attached to the IC socket body 10.

[0004]

Thus, in the case of the above-mentioned conventional contact member, the lead 2 is pressed against the contact member by the pressing member 3 so that the contact member is simply pressed.
It is elastically deformed in the pressure direction, and the pressing force is applied between the lead 2 and the contact member.
A tentative wiping effect corresponding to the pressure change is obtained, whereby the lead 2 and the contact member are electrically connected.

However, in practice, the desired wiping effect may not be obtained because the rubbing distance between the lead 2 and the contact member is very small. Unless the wiping effect is obtained, there is a problem that the electrical connection between the lead 2 and the contact member tends to be uncertain if the oxide film is adhered to the surfaces of the lead 2 and the contact member. The present invention relates to a lead 2
To increase the distance between the contact member and
An object of the present invention is to provide an IC package socket having a high-density lead 2 that is sufficiently broken to ensure electrical connection between the lead 2 and a contact member.

[0006]

An IC socket according to the present invention is provided.
Is the lead of the IC package mounted on the socket body
And a contact member for the lead provided on the socket body.
Contact is made by pressing down the pressing member.
The contact member contacts the lead on the surface
A plurality of electrodes provided in accordance with the pitch of the leads.
Forming an electrode portion comprising a pole and electrically connecting to the electrode;
Connect the circuit pattern for connecting the external circuit to the front or back
Formed by a flexible insulating film
And the film is elastically upward with respect to the socket body.
A block that can be pivoted up and down with a habit
So that the electrode part is on the free end side of the block.
It is attached and fixed.

[0007]

[Action] An IC package is mounted on the IC socket body,
When the lead is pressed against the electrode of the contact member by the pressing member, the elastic body is deformed first if the elastic body is provided, and further pressed by the pressing member, then the block is pressed against the IC socket body. Swing up and down . Therefore, at this time,
The electrode moves relatively to the lead and rubs enough
A wiping action is performed.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a partially enlarged sectional view of an IC socket on which a flat type IC package according to the present invention is mounted. 1 is an IC package body, 2 is an IC package lead, 3
Is a pressing member for pressing the lead 2, 4 is a fine electrode on which a large number of contacts for connecting to the lead 2 are formed at high density, 5 is a flexible polyimide or the like having the fine electrode 4 provided on the surface. An insulating film made, 6 is a flexible circuit made of copper foil or the like which can be electrically connected to the fine electrode 4 provided on the surface of the insulating film 5, 7 is a fine electrode An elastic body, such as rubber, which is disposed over the entire lower part of 4 and is in contact with the insulating film 6 from below; a block 8 attached to the IC socket main body 10 so as to swing up and down by a rotating shaft 9; Reference numeral 11 denotes a spring having one end attached to the IC socket body 10 and the other end attached to the block 8, 12 a cover having the pressing member 3 rotatably attached to the IC socket, and 13 a connection state with the circuit 6. , For connection to the circuit board for performing a mounting test, etc. of the IC package is mounted on the IC socket 10 to match the pitch of the connecting portion of the circuit board terminal.

Thus, when the IC package is mounted, the cover 12 is opened, and the IC package is loaded into the IC socket body 10, so that the leads 2 are mounted on the fine electrodes 4. The fine electrodes 4 are provided on the surface of the insulating film 5 at the same pitch as the pitch of the leads 2 of the IC package. The block 8 uses an elastic force of the spring 11 to
The socket body 10 receives an upward force. When the cover 12 is closed, the pressing member 3 presses the lead 2 downward against the IC socket body. Then, first, the elastic body 7 starts to be elastically deformed, and then the block 8 turns left around the rotation shaft 9 to deform the spring 11. At this time, the fine electrode 4 also rotates about the rotation shaft 9 to rub the lead 2 and perform a wiping action. Then, the lead 2 and the circuit 6 are securely connected, and further connected to a circuit board (not shown) through the terminal 13.

The distance at which the lead 2 and the fine electrode 4 rub against each other is determined by the amount of rotation of the block 8 when the lead 2 is pressed by the pressing member 3. Therefore, by increasing the amount of rotation, the wiping effect between the lead 2 and the fine electrode 4 can be obtained more reliably. However, the rotatable range of the block 8 must be a range where there is no danger of bending the lead 2.

FIG. 2 is a partially enlarged sectional view of a second embodiment of the IC socket according to the present invention. In this case, the electrode 4
Has an elongated shape. The electrode 4 can be deformed according to the deformation of the elastic body 7.

Although the present invention has been described as applied to a flat type IC package, the present invention can also be applied to a tape carrier IC package. Further, in the above embodiment, the case where the elastic member 7 is used is shown, but the member 7 is not always necessary.

[0013]

As described above, the IC socket of the present invention
When the pressing member is pressed down, the electrode and lead are
The electrode part is opposed to the lead by the swinging rotation of the block.
And the electrodes and the leads of the IC package can be rubbed at an appropriate distance, so that the wiping effect can be sufficiently and reliably obtained.

[Brief description of the drawings]

FIG. 1 shows an IC mounted with an IC package according to the present invention.
It is a partial expanded sectional view of an example of a socket.

FIG. 2 is an IC mounted with an IC package according to the present invention.
FIG. 6 is a partially enlarged cross section of another embodiment of the socket.

FIG. 3 is a side view of an example of a conventional contact pin.

FIG. 4 is a perspective view of an example of a conventional IC socket.

FIG. 5 is a perspective view of another example of a conventional connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC package main body 2 Lead 3 Pressing member 4 Electrode 5 Film 6 Circuit 7 Elastic member 8 Block 9 Rotation axis 10 IC socket main body 11 Spring 12 Cover

Claims (1)

(57) [Claims] 1. A IC socket contact of the contact member for the lead in the lead and the socket body of the IC package is placed on the socket body is made by pressing of the pressing member, the contact member, The lead on the surface
An electrode portion composed of a plurality of electrodes provided in accordance with the pitch of the lead is formed so as to be in contact with the lead, and a circuit pattern for external circuit connection electrically connected to the electrode is displayed.
Flexible insulating film on the front or back
Formed Te, the film is the electrode portion is a free end side of the block to the block which is disposed swingably pivoted vertically resiliently habit upward with respect to the socket body
An IC socket characterized by being mounted and fixed in this manner .