JPH0548283U - IC socket - Google Patents

Abstract

(57) [Summary] [Objective] To ensure a wiping effect in an IC socket for an IC package having high-density leads. [Structure] A flexible film having an electrode on the front surface and a circuit electrically connectable with the electrode on the front surface or the back surface is elastically mounted on a block swingably pivoted to an IC socket body. , The films are stacked in this order, and the leads of the IC package are pressed against the electrodes by a pressing member to deform the elastic body and swing the block to obtain a wiping effect.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC socket used for a mounting test or the like of a multi-terminal IC package.

[0002]

[Prior Art]

 At present, the leads of IC packages are tending toward higher density. The contact pins of the IC socket, which are used for the actual testing of the IC package, must also be highly densified. However, it is very difficult to highly densely implant the metallic thin contact pins 14 as shown in FIG. 3 in the IC socket body 10. Therefore, for example, an IC socket as shown in FIG. 4 has been considered. In such an IC socket, a contact member in which a conductive layer 15 made of a conductive rubber film and an insulating layer 16 made of an insulating rubber film are laminated according to the pitch of the leads 2 of the IC package is used as the IC socket body. By attaching to the IC package 10, the IC package having the high-density lead 2 is adapted.

On the other hand, in place of the contact member composed of the conductive layer 15 and the insulating layer 16, fine metal wires 18 are provided in the insulating elastic body 17 shown in FIG. It is also known that the IC socket body 10 is provided with a contact member embedded at an interval matching the above, or a contact member having a flexible circuit board attached to an insulating elastic body.

[0004]

[Problems to be solved by the device]

 Thus, in the case of the above-mentioned contact member, the lead 2 is pressed against the contact member by the pressing member 3, whereby the contact member is elastically deformed, and a temporary wiping effect is obtained between the lead 2 and the contact member. The lead 2 and the contact member are electrically connected.

However, in practice, the distance between the lead 2 and the contact member rubbing against each other is very small, so that the wiping effect may not be obtained in some cases. If the wiping effect is not obtained, there is a problem that the electrical connection between the lead 2 and the contact member is likely to be uncertain when an oxide film is attached to the surfaces of the lead 2 and the contact member. The present invention has a high-density lead 2 in which the rubbing distance between the lead 2 and the contact member is increased and the oxide film is broken to ensure the electrical connection between the lead 2 and the contact member. An IC package socket is provided.

[0006]

[Means for Solving the Problems]

 According to the present invention, an electrode is provided on the front surface, and a film having a circuit pattern on the front surface or the back surface, which is in a state electrically connectable to the electrode, is swingably disposed on an IC socket body, and preferably has an elastic body. By using the block attached to the elastic body instead of the connector, the wiping effect can be surely obtained.

[0007]

[Action]

 When the IC package is mounted on the IC socket body and the lead is pressed against the electrode of the contact member by the pressing member, the elastic member is first deformed when the elastic member is arranged, and further pressed by the pressing member. Next, the block swings with respect to the IC socket body. At this time, the lead and the electrode rub against each other to perform a wiping action.

[0008]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a partially enlarged sectional view of an IC socket equipped with a flat type IC package according to the present invention. Reference numeral 1 is an IC package body, 2 is a lead of an IC package, 3 is a pressing member for pressing the lead 2, 4 is a fine electrode on which a large number of contact points for connecting with the lead 2 are densely formed, 5 Is an insulating film made of a flexible polyimide or the like with the fine electrodes 4 provided on the surface, and 6 is copper that is in a state capable of being electrically connected to the fine electrodes 4 provided on the surface of the insulating film 5. A flexible circuit made of foil or the like, 7 is disposed over the entire lower portion of the fine electrode 4, and is made of an elastic body such as rubber that contacts the insulating film 6 from below. A block attached to the socket body 10 so as to be vertically swingable, 11 is a spring attached to the IC socket body 10 at one end, and another end is attached to the block 8 at the other end, and 12 is rotatably attached to the IC socket. The cover 13 having the pressing member 3 mounted thereon is connected to the circuit 6 in a state of being connected to the circuit 6, and in order to connect with a circuit board for which an IC package mounting test or the like has been performed, the IC is adjusted according to the pitch of the connecting portion of the circuit board. It is a terminal attached to the socket body 10.

Thus, when the IC package is mounted and the cover 12 is opened and the IC package is loaded into the IC socket body 10, the leads 2 are placed on the fine electrodes 4. The fine electrodes 4 are provided on the surface of the insulating film 5 at the same pitch as the pitch of the leads 2 of the IC package. The block 8 receives an upward force on the IC socket body 10 due to the elastic force of the spring 11. When the cover 12 is closed, the pressing member 3 presses the lead 2 downward against the IC socket body. Then, the elastic body 7 begins to elastically deform, and then the block 8 rotates counterclockwise about the rotation shaft 9 to deform the spring 11. At this time, the fine electrode 4 also rotates around the rotating shaft 9 and rubs the lead 2 to perform a wiping action. Then, the lead 2 and the circuit 6 are securely connected to each other, and further connected to a circuit board (not shown) through the terminal 13.

Therefore, the distance at which the lead 2 and the fine electrode 4 rub each other is determined by the rotation amount of the block 8 when the lead 2 is pressed by the pressing member 3. Therefore, the wiping effect of the lead 2 and the fine electrode 4 can be more reliably obtained by increasing the rotation amount. However, the rotatable range of the block 8 must be a range where there is no risk of bending the lead 2.

FIG. 2 is a partially enlarged sectional view of a second embodiment of the IC socket according to the present invention. In this case, the electrode 4 has an elongated shape. The electrode 4 can be deformed according to the deformation of the elastic body 7.

Although the present invention has been described as applied to a flat type IC package, it can also be applied to a tape carrier IC package. Further, although the elastic member 7 is used in the above embodiment, the member 7 is not always necessary.

[0013]

[Effect of the device]

 As described above, the IC socket of the present invention ensures the wiping effect by allowing the electrodes and the leads of the IC package to rub against each other at an appropriate distance.

[Brief description of drawings]

FIG. 1 is an IC equipped with an IC package according to the present invention.
It is a partial expanded sectional view of an example of a socket.

FIG. 2 IC equipped with an IC package according to the present invention
7 is a partially enlarged cross-sectional view of another embodiment of the socket.

FIG. 3 is a side view of an example of a conventional contact pin.

FIG. 4 is a perspective view of an example of a conventional IC socket.

FIG. 5 is a perspective view of another example of a conventional connector.

[Explanation of symbols]

 1 IC Package Main Body 2 Lead 3 Pressing Member 4 Electrode 5 Film 6 Circuit 7 Elastic Member 8 Block 9 Rotating Shaft 10 IC Socket Main Body 11 Spring 12 Cover

Claims (1)

[Scope of utility model registration request] 1. A contact between a lead of an IC package mounted on a socket body and a contact member for the lead provided on the socket body is made by depressing a pressing member.
In the C socket, the contact member is provided with a flexible film having a circuit pattern electrically connected to a plurality of electrodes provided on the surface in accordance with the pitch of the leads, and the film is provided in the socket body. An IC socket characterized by being attached and fixed to a block arranged so as to be capable of swinging up and down with an elastic tendency toward the top.