JPH07201641A - Production of multilayer ceramic electronic device - Google Patents

Abstract

PURPOSE:To decide whether the position of inner electrode is shifted and to detect the direction and extent of positional shift, if any, easily and positively in a process for dicing unfired chips individually from a multilayer block formed by laminating a plurality of ceramic green sheets each having a conductor pattern. CONSTITUTION:A positional shift detection mark 15 has such profile as at least one of the width or the position, being exposed at the cutting faces 16a, 16b of a laminate block 13, varies continuously or stepwise depending on the direction or the extent of shift of cutting position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, and more specifically, a laminated ceramic electronic component having a structure in which internal electrodes are embedded in a ceramic, such as a laminated ceramic capacitor, an LC composite component and a multilayer substrate. Manufacturing method.

[0002]

2. Description of the Related Art For example, in the manufacturing process of a multilayer ceramic electronic component represented by a multilayer ceramic capacitor,
Usually, as shown in FIGS. 5 and 6, a plurality of ceramic green sheets 2 (FIG. 5) in which a plurality of conductor patterns 1 serving as internal electrodes are arranged in a matrix are laminated, and further on both upper and lower sides thereof. After laminating the dummy sheets on which no conductor pattern is formed, the laminated blocks 3 (FIG. 6) obtained by pressure-bonding the dummy sheets are cut along the cutting lines L (L ₁ , L ₂ ) to obtain individual green sheets. Chip (unbaked electronic component element)
The step of cutting out 4 is included.

After firing the unfired chip 4, a multilayer ceramic electronic component (not shown) is manufactured by applying external electrodes or the like at predetermined positions as needed.

By the way, when the laminated block 3 is cut, the internal electrode (conductor pattern) 1 (FIG. 5) of the unfired chip 4 to be cut out is caused by the deviation of the cutting position or the deviation of the laminating position of the ceramic green sheet 2. There is a case in which a laminated ceramic electronic component having desired characteristics cannot be obtained due to the displacement of position (1), the capacitance formed is reduced, or the insulation resistance is reduced.

Therefore, as shown in FIGS. 5 and 6, when the laminated block 3 is cut, a positional shift of the internal electrode 1 caused by a shift of the cutting position or a printing shift of the conductor pattern 1 occurs. In order to detect non-destructively whether or not
Predetermined position of the ceramic green sheet 2, that is,
In this embodiment, a rectangular displacement detection mark 5 is provided around the conductor pattern 1, the laminated block 3 is cut along the cutting line L, and then the cutting block 6 in the peripheral portion of the laminated block 3 is cut. Predetermined cut surfaces 6a, 6b (Fig. 6 (b)-
The position deviation detection mark 5 exposed in (d)) is examined, and when the exposed state of the internal electrode 1 is normal, it is determined that there is no positional deviation of the internal electrode 1, and the exposed state of the internal electrode 1 is If it is abnormal, it is determined that the internal electrode 1 is misaligned, and the unfired chips having the misalignment are selected and removed to prevent or prevent defective products from being mixed into the product. I have to.

FIG. 6 (b) shows that the internal electrodes are not displaced, (c) is the longitudinally displaced internal electrodes, and (d) is the longitudinally and laterally displaced. In the case where there is a mark, the exposure state (including the case where it is not exposed) of the displacement detection mark on the cut surface is shown.

[0007]

By the way, in the above-mentioned conventional method of detecting the positional deviation of the internal electrodes, for example, when the cutting line L ₁ or L ₂ is observed, the positional deviation on the cutting surface 6a or 6b of the cutting block 6 is caused. When some or all of the detection marks 5 are not exposed and it is confirmed that the internal electrode 1 is displaced (for example, as shown in FIG.
In (c) and (d), this may be fed back to adjust conditions such as the cutting position and the positional relationship of the conductor patterns when the ceramic green sheets 2 are laminated. In order to determine how much to adjust, the unfired chip 4 is cut and the internal electrode 1
It is necessary to confirm the direction and size of the position shift.

Therefore, there is a problem that it takes time and effort to adjust the positional deviation of the internal electrodes, and the productivity is lowered.

The present invention solves the above-mentioned problems, and in the step of cutting out individual unfired chips from the laminated block, whether or not the internal electrodes are displaced and if they are displaced. It is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component capable of easily and reliably detecting the direction and size of the positional deviation of the.

[0010]

In order to achieve the above object, a method for manufacturing a monolithic ceramic electronic component according to the present invention comprises:
A laminated block formed by laminating a plurality of ceramic green sheets each having a conductor pattern and a positional deviation detection mark arranged at a constant distance from the conductor pattern is cut at a predetermined position and fired. By doing so, in the method of manufacturing a laminated ceramic electronic component in which the internal electrodes are embedded in the ceramic, the shape of the misregistration detection mark is the shape of the misregistration detection mark exposed on the cut surface when the multilayer block is cut. At least one of the width and the position has a shape that continuously or stepwise changes according to the direction or size of the deviation of the cutting position.

[0011]

In the method for manufacturing a monolithic ceramic electronic component of the present invention, in the step of cutting the laminated block, at least one of the width and the position of the misregistration detection mark which is cut on the cutting surface and is exposed on the cut surface is Since the position or position of the cutting position changes continuously or stepwise depending on the direction or size of the position, the width or position of the position detection mark exposed on the cutting surface is non-destructive and the position deviation of the internal electrode It becomes possible to easily and surely detect whether or not the position deviation has occurred, and the direction and the magnitude of the position deviation when the position deviation has occurred.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

[Embodiment 1] FIG. 1 is a view showing a method of manufacturing a monolithic ceramic electronic component (a monolithic ceramic capacitor in this embodiment) according to an embodiment of the present invention.
(a) shows a main part of a laminated block 13 formed by laminating a ceramic green sheet 12 having a plurality of conductor patterns 11 serving as internal electrodes and displacement detection marks 15 at predetermined positions. The top view shown, (b),
(c), (d) is a perspective view which shows a cutting block when the laminated block is cut. It should be noted that FIG. 1A shows the laminated block in which the dummy sheet on the uppermost layer side is removed.

In this embodiment, the misregistration detection mark 15 provided on the ceramic green sheet 12 is formed in a substantially T-shape, and is located above the width W ₁ of the lower part 15a (ceramic). The width W ₂ of the peripheral portion 15b of the green sheet is larger.

Therefore, in this embodiment, the unfired chip (unfired electronic component element) 14 is cut along the cutting line L.
When the deviation of the cutting position is equal to or smaller than W _1/2 when the cutting is performed, the lower surface 15a and the upper surface of the position deviation detection mark 15 are formed on the cutting surfaces 16a and 16b of the cutting block 16 on the peripheral side of the laminated block 13. Both parts 15b are exposed (FIG. 1 (b)).

[0016] However, in the vertical and horizontal direction, W _1/2
Above, if there is a shift of the cutting position in W _2/2 the range, the cut surface 16a of the cutting block 16, the 16b, only the upper portion 15b of the displacement detection mark 15 is exposed (FIG. 1 (c)) .

Further, when the deviation of cutting position is W _2/2 or more, the cutting surface 16a of the cutting block 16, the 16b,
The misregistration detection mark 15 is not exposed at all (FIG. 1 (d)).

Therefore, for example, when both the lower portion 15a and the upper portion 15b of the displacement detection mark 15 are exposed on the cutting surfaces 16a and 16b of the cutting block 16 (FIG. 1B), the cutting position shift amount is at W _1/2 or less, it can be seen that have been cut with the proper position. Also,
The lower portion 15a of the misregistration detection mark 15 is not exposed,
If only the upper part 15b is exposed (Fig. 1 (c)),
The amount of deviation of cutting position W _1/2 or more W _2/2 it can be seen that less. Further, in the case where the positional deviation detection mark 15 is not exposed at all (FIG. 1 (d)), it can be seen that the amount of deviation of the cutting position is W _2/2 or more. Also, the cutting surface 16
It is also possible to detect the deviation direction from the relationship between the exposure positions of the misregistration detection marks 15 in a and 16b.

It should be noted that the deviation of the cutting position does not always occur in both the vertical and horizontal directions as described above, and naturally occurs in either the vertical direction or the horizontal direction. Also in this case, by checking the exposed state of the positional deviation detection mark 15 on the cut surfaces 16a and 16b,
It is possible to reliably detect in what direction and to what extent the positional deviation has occurred.

In this embodiment, the case has been described in which the widths of the positional deviation detection marks 15 are of two different types, that is, the lower portion 15a and the upper portion 15b. However, by setting the width types to three or more, It is possible to detect the positional deviation amount with higher accuracy.

[Embodiment 2] FIG. 2 is a view showing another embodiment of the method for manufacturing a monolithic ceramic electronic component of the present invention. FIG. 2 (a) shows a plurality of conductor patterns 11 serving as internal electrodes at predetermined positions. A plan view showing a main part of a laminated block 13 formed by laminating ceramic green sheets 12 in which the above and the positional deviation detection marks 15 are arranged, (b),
(c), (d), (e) is a perspective view showing a cutting block when the laminated block is cut. It should be noted that FIG. 2A shows the laminated block in which the uppermost dummy sheet is removed.

In this embodiment, the cutting line L
The misalignment detection mark 25 is formed so as to be asymmetrical when viewed from the center line. The lower portion 25a of the misalignment detection mark 25 projects rightward around the cutting line L, and the upper portion (portion on the peripheral side of the ceramic green sheet) 25b projects leftward around the cutting line L.

Therefore, under the displacement detection mark 25
Projecting portions 25c, 2 of the side portion 25a and the upper portion 25b
The width of the part excluding 5d is W₃, The protrusion of the lower part 25a
Of the protruding portion 25d of the upper portion 25b from the tip of the minute 25c.
W to the tip (maximum width) If you say 4, in the vertical direction
There is no deviation in the cutting position, and only W on the right side₃/ 2 or less
When the deviation of the height occurs, the cutting surface 16 of the cutting block 16
a and 16b include the lower portion 2 of the misregistration detection mark 25.
Both 5a and the upper part 25b are exposed (FIG. 2 (b)).

Also, there is no deviation of the cutting position in the vertical direction.
W on the right side only₃/ 2 or more, W_FourDeviation within a range of / 2 or less
In the case of occurrence of, the cutting surface 16a of the cutting block 16
The protruding portion 2 of the lower portion 25a of the positional deviation detection mark 25
Only 5c is exposed, and the cut surface 16b has a position shift detection mark.
Both the lower part 25a and the upper part 25b of the slab 25 are exposed.
(Fig. 2 (c)). On the other hand, there is no cutting position in the vertical direction.
There is no light, only W on the left side 3/2 or more, W_Four/ 2 or less range
If a deviation occurs in the cutting block 16, the cutting surface 16a of the cutting block 16
The protrusion of the upper portion 25b of the misregistration detection mark 25.
Only the portion 25d is exposed, and the cut surface 16b is misaligned.
Both the lower part 25a and the upper part 25b of the detection mark 25
One is exposed (FIG. 2 (d)).

It should be noted, deviates to the left and right cutting position W _4/2 or more, (not shown) at all exposed not the positional deviation detection mark 25 is the cutting surface 16a of the cutting block 16.

Even when the cutting position is displaced in the vertical direction, the exposed state of the displacement detection mark 25 on the cutting surface 16b of the cutting block 16 behaves in the same manner as when the cutting position is displaced left and right. Show. Incidentally, FIG. 2 (e) cutting position right and upper side W _3/2 or more, and shows a state in which deviation in W _4/2 or less.

Therefore, for example, one cut surface 16a
In the case of I with, as shown in FIG. 2 (b), when both of the lower portion 25a and an upper portion 25b of the displacement detection mark 25 to the cut surface 16a of the cutting block 16 is exposed, W _3/2 When only the following positional deviation occurs, it is understood that the cutting is performed at an appropriate position, and only the protruding portion 25c of the lower portion 25a of the positional deviation detection mark 25 is exposed (FIG. 2 (c)). the, it can be seen that the right to W _3/2 or more, the deviation in the W _4/2 the range has occurred. Further, when only the protruding portion 25d of the upper portion 25b of the positional deviation detection mark 25 is exposed (FIG. 2 (d)),
Left to W _3/2 or more, it can be seen that deviation occurs in the W _4/2 or less.

Also, the two cutting surfaces 16 of the cutting block
2A, for example, as shown in FIG. 2E, the protruding portion 25c of the lower side portion 25a of the displacement detection mark 25 is exposed on the cutting surface 16a, and the cutting surface 16b is exposed.
Upper when the portion 25b of the protruding portion 25d is exposed, cutting position W _3/2 or more to the right and upper, it can be seen that offset by W _4/2 less range.

In this embodiment, the case where the misregistration detection mark 25 having two asymmetrical parts, the upper part and the lower part, is provided, but by providing the misregistration detection mark having three or more asymmetrical parts. Further, it becomes possible to detect the positional deviation amount with higher accuracy.

In the first and second embodiments, the shape or position of the misregistration detection mark is changed so that the width or position exposed on the cutting surface changes stepwise according to the direction or size of the deviation of the cutting position. However, the shape of the misregistration detection mark is not limited to these. For example, the misregistration detection mark 35 (FIG. 3) in the shape of a right triangle or the misalignment detection mark in the shape of an oblique band is used. 45
As shown in (FIG. 4), the width or position exposed on the cutting surface of the cutting block can be changed continuously (steplessly) according to the direction and size of the deviation of the cutting position. Is.

The shape of the misregistration detection mark is shown in FIGS.
If the width or position exposed on the cutting surface of the cutting block changes continuously according to the direction or size of the cutting position deviation, as shown in, the internal electrode position deviation is In addition, it becomes possible to detect steplessly, and in some cases, it becomes possible to further improve the detection accuracy of the positional deviation.

Further, in the above embodiments, the method for manufacturing a monolithic ceramic capacitor has been described, but the monolithic ceramic electronic component to which the present invention can be applied is not limited to this, and may be an inductor, an LC composite component, a multi-layered component. It can be applied when manufacturing various laminated ceramic electronic components in which internal electrodes are embedded in a ceramic such as a substrate.

Further, the present invention is not limited to the above-mentioned embodiment, but the positional deviation detection mark and the conductor pattern (internal electrode) are provided on the ceramic green sheet, and the specific positions of the internal electrodes. With respect to the pattern, the number of laminated ceramic layers and internal electrodes, and the like, various applications and modifications can be made within the scope of the invention.

[0034]

As described above, according to the method for manufacturing a laminated ceramic electronic component of the present invention, the shape of the misregistration detection mark is set to the width or position of the misregistration detection mark exposed on the cut surface when the laminated block is cut. At least one of
Since the shape is such that it changes continuously or stepwise depending on the direction or size of the deviation of the cutting position, by checking the width and position of the position deviation detection mark exposed on the cutting surface, non-destructive, It is possible to easily and surely detect whether or not the positional displacement of the internal electrode has occurred, and the direction and the magnitude of the positional displacement when the positional displacement has occurred.

Therefore, the step of cutting the unfired chip cut out from the laminated block and detecting the direction and size of the positional deviation, which is conventionally required, can be omitted, and the manufacturing process is streamlined. The cost can be reduced.

Further, since the shift amount of the cutting position can be easily detected, it is possible to manufacture a small-sized monolithic ceramic electronic component having a small distance from the outer peripheral portion of the internal electrode to the cutting surface with high yield, and The quality can be improved.

[Brief description of drawings]

1A and 1B are views showing a method for manufacturing a laminated ceramic electronic component according to an embodiment of the present invention, FIG. 1A is a plan view showing an essential part of a laminated block, and FIG. 1B is cut at an appropriate position. FIG. 6 is a perspective view showing a cutting block in the case, and FIGS. 7 (c) and 7 (d) are perspective views showing the cutting block in the case where the cutting position is displaced.

2A and 2B are views showing a method for manufacturing a laminated ceramic electronic component according to another embodiment of the present invention, FIG. 2A is a plan view showing an essential part of a laminated block, and FIG. 2B is cut at an appropriate position. Perspective view showing the cutting block in the case of (c), (d),
(e) is a perspective view showing a cutting block when the cutting position is displaced.

FIG. 3 is a diagram showing a shape of a position shift detection mark according to still another embodiment of the present invention.

FIG. 4 is a diagram showing a shape of a position shift detection mark according to still another embodiment of the present invention.

FIG. 5 is a plan view showing a ceramic green sheet on which a conductor pattern and displacement detection marks are arranged in a conventional method for manufacturing a monolithic ceramic electronic component.

FIG. 6 is a diagram showing a conventional method for manufacturing a laminated ceramic electronic component, wherein (a) is a perspective view showing a laminated block;
(B) is a perspective view showing the cutting block when cut at an appropriate position, and (c) and (d) are perspective views showing the cutting block when there is a deviation of the cutting position.

[Explanation of symbols]

 11 conductor pattern 12 ceramic green sheet 13 laminated block 14 unfired chip 15, 25, 35, 45 misregistration detection mark 16 cutting block 16a, 16b cutting surface of cutting block L cutting line

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasunobu Yoneda 2-10-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (72) Inventor Satoru Yamazaki 2-26-10 Tenjin, Nagaokakyo, Kyoto Murata Manufacturing

Claims (1)

[Claims] 1. A laminated block formed by laminating a plurality of ceramic green sheets each having a conductor pattern and a positional deviation detection mark which is arranged at a constant distance from the conductor pattern, at a predetermined position. In a method of manufacturing a laminated ceramic electronic component in which internal electrodes are embedded in a ceramic by cutting and firing at, the shape of the misregistration detection mark is exposed on a cut surface when the laminated block is cut. At least one of the width and the position of the misregistration detection mark is shaped so as to change continuously or stepwise according to the direction or size of the deviation of the cutting position. .