JP2002164240A - Laminated chip part and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide laminated chip parts that can detect deviation in a conductor pattern inside a laminated layer over an entire region on a green sheet, and can correct cut position, when performing dicing, and to provide a method for manufacturing the laminated chip parts. SOLUTION: In these laminated chip parts, the laminated layers are cut into each chip by dicing. In this case, in the laminated layer, a plurality of green sheets having an internal electrode 15 are laminated and pressed for forming a number of matrix-like conductor circuits. Also, in the laminated chip parts, an electrode pattern 18 for misalignment detection is provided near the intersection of a cut line 21 for allowing the green sheet to be vertically and horizontally subjected to dicing in each chip compartment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer chip component and a method of manufacturing the same, and more particularly, to a method of forming internal electrodes in a matrix on a green sheet, laminating a plurality of layers of the internal electrodes, and forming internal electrodes of adjacent green sheets via via holes. The present invention relates to a method for manufacturing a laminated chip component in which a large number of conductive circuits are formed in a matrix in a matrix, and the formed laminated pressure-bonded body is cut into individual chips by dicing. In particular, the present invention relates to a laminated chip component in which cutting during dicing does not cause a shift with respect to an internal electrode arranged inside a laminated pressure-bonded body, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In a general method of manufacturing a multilayer chip component such as a multilayer chip inductor, a ceramic green sheet made of a ceramic raw material is first formed on a polyethylene terephthalate film (hereinafter referred to as a PET film) by a printing method or the like. The green sheet formed on this film is, for example, about 15 cm in length and width, and the thickness of the green sheet is, for example, 20 μm.
It is about. These green sheets and films include
Through holes for alignment are provided at the four corners. When laminating the green sheets, a base having a flat surface and a jig having posts (pins) and the like standing upright at the four corners of the base are prepared, and an adhesive or adsorptive base is provided on the base. The sheet is placed, and a green sheet on which a display mark pattern is formed in advance by printing or the like is fitted to a jig by fitting a through hole of the green sheet into a post so that the display mark surface contacts the base sheet, and pressure is applied. Then, the green sheet is fixed to the surface of the base sheet in close contact. Then, by peeling off the PET film, the first layer green sheet provided with the display mark is fixed to the base sheet surface.

[0003] Next, a plain green sheet formed on a PET film is similarly mounted on the post so that the through hole of the green sheet and the film fits into the post.
After temporary pressing, the film is peeled off. By repeating this process for several sheets, for example, a plain green sheet layer is laminated.

Next, a green sheet having a conductor pattern for forming a coil portion such as an inductor is laminated. As described above, a green sheet having a conductive pattern is formed by first forming a green sheet on a PET film by a printing method or the like, and then forming a conductive pattern on the green sheet. In the case of forming a coil, the conductor pattern is formed, for example, by forming a half-turn conductor pattern by screen printing of a conductive material paste or the like, so that its end overlaps the via hole provided in the green sheet. By laminating a plurality of these, a conductor pattern can be connected through each via hole to form a coil. For example, if a half-turn conductor is formed on one green sheet, a minimum of four green sheets may be laminated to form a two-turn coil. In this case, the extraction electrodes are provided on the green sheets located at the upper and lower end layers, and extend to the edge of the chip region. Then, on the green sheet laminate having these conductor patterns, several plain green sheets are arranged on the green sheet laminate, and the green sheets are laminated and pressed to form a laminated pressure-bonded body.

[0005] Since the laminated pressure-bonded body is a multi-piece substrate, it is cut in accordance with each chip section, and each chip is diced to be baked at a high temperature. By this firing, the chips obtained by dicing the green-sheet laminated pressure-bonded body become a ceramic sintered body having hardness, and the conductive material as the conductive pattern volatilizes the solvent to form an internal electrode as a metal conductive layer. Then, the external electrodes are formed by means such as dipping and plating of a conductive material, and the external electrodes are connected to the extraction electrodes to complete the multilayer chip component.

[0006]

According to the above-described method for manufacturing a laminated chip component, when the laminated green sheets are press-bonded to form a laminated press-bonded body, the green sheets extend, and the green sheets are stretched. However, there is a problem that the conductor pattern formed in the above is shifted from a regular position. If dicing is performed in a state where the conductor pattern inside the laminated pressure-bonded body is displaced, a part of the conductor pattern may be exposed on the cut surface, which may cause poor characteristics. Therefore, it is important in dicing to know how the position of the conductor pattern formed on the green sheet inside the laminated pressure-bonded body is shifted.

There is a problem that the displacement of the conductor pattern inside the laminated pressure-bonded body cannot be observed from the surface, and can be recognized only when the internal electrode is exposed on the cut surface. If the internal electrodes are not exposed,
In order to measure the displacement of the conductor pattern inside the laminated pressure-bonded body, it was necessary to grind the chip and observe the internal structure of the chip, which required a troublesome and time-consuming operation. In order to address such a problem, a technique disclosed in Japanese Patent No. 2534976 is known. This technology arranges a test pattern in place of an internal electrode pattern in a chip section or the like at four corners on a green sheet so that the test pattern passes through a virtual cutting line that is cut when dicing the laminated pressure-bonded body. It was done.

However, according to this technique, the inspection pattern can be arranged only in a very small area such as a chip section at the four corners on the green sheet, so that it is impossible to observe the displacement of the conductor pattern in the entire green sheet. there were. That is, in order to cope with the recent miniaturization of chip components, it is necessary to be able to cope with even a slight displacement of the conductor pattern, and such a technique has been insufficient.

The present invention has been made in view of the above-mentioned circumstances, and it is possible to detect a displacement of a conductor pattern inside a laminated press-bonded body over an entire area on a green sheet, and thereby a cutting position at the time of dicing. It is an object of the present invention to provide a multilayer chip component capable of correcting the problem and a method for manufacturing the same.

[0010]

SUMMARY OF THE INVENTION According to the present invention, a plurality of green sheets having internal electrodes are laminated and pressed to form a large number of conductive circuits in a matrix. In the laminated chip component formed by the above method, there is provided a laminated chip component provided with a misregistration detecting electrode pattern near an intersection of a cutting line for dicing the green sheet vertically and horizontally in each chip section.

In the present invention, it is preferable that the misregistration detecting electrode pattern is arranged on a green sheet on which a lead electrode of the conductor circuit is formed, and the misregistration detecting electrode pattern is provided on the green sheet. More preferably, it is connected to an electrode. Further, the length or the number of the position shift detection electrode patterns appearing on the cut surface changes according to the shift of the dicing cutting position.

In the method for manufacturing a laminated chip component according to the present invention, a misregistration detecting pattern capable of detecting a misalignment of a cutting line is arranged in each chip section of the green sheet on which the lead electrode portion of the conductor circuit is formed, and dicing is performed. By measuring the length or the number of the misregistration detection patterns appearing on the side surface of the laminated pressure-bonded body, the distribution of the displacement of the internal electrode in the laminated and press-bonded green sheet is detected, and the distribution of the detected deviation is used. It is characterized in that the cutting position at the time of dicing is corrected.

According to the present invention described above, all the chip sections of the green sheet are provided with the electrode patterns for detecting the misalignment of the conductor pattern inside the laminated pressure-bonded body, so that the positions exposed on the side surfaces of the chips after cutting during dicing are obtained. It is possible to confirm the length of the displacement detection electrodes or the number thereof. This makes it possible to detect the degree of displacement of the internal electrodes. Since each chip section is provided with the electrode pattern for detecting a displacement, the distribution of strain and elongation of the conductor pattern over the entire green sheet can be known. Therefore, by correcting the cutting position of dicing based on this deviation, it becomes possible to perform appropriate dicing corresponding to the distribution of strain and elongation of the conductor pattern. As a result, problems such as poor characteristics due to the exposure of the internal electrodes can be prevented. Therefore, it is possible to improve the yield in the manufacturing process of the multilayer chip component and to provide a highly reliable multilayer chip component.

[0014]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows chip sections of several green sheets provided with a misregistration detecting electrode pattern according to a first embodiment of the present invention. Conductor pattern 15 serving as internal electrode
Each of the chip sections of the green sheet 11 on which is disposed the electrode pattern 18 for detecting a displacement. In the green sheet 11, a pattern having the same shape is arranged in a matrix by printing, and a portion surrounded by a dotted line in the drawing is a section which is cut after lamination and pressure bonding to become individual chips. That is, the dotted line in the drawing indicates the position of the normal cutting line at the time of dicing of the laminated pressure-bonded body of the green sheet 11. It is preferable that the misregistration detection electrode pattern 18 is formed on a green sheet provided with an extraction electrode. In the illustrated example, the conductor pattern 15 constituting the internal electrode is formed in one chip section.
And a strip-shaped conductor pattern 20 forming a lead-out electrode portion between the pair of conductor patterns 15, 15. Therefore, when the laminated pressure-bonded body obtained by laminating and pressing the green sheets is cut along the cutting line 21, this portion is exposed on the side surface of the chip and further connected to an external electrode to be formed thereafter.

In this embodiment, the misregistration detecting electrode pattern 18 has a triangular portion and is arranged near the intersection of the dicing cutting lines 21. Therefore, when the cutting line 21 at the time of dicing is relatively displaced with respect to the conductor pattern 15 of the internal electrode, the length (width) 18 of the electrode of the positional displacement detection electrode pattern 18 exposed on the cut surface changes. FIG. 2 shows the appearance of the electrode pattern for detecting the displacement on the cut surface after dicing. That is, when the cutting position is A, portions from Sa to So of the electrode pattern appear on the cut surface as shown in FIG. next,
When the cutting position is shifted to B, a portion from Sb to So of the electrode pattern appears on the cut surface as shown in FIG. Similarly, when the cutting position is shifted to C, the portion from Sc to So of the electrode pattern appears on the cut surface as shown in FIG. In this way, by measuring the length (width) of the misregistration detection electrode pattern portion appearing on the cut surface, it is possible to determine how much the internal electrode is displaced from the regular dicing cut position. . Although the illustrated example shows only the case where the cutting line is shifted to the right in the drawing, the same applies to the case where the cutting line is shifted to the left in the drawing.

Since each section serving as all the chips on the green sheet is provided with an electrode pattern for detecting a positional deviation at the time of cutting, the amount of positional deviation of the conductor pattern is calculated along the entire cut surface of the green sheet after cutting. be able to. Therefore, the distribution of strain and elongation of the conductor pattern over the entire green sheet can be known. Accordingly, for example, even when the cutting line 21 is obliquely shifted from the normal position, this can be detected. According to the position shift detecting electrode pattern 18, the degree of shift of the internal electrode can be known over the entire length of the green sheet 11, so that appropriate feedback corresponding to this can be given. That is, by performing an appropriate correction to the dicing cutting position in accordance with the displacement amount of the internal electrodes, it is possible to perform cutting corresponding to the displacement distribution of the internal electrodes that cannot be seen from the surface. As a result, problems such as poor characteristics due to the exposure of the internal electrodes can be prevented. Therefore, it is possible to improve the yield in the manufacturing process of the multilayer chip component and to provide a highly reliable multilayer chip component.

FIG. 3 shows a misregistration detecting electrode pattern according to a second embodiment of the present invention. This electrode pattern 19
Has a spiral shape as shown in FIG.
Forming on the green sheet by connecting to 0 is the same as in the above embodiment. The appearance of the electrode portion of the positional displacement detection electrode pattern after cutting the laminated pressure-bonded body corresponding to the displacement of the internal electrode when the cutting line is in the Y direction is as follows. When the cutting position is the reference position A where no shift occurs in the internal electrode, only the extraction electrode section 20 appears as shown in FIG. Next, when the cutting line is relatively displaced to the position B, a long line of the displacement detection electrode pattern 19 appears in addition to the extraction electrode portion 20 on the side surface of the laminated pressure-bonded body.
Further, when the cutting position is shifted to C, two cut portions of the position shift detecting electrode pattern 19 appear. Further, when the cutting line is shifted to the position D, three cut portions of the position shift detecting electrode pattern 19 appear in addition to the extraction electrode portion 20.

Similarly, when the cutting line is in the X direction, the displacement of the internal electrode can be detected. That is, when the cutting line in the X direction is at the reference position E where there is no displacement of the internal electrode, the extraction electrode appears as shown in FIG. Furthermore, when the cutting line is relatively shifted to the position F, one cut portion of the electrode pattern 19 for position shift detection appears as shown in FIG. Further, for example, when the cutting line is relatively shifted to the position G, four position shift detecting electrode portions 19 appear on the cut surface of the laminated pressure-bonded body as shown in FIG. Note that, even when the cutting line is oblique as shown at the position H, the cut portion appears as shown in FIG. 4H, and this oblique positional deviation can be detected. In this way, it is possible to accurately determine the degree of the position shift based on the appearance of the position shift detection electrode unit.

FIGS. 5 and 6 show a misalignment detection electrode pattern according to a third embodiment of the present invention and how it appears on the side surface of the chip when it is cut. In this case, a triangular-shaped misaligned electrode detecting pattern 23 as shown in the figure is provided at four locations around the intersection of the cutting lines in the X and Y directions. When the cutting line in the Y direction is the reference position A, as shown in FIG. 6A, the electrode pattern 23 does not appear on the side surface of the laminated pressure-bonded body at the time of cutting. When the cutting line is shifted to the position B, the electrode portion 2 of the electrode pattern for detecting a position shift is used.
3 appears as two relatively long lines as shown in FIG. 6 (b). Further, when the cutting line is shifted to the position C, the electrode portion 23 of the electrode pattern for detecting a positional shift is moved to the position shown in FIG.
And appears as two slightly shorter lines. Further, when the cutting line is displaced to the position D, as shown in FIG.
Appears as a book line.

Similarly, when the cutting line in the X direction is at the reference position E, the electrode portion 23 of the electrode pattern for detecting the displacement does not appear on the side surface of the chip as shown in FIG. X
When the cutting line in the direction is shifted in the Y direction and is at the position F,
As shown in FIG. 6F, two relatively long lines of the electrode portion 23 appear. Further, when the cutting line comes to the position G with a large shift in the Y direction, the electrode pattern 23 for position shift detection appears as two relatively short lines as shown in FIG. In this way, by using the electrode pattern for detecting the position offset electrode of the present embodiment, when the cutting lines in the X direction and the Y direction are each displaced relative to the internal electrodes, the displacement is determined. The degree can be accurately detected.

FIG. 7 shows a misregistration detecting electrode pattern according to a fourth embodiment of the present invention. The electrode pattern of this embodiment has a rhombic electrode pattern 25 at the intersection of the cutting lines 21 and 21 in the X and Y directions. The diamond-shaped electrode pattern is connected to two parallel electrode lines 26 with the cutting line 21 in the X direction interposed therebetween.
Conductor pattern 15 constituting internal electrode via 6, 26
Is connected to Therefore, the cutting line 21 in the X direction or Y
When the cutting lines 21 in the directions deviate from the normal positions,
Correspondingly, the cut portion of the diamond-shaped electrode pattern 25 appears on the cut surface of the laminated pressure-bonded body, as in the above-described embodiments. Therefore, by measuring this length, it is possible to accurately detect the displacement of the internal electrodes in the X direction and the Y direction. Further, in this embodiment, since two parallel electrode lines 26, 26 for connecting the diamond-shaped misalignment detection electrode pattern 25 and the internal electrode 15 are provided, each chip after dicing is used. When forming the external electrode, the internal electrode 1
5 can play the role of an extraction electrode connected thereto. Therefore, when forming the external electrodes by plating or the like, it is possible to assist the stable connection of the internal electrodes with the external electrodes.

In each of the second, third and fourth embodiments, the detection of the displacement of the internal electrode corresponding to one chip section has been described. Since the electrode pattern for detecting the displacement is provided, the distribution of the strain and elongation of the conductor pattern over the entire green sheet inside the laminated pressure-bonded body can be known in any pattern.

Next, FIG. 8 shows a laminated pressure-bonded body manufactured by using the manufacturing method of the present invention. The illustrated example shows one chip section, but in practice, a large number of chips are formed in a matrix on a large green sheet. In this embodiment, the laminated pressure-bonded body 30 is composed of ten green sheets 11a to 11j. The lower three green sheets 11a, 11b, 11c are formed of solid green sheets having no electrode pattern. The middle four green sheets 11d, 1
Reference numerals 1e, 11f, and 11g each include a green sheet having an internal electrode pattern. Each green sheet has a via hole in a connection portion, and upper and lower electrodes are electrically connected by a conductive material filled in the via hole. I have. Thereby, a conductor circuit such as a coil is formed.

Of the green sheets on which the internal electrode patterns are formed, the lowermost and uppermost green sheets 11d, 1d
In 1 g, the extraction electrode 20 is exposed on the side surface, and is connected to the external electrode 32 formed after sintering. The green sheet has the electrode pattern 18 for detecting the displacement.
As described above, the electrode portion 18 is exposed on the cut surface by dicing. Therefore, if the internal electrode is misaligned with respect to the display of the dicing cutting position, this is corrected and the cutting is performed while being shifted from the dicing cutting position display. Therefore, it is possible to prevent problems such as poor characteristics due to exposure of the internal electrode to the cut surface. Further, the electrode pattern 1 for detecting a displacement is provided.
Since the electrode 8 is exposed on the cut surface, the misalignment detection electrode pattern 18 can share the auxiliary role of the extraction electrode 20. In particular, as shown in FIGS. 1, 3 and 7, when the misregistration detecting electrode pattern is kept in a conductive state with the internal electrode, the connection between the internal electrode and the external electrode can be made more stable. it can.

The upper two green sheets 11h, 11
i is constituted by a solid green sheet. The green sheet 11j located above the green sheet 11j is a green sheet on which a mark indicating a cutting position is formed, is the outermost surface of the laminated pressure-bonded body 30, and has a display mark indicating a rated value, polarity, and the like. The mark indicating the cutting position is provided outside the chip section (not shown) of the green sheet.

FIG. 9 shows an example of the arrangement of internal electrode patterns in the laminated pressure-bonded body shown in FIG. Of the green sheets on which the internal electrode patterns are formed, the lowermost green sheet 11d is connected to the internal electrode 1 from the extraction electrode 20 at the chip edge.
5 extends, and the other electrode end 15 after a half turn is connected to the internal electrode 15 on the upper green sheet 11 e having the via hole 16 via the via hole 16. In this manner, the internal electrodes 1 on the green sheets 11d to 11g are
5 are connected to each other via a via hole 16 to form a coil. Then, the internal electrode 15 on the green sheet 11g extends to the extraction electrode 20 on the other chip edge,
It is connected to an electrode 32 outside the chip. This extraction electrode 20
Are provided with misregistration detection electrodes 18, and after dicing, the electrode portions of misregistration detection electrodes 18 appear in two layers of green sheets 11d and 11g on the cut surface.

Next, a method of forming the laminated pressure-bonded body shown in FIG. 8 will be described with reference to FIG. In this embodiment, for example, the chip size is 1005 size (1
mm × 0.5mm) or 0603 size (0.6mm
× 0.3 mm).
Therefore, the thickness of one green sheet is extremely thin, from several μm to several tens μm. For this reason, the green sheet is made of PE
It is formed on a T film by, for example, printing. Then, the internal electrodes are formed on the green sheet by screen printing using a conductive paste. In screen printing, conductor patterns corresponding to a large number of chip sections can be printed in a matrix on a green sheet at a time. However, there is a problem in that the conductor patterns are displaced or distorted due to settling of a screen mask or the like.

The green sheet 11 is laminated with
A jig 39 having a base 33 having a flat surface and positioning pins 34 erected at four corners of the base 33 is prepared. The lowermost green sheet 1 on which the base sheet 40 having adsorbability is placed and fixed,
After fixing 1a and performing temporary pressing to sufficiently press the base sheet 40 on the base sheet 40, only the PET film (not shown) is peeled off from the green sheet 11a. At this time, the position of the green sheet 11a is adjusted by the pins 3 set up on the jig 39.
4 by fitting through holes 12 formed at the four corners of the PET film and the green sheet 11a. Next, similarly, a film to which a plain green sheet 11b is adhered is prepared, and the green sheet 11b is placed on the ground green sheet 11a by fitting the through holes 12 to the pins 34 at the four corners with the surface of the green sheet 11b facing down. . Then, the PET film is temporarily pressed, and then the PET film is peeled off.
Thereby, the green sheets 11b are stacked. This operation is repeated for the third green sheet 11c.

Then, green sheets 11d, 11e, 11f, 11 having internal electrode patterns and via holes
g, and press it temporarily on the green sheet
Thereafter, the operation of peeling off the PET film was similarly performed for 1
Repeat one by one. Further, plain green sheets 11h and 11i having no internal electrode and a green sheet 11j on which a pattern indicating a cutting position is formed are further laminated and pressed by the same procedure as described above. In the process of laminating and pressing these green sheets, elongation and distortion occur in the green sheets, and as a result, elongation and distortion of the conductor patterns of the internal electrodes occur.

Since the base sheet 40 has tackiness or adsorptivity in a normal state, the lowermost green sheet 11
a to the green sheet 11b.
To 11j are stacked. When the base sheet 40 is made of an ultraviolet release film, the base sheet 40 loses its tackiness when irradiated with ultraviolet rays. Therefore,
After the formation of the display mark or the like by means such as transfer onto the green sheet 11j, the adhesive is removed from the jig 39 and irradiated with ultraviolet rays on the base sheet 40, so that the adhesiveness is lost and the base sheet 40 is easily temporarily removed from the base sheet 40. The pressed laminated body 30 can be released.

Then, a main press such as a hydraulic press is performed.
The sheet-like laminated pressure-bonded body 30 is completed. Next, the sheet-like laminated pressure-bonded body is cut along a cutting line indicated by the display mark with a dicing saw or the like to obtain individual chip-shaped laminated pressure-bonded bodies. In this dicing, the length or number of the misregistration detection electrode patterns appearing on the side surfaces of the cut laminated pressure-bonded body is measured to detect the distribution of the displacement of the internal electrodes in the laminated and pressure-bonded green sheets. Then, the cutting position at the time of dicing is corrected based on the distribution of the detected deviation. The distribution of the displacement of the internal electrodes is performed by observing both of the upper and lower green sheets 11d and 11g, since the electrode patterns for detecting the displacement are provided on the upper and lower two green sheets 11d and 11g. Therefore, dicing can be performed in accordance with the internal electrodes that cannot be seen from the surface where the displacement has occurred, and problems such as poor characteristics due to the exposure of the internal electrodes can be prevented. In the case where the conductor pattern row is obliquely shifted on the green sheet, the position of the laminated pressure-bonded body 30 on the sheet may be adjusted in accordance with this and cut.

The steps after the dicing are the same as those in the prior art, and a sintered ceramic chip is obtained by firing at a high temperature. The internal electrode also becomes a metal conductive layer by firing at a high temperature, and this is connected via a via hole, so that a coil of the metal conductor is formed in the ceramic sintered body. At this time, the cutting position of the dicing is corrected according to the printed conductor pattern of the internal electrode. As a result, highly accurate dicing is achieved. Then, the external electrode 32 (see FIG. 8) is connected to the extraction electrode by A.
g or Ag-Pd paste or the like, and is formed by coating with a conductive material or the like, and further processed by nickel or solder plating or the like to complete a chip component.

[0034]

As described above, according to the present invention, it is possible to cut a sheet-like laminated pressure-bonded body in accordance with the distribution of the printing pattern shift of the electrodes inside the laminated pressure-bonded body that cannot be seen from the surface. Therefore, appropriate dicing can be performed on the position of the displaced internal electrode. This prevents problems such as poor characteristics due to exposure of the internal electrodes to the cut surface. In general, according to the present invention, it is possible to manufacture a high-quality laminated chip component at low cost.

[Brief description of the drawings]

FIG. 1 is a plan view showing a misregistration detection electrode pattern according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a state in which the misregistration detection electrode pattern of FIG. 1 appears on a cut surface.

FIG. 3 is a plan view showing a misregistration detection electrode pattern according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a state in which the misregistration detection electrode pattern of FIG. 3 appears on a cut surface.

FIG. 5 is a plan view showing a misregistration detection electrode pattern according to a third embodiment of the present invention.

FIG. 6 is a diagram showing a state in which the misregistration detection electrode pattern of FIG. 5 appears on a cut surface.

FIG. 7 is a plan view showing a misregistration detection electrode pattern according to a fourth embodiment of the present invention.

FIG. 8 is a perspective view showing one chip section of the laminated pressure-bonded body according to the embodiment of the present invention.

9 is a plan view showing a pattern example of internal electrodes of the laminated pressure-bonded body shown in FIG.

FIG. 10 is an exploded perspective view showing a manufacturing process of the laminated pressure-bonded body according to the embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 Green sheet 12 Lamination positioning through hole 15 Internal electrode (conductor pattern) 18, 19, 23, 25 Position shift detection electrode pattern 20 Lead electrode

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Takayuki Yamabe 14016 Nakaminowa, Minowa-cho, Kamiina-gun, Nagano F-term in Koa Corporation (reference) 5E062 DD04 FF01 5E070 AA01 AB02 CB03 CB13

Claims (5)

[Claims] 1. A laminated chip component formed by cutting a plurality of green sheets having internal electrodes by laminating and pressing to form a multiplicity of conductive circuits in a matrix form into individual chips by dicing. A multilayer chip component comprising a misalignment detection electrode pattern near an intersection of a cutting line for dicing the green sheet vertically and horizontally into each chip section. 2. The multilayer chip component according to claim 1, wherein the misregistration detecting electrode pattern is arranged on a green sheet on which the lead electrodes of the conductor circuit are formed. 3. The electrode pattern for detecting displacement according to claim 1, wherein the electrode pattern is connected to the extraction electrode.
3. The laminated chip component according to item 1. 4. The lamination according to claim 1, wherein a length or a number of the electrode patterns for detecting a position shift, which appear on a cut surface thereof, change in accordance with a shift of a cutting position of dicing. Chip parts. 5. A method of manufacturing a laminated chip component, wherein a plurality of green sheets having internal electrodes are laminated and pressed to form a large number of conductive circuits in a matrix and cut into individual chips by dicing. In each chip section of the green sheet on which the extraction electrode portion of the conductor circuit is formed, a misregistration detection pattern for detecting misalignment of the cutting line is arranged, and the misregistration detection pattern that appears on the side surface of the laminated pressure-bonded body that has been diced. By measuring the length or the number, the distribution of the displacement of the internal electrode in the laminated and pressed green sheet is detected, and the cut position at the time of dicing is corrected based on the distribution of the detected displacement. Manufacturing method of multilayer chip parts.