JPH07199166A - Production of reflection electrode plate - Google Patents

Production of reflection electrode plate

Info

Publication number
JPH07199166A
JPH07199166A JP33413193A JP33413193A JPH07199166A JP H07199166 A JPH07199166 A JP H07199166A JP 33413193 A JP33413193 A JP 33413193A JP 33413193 A JP33413193 A JP 33413193A JP H07199166 A JPH07199166 A JP H07199166A
Authority
JP
Japan
Prior art keywords
insulating film
original plate
electrode plate
organic insulating
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33413193A
Other languages
Japanese (ja)
Other versions
JP2760274B2 (en
Inventor
Eiji Mizobata
英司 溝端
Hiroshi Kano
博司 加納
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5334131A priority Critical patent/JP2760274B2/en
Publication of JPH07199166A publication Critical patent/JPH07199166A/en
Application granted granted Critical
Publication of JP2760274B2 publication Critical patent/JP2760274B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

PURPOSE:To obtain a process for producing a reflection electrode plate capable of freely forming an average degree of inclination of the shape of ruggedness by a simple method consisting of a small number of stages by bringing an original plate having the ruggedness into contact with the surface of an org. insulating film, thereby forming the rugged surface shape of the org. insulating film. CONSTITUTION:This rugged surface shape of the org. insulating film 2 is formed by bringing the original plate 3 having the ruggedness into contact with the surface of the org. insulating film 2 in the process for producing the reflection electrode plate by forming the org. insulating film 2 having the rugged surface shape on a flat substrate 1 and forming reflection electrodes having the ruggedness on the surface on the org. insulating film 2. The formation is made possible only by the stage of pressing the original plate 3 to the film and the rugged shape is formed in about 30 minutes to 1 hour according to such process for production. Then, one sheet of the reflection electrode plate is formable in about 2 to 3 hours even if all the stages are included. Further, the control of the average degree of inclination of the reflection electrode plate is made possible by using the original plate 3 which is controlled in the average degree of inclination of the section shape of the ruggedness.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は一方を透明絶縁性基板、
他方を反射電極を内側に有する絶縁性基板で液晶層を挟
んだ構造の液晶表示パネルに用いる反射電極板の製造方
法に関する。
BACKGROUND OF THE INVENTION The present invention relates to a transparent insulating substrate on one side,
The present invention relates to a method of manufacturing a reflective electrode plate used for a liquid crystal display panel having a structure in which a liquid crystal layer is sandwiched between insulating substrates having a reflective electrode inside.

【0002】[0002]

【従来の技術】携帯型コンピュータや携帯型情報機器用
のフラットパネルディスプレイとして液晶ディスプレイ
が注目されている。その中でもバックライトを必要とし
ない反射型液晶ディスプレイはバックライトで消費され
る電力が必要ないことから、低消費電力型のディスプレ
イとして、電池駆動の携帯型情報機器のディスプレイと
しての応用が考えられ、各機関で活発に開発が行われて
いる。
2. Description of the Related Art Liquid crystal displays have been attracting attention as flat panel displays for portable computers and portable information devices. Among them, the reflection type liquid crystal display that does not require a backlight does not require the power consumed by the backlight, so it can be considered to be applied as a low power consumption type display as a display of a battery-powered portable information device, Each organization is actively developing.

【0003】反射型ディスプレイの中で、特に二色性色
素を液晶内に混入させたGH(Guest-Host)液晶ディス
プレイは偏光板を必要としないため、偏光板での光の吸
収がないため明るいディスプレイを作ることができる。
また、偏光板が必要ないことから反射電極板をパネルの
内側に作成できることから、表示させた文字の像が反射
電極板から浮いた表示にならないという利点がある。こ
の反射電極板は写り込みのない明るい反射特性を得るた
めに表面に凹凸を設ける必要があり、平坦なガラス基板
の上に適当な材料の絶縁膜を形成し、通常のフォトリソ
及びエッチング工程により凹凸を形成し、その上に金属
膜を形成することにより凹凸を作成している。このよう
な反射電極板の製造技術は、例えば、木村直史、三ッ井
精一、島田康憲、山本邦彦、神崎修一、森本弘、松浦昌
孝、「反射型カラーLCDの開発」、シャープ技報、第
56号、1993年6月に開示されている。
Among the reflection type displays, a GH (Guest-Host) liquid crystal display in which a dichroic dye is mixed in the liquid crystal does not require a polarizing plate and is therefore bright because the polarizing plate does not absorb light. You can make a display.
In addition, since the polarizing plate is not required, the reflective electrode plate can be formed inside the panel, which has an advantage that the displayed character image does not float from the reflective electrode plate. This reflective electrode plate needs to have irregularities on the surface in order to obtain bright reflection characteristics without reflection, and an insulating film of an appropriate material is formed on a flat glass substrate, and the irregularities are formed by ordinary photolithography and etching processes. Is formed, and a metal film is formed thereon to form irregularities. The manufacturing technique of such a reflective electrode plate is described in, for example, Naofumi Kimura, Seiichi Mitsui, Yasunori Shimada, Kunihiko Yamamoto, Shuichi Kanzaki, Hiroshi Morimoto, Masataka Matsuura, “Development of reflective color LCD”, Sharp Technical Report. No. 56, June 1993.

【0004】図4に従来の反射電極板の製造方法を示
す。図4では基板上に絶縁膜を形成したところ以後から
の凹凸形状を形成する工程を示す。工程は通常の半導体
プロセスと同様のフォトリソ工程とエッチング工程から
なる。図4に大まかに工程を分離しても5工程有り、さ
らにこの他にレジスト塗布後の焼成、現像後の焼成の工
程を含めると図4中のレジスト塗布からレジスト剥離の
工程で約2時間から3時間必要とする。したがって、全
工程では4時間〜5時間程度かかる。さらに、凹凸の断
面形状はエッチング条件でサイドエッチの量を調節する
ことにより若干変えることは可能であるが、自由に断面
形状の平均傾斜角度を制御することは不可能である。
FIG. 4 shows a conventional method of manufacturing a reflective electrode plate. FIG. 4 shows a step of forming an uneven film after the insulating film is formed on the substrate. The process includes a photolithography process and an etching process, which are similar to those of a normal semiconductor process. There are 5 steps even if the steps are roughly separated in FIG. 4, and if the steps of baking after resist application and baking after development are included in addition to this, it takes about 2 hours from the step of resist application to the step of resist stripping in FIG. Need 3 hours. Therefore, the whole process takes about 4 to 5 hours. Furthermore, the cross-sectional shape of the unevenness can be slightly changed by adjusting the amount of side etching under the etching conditions, but it is impossible to freely control the average inclination angle of the cross-sectional shape.

【0005】[0005]

【発明が解決しようとする課題】本発明の分野である、
一方を透明絶縁性基板、他方を反射電極を内側に有する
絶縁性基板で液晶層を挟んだ構造の液晶表示パネルに用
いる反射電極板は平坦な絶縁基板上に薄膜を形成し、そ
の薄膜をフォトリソ及びエッチング工程により凹凸を形
成し、その上に金属電極を形成しているが、フォトリソ
及びエッチングは工程数が多く、時間及びコストがかか
るという欠点がある。また、凹凸の形状を自由に形成す
ることが困難であり、設計通りの反射特性を有する反射
電極板を作成できないという問題点がある。
The field of the invention is:
A reflective electrode plate used for a liquid crystal display panel having a structure in which a liquid crystal layer is sandwiched between a transparent insulating substrate on one side and an insulating substrate having a reflective electrode inside, and a thin film is formed on a flat insulating substrate and the thin film is formed by photolithography. Although the unevenness is formed by the etching process and the metal electrode is formed on the unevenness, the photolithography and the etching have a number of processes, and have a drawback that it takes time and cost. In addition, it is difficult to freely form the shape of the unevenness, and there is a problem in that a reflective electrode plate having a reflection characteristic as designed cannot be produced.

【0006】本発明の目的は、工程数の少ない簡単な方
法で、しかも凹凸の形状の平均傾斜角度を自由に形成す
ることができる反射電極板の製造方法を提供することに
ある。
It is an object of the present invention to provide a method of manufacturing a reflective electrode plate which has a simple method with a small number of steps and which is capable of freely forming the average inclination angle of the uneven shape.

【0007】[0007]

【課題を解決するための手段】第1の発明は、平坦な基
板上に凹凸表面形状を有する有機系絶縁膜を形成し、前
記有機系絶縁膜上に表面が凹凸を有する反射電極を形成
する反射電極板の製造方法において、前記有機系絶縁膜
の凹凸表面形状を、凹凸を有する原版を前記有機系絶縁
膜表面に接触させることにより形成することを特徴とす
る。
According to a first aspect of the present invention, an organic insulating film having an uneven surface shape is formed on a flat substrate, and a reflective electrode having an uneven surface is formed on the organic insulating film. In the method for manufacturing a reflective electrode plate, the uneven surface shape of the organic insulating film is formed by bringing an original plate having unevenness into contact with the surface of the organic insulating film.

【0008】第2の発明は、平坦な基板上に凹凸表面形
状を有する有機系絶縁膜を形成し、前記有機系絶縁膜上
に表面が凹凸を有する反射電極を形成する反射電極板の
製造方法において、前記有機系絶縁膜の凹凸表面形状
を、凹凸を有する原版上に前記有機系絶縁膜を塗布し、
前記有機系絶縁膜上に平坦な前記基板を張り合わせ、前
記原版を剥離し、前記原版の凹凸形状を転写することに
より形成することを特徴とする。
A second aspect of the present invention is a method of manufacturing a reflective electrode plate in which an organic insulating film having an uneven surface shape is formed on a flat substrate, and a reflective electrode having an uneven surface is formed on the organic insulating film. In, the uneven surface shape of the organic insulating film, the organic insulating film is coated on the original plate having unevenness,
The flat substrate is laminated on the organic insulating film, the original plate is peeled off, and the uneven shape of the original plate is transferred to form the substrate.

【0009】[0009]

【作用】第1の発明の製造方法によれば、図1に示すと
おり、あらかじめ設計された凹凸形状の原版を作成して
おけば、有機系絶縁膜の上に原版を押しつけるだけで原
版と同様の凹凸形状を作成することができる。また、図
1では板状の原版を用いたが、図2のようなローラー状
の原版を有機絶縁膜状に押しつけるようにして転がすこ
とによりやはり原版と同様の凹凸形状を作成することが
できる。さらに、第2の発明の製造方法によれば、図3
のように原版側に有機系絶縁膜を形成し、平坦な基板上
に転写することで凹凸を形成することができる。
According to the manufacturing method of the first invention, as shown in FIG. 1, if an original plate having an irregular shape designed in advance is prepared, the original plate can be pressed just on the organic insulating film and the same as the original plate. The uneven shape of can be created. Further, although the plate-shaped original plate is used in FIG. 1, a roller-shaped original plate as shown in FIG. 2 can be rolled by pressing it against the organic insulating film to form an uneven shape similar to that of the original plate. Further, according to the manufacturing method of the second invention,
As described above, the organic insulating film is formed on the original plate side and transferred onto a flat substrate to form the unevenness.

【0010】このように本発明の製造方法によれば原版
を押しつける工程だけで作成が可能となり、焼成または
紫外線照射等の時間を含めても1枚につき30分から1
時間程度で凹凸形状を作成することができる。したがっ
て、全工程を含めても2時間〜3時間程度で反射電極板
が作成可能となる。さらに、例えば粗面化ガラスを弗酸
でエッチングすることにより凹凸の断面形状の平均傾斜
角度を制御した原版を用いることにより、反射電極版の
平均傾斜角度も制御することが可能である。
As described above, according to the production method of the present invention, the production can be performed only by the step of pressing the original plate, and even if the time such as firing or irradiation of ultraviolet rays is included, it is 30 minutes to 1 minute per sheet.
The uneven shape can be created in about time. Therefore, the reflective electrode plate can be produced in about 2 to 3 hours including all steps. Further, the average tilt angle of the reflective electrode plate can also be controlled by using an original plate in which the average tilt angle of the uneven cross-sectional shape is controlled by etching roughened glass with hydrofluoric acid.

【0011】[0011]

【実施例】以下に本発明の実施例について図面を参照し
て詳細に説明する。
Embodiments of the present invention will be described in detail below with reference to the drawings.

【0012】実施例1 図1は第1の発明の実施例1による製造方法の凹凸形成
部分の説明図である。
Embodiment 1 FIG. 1 is an explanatory view of a concavo-convex forming portion in a manufacturing method according to Embodiment 1 of the first invention.

【0013】はじめに、ガラス基板などの絶縁性の基板
1の上にポリイミドなどの有機系絶縁膜2をスピンコー
ターで1〜4μm程度塗布をする。その後、約30分程
度80度〜120度程度でオーブンで仮焼成を行う。次
に、例えば、あらかじめ粗面化ガラスを適当な時間でエ
ッチングし所望の凹凸断面の平均傾斜角度を有するガラ
ス基板で作成しておいた原版3を有機系絶縁膜上に押し
つけ、本焼成を約30分程度150度〜200度程度で
行う。その後、原版3を有機系絶縁膜2から剥離するこ
とにより、原版3の凹凸形状を有機系絶縁膜2に転写す
ることができる。さらに、凹凸形状を有する面にアルミ
等をスパッタ法により300nm〜500nm程度成膜
することにより、所望の凹凸形状の反射電極板を作成す
ることができる。このようにして単純なプロセスのみ
で、全工程を2時間〜3時間で行うことができる。ま
た、凹凸形状も原版とほぼ同様の形状が得られる。
First, an organic insulating film 2 made of polyimide or the like is applied on an insulating substrate 1 such as a glass substrate by a spin coater to a thickness of about 1 to 4 μm. After that, pre-baking is performed in an oven at about 80 to 120 degrees for about 30 minutes. Next, for example, the original plate 3, which has been prepared by etching a roughened glass in advance for a suitable time with a glass substrate having an average inclination angle of the desired uneven cross section, is pressed onto the organic insulating film, and the main firing is performed. It is performed at about 150 to 200 degrees for about 30 minutes. After that, the original plate 3 is peeled off from the organic insulating film 2, whereby the uneven shape of the original plate 3 can be transferred to the organic insulating film 2. Further, by depositing aluminum or the like on the surface having the uneven shape by a sputtering method to a thickness of about 300 nm to 500 nm, a reflective electrode plate having a desired uneven shape can be prepared. In this way, all the steps can be performed in 2 to 3 hours with a simple process. In addition, the uneven shape can be obtained almost the same as the original plate.

【0014】なお、本実施例では原版3を押しつけた状
態で本焼成を行ったが、仮焼成と本焼成の温度設定によ
っては原版3を剥離した方が剥離しやすく、しかも形状
を転写しやすい場合もある。
In this embodiment, the main calcination was carried out while the original plate 3 was pressed. However, depending on the temperature settings of the calcination and the main calcination, the original plate 3 may be peeled off more easily and the shape may be transferred more easily. In some cases.

【0015】実施例2 有機系絶縁膜2として紫外線硬化樹脂Photo Po
lymer(2P樹脂)を使用し、原版3を押しつけた
後に紫外線照射を行う以外は、実施例1と同様に作成す
る方法である。なお、2P樹脂の硬化には紫外線照射以
外に150度程度の焼成を行った方がよい場合もある。
Example 2 A UV curable resin Photo Po as the organic insulating film 2
The method is the same as that of Example 1 except that a lymer (2P resin) is used and the original plate 3 is pressed and then irradiated with ultraviolet rays. In addition, in some cases, it is better to perform baking at about 150 degrees in addition to ultraviolet irradiation for curing the 2P resin.

【0016】実施例3 図2は第1の発明の実施例3による製造方法の凹凸形成
部分の説明図である。
Embodiment 3 FIG. 2 is an explanatory diagram of a concavo-convex forming portion in a manufacturing method according to Embodiment 3 of the first invention.

【0017】はじめに、ガラス基板などの絶縁性の基板
1の上にポリイミドなどの有機系絶縁膜2をスピンコー
ターで1〜4μm程度塗布をする。その後、約30分程
度80度〜120度程度でオーブンで仮焼成を行う。次
に、例えば、あらかじめ粗面化ガラスを適当な時間でエ
ッチングし所望の凹凸断面の平均傾斜角度を有するガラ
ス基板から金型を作成し、円筒系の筒に金型を巻き付け
て作成しておいた原版ローラー4を有機系絶縁膜2上に
押しつけながら回転させて行き、原版ローラー4の凹凸
形状を有機系絶縁膜2に転写する。その後、本焼成を約
30分程度150度〜200度程度で行い凹凸の形状を
確定させる。さらに、凹凸形状を有する面にアルミ等を
スパッタ法により300nm〜500nm程度成膜する
ことにより、所望の凹凸形状の反射電極板を作成するこ
とができる。このようにして単純なプロセスのみで、全
工程を2時間〜3時間で行うことができる。また、凹凸
形状も原版とほぼ同様の形状が得られる。
First, an organic insulating film 2 made of polyimide or the like is applied to an insulating substrate 1 such as a glass substrate by a spin coater to a thickness of about 1 to 4 μm. After that, pre-baking is performed in an oven at about 80 to 120 degrees for about 30 minutes. Next, for example, a roughened glass is etched in advance for an appropriate time to create a mold from a glass substrate having a desired average cross-sectional inclination angle, and the mold is wound around a cylindrical cylinder. The original plate roller 4 is rotated while being pressed against the organic insulating film 2, and the uneven shape of the original plate roller 4 is transferred to the organic insulating film 2. After that, the main baking is performed for about 30 minutes at about 150 to 200 degrees to determine the shape of the unevenness. Furthermore, a film of aluminum or the like having a thickness of about 300 nm to 500 nm is formed on a surface having an uneven shape by a sputtering method, whereby a reflective electrode plate having a desired uneven shape can be formed. In this way, all the steps can be performed in 2 to 3 hours with a simple process. In addition, the uneven shape can be obtained almost the same as the original plate.

【0018】実施例4 有機系絶縁膜として紫外線硬化樹脂Photo Pol
ymer(2P樹脂)を使用し、原版ローラー4を押し
つけながら2P樹脂上を転がした後に紫外線照射を行う
以外は、実施例3と同様に作成する方法である。なお、
2P樹脂の硬化には紫外線照射以外に150度程度の焼
成を行った方がよい場合もある。
Example 4 UV curable resin Photo Pol as an organic insulating film
The method is the same as that in Example 3 except that ymer (2P resin) is used, and while the original plate roller 4 is being pressed, it is rolled on the 2P resin and then irradiated with ultraviolet rays. In addition,
For curing the 2P resin, it may be better to perform baking at about 150 degrees in addition to ultraviolet irradiation.

【0019】実施例5 図3は第2の発明の実施例5による製造方法の凹凸形成
部分の説明図である。
Embodiment 5 FIG. 3 is an explanatory view of a concavo-convex forming portion in a manufacturing method according to Embodiment 5 of the second invention.

【0020】はじめに、例えば、あらかじめ粗面化ガラ
スを適当な時間でエッチングし所望の凹凸断面の平均傾
斜角度を有するガラス基板で作成しておいた原版3の上
にポリイミドなどの有機系絶縁膜2をスピンコーターで
1〜4μm程度塗布をする。その後、約30分程度80
度〜120度程度でオーブンで仮焼成を行う。次に、ガ
ラス基板などの絶縁性の基板1を有機系絶縁膜2の上に
押しつけ、本焼成を約30分程度150度〜200度程
度で行う。その後、原版3を有機系絶縁膜2から剥離す
ることにより、原版3の凹凸形状を有機系絶縁膜2に転
写したものを基板1上に写し取ることができる。さら
に、凹凸形状を有する面にアルミ等をスパッタ法により
300nm〜500nm程度成膜することにより、所望
の凹凸形状の反射電極板を作成することができる。この
ようにして単純なプロセスのみで、全工程を2時間〜3
時間で行うことができる。また、凹凸形状も原版3とほ
ぼ同様の形状が得られる。
First, for example, an organic insulating film 2 made of polyimide or the like is formed on an original plate 3 which is prepared by etching a roughened glass in advance for a proper time with a glass substrate having an average inclination angle of a desired uneven cross section. Is applied by a spin coater to about 1 to 4 μm. Then, about 30 minutes 80
Temporary baking is performed in an oven at a temperature of about 120 to 120 degrees. Next, an insulative substrate 1 such as a glass substrate is pressed onto the organic insulating film 2 and main firing is performed at about 150 to 200 degrees for about 30 minutes. After that, the original plate 3 is peeled off from the organic insulating film 2, so that the uneven shape of the original plate 3 transferred to the organic insulating film 2 can be copied onto the substrate 1. Furthermore, a film of aluminum or the like having a thickness of about 300 nm to 500 nm is formed on a surface having an uneven shape by a sputtering method, whereby a reflective electrode plate having a desired uneven shape can be formed. In this way, the whole process takes 2 hours to 3
Can be done in time. In addition, the uneven shape can be obtained in a shape substantially similar to that of the original plate 3.

【0021】なお、本実施例では原版3と基板1の張り
合わせの際に、基板1側には何も塗布していないが、有
機系絶縁膜2を塗布することにより写し取りが容易に行
うことができる。
In this embodiment, when the original plate 3 and the substrate 1 are bonded together, nothing is coated on the substrate 1 side, but the organic insulating film 2 is coated so that copying can be easily performed. You can

【0022】実施例6 有機系絶縁膜2として紫外線硬化樹脂Photo Po
lymer(2P樹脂)を使用し、基板1を押しつけた
後に紫外線照射を行う以外は、実施例5と同様に作成す
る方法である。なお、2P樹脂の硬化には紫外線照射以
外に150度程度の焼成を行った方がよい場合もある。
Example 6 As the organic insulating film 2, a UV curable resin Photo Po
The method is the same as in Example 5 except that the polymer (2P resin) is used and the substrate 1 is pressed and then ultraviolet irradiation is performed. In addition, in some cases, it is better to perform baking at about 150 degrees in addition to ultraviolet irradiation for curing the 2P resin.

【0023】[0023]

【発明の効果】本発明を適用するならば、簡単な工程だ
けで、自由に設計通りの平均傾斜角度の凹凸形状を有す
る反射電極板を製造することができる。
If the present invention is applied, it is possible to freely manufacture a reflective electrode plate having a concavo-convex shape with an average inclination angle as designed by only simple steps.

【図面の簡単な説明】[Brief description of drawings]

【図1】第1の発明の製造方法の実施例1、2による製
造工程を示した図である。
FIG. 1 is a diagram showing a manufacturing process according to Examples 1 and 2 of a manufacturing method of a first invention.

【図2】第1の発明の製造方法の実施例3、4による製
造工程を示した図である。
FIG. 2 is a diagram showing a manufacturing process according to Examples 3 and 4 of the manufacturing method of the first invention.

【図3】第2の発明の製造方法の実施例5、6による製
造工程を示した図である。
FIG. 3 is a diagram showing a manufacturing process according to Examples 5 and 6 of the manufacturing method of the second invention.

【図4】従来の製造方法による製造工程を示した図であ
る。
FIG. 4 is a diagram showing a manufacturing process according to a conventional manufacturing method.

【符号の説明】[Explanation of symbols]

1 基板 2 有機系絶縁膜 3 原版 4 原版ローラー 5 絶縁膜 6 レジスト 7 マスク 1 substrate 2 organic insulating film 3 original plate 4 original plate roller 5 insulating film 6 resist 7 mask

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 平坦な基板上に凹凸表面形状を有する有
機系絶縁膜を形成し、前記有機系絶縁膜上に表面が凹凸
を有する反射電極を形成する反射電極板の製造方法にお
いて、前記有機系絶縁膜の凹凸表面形状を、凹凸を有す
る原版を前記有機系絶縁膜表面に接触させることにより
形成することを特徴とする反射電極板の製造方法。
1. A method of manufacturing a reflective electrode plate, comprising forming an organic insulating film having an uneven surface shape on a flat substrate and forming a reflective electrode having an uneven surface on the organic insulating film. A method of manufacturing a reflective electrode plate, comprising forming the uneven surface shape of a system insulating film by bringing an original plate having unevenness into contact with the surface of the organic insulating film.
【請求項2】 平坦な基板上に凹凸表面形状を有する有
機系絶縁膜を形成し、前記有機系絶縁膜上に表面が凹凸
を有する反射電極を形成する反射電極板の製造方法にお
いて、前記有機系絶縁膜の凹凸表面形状を、凹凸を有す
る原版上に前記有機系絶縁膜を塗布し、前記有機系絶縁
膜上に平坦な前記基板を張り合わせ、前記原版を剥離
し、前記原版の凹凸形状を転写することにより形成する
ことを特徴とする反射電極板の製造方法。
2. A method of manufacturing a reflective electrode plate, comprising forming an organic insulating film having an uneven surface shape on a flat substrate and forming a reflective electrode having an uneven surface on the organic insulating film. The uneven surface shape of the system insulating film, the organic insulating film is applied on the original plate having unevenness, the flat substrate is bonded onto the organic insulating film, the original plate is peeled off, and the uneven shape of the original plate is formed. A method of manufacturing a reflective electrode plate, which is characterized by being formed by transferring.
JP5334131A 1993-12-28 1993-12-28 Method for manufacturing reflective electrode plate Expired - Lifetime JP2760274B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5334131A JP2760274B2 (en) 1993-12-28 1993-12-28 Method for manufacturing reflective electrode plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5334131A JP2760274B2 (en) 1993-12-28 1993-12-28 Method for manufacturing reflective electrode plate

Publications (2)

Publication Number Publication Date
JPH07199166A true JPH07199166A (en) 1995-08-04
JP2760274B2 JP2760274B2 (en) 1998-05-28

Family

ID=18273874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5334131A Expired - Lifetime JP2760274B2 (en) 1993-12-28 1993-12-28 Method for manufacturing reflective electrode plate

Country Status (1)

Country Link
JP (1) JP2760274B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000047200A (en) * 1998-07-31 2000-02-18 Hitachi Ltd Diffusive reflector, liquid crystal display device using that, and its production
JP2000258615A (en) * 1999-03-08 2000-09-22 Hitachi Chem Co Ltd Production of diffusion reflection plate and transfer film
JP2002032036A (en) * 2000-07-18 2002-01-31 Sumitomo Bakelite Co Ltd Substrate for display element and reflection type liquid crystal display device
JP2004004750A (en) * 2003-04-14 2004-01-08 Hitachi Chem Co Ltd Method for manufacturing transfer film and diffusion reflection plate
JP2009080506A (en) * 2009-01-08 2009-04-16 Hitachi Chem Co Ltd Method of manufacturing diffuse reflection plate and transfer film
US7595855B2 (en) 2005-09-29 2009-09-29 Samsung Electronics Co., Ltd. Liquid crystal display and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120529A (en) * 1987-11-04 1989-05-12 Alps Electric Co Ltd Production of liquid crystal element
JPH02126227A (en) * 1988-11-07 1990-05-15 Seikosha Co Ltd Liquid crystal display device
JPH04212931A (en) * 1990-11-28 1992-08-04 Seiko Epson Corp Electro-optical device and manufacture thereof
JPH04250418A (en) * 1991-01-28 1992-09-07 Nec Corp Liquid crystal optical element and its manufacture
JPH0534730A (en) * 1991-07-29 1993-02-12 Ricoh Co Ltd Liquid crystal display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120529A (en) * 1987-11-04 1989-05-12 Alps Electric Co Ltd Production of liquid crystal element
JPH02126227A (en) * 1988-11-07 1990-05-15 Seikosha Co Ltd Liquid crystal display device
JPH04212931A (en) * 1990-11-28 1992-08-04 Seiko Epson Corp Electro-optical device and manufacture thereof
JPH04250418A (en) * 1991-01-28 1992-09-07 Nec Corp Liquid crystal optical element and its manufacture
JPH0534730A (en) * 1991-07-29 1993-02-12 Ricoh Co Ltd Liquid crystal display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000047200A (en) * 1998-07-31 2000-02-18 Hitachi Ltd Diffusive reflector, liquid crystal display device using that, and its production
JP2000258615A (en) * 1999-03-08 2000-09-22 Hitachi Chem Co Ltd Production of diffusion reflection plate and transfer film
JP2002032036A (en) * 2000-07-18 2002-01-31 Sumitomo Bakelite Co Ltd Substrate for display element and reflection type liquid crystal display device
JP2004004750A (en) * 2003-04-14 2004-01-08 Hitachi Chem Co Ltd Method for manufacturing transfer film and diffusion reflection plate
US7595855B2 (en) 2005-09-29 2009-09-29 Samsung Electronics Co., Ltd. Liquid crystal display and manufacturing method thereof
JP2009080506A (en) * 2009-01-08 2009-04-16 Hitachi Chem Co Ltd Method of manufacturing diffuse reflection plate and transfer film

Also Published As

Publication number Publication date
JP2760274B2 (en) 1998-05-28

Similar Documents

Publication Publication Date Title
US6538711B2 (en) Method of manufacturing reflective liquid crystal display device
JP4059512B2 (en) Transflective liquid crystal display device
KR100291917B1 (en) Reflective liquid crystal display
JPH07199166A (en) Production of reflection electrode plate
US20100059757A1 (en) Apparatus and method of manufacturing the same
JP3094546B2 (en) Method for manufacturing a diffuse reflection plate for a liquid crystal display, and method for manufacturing a liquid crystal display
US20020167635A1 (en) Method for forming spacer of liquid crystal display panel
JP4041122B2 (en) Liquid crystal display device and manufacturing method thereof
JP3199677B2 (en) Manufacturing method of electro-optical device
JP3063764B2 (en) Manufacturing method of electro-optical device
JP2720780B2 (en) Method for manufacturing reflective electrode plate
JP3566874B2 (en) Manufacturing method of liquid crystal display device
JPH112718A (en) Color filter and color liquid crystal display device
JPH10177109A (en) Color filter and its production
JP2002350841A (en) Reflective liquid crystal display element and manufacturing method therefor
TW574565B (en) Liquid crystal display for enhancing reflection and method of manufacturing the same
US6927017B2 (en) Method for fabricating reflective-type LCD
JP2001042319A (en) Production of light-reflecting substrate and reflection type liquid crystal display device
JP3238381B2 (en) Electro-optical device
JP2000111906A (en) Production of electro-optic device
KR20020017189A (en) Method for fabricating a color filter substrate
JP4965388B2 (en) Manufacturing method of transflective liquid crystal display device
JPH11295728A (en) Reflection type liquid crystal device, manufacture thereof and electronic equipment
JP3141884B2 (en) Manufacturing method of electro-optical device
JP2003233067A (en) Method for manufacturing reflective liquid crystal display element

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19980217

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080320

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090320

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090320

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100320

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100320

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110320

Year of fee payment: 13

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110320

Year of fee payment: 13

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110320

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120320

Year of fee payment: 14

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120320

Year of fee payment: 14

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120320

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130320

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130320

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140320

Year of fee payment: 16

EXPY Cancellation because of completion of term