JPH07195660A - Vacuum holding device for semiconductor device in printing of solder paste - Google Patents

Abstract

PURPOSE:To prevent a semiconductor device from adhering to a printing mask by an adhesive force of a solder paste when the semiconductor device and the printing mask are separated from a form plate at a batch printing time of the solder paste for pads to a surface of the semiconductor device. CONSTITUTION:A vacuum suction stage 18 is set on a backup plate 17 of a working table 4 of a solder paste-printing apparatus. The interior of a vacuum drive chamber 20 of the vacuum suction stage 18 is vacuumized, thereby sucking and fixing each semiconductor device 1 positioned and stored in a storing hole 11 of an arrangement plate 10 to an suction face 25 by a vacuum suction force. After a solder paste is completely printed to the semiconductor device 1, a printing mask 6 and the semiconductor device 1 are separated from a form plate. At this time, a vacuum suction/fixing force to the semiconductor device 1 is larger than an adhesive force of the solder paste of the printing mask 6, and therefore the semiconductor device 1 is prevented from adhering to the printing mask 6 when separated from the form plate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention holds a plurality of semiconductor devices such as ICs and LSIs in a semiconductor device array plate and holds the semiconductor devices fixedly when collectively printing pad cream solder on the surface of the semiconductor devices. It relates to the device.

[0002]

2. Description of the Related Art FIG. 7 shows a semiconductor device in which semiconductor elements such as IC and LSI are accommodated in a general semiconductor element accommodation package. A plurality of lead pins 2 are formed on the side of the semiconductor device 1, and the semiconductor device 1 is mounted on the circuit board by connecting the lead pins 2 to a circuit pattern of a circuit board (not shown).

However, in the structure in which the plurality of lead pins 2 are formed in the semiconductor device 1, there is a problem that the semiconductor device 1 becomes large in size because the lead pins 2 are formed so as to project from the main body of the semiconductor device 1. The work of connecting the plurality of lead pins 2 to the semiconductor device is complicated and the work efficiency is poor.

In order to solve such a problem, the applicant has previously proposed a semiconductor device 1 as shown in FIG. In the semiconductor device 1 of this proposal, cream solder is printed and formed at a plurality of predetermined positions on the surface of the semiconductor device, solder balls are placed on the cream solder printing portion, and the solder balls are passed through a heating furnace to be reflowed. The spherical pads 3 for connection are formed by fixing the arrangement on the surface of the. When the semiconductor device 1 is mounted on the circuit board, the pads 3 of the semiconductor device 1 are mounted on the circuit board with the formation surface of the pads 3 of the semiconductor device 1 on the circuit board side, and reflowed in this state, so that the pads 3 of the semiconductor device 1 are connected to the circuit. The semiconductor devices 1 are collectively connected and fixed to a predetermined connection position on the board, and the semiconductor device 1 is surface-mounted on the circuit board.

According to the semiconductor device 1 of this proposed example, the lead pin 2 of the conventional example is not required, and the semiconductor device 1 can be greatly downsized and the mounting density on the circuit board can be improved.

[0006]

When the cream solder for forming the pad 3 is printed on the surface of the semiconductor device 1 of the above-mentioned proposed example, as shown in FIG. 5, the work table 4 of the cream solder printing machine is used. The semiconductor device 1 is positioned and mounted on the upper surface of the semiconductor device 1 and a printing mask 6 having a plurality of holes 5 corresponding to the positions of the pads 3 is applied to the upper side thereof, and the cream solder 7 supplied to the upper side of the printing mask 6 is applied. Squeegee 8
Is put into the hole 5 by the sliding movement of and the cream solder of the pattern shape of the hole 5 of the print mask 6 is transferred to the surface of the semiconductor device 1 to form the cream solder for forming the pad 3 on the surface of the semiconductor device 1. Can be printed.

However, it is very troublesome to mount the plurality of semiconductor devices 1 one by one on the work table 4 of the printing machine and print the cream solder for pads one by one, and it is difficult to improve work efficiency. is there. Therefore, in order to solve such a difficulty, the applicant has proposed a semiconductor device array plate capable of collectively printing cream solder on the surfaces of a plurality of semiconductor devices.

FIG. 2 shows the proposed semiconductor device array plate. In the figure, on the surface of the semiconductor device array plate 10 made of aluminum or the like, a plurality of quadrangular semiconductor device housing holes 11 are arrayed and formed in a two-dimensional matrix shape (6 columns in the vertical direction and 5 columns in the horizontal direction). . The semiconductor device accommodation hole 11 is a through hole, and each semiconductor device accommodation hole 11
The mounting reference surface 12 is formed on the bottom side of the
The depth from the surface side of the semiconductor device accommodating hole 11 to the mounting reference surface 12 corresponds to the height dimension of the semiconductor device to be accommodated, and the semiconductor device is mounted on the mounting reference surface 12 and the semiconductor The surface height of the device matches the surface height of the base plate 10. The vertical and horizontal dimensions of the rectangular semiconductor device accommodation hole 11 are larger than the corresponding dimensions of the same rectangular semiconductor device.

Two adjacent surfaces of the square semiconductor device housing hole 11 are positioning reference surfaces 13a and 13b. The positioning reference surface 13a is as shown in FIG.
The semiconductor device 1 accommodated in the semiconductor device accommodation hole 11 serves as a reference surface that regulates the position in the X-axis direction, and the positioning reference surface 13b serves as a reference surface that regulates the position of the semiconductor device 1 in the Y-axis direction. There is.

A spring accommodating recess 9 is formed in a diagonally opposite side of the positioning reference surfaces 13a and 13b, that is, in a linear region connecting a corner A and a corner B of the semiconductor device accommodating hole 11, and the spring accommodating recess 9 is formed. A U-shaped bifurcated leaf spring 14 is disposed therein as a semiconductor device holding means. The bifurcated leaf spring 14 has two (a pair) spring leaf-shaped foot springs 15a and 15b from the base end side.
Is extended into the semiconductor device accommodation hole 11 toward the diagonal position A side of the semiconductor device accommodation hole 11, and the foot springs 15a and 15b thereof are provided.
The front end side of is bent outward with a curved line.
The bifurcated leaf spring 14 is fixed by a mounting rod 16 inserted on the base end side.
The semiconductor device array plate 10 is fixed at 16 by implantation.
The height of the bifurcated leaf spring 14 and the mounting rod 16 matches the surface height of the semiconductor device array plate 10,
It is set so as not to project upward from the surface of the semiconductor device array plate 10.

When cream solder printing is collectively performed on the surfaces of a plurality of semiconductor devices 1 using this semiconductor device array plate, as shown in FIG. 3A, a bifurcated leaf spring is formed.
With 14 free, insert the insertion pin 21 between the crotch of the bifurcated leaf spring 14 as shown in FIG.
The semiconductor device 1 is inserted into the semiconductor device housing hole 11 with the foot springs 15a and 15b retracted from the path for inserting the semiconductor device 1 into the semiconductor device housing hole 11 by opening a and 15b. After this semiconductor device is inserted, the leg springs 15a and 15b are released from the open state, so that the semiconductor device 1 is positioned by the elastic restoring force of the foot springs 15a and 15b as shown in FIG. The semiconductor device 1 is held in pressure contact with the 13a and 13b to achieve the positioning of the semiconductor device 1 in the X and Y biaxial directions, and the semiconductor device 1 is mounted on the mounting reference surface 12 so that the positioning in the height direction is also achieved. The semiconductor device is accommodated in the semiconductor device accommodation hole 11 in this state.

In this way, the semiconductor device array plate
After the semiconductor device 1 is accommodated and held in all the semiconductor device accommodating holes 11 of 10 in a positioned state, the semiconductor device array plate 10 is shown in FIG.
The solder cream is attached to the work table 4 of the printing machine shown in FIG. 1 in a positioned state, and the cream solder 7 is pushed into the holes 5 of the print mask 6 by the squeegee 8 from the upper side of the print mask 6, thereby the surfaces of all the semiconductor devices 1 are covered. A cream solder print for the pad is formed without misalignment.

After printing the cream solder, the work table 4 is lowered to separate the semiconductor device 1 from the printing mask 6, and the semiconductor device array plate 10 is removed from the work table 4 to remove the semiconductor device 1 from the work table 4. By placing a solder ball on the solder cream printing surface and performing reflow, a substantially spherical pad of the solder ball is formed on the surface of each semiconductor device 1. After forming this pad, the bifurcated leaf spring 14
By opening the foot springs 15a and 15b to release the positioning and holding state of the semiconductor device 1, it is possible to take out the semiconductor device 1 having the pads formed therein from the semiconductor device accommodating hole 11.

However, after the cream solder is printed on the surface of the semiconductor device 1, when the work table 4 is lowered, the adhesive force of the cream solder 7 is strong as shown in FIG. The semiconductor device 1 is overcome by overcoming the holding force of the forked leaf spring 14 holding the semiconductor device 1.
Is attached to the print mask 6 side. In this way, when the semiconductor device 1 adheres to the print mask 6 side, it takes a lot of time to peel it off, and when the semiconductor device 1 is peeled off, the semiconductor device 1 rubs against the print mask 6 and the surface of the semiconductor device 1 There arises a problem that the print pattern shape of the cream solder 7 printed on the board becomes defective.

The present invention has been made to solve the above problems, and an object of the present invention is to, after cream solder printing of a semiconductor device, lower the work table of the printing machine to cause plate separation when the semiconductor device is separated. Is to provide a vacuum holding device for a semiconductor device during cream solder printing, which does not adhere to the print mask side due to the adhesive force of the cream solder.

[0016]

In order to achieve the above object, the present invention is constructed as follows. That is, the present invention is a device for holding each semiconductor device by vacuum suction when collectively printing pad cream solder on the surface of a plurality of semiconductor devices, and the device has a printing side surface side. A semiconductor device array plate having a plurality of semiconductor device housing holes for positioning and housing the semiconductor device is provided, and a vacuum drive chamber communicating with each semiconductor device housing hole is provided on the back side of the semiconductor device array plate. The semiconductor device housed in each semiconductor device housing hole is sucked and fixed to the semiconductor device suction surface provided on the bottom side of each semiconductor device housing hole by the vacuum suction force of the vacuum drive chamber. .

[0017]

In the present invention having the above-described structure, the semiconductor devices are positioned and accommodated in the respective semiconductor device accommodating holes of the semiconductor device arranging plate, the semiconductor device arranging plate is mounted on the cream solder printer, and the semiconductor device arranging plate is mounted on the surface of the semiconductor device. When the cream solder is collectively printed, the air in the vacuum drive chamber on the back surface side of the semiconductor device array plate is evacuated. As a result, each semiconductor device is vacuum-sucked by the vacuum suction force,
The semiconductor device is sucked and fixed to a semiconductor device suction surface provided on the bottom side of each semiconductor device housing hole.

In this suction-fixed state, a printing mask is applied to the upper side of the semiconductor device array plate, and the cream solder for pads is printed all at once on the surface of the semiconductor device.

After the completion of printing, the work table of the cream solder printing machine is lowered together with the semiconductor device array plate,
The plate is separated from the semiconductor device and the print mask. At the time of separating the plate, since each semiconductor device is adsorbed and fixed to the semiconductor device adsorption surface by the vacuum suction force, the vacuum adsorption fixing force is different from the adhesive force of the solder cream that adheres the semiconductor device to the printing mask side. The semiconductor device does not adhere to the print mask side when the printing plate is released after overcoming.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the configuration of essential parts of an embodiment of a vacuum holding device according to the present invention. In the figure, a box-shaped vacuum suction table 18 is airtightly mounted on the upper side of the backup plate 17 provided on the work table 4 of the cream solder printing machine with the opening surface facing down. A vacuum drive chamber 20 is formed in the internal space surrounded by 17.

A vacuum exhaust port 22 is formed on the side wall surface of the vacuum drive chamber 20, and the vacuum exhaust port 22 is connected to a vacuum suction port of a vacuum pump (not shown).

The semiconductor device array plate 10 shown in FIG. 2 is positioned and mounted on the upper side of the vacuum suction table 18, and the vacuum suction table is opposed to the semiconductor device housing holes 11 of each semiconductor device array plate 10. Vacuum suction holes in the top wall 23 of 18
24 is opened, and each semiconductor device accommodation hole 11 is communicated with the vacuum drive chamber 20 through the vacuum suction hole 24. The upper surface of the vacuum suction table 18 facing the bottom surface of the semiconductor device 1 housed in each semiconductor device housing hole 11 functions as a semiconductor device suction surface 25 of the semiconductor device 1.

This embodiment is constructed as described above,
Next, the operation will be described. When the cream solder for a pad is collectively printed on the surface of each semiconductor device 1 which is housed in each semiconductor device housing hole 11 of the semiconductor device array plate 10 and positioned and held, the semiconductor device in which the semiconductor device 1 is positioned and housed The array plate 10 is positioned and mounted on the upper side of the vacuum suction table 18.

In this state, the vacuum pump is driven and the inside of the vacuum drive chamber 20 is evacuated to receive the vacuum suction force from the vacuum drive chamber 20 so that the semiconductor device 1 is sucked and fixed to the semiconductor device suction surface 25. To be done.

In this state, the work table 4 is moved upward to bring the surface of each semiconductor device 1 into close contact with the print mask 6. In this state, as shown in FIG. 5, the squeegee 8 slides on the surface of the print mask 6 and the cream solder 7 is pushed into the holes 5 of the print mask 6 to form a pad on the surface of each semiconductor device 1. Cream solder 7 for printing is collectively formed by printing.

After the completion of printing, the work table 4 is lowered together with the semiconductor device array plate 10 to separate the semiconductor device 1 from the printing mask 6. At the lowering stop position of the work table 4, the vacuum pump is stopped and the vacuum drive chamber 20 is opened in vacuum.

Next, the semiconductor device array plate 10 is removed from the vacuum suction table 18, and solder balls are placed on the cream solder printing surface of each semiconductor device 1 and reflowed. Formed on the surface of. After the pads are formed, the semiconductor device 1 is held by the bifurcated leaf springs 14 as shown in FIG. 3C, and the bifurcated leaf springs 14 as shown in FIG. Insert the insertion pin 21 between the foot springs 15
Open a and 15b, and remove the semiconductor device 1 on which pads have been formed from the semiconductor device array plate 10.

According to this embodiment, when the semiconductor device 1 is printed with cream solder, the semiconductor device 1 is sucked and fixed to the semiconductor device suction surface 25 by the vacuum suction force of the vacuum drive chamber 20, so that after the solder paste printing is completed. When the work table 4 is lowered and the semiconductor device 1 and the printing mask 6 are separated from each other, the semiconductor device 1 does not adhere to the printing mask 6 side due to the adhesive force of the cream solder. Smooth solder printing work, and
It becomes possible to carry out efficiently.

The present invention is not limited to the above-mentioned embodiment, and various embodiments can be adopted. For example, although the vacuum suction table 18 is detachably attached to the backup plate 17 in the above-described embodiment, the vacuum suction table 18 is used as the backup plate.
It may be configured integrally with 17.

Although the semiconductor device array plate 10 is attached to and detached from the vacuum suction table 18 in the above embodiment, the semiconductor device array plate 10 may be formed integrally with the vacuum suction table 18.

[0031]

According to the present invention, a vacuum drive chamber is provided on the back side of a semiconductor device array plate having a plurality of semiconductor device accommodation holes for positioning and accommodating semiconductor devices, and the vacuum suction force of the vacuum drive chamber is used. Since the semiconductor device accommodated in the semiconductor device accommodating hole is configured to be adsorbed and fixed on the semiconductor device adsorption surface, after the cream solder for the pad is collectively printed on the surface of each semiconductor device, the print mask and the semiconductor device When the plate separation is performed, the vacuum suction fixing force of each semiconductor device sufficiently overcomes the adhesive force of the cream solder, so that the semiconductor device does not adhere to the print mask side by the adhesive force of the cream solder.

Therefore, it is possible that the semiconductor device attached to the print mask is released from the hand gap for each peeling, and when the semiconductor device is peeled off, the semiconductor device rubs against the print mask and the print pattern of the cream solder formed by printing becomes defective. Therefore, the cream solder for pad of the semiconductor device can be printed smoothly and efficiently.

[Brief description of drawings]

FIG. 1 is a main part configuration diagram showing an embodiment of a vacuum holding device according to the present invention.

FIG. 2 is an explanatory diagram of a semiconductor device array plate for collectively printing cream solder for pads of a plurality of semiconductor devices.

FIG. 3 is an operation explanatory diagram of attaching and detaching the semiconductor device to and from the semiconductor device array plate.

FIG. 4 is an explanatory diagram of a defective state when a plurality of semiconductor devices are collectively printed using the semiconductor device array plate.

FIG. 5 is an explanatory diagram of a general cream solder printing operation.

FIG. 6 is a configuration explanatory diagram of a semiconductor device previously proposed by the applicant.

FIG. 7 is an explanatory diagram of a generally known semiconductor device.

[Explanation of symbols]

 1 semiconductor device 6 printing mask 7 cream solder 10 semiconductor device array plate 11 semiconductor device accommodation hole 18 vacuum suction table 20 vacuum drive chamber 24 vacuum suction hole 25 semiconductor device suction surface

Front page continued (72) Inventor Taro Matsuoka 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Inventor Tsuneaki Komazawa 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Kogyo Co., Ltd. (72) Inventor Yoshinari Umetani 1-1 Yamashita-cho, Kokubun-shi, Kagoshima Prefecture Kyocera Stock Company, Kokubun Plant (72) Inventor Takeshi Gokoshi 1-1, Yamashita-cho, Kokubun-shi, Kagoshima Prefecture Kokubun Plant (72) ) Inventor Shingo Sato 1-1 Yamashita-cho, Kokubun-shi, Kagoshima Prefecture Kyocera Co., Ltd. Kokubun factory

Claims (1)

[Claims] 1. A device for holding each semiconductor device by vacuum suction when batch-printing cream solder for pads on the surface of a plurality of semiconductor devices, the device having a surface to be printed on the front side. A semiconductor device array plate formed by forming a plurality of semiconductor device housing holes for positioning and housing the semiconductor device, and a vacuum drive chamber communicating with each semiconductor device housing hole is provided on the back surface side of the semiconductor device array plate, A semiconductor during cream solder printing in which the semiconductor device housed in each semiconductor device housing hole is sucked and fixed to the semiconductor device suction surface provided on the bottom side of each semiconductor device housing hole by the vacuum suction force of the vacuum drive chamber. Equipment vacuum holding device.