JP3138584B2 - Device for releasing holding of semiconductor device holding means when attaching / detaching semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a plurality of semiconductor devices, such as ICs and LSIs, in a semiconductor device array plate and printing cream solder for pads on the surface of the semiconductor device at a time. The present invention relates to a device used when attaching and detaching to and from a device arrangement plate.

[0002]

2. Description of the Related Art FIG. 13 shows a semiconductor device in which semiconductor elements such as ICs and LSIs are housed in a general semiconductor element housing package. A plurality of lead pins 2 are arranged and formed on the side of the semiconductor device 1. The semiconductor device 1 is mounted on a circuit board by connecting the lead pins 2 to a circuit pattern on a circuit board (not shown).

However, in the configuration in which a plurality of lead pins 2 are arranged and formed on the semiconductor device 1, there is a problem that the semiconductor device 1 becomes large because the lead pins 2 are formed to protrude from the main body of the semiconductor device 1. The work of connecting a plurality of lead pins 2 to a semiconductor device and connecting each lead pin 2 to a circuit board is complicated, and the mounting density is poor.

In order to solve such a problem, the applicant has previously proposed a semiconductor device 1 as shown in FIG. In the proposed semiconductor device 1, cream solder is printed and formed at a plurality of predetermined positions on the surface, solder balls are placed on the cream solder printed portion, and the solder balls are reflowed through a heating furnace to reflow the solder balls. A spherical pad 3 for connection is formed by fixing the arrangement on the surface. When mounting the semiconductor device 1 on a circuit board,
By mounting the pads 3 of the semiconductor device 1 on the circuit board with the surface on which the pads 3 are formed facing the circuit board, and reflowing in this state,
The pads 3 of the semiconductor device 1 are collectively connected and fixed to predetermined connection positions on the circuit board, and the semiconductor device 1 is surface-mounted on the circuit board.

According to the semiconductor device 1 of the proposed example, the lead pins 2 of the conventional example are not required, and the size of the semiconductor device 1 can be significantly reduced, and the efficiency of mounting on the circuit board can be improved.

[0006]

In the case where cream solder for forming the pads 3 is printed on the surface of the semiconductor device 1 of the proposed example, as shown in FIG. 11, the work table 4 of the cream solder printing machine is used. The semiconductor device 1 is positioned and mounted thereon, and a print mask 6 formed with a plurality of holes 5 corresponding to the positions of the pads 3 is applied to the upper side of the semiconductor device 1, and the cream solder 7 supplied to the upper side of the print mask 6 is applied. Squeegee 8
The solder paste for forming the pad 3 on the surface of the semiconductor device 1 is transferred to the surface of the semiconductor device 1 by transferring the cream solder having the pattern shape of the hole 5 of the print mask 6 to the surface of the semiconductor device 1 by sliding the liquid into the hole 5. Can be printed.

However, it is very troublesome to mount the plurality of semiconductor devices 1 one by one on the work table 4 of the printing press and print the cream solder for the pads one by one, and it is difficult to increase the work efficiency. is there. In order to solve such difficulties, the applicant has proposed a semiconductor device array plate that can print cream solder on a plurality of semiconductor device surfaces at once.

FIG. 9 shows the proposed semiconductor device arrangement plate. In the figure, a plurality of semiconductor device housing holes 11 having a plurality of rectangular shapes are arranged and formed in a two-dimensional matrix (six rows and five rows in the figure) on the surface of a semiconductor device array plate 10 made of aluminum or the like. . The semiconductor device housing holes 11 are through holes, and each semiconductor device housing hole 11
A mounting reference surface 12 is formed on the bottom side of the
The depth from the front surface side of the semiconductor device housing hole 11 to the mounting reference surface 12 matches the height of the semiconductor device to be housed, and the semiconductor device is mounted on the mounting reference surface 12 while the semiconductor device is mounted. The surface height of the device matches the surface height of the base plate 10. The vertical and horizontal dimensions of the square semiconductor device housing hole 11 are larger than the corresponding dimensions of the square semiconductor device.

Two adjacent surfaces of the rectangular semiconductor device housing hole 11 are positioning reference surfaces 13a and 13b. The positioning reference surface 13a is, as shown in FIG.
The reference surface 13b serves as a reference surface for regulating the position of the semiconductor device 1 accommodated in the semiconductor device accommodation hole 11 in the X-axis direction. The positioning reference surface 13b serves as a reference surface for regulating the position of the semiconductor device 1 in the Y-axis direction. I have.

A spring accommodating recess 9 is formed on the diagonally opposite side of the positioning reference surfaces 13a and 13b, that is, in a region on a straight line connecting the corners A and B of the semiconductor device accommodating hole 11. A U-shaped bifurcated leaf spring 14 as a semiconductor device holding means is disposed therein. The bifurcated leaf spring 14 is composed of two (a pair) leaf springs 15a, 15b from the base end side.
Are extended into the semiconductor device housing hole 11 toward the diagonal position A side of the semiconductor device housing hole 11, and the leg springs 15a, 15b
Is bent outward with a curved line.
The bifurcated leaf spring 14 is fixed by a mounting rod 16 inserted on the base end side.
16 is implanted and fixed to the semiconductor device array plate 10.
The heights of the forked leaf spring 14 and the mounting rod 16 match the surface height of the semiconductor device array plate 10,
It is set so as not to protrude upward from the surface of the semiconductor device array plate 10.

When cream solder printing is performed collectively on the surfaces of a plurality of semiconductor devices 1 using the semiconductor device arrangement plate, a bifurcated leaf spring is used as shown in FIG.
In the free state, the leg springs 15a and 15b of the bifurcated leaf spring 14 are manually opened as shown in FIG. Spring
The semiconductor device 1 is inserted into the semiconductor device housing hole 11 with the 15a and 15b retracted. After the insertion of the semiconductor device, the leg springs 15a and 15b are released from the open state, so that the semiconductor device 1 is brought into contact with the leg springs 15a and 15b as shown in FIG.
Is pressed against the positioning reference surfaces 13a and 13b by the elastic restoring force of the semiconductor device 1 to achieve the positioning of the semiconductor device 1 in the X and Y biaxial directions, and the semiconductor device 1 is mounted on the mounting reference surface 12. Then, the semiconductor device is housed in the semiconductor device housing hole 11 in a state where the positioning in the height direction is also achieved.

In this manner, the semiconductor device array plate
After the semiconductor device 1 is accommodated and held in all the semiconductor device accommodation holes 11 of FIG.
2 is mounted on the work table 4 of the solder cream printing machine shown in FIG. 1 in a state of being positioned, and the cream solder 7 is pushed into the holes 5 of the print mask 6 by a squeegee 8 from above the print mask 6 to thereby obtain the surface of the plurality of semiconductor devices 1. The cream solder print for the pad is formed without any displacement.

After the printing of the cream solder, the semiconductor device array plate 10 is removed from the work table 4, and solder balls are placed on the printed solder cream pattern and reflowed, so that the surface of each semiconductor device 1 is soldered. A spherical pad made of a ball can be formed. After the formation of the pad, the leg spring 15 of the bifurcated leaf spring 14
By releasing the positioning and holding state of the semiconductor device 1 by opening a and 15b, the semiconductor device 1 on which the pad is formed can be taken out from the semiconductor device accommodation hole 11.

However, the semiconductor device array plate 10
When the semiconductor device 1 is housed in each of the semiconductor device housing holes 11, the semiconductor device 1 after the pad is formed is placed in the semiconductor device housing hole 11.
When detaching the leg springs 15a and 15b of the bifurcated leaf spring 14 by hand, it is very troublesome.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to automatically mount a foot of a bifurcated leaf spring when attaching / detaching a semiconductor device to / from a semiconductor device receiving hole of a semiconductor device array plate. An object of the present invention is to provide a device for releasing the holding of the semiconductor device holding means when the semiconductor device is attached / detached so that the spring can be opened.

[0016]

The present invention is configured as follows to achieve the above object. That is, the first invention provides a semiconductor device arrangement plate for cream solder printing of a semiconductor device, wherein a plurality of semiconductor device accommodation holes of the semiconductor device, and the semiconductor device accommodated in each semiconductor device accommodation hole is provided in the semiconductor device accommodation hole. A semiconductor device holding means for pressing and positioning the semiconductor device on the positioning reference surface, and performing the positioning and holding operation of the semiconductor device holding means when the semiconductor device is attached to or detached from each semiconductor device receiving hole of the semiconductor device array plate. A jig plate for detachably holding the semiconductor device array plate from below, and a jig plate surface facing the respective semiconductor device holding means. Holding operation releasing means for releasing the positioning and holding operation of the semiconductor device holding means by passing through the semiconductor device array plate provided It is configured as characteristic.

According to a second aspect of the present invention, there is provided a semiconductor device array plate for cream solder printing of a semiconductor device, wherein a plurality of semiconductor device housing holes of the semiconductor device and the semiconductor device housed in each semiconductor device housing hole are accommodated in the semiconductor device housing plate. A semiconductor device holding means for pressing and positioning the semiconductor device on the positioning reference surface of the hole, and for attaching and detaching the semiconductor device to and from the semiconductor device accommodation hole of the semiconductor device array plate by using the carrier means of the semiconductor device. A holding release device for releasing the positioning and holding operation of the semiconductor device holding means, wherein the holding release device is provided on the semiconductor device holding head for holding and releasing the semiconductor device holding of the transport means. Prior to the operation of holding and releasing the semiconductor device, the positioning and holding operation of the semiconductor device holding means provided on the semiconductor device array plate is performed. It is characterized in that it is configured to have a holding operation canceling means for dividing.

Furthermore, the semiconductor device holding means of the semiconductor device array plate is provided with a pair of U-shaped bifurcated leg springs for holding the semiconductor device in a semiconductor device receiving hole with two adjacent sides of the semiconductor device sandwiched therebetween. The holding operation releasing means is inserted between the crotch of a pair of leg springs of the bifurcated plate spring to open the leg spring and perform the holding operation of the semiconductor device. The present invention is also characterized by having an insertion pin which is released and which is wider than the crotch interval of the bifurcated leaf spring.

[0019]

In the present invention having the above-described structure, when a plurality of semiconductor devices are positioned and housed in the semiconductor device housing holes of the semiconductor device array plate, first, a holding release device for releasing the positioning and holding operation of the semiconductor device holding means is provided. Used to release the positioning and holding operation of the semiconductor device holding means. By releasing the positioning and holding operation, the semiconductor device holding means is kept in a retracted state from the path through which the semiconductor device enters the semiconductor device housing hole, and is brought into a state in which the semiconductor device is not hindered from being inserted into the semiconductor device housing hole.

In this state, the transferred semiconductor device is inserted into the corresponding semiconductor device receiving hole by the transfer means or the like, whereby the semiconductor device is smoothly received in the corresponding semiconductor device receiving hole.

After the semiconductor device is housed in the semiconductor device housing hole, the semiconductor device holding means is released by an elastic restoring force by releasing the holding release state of the semiconductor device holding means by the holding operation releasing means. It presses against the positioning reference plane of the device housing hole and holds the positioning.

In this state, the semiconductor device array plate is mounted on a cream solder printing machine and cream solder printing is performed, so that cream solder for pads is printed on the surfaces of a plurality of semiconductor devices at once.

Next, the semiconductor device array plate is removed from the cream solder printing machine, and pads are formed on the printed portions of the solder cream. Then, the holding operation releasing means is operated to release the holding operation of the semiconductor device holding means. As a result, the semiconductor device is released from the restraining force and becomes a free state, and in this state, the semiconductor device with the pad formed thereon is smoothly taken out from each semiconductor device accommodation hole.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the apparatus of the present invention. In the figure, fitting pins 18 having step surfaces 19 for positioning and fitting to the semiconductor device array plate 10 of FIG. 9 described in the above-mentioned proposal are implanted at four corner positions of the rectangular jig plate. ing. The fitting pins 18 are fitted into positioning fitting holes 20 indicated by dashed lines provided at four corners of the semiconductor device array plate shown in FIG. The jig plate 17 is detachably held in a positioning and fitted state from below.

On the front side of the jig plate 17, an insertion pin 21 as a holding motion releasing means is provided at a position corresponding to the bifurcated base end side of the bifurcated leaf spring 14 of the semiconductor device array plate 10. And projecting upward in the direction perpendicular to. The length of the insertion pin 21 is such that when the semiconductor device array plate 10 is fitted to the jig plate 17, the leg spring 15 of the bifurcated leaf spring 14 penetrates the semiconductor device housing hole 11.
The length of the insertion pin 21 is formed larger than the interval between the leg springs 15a and 15b of the bifurcated leaf spring 14, and the insertion pin 21 is bifurcated. Leaf spring
When the semiconductor device 1 is inserted between the 14 crotches, the leg springs 15a and 15b are opened and the semiconductor device 1 is formed to have a thickness that allows the semiconductor device 1 to retreat from a path into the semiconductor device housing hole 11. The insertion pin 21
A taper 22 is formed on the tip side of the fork so that the insertion pin 21 can easily enter the crotch of the forked leaf spring 14.

The first embodiment is configured as described above, and the operation of attaching and detaching the semiconductor device 1 to and from the semiconductor device array plate 10 using the device of this embodiment will be described.
First, each semiconductor device accommodation hole of the semiconductor device array plate 10
Prior to housing the semiconductor device 1 in the semiconductor device 1, the positioning fitting hole 20 of the semiconductor device array plate 10 is fitted into the fitting pin 18 of the jig plate 17, and the semiconductor device array plate 10 is positioned on the jig plate 17. Installing. Then, each of the insertion pins 21 of the jig plate 17 corresponds to the corresponding semiconductor device accommodation hole 11.
And inserted into the crotch of the corresponding forked leaf spring 14, and the leg springs 15a, 15b of the forked leaf spring 14 are pushed open from the state of FIG. 2 (a) as shown in FIG. 2 (b). Evacuation.
In this state, for example, the semiconductor device 1 is sucked and held by the vacuum suction pad 23 by using a transfer means as shown in FIG.
One by one, by a plurality, by the number of rows of semiconductor device housing holes 11, or by all semiconductor device housing holes.
The number 11 is collectively conveyed onto the semiconductor device array plate 10.

Next, the semiconductor device holding head 24 of the transport means
When the semiconductor device 1 is inserted into the semiconductor device receiving hole 11 and the vacuum suction of the vacuum suction pad 23 is stopped, as shown in FIG. The semiconductor device is mounted on the mounting reference surface 12 of the semiconductor device housing hole 11 apart from the semiconductor device housing hole 11. After the semiconductor device 1 is completely accommodated in all the semiconductor device accommodation holes 11 by the transfer means, the semiconductor device arrangement plate 10 is lifted upward from the fitting pins 18 of the jig plate 17 and pulled out, so that each semiconductor device accommodation plate is removed. The insertion pin 21 that has been inserted into the crotch of the bifurcated leaf spring 14 in the hole 11 also comes out of the bifurcated leaf spring 14 and
The leg springs 15a, 15b are elastically deformed by return, and press the semiconductor device 1 against the positioning reference surfaces 13a, 13b of the semiconductor device housing hole 11 with an elastic restoring force to make pressure contact. Thereby, the semiconductor device 1 achieves the positioning in the biaxial directions of X and Y, and also achieves the positioning in the height direction by being mounted on the mounting reference surface 12. It is held by the elastic restoring force of the spring 14.

After the semiconductor device 1 is positioned and held in all the semiconductor device receiving holes 11 in this manner, the semiconductor device array plate 10 is positioned and mounted on the work table 4 of the cream solder printing machine shown in FIG. By pushing the cream solder 7 from above the print mask 6 into the holes 5 of the print mask 6 with the squeegee 8, the cream solder for the pad is printed and formed on the surfaces of all the plurality of semiconductor devices 1 without displacement.

After the printing of the cream solder, the semiconductor device array plate 10 is removed from the work table 4, the solder balls are placed at the printing positions of the cream solder, and after a reflow process, as shown in FIG. The connection pad 3 is formed on the surface.

After the pads are formed, the semiconductor device array plate 10 is fitted and mounted on the jig plate 17 again.
The insertion pin 21 is inserted into the crotch of the corresponding bifurcated leaf spring 14,
The leg springs 15a and 15b of the bifurcated leaf spring 14 are opened and retracted, and the pressing and holding operation of the semiconductor device 1 is released. In this state, the semiconductor device 1 on which the pad has been formed is vacuum-sucked by the vacuum suction pad 23 of the transfer means, and the semiconductor device holding head 24 is moved upward. Get out. Then, the semiconductor device 1 is transported to a desired place by the transport operation of the transport unit.

According to the present embodiment, the insertion pins 21 are arrayed on the surface of the jig plate 17 at positions corresponding to the bifurcated leaf springs 14 of the semiconductor device array plate 10. By simply fitting the array plate 10 to the jig plate 17, the insertion pin 21 is automatically inserted between the forks of the bifurcated leaf spring 14, and the foot spring 15 of the bifurcated leaf spring 14 is inserted.
a and 15b can be opened and retracted, so that the leg springs 15 of the bifurcated leaf springs 14 can be manually moved.
Since there is no need to open and retract the semiconductor devices 1 and 15b, the operation of attaching and detaching the semiconductor device 1 to and from the semiconductor device accommodation hole 11 of the semiconductor device array plate 10 becomes extremely easy, and the operation of attaching and detaching the semiconductor device 1 can be easily automated. Can be achieved.

FIG. 5 shows a second embodiment of the present invention. This embodiment is characterized in that an insertion pin 21 as a holding operation canceling means is provided on a semiconductor device holding head 24 of a transfer means for transferring the semiconductor device 1 so as to be movable up and down by driving a cylinder.

The semiconductor device holding head 24 has the semiconductor device 1
Vacuum suction pads 23 for vacuum suction are provided, and the same number of cylinders are provided in accordance with the number of vacuum suction pads 23.
25, and the insertion pin 21 is attached to the rod 26 of the cylinder 25.
Is attached. When the semiconductor device holding head 24 carries the semiconductor device holding head 24 and the vacuum suction pad 23 is at the fixed mounting / detaching position of the semiconductor device housing hole 11, the insertion pin 21
It is positioned and installed so as to oppose the crotch of the fourteen foot springs 15a and 15b.

When the semiconductor device 1 is accommodated in each semiconductor device accommodation hole 11 of the semiconductor device array plate 10 by the apparatus of this embodiment, the vacuum suction pad 23 of the carrier means causes the semiconductor device 1 to be accommodated.
The semiconductor device 1 is sucked, and the semiconductor device holding head 24 is moved onto the semiconductor device array plate 10.

Next, the semiconductor device holding head 24 of the transport means
To move down. At this time, before accommodating the semiconductor device 1 in the corresponding semiconductor device accommodation hole 11, the insertion pin 21 of the cylinder 25 is lowered to be inserted between the forks of the bifurcated leaf spring 14 as shown in FIG. As shown, the foot plates 15a and 15b are opened, and the foot plates 15a and 15b are moved from the path where the semiconductor device 1 enters the semiconductor device housing hole 11.
a and 15b are evacuated.

Next, when the vacuum suction of the vacuum suction pad 23 is stopped, the semiconductor device 1 is separated from the vacuum suction pad 23 as shown in FIG.
Get into it. Next, the insertion pins 21 of the cylinder 25 are moved back and forth, and the insertion pins 21 are pulled out of the forked leaf springs 14, whereby the foot plates 15a and 15b are elastically returned and deformed, and the semiconductor device 1 is resiliently restored with an elastic restoring force. The device housing hole 11 is pressed against the positioning reference surfaces 13a and 13b to be in pressure contact. Thereby, the semiconductor device 1 achieves the positioning in the biaxial directions of X and Y, and also achieves the positioning in the height direction by being mounted on the mounting reference surface 12. It is held by the elastic restoring force of the spring 14.

The semiconductor device array plate 10 in which the semiconductor device 1 is positioned and held in all the semiconductor device receiving holes 11 is attached to the work table 4 of the cream solder printing machine shown in FIG. A cream solder for a pad is printed on the surface of the semiconductor device 1.

After the printing of the cream solder, the base plate 10 is removed from the work table 4, and the pads 3 are formed in the same manner as in the first embodiment.
After inserting the twenty-five insertion pins 21 between the forks of the bifurcated leaf spring 14 to open the foot plates 15a and 15b, the vacuum suction pad 23 suctions the semiconductor device 1 on which the pad has been formed, and transports it. By moving the means upward, the semiconductor device 1 on which the pad has been formed comes out of the semiconductor device accommodation hole 11. And
The semiconductor device 1 is transported to a desired place by the transport operation of the transport unit.

According to this embodiment, the insertion pins 21 are provided on the semiconductor device holding head 24 of the transport means so as to be able to move up and down by using the cylinder 25. When the semiconductor device 1 is housed in the device housing hole 11, the insertion pin 21
Is inserted between the forks of the bifurcated leaf spring 14, and the foot springs 15a, 15b
And the semiconductor device 1 can be smoothly housed in the semiconductor device housing hole 11. When the semiconductor device 1 with the pad formed thereon is to be removed from the semiconductor device housing hole 11, the semiconductor device 1 is inserted prior to the removal operation. Since the pin 21 is inserted into the crotch of the bifurcated leaf spring 14 and the leg springs 15a and 15b are retracted, the semiconductor device 1 can be easily taken out by sucking and holding the semiconductor device 1 with the vacuum suction pad 23.
Since it is not necessary to expand the leg springs 15a and 15b by hand each time when attaching and detaching the semiconductor device, the attaching and detaching operation of the semiconductor device 1 to and from the semiconductor device array plate 10 can be easily performed as in the first embodiment.

Note that the present invention is not limited to the above-described embodiment, but can adopt various embodiments. For example, in the above embodiment, the semiconductor device holding means for holding and fixing the semiconductor device 1 is constituted by the bifurcated leaf spring 14, and the holding operation canceling means is constituted by the insertion pin 21. Press 1 to position reference plane 13
Any structure may be used as long as it is configured to be in pressure contact with a and 13b, and it may be formed by a leaf spring of another shape, or may be formed by using another type of spring such as a coil spring. When the semiconductor device holding means is constituted by means other than the bifurcated leaf spring as described above, the holding operation canceling means is constituted in accordance with the means.

Further, in the above embodiment, the transfer and detachment of the semiconductor device 1 to and from the semiconductor device housing hole 11 are performed by the vacuum suction pad 23.
As shown in FIG. 6, for example, as shown in FIG.
The gripping claws 27 may be used to carry the semiconductor device 1 and to attach and detach the semiconductor device 1 to and from the semiconductor device housing hole 11. In this case, for example, as shown in FIG. 7, an escape recess 28 through which the gripping claws 27 can be inserted and removed is provided at a necessary portion on the inner wall surface of the semiconductor device housing hole 11.

Further, in the above embodiment, the work of housing the semiconductor device 1 in the semiconductor device housing hole 11 was performed with the semiconductor device array plate 10 removed from the work table 4 of the cream solder printing machine. When the holding operation releasing means (insertion pin 21) is provided on the transport means side (semiconductor device holding head 24 side) as in the embodiment, the semiconductor device array plate 10 is positioned and mounted on the work table 4 while the semiconductor device 1 is mounted. The semiconductor device can be housed in the semiconductor device housing hole 11.

Further, in the above embodiment, the semiconductor device accommodation hole 11 formed in the semiconductor device array plate 10 is a through hole, but may be a blind hole in a recessed state that does not penetrate. In this case, the bottom surface of the concave portion functions as a mounting reference surface that regulates the height position of the semiconductor device. In the case of the first embodiment, a through hole for the insertion pin 21 is provided on the bottom surface of the concave portion, In the case of the second embodiment, a through hole for the insertion pin is provided as needed.

Further, in the second embodiment, the cylinder 25 is provided in the semiconductor device holding head 24, and the insertion pin 21 is moved in the up and down direction by the cylinder 25. However, the cylinder 25 is omitted. For example, as shown in FIG. 8, a configuration may be employed in which the insertion pin 21 is protruded downward from the semiconductor device holding head 24. In this case, insert pin 21
Of the semiconductor device 1 to be sucked and held by the vacuum suction pad 23 is longer than the distance L from the semiconductor device holding head 24, and when the semiconductor device holding head 24 is lowered, the vacuum Before the suction pad 23 descends to the position where the semiconductor device 1 is attached / detached, the insertion pin 21 enters between the leg springs 15a, 15b of the bifurcated leaf spring 14 and the leg springs 15a, 15b.
It is necessary to open 15b.

[0045]

According to the present invention, the holding operation of the semiconductor device holding means for positioning and holding the semiconductor device housed in the semiconductor device housing hole of the semiconductor device array plate is automatically released by the holding operation releasing means. Because
When a plurality of semiconductor devices are accommodated and held in the respective semiconductor device accommodation holes of the semiconductor device array plate and cream solder for pads is collectively printed and formed on the surfaces of the plurality of semiconductor devices, or after necessary processing, the semiconductor device is removed. When the semiconductor device holding plate is removed from the device array plate, the semiconductor device holding operation of the semiconductor device holding unit can be automatically released by the operation of the holding operation releasing unit. It is very easy to attach and detach the semiconductor device, and it is possible to increase the efficiency of the operation of attaching and detaching the semiconductor device, and to automate the attachment and detachment of the semiconductor device.

[Brief description of the drawings]

FIG. 1 is a configuration explanatory view showing a first embodiment of a holding release device according to the present invention.

FIG. 2 is an explanatory diagram of an attaching / detaching operation of a semiconductor device using the device of the embodiment.

FIG. 3 is an explanatory diagram of a transfer unit used for attaching and detaching a semiconductor device.

FIG. 4 is an explanatory diagram of a form of a semiconductor device with a pad manufactured according to the present embodiment.

FIG. 5 is a configuration explanatory view showing a second embodiment of the present invention.

FIG. 6 is an explanatory diagram showing another configuration example of the transport unit.

FIG. 7 is an explanatory diagram of an example in which an escape recess is provided in a semiconductor device housing hole.

FIG. 8 is an explanatory view of another embodiment of the holding release device according to the present invention.

FIG. 9 is an explanatory diagram of a semiconductor device arrangement plate proposed by the applicant.

10 is an explanatory diagram of an operation generally considered as a method of accommodating a semiconductor device in the semiconductor device array plate of FIG. 9;

FIG. 11 is an explanatory diagram of a printing operation of cream solder.

FIG. 12 is an explanatory diagram of a configuration of a semiconductor device previously proposed by the applicant.

FIG. 13 is an explanatory diagram of a generally known semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 10 Semiconductor device arrangement plate 11 Semiconductor device accommodation hole 14 Bifurcated leaf spring 15a, 15b Foot spring 17 Jig plate 21 Insertion pin 23 Vacuum suction pad 24 Semiconductor device holding head 25 Cylinder

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Tsuneaki Komazawa 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Inventor Yoshinari Umetani 1-1 Yamashita-cho, Kokubun-shi, Kagoshima Kyocera Corporation Inside the Kokubu Plant (72) Inventor Takeshi Torigoe 1-1 Yamashita-cho, Kokubu-shi, Kagoshima Prefecture Inside Kyocera Plant (72) Inventor Shingo Sato 1-1 1-1 Yamashita-cho, Kokubu-shi, Kagoshima Inside Kyocera Plant (56) References JP-A-62-191149 (JP, A) JP-A-1-321820 (JP, A) JP-A-5-42658 (JP, A) JP-A-3-2311884 (JP, A) JP-A-2-224392 (JP, A) JP-A-5-212852 (JP, A) JP-A-63-242636 (JP, A) JP-A-55-133592 (JP, A) JP, U) Hira 5 44533 (JP, U) JitsuHiraku Akira 51-74751 (JP, U) JitsuHiraku flat 2-11378 (JP, U) (58 ) investigated the field (Int.Cl. ^7, DB name) B41F 15/26 B41F 15 / 08 303 H01L 21/00-23/66

Claims (3)

(57) [Claims] 1. A semiconductor device arrangement plate for cream solder printing of a semiconductor device, a plurality of semiconductor device accommodation holes of the semiconductor device, and a semiconductor device accommodated in each semiconductor device accommodation hole, a positioning reference plane of the semiconductor device accommodation hole. And a semiconductor device holding means for pressing and holding the semiconductor device for positioning.
A holding release device for releasing the positioning and holding operation of the semiconductor device holding means when the semiconductor device is inserted into and removed from each semiconductor device receiving hole of the semiconductor device array plate, wherein the holding device releases the semiconductor device array plate. A jig plate detachably held from below, and a semiconductor device array plate provided on the jig plate surface so as to face the semiconductor device holding means is released to release the positioning and holding operation of the semiconductor device holding means. And a holding operation canceling means for holding the semiconductor device. 2. A semiconductor device arrangement plate for cream solder printing of a semiconductor device, wherein a plurality of semiconductor device accommodation holes of the semiconductor device and a semiconductor device accommodated in each semiconductor device accommodation hole are positioned with respect to a positioning reference plane of the semiconductor device accommodation hole. And a semiconductor device holding means for pressing and holding the semiconductor device for positioning.
A holding release device for releasing the positioning and holding operation of the semiconductor device holding means when a semiconductor device is attached to and detached from each semiconductor device accommodation hole of the semiconductor device array plate by using a transfer means of the semiconductor device; The apparatus is provided on a semiconductor device holding head for holding and releasing the semiconductor device of the transport means, and the semiconductor device holding plate provided on the semiconductor device array plate prior to the operation of holding and releasing the semiconductor device of the semiconductor device holding head. An apparatus for holding and releasing a semiconductor device holding means at the time of attaching and detaching a semiconductor device, comprising a holding operation canceling means for canceling a positioning holding operation of the means. 3. The semiconductor device holding means of the semiconductor device array plate includes a pair of U-shaped bifurcated leg springs sandwiching the semiconductor device between two adjacent sides of the square semiconductor device. The bifurcated leaf spring is pressed and held on the positioning reference plane, and the retaining operation releasing means is inserted between the crotch of the pair of leg springs of the bifurcated leaf spring to open the leg spring and release the retaining operation of the semiconductor device. 3. The device according to claim 1, further comprising an insertion pin wider than the crotch interval of the bifurcated leaf spring.