JP3303496B2 - Plate jig for batch printing of solder paste for pads of multiple semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for collectively printing cream solder for pads on the surface of a plurality of semiconductor devices such as ICs and LSIs.

[0002]

2. Description of the Related Art FIG. 9 shows a semiconductor device in which semiconductor elements such as ICs and LSIs are housed in a general semiconductor element housing package. A plurality of lead pins 2 are arranged and formed on the side of the semiconductor device 1. The semiconductor device 1 is mounted on a circuit board by connecting the lead pins 2 to a circuit pattern on a circuit board (not shown).

However, in the configuration in which a plurality of lead pins 2 are arranged and formed on the semiconductor device 1, there is a problem that the semiconductor device 1 becomes large because the lead pins 2 are formed to protrude from the main body of the semiconductor device 1. The operation of connecting the plurality of lead pins 2 to the semiconductor device is complicated, and the mounting density on the circuit board is poor.

In order to solve such a problem, the applicant has previously proposed a semiconductor device 1 as shown in FIG. In the proposed semiconductor device 1, cream solder is printed and formed at a plurality of predetermined positions on the surface, solder balls are placed on the cream solder printed portion, and the solder balls are reflowed through a heating furnace to reflow the solder balls. A spherical pad 3 for connection is formed by fixing the arrangement on the surface. When mounting the semiconductor device 1 on a circuit board,
By mounting the pads 3 of the semiconductor device 1 on the circuit board with the surface on which the pads 3 are formed facing the circuit board, and reflowing in this state,
The pads 3 of the semiconductor device 1 are collectively connected and fixed to predetermined connection positions on the circuit board, and the semiconductor device 1 is surface-mounted on the circuit board.

According to the semiconductor device 1 of the proposed example, the lead pins 2 of the conventional example become unnecessary, and the size of the semiconductor device 1 can be significantly reduced, and the mounting density on a circuit board can be improved.

[0006]

In the case where cream solder for forming the pads 3 is printed on the surface of the semiconductor device 1 of the above proposed example, as shown in FIG. 7, a work table 4 of a cream solder printing machine is used. The semiconductor device 1 is positioned and mounted thereon, and a print mask 6 formed with a plurality of holes 5 corresponding to the positions of the pads 3 is applied to the upper side of the semiconductor device 1, and the cream solder 7 supplied to the upper side of the print mask 6 is applied. Squeegee 8
The solder paste for forming the pad 3 on the surface of the semiconductor device 1 is transferred to the surface of the semiconductor device 1 by transferring the cream solder having the pattern shape of the hole 5 of the print mask 6 to the surface of the semiconductor device 1 by sliding the liquid into the hole 5. Can be printed.

However, it is very troublesome to mount the plurality of semiconductor devices 1 one by one on the work table 4 of the printing press and print the cream solder for the pads one by one, and it is difficult to increase the work efficiency. is there.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a pad for a plurality of semiconductor devices capable of collectively printing and forming pad cream solder on the surface of the plurality of semiconductor devices. To provide a plate jig for batch printing of cream solder.

[0009]

The present invention is configured as follows to achieve the above object. That is, in the printing plate jig of the present invention, a plurality of semiconductor device housing holes for housing semiconductor devices are formed and arranged on the surface of a base plate mounted on a cream solder printing machine, and the bottom side of each semiconductor device housing hole is formed. A mounting reference surface for controlling the mounting of the semiconductor device to be housed and the height of the semiconductor device surface is formed, and two adjacent surfaces of the semiconductor device housing hole are formed in a plane biaxial direction of the semiconductor device having a square shape. A positioning reference plane is provided. On the opposite side of the two positioning reference planes , a semiconductor device is pressed to press the semiconductor device against the two positioning reference planes.
Bifurcated plate that allows pins to be inserted and removed between the crotch of two foot plates
It is characterized in that a pressing means consisting of a spring is provided.

The base plate is formed of a metal having good heat conductivity, the base plate is formed of a blackened or anodized aluminum material, and the pressing means is a base. The fact that it is detachable from the base plate is also a characteristic configuration of the present invention.

[0011]

In the present invention having the above structure, when printing cream solder for a pad on the surface of a plurality of semiconductor devices,
The semiconductor device is housed in a plurality of semiconductor device housing holes formed in the base plate. The accommodated semiconductor device is placed on the placement reference plane of the semiconductor device accommodation hole, the height position is regulated, and two adjacent surfaces of the square semiconductor device pressed by the pressing means are accommodated in the semiconductor device accommodation hole. By pressing against the positioning reference plane of the hole, planar biaxial positioning is achieved. By mounting the base plate accommodating a plurality of semiconductor devices on the work table of the printing press by positioning and accommodating the semiconductor devices, the printing mask and each semiconductor device are positioned, and cream solder is printed in this state. By doing so, the cream solder for the pad is collectively printed and formed at an accurate position on the surfaces of the plurality of semiconductor devices without displacement.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a main configuration of an embodiment of a printing plate jig according to the present invention. In the figure, a plurality of square semiconductor device receiving holes 11 are arranged in a two-dimensional matrix on the surface of a base plate 10 made of aluminum or the like having good thermal conductivity. The base plate 10 has been subjected to a blackening treatment to easily receive heat, and the aluminum plate has been subjected to an alumite treatment. The semiconductor device housing hole 11 is a through hole, and a mounting reference surface 12 is formed on the bottom side of each semiconductor device housing hole 11 so as to protrude. Up to the height of the semiconductor device to be accommodated, and the surface height of the semiconductor device is set to the surface height of the base plate 10 when the semiconductor device is mounted on the mounting reference surface 12. Is to be matched. The vertical and horizontal dimensions of the square semiconductor device housing hole 11 are larger than the corresponding dimensions of the square semiconductor device.

In this embodiment, two adjacent surfaces of the rectangular semiconductor device housing hole 11 are positioned as positioning reference surfaces 13a and 13b.
As shown in FIG. 2C, the positioning reference surface 13a is a reference surface for regulating the position of the semiconductor device 1 accommodated in the semiconductor device accommodation hole 11 in the X-axis direction. The reference plane 13b is a reference plane that regulates the position of the semiconductor device 1 in the Y-axis direction.

A spring accommodating recess 9 is formed on the diagonally opposite side of the positioning reference surfaces 13a, 13b, that is, in a region on a straight line connecting the angle A and the point B of the semiconductor device accommodating hole 11. U-shaped bifurcated leaf spring as pressing means inside
14 are arranged. In the bifurcated leaf spring 14, two foot plates 15a and 15b are extended from the base end toward the diagonal position A of the semiconductor device housing hole 11 into the semiconductor device housing hole 11.
The distal ends of the foot plates 15a and 15b are bent outward with a curved line. The bifurcated leaf spring 14 is fixed by a mounting rod 16 inserted on the base end side, and the mounting rod 16 is implanted and fixed on the base plate 10. The forked leaf spring 14 and the mounting rod 16
Is equal to the surface height of the base plate 10, and is set so as not to protrude upward from the surface of the base plate 10.

The printing plate jig of the present embodiment is configured as described above. Next, an example of a printing operation of cream solder for a pad of the semiconductor device 1 using the printing plate jig will be described. FIG. 2A shows a state before the semiconductor device 1 is accommodated in each semiconductor device accommodating hole 11 of the base plate 10, and in this state, for example, by using a conveying means as shown in FIG. The semiconductor device 1 is sucked and held by the vacuum suction pad 17, one by one, a plurality of pieces, or the number of rows of the semiconductor device accommodation holes 11, or the number of all the semiconductor device accommodation holes 11 collectively. It is transported on the plate 10.

Next, the transport means is moved downward. At this time, before the semiconductor device 1 is inserted into the corresponding semiconductor device receiving hole 11, the guide pin 20 of the cylinder 18 provided in the transfer means is lowered to make the guide pin larger than the crotch interval of the bifurcated leaf spring 14. 2B, the foot plates 15a, 15b are opened by inserting the foot plates 15a, 15b between the crotches of the bifurcated leaf spring 14, as shown in FIG. Evacuate 15b.

Next, when the vacuum suction of the vacuum suction pad 17 is stopped, the semiconductor device 1 separates from the vacuum suction pad 17 and enters the semiconductor device housing hole 11, as shown in FIG. Then, the cylinder 18 moths Idopin 2
0, and the guide pin 20 is moved backward by the bifurcated leaf spring 1.
4, the foot plate 15 of the bifurcated leaf spring 14
a, 15b are elastically restored and the semiconductor device 1 is positioned with the elastic restoring force by the elasticity restoring force.
13b and pressed against it. As a result, the semiconductor device 1 achieves positioning in the X and Y biaxial directions, and is mounted on the mounting reference surface 12 to achieve positioning in the height direction. It is held and fixed by the elastic restoring force of the spring 14.

After the semiconductor device 1 has been positioned and held and fixed in all the semiconductor device receiving holes 11, the base plate
10 is positioned and mounted on the work table 4 of the cream solder printing machine shown in FIG. 7, and the cream solder 7 is squeegeeed from above the print mask 6 into the holes 5 of the print mask 6.
The cream solder for the pad is printed and formed on the package surfaces of all of the plurality of semiconductor devices 1 without displacement.

After the printing of the cream solder, the base plate 10 is removed from the work table 4, solder balls are placed at the printing positions of the cream solder, and then the base plate 10 is passed through a heating furnace to perform reflow. As shown in FIG. 6, a spherical connection pad 3 is formed on the surface of the semiconductor device 1.
Is formed.

[0020] After this reflow process, the insert and the foot plate 15a between the crotch moths Idopin 20 of the conveying means of the cylinder 18 bifurcated leaf spring 14, to open the 15b, the vacuum suction of the vacuum suction pad 17 Thereby, the semiconductor device 1 on which the pads 3 are formed is sucked, and the transporting means is moved upward, so that the semiconductor device 1 comes out of the semiconductor device housing hole 11. Then, the semiconductor device 1 is transported to a desired place by the transport operation of the transport unit.

According to the present embodiment, a plurality of semiconductor device receiving holes 11 are formed in an array on the base plate 10, and two adjacent surfaces of each semiconductor device receiving hole 11 are used as positioning reference surfaces 13a and 13b.
The semiconductor device 1 housed in the semiconductor device housing hole 11 is positioned by the elastic restoring force of the bifurcated leaf spring 14.
b, the semiconductor device 1 is positioned in the X and Y biaxial plane directions, and the mounting reference surface 12 of the semiconductor device housing hole 11 is positioned.
Therefore, the plurality of semiconductor devices 1 can be set in the respective semiconductor device receiving holes 11 of the base plate 10 in a positioning state.

Thus, when the base plate 10 is attached to a printing machine and cream solder printing is performed, the alignment between each semiconductor device 1 and the print mask 6 is correctly performed, and the cream solder printing is performed in this state. As a result, the cream solder for the pad is collectively printed and formed at the correct position on the surfaces of the plurality of semiconductor devices 1 without displacement, and the printing efficiency is remarkably improved as compared with the case where the semiconductor devices 1 are printed one by one. Will be enhanced.

Since the semiconductor device 1 housed in the semiconductor device housing hole 11 is held and fixed by the elastic restoring force of the bifurcated leaf spring 14, a guide pin 20 is provided between the forks of the bifurcated leaf spring 14. The semiconductor device 1 can be easily held and released by only an operation of taking the semiconductor device 1 in and out, and the work of attaching and detaching the semiconductor device 1 to and from the semiconductor device housing hole 11 becomes very easy.

[0024] The present invention is not limited to the above embodiments, Ru take the aspect of various embodiments.

For example , in the above embodiment, the pressing means is fixed to the base plate 10, but it may be detachable. When detachable, for example, the attachment rod 16 may be detachably inserted into the base plate 10. By making the semiconductor device 1 detachable in this manner, the bifurcated leaf spring 14 having a length suitable for the size of the semiconductor device 1 can be attached and detached and exchanged for use, which is very convenient.

Further, in the above embodiment, the transfer and detachment of the semiconductor device 1 to and from the semiconductor device receiving hole 11 are performed by using a vacuum suction pad.
17, for example, as shown in FIG. 4, as shown in FIG.
21 may be provided, and the gripping claws 21 may be used to carry the semiconductor device 1 and to attach and detach the semiconductor device 1 to and from the semiconductor device housing hole 11. In this case, for example, as shown in FIG. 5, an escape recess 22 through which the gripping claws 21 can be inserted and removed is provided at a necessary portion on the inner wall surface of the semiconductor device housing hole 11.

Further, in the above embodiment, the operation of housing the semiconductor device 1 in the semiconductor device housing hole 11 is performed by the base plate 10.
Was removed from the work table 4 of the cream solder printing machine, but the semiconductor device 1 was housed in the semiconductor device housing hole 11 with the base plate 10 positioned and mounted on the work table 4. Is also good.

Further, in the above embodiment, the semiconductor device accommodating hole 11 formed in the base plate 10 is a through hole, but it may be a blind hole in a recessed state that does not penetrate. In this case,
The bottom surface of the concave portion functions as a mounting reference surface that regulates the height position of the semiconductor device.

[0029]

According to the present invention, a mounting reference surface is provided on the bottom side of each of a plurality of semiconductor device receiving holes arrayed on a base plate.
Positioning reference surfaces are respectively formed on two adjacent surfaces of the semiconductor device housing hole, and the semiconductor devices housed in the respective semiconductor device housing holes are configured to be pressed against the positioning reference surface by pressing means. The positioning of the semiconductor device housed in the plurality of semiconductor device housing holes in the height direction and the planar biaxial direction can be automatically achieved using the respective reference surfaces. By mounting the base plate containing the plurality of semiconductor devices on the solder cream printing machine, the positioning between each semiconductor device and the print mask is achieved. By performing the printing, the cream solder for the connection pad is collectively printed and formed at the correct position on the surfaces of the plurality of semiconductor devices without displacement, and the printing work efficiency of the cream solder is remarkably improved. It becomes possible.

Further, since the semiconductor device can be housed in the semiconductor device housing hole and the semiconductor device can be taken out in a state where the pressing means is released from the pressing, the work of attaching and detaching the semiconductor device to and from the semiconductor device housing hole is very easy. It will be easier. In particular, pressing hands
The step is a pin between the crotch of the two foot plates that presses the semiconductor device.
It consists of a bifurcated leaf spring that can be taken in and out.
Then, insert the pin between the crotch of this bifurcated leaf spring
The foot plate is opened, and the semiconductor device accommodates the semiconductor device.
Evacuate the footboard from the path that enters the hole,
The semiconductor device in a state where it is not
The semiconductor device into the semiconductor device housing hole and take out the semiconductor device.
Can be easily pulled out.
By removing the pin, the foot plate is changed from the open state to the closed state.
The semiconductor device is moved between the foot plates by the elastic restoring force of the elastic return deformation.
Can be automatically retained
You. Also, a semiconductor device is sandwiched between the tip sides of the two foot plates.
Presses and holds the semiconductor device, and elastically opens the foot plate.
Semi-conductive large and small size range due to wide leg range
It can respond to holding of a body device.

[Brief description of the drawings]

FIG. 1 is a main part configuration diagram showing an embodiment of a printing plate jig according to the present invention.

FIG. 2 is an explanatory diagram of an operation of attaching / detaching a semiconductor device to / from a semiconductor device housing hole in the embodiment.

FIG. 3 is an explanatory diagram illustrating an example of a transfer unit of the semiconductor device.

FIG. 4 is an explanatory view showing another example of the transport means.

FIG. 5 is an explanatory diagram of another embodiment of a semiconductor device accommodation hole formed in a base plate.

FIG. 6 is an explanatory diagram of a form of a semiconductor device with a pad manufactured according to the present embodiment.

FIG. 7 is an explanatory diagram of a printing operation of cream solder.

FIG. 8 is an explanatory diagram of a configuration of a semiconductor device proposed by the applicant.

FIG. 9 is an explanatory diagram of a generally known semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 10 Base plate 11 Semiconductor device accommodation hole 12 Mounting reference surface 13a, 13b Positioning reference surface 14 Bifurcated leaf spring

Continued on the front page (72) Inventor Tsuneaki Komazawa 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (72) Inventor Yoshinari Umetani 1-1 Yamashitacho, Kokubu-shi, Kagoshima Kyocera Corporation Kokubu Plant (72) Inventor Gaku Torigoe 1-1, Yamashita-cho, Kokubu-shi, Kagoshima Prefecture Inside Kyocera Kokubu Plant (72) Inventor Shingo Sato 1-1, Yamashita-cho, Kokubu-shi, Kagoshima Prefecture Kokubu Plant, Kyocera Corporation (56) References JP-A-62-191149 (JP, A) JP-A-5-44533 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B41F 15/00-15/44 H01L 21 / 92

Claims (4)

(57) [Claims] A semiconductor device accommodating hole for accommodating a semiconductor device is formed in a plurality on a surface of a base plate mounted on a cream solder printing machine, and a semiconductor device accommodated on a bottom side of each semiconductor device accommodating hole. A mounting reference surface for controlling the mounting of the semiconductor device and the height of the surface of the semiconductor device is formed, and two adjacent surfaces of the semiconductor device receiving hole serve as positioning reference surfaces in a plane biaxial direction of the semiconductor device having a square shape. On the diagonally opposite sides of the two positioning reference planes, two crotch portions of two foot plates for pressing the semiconductor device for pressing the semiconductor device against the two positioning reference planes .
A plate jig for collectively printing cream solder for pads of a plurality of semiconductor devices provided with a pressing means formed of a bifurcated leaf spring between which pins can be taken in and out . 2. The plate jig for batch printing of solder paste for pads of a plurality of semiconductor devices according to claim 1, wherein the base plate is formed using a metal having good thermal conductivity. 3. The plate jig for batch printing of solder paste for pads of a plurality of semiconductor devices according to claim 1, wherein the base plate is formed using an aluminum material subjected to blackening or alumite processing. 4. A plate jig for batch printing of solder paste for pads of a plurality of semiconductor devices according to claim 1, wherein said pressing means is detachable from said base plate.