JP3303497B2 - Vacuum holding device for semiconductor device during cream solder printing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for holding a plurality of semiconductor devices such as ICs and LSIs in a semiconductor device array plate and fixing and holding the semiconductor devices when collectively printing cream solder for pads on the surface of the semiconductor device. It concerns the device.

[0002]

2. Description of the Related Art FIG. 7 shows a semiconductor device in which semiconductor elements such as ICs and LSIs are housed in a general semiconductor element housing package. A plurality of lead pins 2 are arranged and formed on the side of the semiconductor device 1. The semiconductor device 1 is mounted on a circuit board by connecting the lead pins 2 to a circuit pattern on a circuit board (not shown).

However, in the configuration in which a plurality of lead pins 2 are arranged and formed on the semiconductor device 1, there is a problem that the semiconductor device 1 becomes large because the lead pins 2 are formed to protrude from the main body of the semiconductor device 1. The work of connecting the plurality of lead pins 2 to the semiconductor device is complicated and the work efficiency is poor.

In order to solve such a problem, the applicant has previously proposed a semiconductor device 1 as shown in FIG. In the proposed semiconductor device 1, cream solder is printed and formed at a plurality of predetermined positions on the surface of the semiconductor device, solder balls are placed on the cream solder printed portion, and the solder balls are reflowed through a heating furnace. Are arranged and fixed on the surface of the device to form spherical pads 3 for connection. When the semiconductor device 1 is mounted on a circuit board, the pad 3 of the semiconductor device 1 is mounted on the circuit board with the surface on which the pads 3 are formed facing the circuit board, and the pads 3 of the semiconductor device 1 are reflowed in this state. The semiconductor device 1 is collectively connected and fixed to a predetermined connection position on the substrate, and the semiconductor device 1 is surface-mounted on a circuit substrate.

According to the semiconductor device 1 of the proposed example, the lead pins 2 of the conventional example become unnecessary, and the size of the semiconductor device 1 can be significantly reduced, and the mounting density on a circuit board can be improved.

[0006]

When cream solder for forming the pads 3 is printed on the surface of the semiconductor device 1 of the proposed example, as shown in FIG. 5, the work table 4 of the cream solder printing machine is used. The semiconductor device 1 is positioned and mounted thereon, and a print mask 6 formed with a plurality of holes 5 corresponding to the positions of the pads 3 is applied to the upper side of the semiconductor device 1, and the cream solder 7 supplied to the upper side of the print mask 6 is applied. Squeegee 8
The solder paste for forming the pad 3 on the surface of the semiconductor device 1 is transferred to the surface of the semiconductor device 1 by transferring the cream solder having the pattern shape of the hole 5 of the print mask 6 to the surface of the semiconductor device 1 by sliding the liquid into the hole 5. Can be printed.

However, it is very troublesome to mount the plurality of semiconductor devices 1 one by one on the work table 4 of the printing press and print the cream solder for the pads one by one, and it is difficult to increase the work efficiency. is there. In order to solve such difficulties, the applicant has proposed a semiconductor device array plate that can print cream solder on a plurality of semiconductor device surfaces at once.

FIG. 2 shows the proposed semiconductor device arrangement plate. In the figure, a plurality of semiconductor device housing holes 11 having a plurality of rectangular shapes are arranged and formed in a two-dimensional matrix (six rows and five rows in the figure) on the surface of a semiconductor device array plate 10 made of aluminum or the like. . The semiconductor device housing holes 11 are through holes, and each semiconductor device housing hole 11
A mounting reference surface 12 is formed on the bottom side of the
The depth from the front surface side of the semiconductor device housing hole 11 to the mounting reference surface 12 matches the height of the semiconductor device to be housed, and the semiconductor device is mounted on the mounting reference surface 12 while the semiconductor device is mounted. The surface height of the device matches the surface height of the base plate 10. The vertical and horizontal dimensions of the square semiconductor device housing hole 11 are larger than the corresponding dimensions of the square semiconductor device.

Two adjacent surfaces of the rectangular semiconductor device housing hole 11 are positioning reference surfaces 13a and 13b. The positioning reference surface 13a is, as shown in FIG.
The reference surface 13b serves as a reference surface for regulating the position of the semiconductor device 1 accommodated in the semiconductor device accommodation hole 11 in the X-axis direction. The positioning reference surface 13b serves as a reference surface for regulating the position of the semiconductor device 1 in the Y-axis direction. I have.

A spring accommodating recess 9 is formed on the diagonally opposite side of the positioning reference surfaces 13a and 13b, that is, in a region on a straight line connecting the corners A and B of the semiconductor device accommodating hole 11. A U-shaped bifurcated leaf spring 14 as a semiconductor device holding means is disposed therein. The bifurcated leaf spring 14 is composed of two (a pair) leaf springs 15a, 15b from the base end side.
Are extended into the semiconductor device housing hole 11 toward the diagonal position A side of the semiconductor device housing hole 11, and the leg springs 15a, 15b
Is bent outward with a curved line.
The bifurcated leaf spring 14 is fixed by a mounting rod 16 inserted on the base end side.
16 is implanted and fixed to the semiconductor device array plate 10.
The heights of the forked leaf spring 14 and the mounting rod 16 match the surface height of the semiconductor device array plate 10,
It is set so as not to protrude upward from the surface of the semiconductor device array plate 10.

When cream solder printing is performed collectively on the surfaces of a plurality of semiconductor devices 1 using the semiconductor device array plate, a bifurcated leaf spring is used as shown in FIG.
In the free state, the insertion pin 21 is inserted between the forks of the bifurcated leaf spring 14 so as to
a, 15b are opened, and the semiconductor device 1 is inserted into the semiconductor device housing hole 11 with the leg springs 15a, 15b retracted from the path for inserting the semiconductor device 1 into the semiconductor device housing hole 11. After the insertion of the semiconductor device, the semiconductor device is inserted through the crotch of the bifurcated leaf spring 14.
By removing the input pin 21 and releasing the open state of the leg springs 15a and 15b, the semiconductor device 1 is positioned by the elastic restoring force of the leg springs 15a and 15b as shown in FIG. 13a and 13b are pressed and held, and X,
The semiconductor device 1 achieves positioning in the Y biaxial direction, and
By being mounted on the mounting reference surface 12, the semiconductor device is housed in the semiconductor device housing hole 11 in a state where positioning in the height direction is also achieved.

In this manner, the semiconductor device array plate
After the semiconductor device 1 is housed and held in all the semiconductor device housing holes 11 of FIG.
2 is mounted on the work table 4 of the solder cream printing machine shown in FIG. 1 in a state of being positioned, and the cream solder 7 is pushed into the holes 5 of the print mask 6 by a squeegee 8 from above the print mask 6 to thereby obtain the surface of the plurality of all semiconductor devices 1. The cream solder print for the pad is formed without any displacement.

After printing the cream solder, the work table 4 is lowered to separate the semiconductor device 1 from the printing mask 6, and then the semiconductor device arrangement plate 10 is removed from the work table 4. By placing a solder ball on the solder cream printing surface and performing reflow, a substantially spherical pad of the solder ball is formed on the surface of each semiconductor device 1. After the formation of the pad, the forked leaf spring 14
By releasing the foot springs 15a and 15b of the semiconductor device 1 and releasing the positioning and holding state of the semiconductor device 1, the semiconductor device 1 with the pad formed thereon can be taken out of the semiconductor device housing hole 11.

However, when the work table 4 is lowered after printing the cream solder on the surface of the semiconductor device 1, as shown in FIG. 4, the adhesive strength of the cream solder 7 is strong. Overcoming the holding force of the bifurcated leaf spring 14 holding the semiconductor device 1, the semiconductor device 1
Is attached to the print mask 6 side. Thus, when the semiconductor device 1 is attached to the printing mask 6 side, it takes between hands to peel this, also, upon the release of the semiconductor device 1, rubbing the semiconductor device 1 and the printing mask 6, the semiconductor device 1 Cream solder 7 printed on the surface
However, there is a problem that the print pattern shape becomes defective.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to reduce the work of a semiconductor device by lowering a work table of a printing machine after cream solder printing of the semiconductor device to cause separation of a plate. It is an object of the present invention to provide a vacuum holding device for a semiconductor device at the time of cream solder printing which does not adhere to the print mask side due to the adhesive force of the cream solder.

[0016]

The present invention is configured as follows to achieve the above object. That is, the present invention is an apparatus for holding each semiconductor device by vacuum suction when collectively printing cream solder for a pad on the surface of a plurality of semiconductor devices, and the device has a surface on which printing is performed on the front side. To form a plurality of semiconductor device housing holes for positioning and housing the semiconductor device ,
Two adjacent planes are positioned in the plane biaxial direction of the semiconductor device.
A semi-guide on the diagonally opposite side of both positioning reference planes
Semiconductor device for pressing the body device against both positioning reference surfaces
Inserting the insertion pin between the crotch of the two foot springs
A semiconductor device array plate provided with a pressing means formed of a bifurcated leaf spring capable of performing the above operation. A vacuum drive chamber communicating with each semiconductor device receiving hole is provided on the back side of the semiconductor device array plate. The semiconductor device housed in each semiconductor device housing hole is suction-fixed to a semiconductor device suction surface provided at the bottom side of each semiconductor device housing hole by the vacuum suction force of the drive chamber.

[0017]

In the present invention having the above structure, the semiconductor device is positioned and housed in each semiconductor device housing hole of the semiconductor device array plate, the semiconductor device array plate is mounted on a cream solder printing machine, and pads for pads are provided on the surface of the semiconductor device. When batch printing of the cream solder is performed, the air in the vacuum driving chamber on the back side of the semiconductor device array plate is evacuated. Thereby, each semiconductor device is vacuum-sucked with a vacuum suction force,
The semiconductor device is suction-fixed to a semiconductor device suction surface provided on the bottom side of each semiconductor device housing hole.

In this fixed state, a printing mask is applied to the upper side of the semiconductor device array plate, and cream solder for a pad is printed on the surface of the semiconductor device at a time.

After the printing, the work table of the cream solder printing machine is lowered together with the semiconductor device array plate,
The plate separation between the semiconductor device and the print mask is performed. At the time of this plate separation, since each semiconductor device is suction-fixed to the semiconductor device suction surface by the vacuum suction force, the vacuum suction fixing force is smaller than the adhesive force of the solder cream that sticks the semiconductor device to the print mask side. The semiconductor device does not adhere to the printing mask side when the plate is separated and the plate is separated.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a main configuration of an embodiment of a vacuum holding device according to the present invention. In the drawing, a box-shaped vacuum suction table 18 is mounted airtightly on an upper side of a backup plate 17 provided on a work table 4 of a cream solder printing machine with an opening face down. A vacuum drive chamber 20 is formed in an internal space surrounded by 17.

A vacuum exhaust port 22 is formed on the side wall surface of the vacuum drive chamber 20, and this vacuum exhaust port 22 is connected to a vacuum suction port of a vacuum pump (not shown).

The semiconductor device array plate 10 shown in FIG. 2 is positioned and mounted on the upper side of the vacuum suction table 18, and the vacuum suction table opposing the semiconductor device receiving hole 11 of each semiconductor device array plate 10. Vacuum suction hole on top wall 23 of 18
The semiconductor device accommodating hole 11 is communicated with the vacuum drive chamber 20 via the vacuum suction hole 24. The upper surface of the vacuum suction table 18 facing the bottom surface of the semiconductor device 1 accommodated in each semiconductor device accommodation hole 11 functions as a semiconductor device suction surface 25 of the semiconductor device 1.

This embodiment is configured as described above.
Next, the operation will be described. When the cream solder for a pad is collectively printed on the surface of each semiconductor device 1 held and positioned in each semiconductor device housing hole 11 of the semiconductor device array plate 10, the semiconductor device in which the semiconductor device 1 is positioned and housed is used. The array plate 10 is positioned and mounted on the upper side of the vacuum suction table 18.

In this state, the vacuum pump is driven to evacuate the vacuum driving chamber 20, thereby receiving the vacuum suction force from the vacuum driving chamber 20 and adsorbing and fixing the semiconductor device 1 to the semiconductor device suction surface 25. Is done.

In this state, the work table 4 is moved up to bring the surface of each semiconductor device 1 into close contact with the print mask 6. In this state, the squeegee 8 is slid on the surface of the print mask 6 and the cream solder 7 is pressed into the holes 5 of the print mask 6 as shown in FIG. Cream solder 7 is collectively printed and formed.

After the printing is completed, the work table 4 is lowered together with the semiconductor device array plate 10 to separate the plate from the semiconductor device 1 and the print mask 6. At the descent stop position of the work table 4, the vacuum pump is stopped, and the vacuum drive chamber 20 is evacuated to a vacuum.

Next, the semiconductor device array plate 10 is removed from the vacuum suction table 18, and a solder ball is placed on the cream solder printed surface of each semiconductor device 1 and reflowed. Formed on the surface. After the formation of the pad, in a state where the semiconductor device 1 is held by the bifurcated leaf spring 14 as shown in FIG. 3C, the crotch of the bifurcated leaf spring 14 is formed as shown in FIG. Insert the insertion pin 21 between the foot spring 15
a, 15b are opened, and the semiconductor device 1 on which the pads are formed is removed from the semiconductor device array plate 10.

According to this embodiment, when printing the cream solder on the semiconductor device 1, the semiconductor device 1 is suction-fixed to the semiconductor device suction surface 25 by the vacuum suction force of the vacuum driving chamber 20, so that after the printing of the cream solder is completed. When the work table 4 is lowered to separate the printing plate 6 from the semiconductor device 1, the semiconductor device 1 does not adhere to the printing mask 6 due to the adhesive force of the cream solder. Solder printing work smoothly and
It can be performed efficiently.

The present invention is not limited to the above-described embodiment, but can adopt various embodiments. For example, in the above embodiment, the vacuum suction table 18 is detachable from the backup plate 17, but the vacuum suction table 18 is
It may be configured integrally with 17.

In the above embodiment, the semiconductor device array plate 10 is attached to and detached from the vacuum suction table 18. However, the semiconductor device array plate 10 may be formed integrally with the vacuum suction table 18.

[0031]

According to the present invention, a vacuum driving chamber is provided on the back side of a semiconductor device array plate having a plurality of semiconductor device receiving holes for positioning and receiving a semiconductor device, and the vacuum driving chamber uses the vacuum suction force. Since the semiconductor device housed in the semiconductor device housing hole is configured to be suction-fixed on the semiconductor device suction surface, cream solder for a pad is collectively printed on the surface of each semiconductor device, and then the print mask and the semiconductor device are printed. When the plate is separated, the vacuum suction fixing force of each semiconductor device sufficiently overcomes the adhesive force of the cream solder, so that the semiconductor device does not adhere to the print mask due to the adhesive force of the cream solder.

[0032] Thus, the every time opened manually or inter et peeling the semiconductor device attached to the printing mask, that cream solder printing pattern the semiconductor device is formed by printing rub against the printing mask when peeling off the semiconductor device is defective As a result, the cream solder for the pad of the semiconductor device can be printed smoothly and efficiently. In addition, semiconductor devices are arranged on the semiconductor device array plate.
When a plurality of semiconductor device housing holes for positioning and housing are formed,
In both cases, the two adjacent surfaces of the semiconductor device accommodation hole
Of the two axes in the plane
The semiconductor device is placed on both positioning reference planes on the diagonally opposite side of the reference plane.
Of two foot springs for pressing the semiconductor device for pressing.
From a bifurcated leaf spring that allows the insertion pin to be inserted and removed between the crotch
Since it is configured to be provided with a pressing means comprising
Insert a pin between the crotch of this bifurcated leaf spring (between the crotch of the foot spring).
By inserting, the foot spring is opened, and the semiconductor device
Retract the foot spring from the path that enters the semiconductor device housing hole.
The semiconductor device with the foot spring not in the way.
Housing in the body device housing hole and removal of the semiconductor device.
It can be easily performed, and the pin
To return the spring from the open state to the closed state.
The semiconductor device is automatically moved between the foot springs by the elastic restoring force of the return deformation.
The effect of being able to hold dynamically is obtained. I
The semiconductor device is stored in the semiconductor device due to the pressing force of the foot spring.
Pressing against the positioning reference surface of the container hole
The solder paste for the pad on the surface of the semiconductor device.
The effect is obtained that printing can be performed correctly without misalignment. Ma
In addition, a bifurcated leaf spring is a semiconductor between the tip sides of two leg springs.
The semiconductor device is pressed and held across the device,
Because the spring elastic leg range can be widened, large and small
Capable of holding semiconductor devices in a small range
It is.

[Brief description of the drawings]

FIG. 1 is a main part configuration diagram showing one embodiment of a vacuum holding device according to the present invention.

FIG. 2 is an explanatory diagram of a semiconductor device array plate for collectively printing cream solder for pads of a plurality of semiconductor devices.

FIG. 3 is an explanatory view of an operation of attaching and detaching a semiconductor device to and from the semiconductor device array plate.

FIG. 4 is an explanatory diagram of a failure state when a plurality of semiconductor devices are printed collectively using a semiconductor device array plate.

FIG. 5 is an explanatory diagram of a general cream solder printing operation.

FIG. 6 is an explanatory diagram of a configuration of a semiconductor device proposed by the applicant earlier.

FIG. 7 is an explanatory diagram of a generally known semiconductor device.

[Description of Signs] 1 Semiconductor device 6 Print mask 7 Cream solder 10 Semiconductor device array plate 11 Semiconductor device accommodation hole 18 Vacuum suction table 20 Vacuum drive room 24 Vacuum suction hole 25 Semiconductor device adsorption surface

Continued on the front page (72) Inventor Tsuneaki Komazawa 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (72) Inventor Yoshinari Umetani 1-1 Yamashitacho, Kokubu-shi, Kagoshima Kyocera Corporation Kokubu Plant (72) Inventor Gaku Torigoe 1-1, Yamashita-cho, Kokubu-shi, Kagoshima Prefecture Inside Kyocera Kokubu Plant (72) Inventor Shingo Sato 1-1, Yamashita-cho, Kokubu-shi, Kagoshima Prefecture Kokubu Plant, Kyocera Corporation (56) References JP-A-2-224392 (JP, A) JP-B-35-14067 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB name) B41F 15/00-15/44

Claims (1)

(57) [Claims] 1. A device for holding a semiconductor device by vacuum suction when cream solder for a pad is collectively printed on a surface of a plurality of semiconductor devices, wherein the device has a surface to be printed facing up. Forming a plurality of semiconductor device housing holes for positioning and housing the semiconductor device,
The two adjacent surfaces of the receiving hole are aligned with the planar biaxial direction of the semiconductor device.
The positioning reference plane, which is the diagonally opposite side of both positioning reference planes
To press the semiconductor device against both positioning reference planes.
Insertion pin between the crotch of two leg springs pressing the conductor device
A semiconductor device array plate provided with pressing means formed of a bifurcated leaf spring that can be taken in and out, and a vacuum drive chamber communicating with each semiconductor device housing hole is provided on the back side of the semiconductor device array plate. In the case of cream solder printing, the semiconductor device housed in each semiconductor device housing hole is suction-fixed to the semiconductor device suction surface provided at the bottom side of each semiconductor device housing hole by the vacuum suction force of the vacuum drive chamber. Vacuum holding device for semiconductor device in.