JPH07193177A - Device for cutting lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To provide an apparatus for separating plastic molded devices from a lead frame and smoothly transferring them to the next stage even if dust appears from the punching die or devices have resin flashes. CONSTITUTION:An apparatus for removing plastic molded devices from the lead-frame comprises a punching die 1 having an opening 11 for receiving a suction pad 9 in its upper die, a head 8 for picking up a molded package 3 using the suction pad to transfer it a predetermined distance, a carrier 24 that supports sliding rails 16 to which molded packages are transferred by the head, and a constant feed mechanism 23 for positioning a retainer provided with recesses 18 that receive molded packages and enclose their lower halves.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention separates individual semiconductor devices by cutting a connecting portion between a resin outer shell of a semiconductor device mounted on a long lead frame in a plurality of rows and a lead frame. The present invention relates to a lead frame separating device (hereinafter simply referred to as a lead frame separating device) in a semiconductor device that supplies a semiconductor device separated to a stage of a manufacturing apparatus in a next step.

[0002]

2. Description of the Related Art In a finishing process after an automated line in which a semiconductor chip having an integrated circuit formed on a semiconductor substrate is resin-sealed and assembled into a semiconductor device, a lead frame tie bar and an external lead are cut off and a lead frame is cut off. Automated equipment including cutting and resin burr removal dies was located. In addition, a transport device that organically connects these automated facilities is also arranged in each. Further, a delivery device, which is a kind of transfer device for supplying and discharging a work to an adjacent automation device or a transfer device, is attached to these automation devices.

FIG. 2 is a diagram showing a lead frame in which a resin outer shell of a semiconductor device is mounted, and FIG. 3 is a diagram showing a configuration of the device for explaining an example of a conventional lead frame separating device. Conventionally, this type of lead frame separating device is
For example, as shown in FIG. 3, a cutting die for cutting the suspension leads 2a to separate the resin outer shell 3 and the lead frame 2 of the semiconductor device of FIG. 2 and the resin outer shell 3 of the separated semiconductor device are provided. It was provided with the supply part 7 which is a discharging mechanism for sending in one direction.

The cutting of the suspension lead 2a by the cutting die holds the resin outer shell 3 of the lead frame 2 sent by the clamp 5a of the upper die 5 and the lower die 6 and lowers the upper die 5 to Accordingly, the punch 6a was inserted into the recess having the cutting edge of the clamp 5a to cut the suspension lead 2a. As shown in FIG. 4B, the resin shell 3 that has been cut and separated is pushed by the pusher 4 from one direction of the discharge port 21a on the base of the supply unit 7 of the lower mold 6 and inserted into the tutor 21. It

Then, such an operation is continuously carried out, the resin outer shell 3 is sent to the tutor 21 one after another, and the resin outer shell 3 itself pushes out from the outlet of the tutor 21 to the stage of the next equipment. Was being supplied.

[0006]

In the above-mentioned conventional lead frame separating device, there is a problem that cutting wastes from the cutting die enter the discharge port of the tutor and significantly hinder the feeding of the resin outer shell. As a measure against this, even if the outlet of the tutor is widened, the resin burrs attached to the resin shell collide when they push against each other and tilt the resin shell itself, causing the resin burrs of the resin shell to be caught on the outlet wall and discharged. There was often a problem of clogging the exit. Also, even if the resin outer shell is pushed and smoothly moving inside the tutor, the stop position of the resin outer shell discharged from the tutor is not constant, and the problem that the supply to the next equipment does not occur smoothly is also included. I was out.

Therefore, an object of the present invention is to separate the resin outer shell of the semiconductor device from the lead frame and smoothly carry out the next process even if chips are generated from the cutting die or the resin burrs remain in the resin outer shell. An object of the present invention is to provide a lead frame separating device that can be supplied to equipment.

[0008]

A feature of the present invention is that a long lead frame on which resin outer shells of a plurality of semiconductor devices are mounted side by side is fed from one direction, and a connecting member for connecting the resin outer shells and the lead frames is provided. A cutting die for cutting, an adsorption pad for adsorbing a flat surface of the resin outer shell separated from the lead frame exposed at the opening of the upper die of the cutting die, and an adsorption pad for moving the adsorption pad up and down. A transfer head that is inserted into the opening and picks up the resin shell and moves to a predetermined position separated from the mold; and a transfer head that is separated from the suction pad of the transfer head that has moved to the predetermined position and transfers the resin shell. And a holder for wrapping and holding a lower half of the resin outer casing mounted on the sliding rail, and a carrier for arranging a plurality of sliding rails arranged in one direction. Just move A lead frame disconnect device in the semiconductor device and a feed mechanism.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a partially cutaway side view of a lead frame separating device according to an embodiment of the present invention. As shown in FIG. 1, this lead frame separating device feeds the long lead frame 2 of FIG. 2 in which the resin outer shells 3 of a plurality of semiconductor devices are mounted side by side from one direction, and the resin outer shell 3 and the lead frame 2 are connected to each other. Cutting die 1 for cutting the suspension lead 2a which is a connecting portion of the resin, and the resin outer shell 3 separated from the lead frame 2 exposed in the opening 11 of the upper die 5b of the cutting die 1.
, A suction pad 9 for sucking the flat surface of the suction pad 9, a transport head 8 for moving the suction pad 9 up and down, inserting it into the opening 11, picking up the resin outer shell 3 and moving it to a predetermined position apart from the cutting die 1. A carrier 24 for arranging a plurality of sliding rails 16 that are separated from the suction pad 9 of the carrying head 8 that has been moved to a predetermined position and on which the resin outer shell 3 is transferred in one direction, and a resin placed on the sliding rails 16. A holding tool 17 for wrapping and holding the lower half of the outer shell 3 is provided, and a fixed-size feed mechanism 23 for sliding on the slide rail 16 and moving a fixed distance is provided.

The cutting die is composed of an upper die 5b and a lower die 6a, and the die is opened by hydraulic pressure or air pressure by the guide of the guide post. The upper mold 5b is provided with an opening 11 into which the suction pad 9 is inserted, and the separated resin outer shell 3 exposed from the opening 11 can be picked up. Further, the die 12 is attached to the upper die 5b, and the punch 14 is attached to the lower die 6a. The punch 14 guided by the guide 15 and the groove 13 by the repulsive force of the spring by the die clamping operation is fitted to the die 12. As a result, the suspension lead of the lead frame 2 is cut. In addition, punch 14
A pin is embedded in the outer side of the pin, and this pin positions one frame of the lead frame 2.

The transport head 8 having the suction pad 9 has a structure which can be slidably moved on a traveling rail, and further has an elevating mechanism for moving the suction pad 9 up and down. Also,
A hole for vacuum-sucking the flat surface of the resin shell 3 is provided at the tip of the suction pad 9. Here, the tip of the suction pad 9 has a recess that is preferably shallower than a flat surface. The reason why the shallow recess is provided is that the resin outer shell 3 is guided by the recess when the resin outer shell 3 is sucked, and the position and the direction of the resin outer shell 3 are regulated. Further, making the depression shallow means that the suction pad does not come into contact with the external lead protruding from the side surface of the resin outer shell 3. Further, it is desirable to provide a mechanism capable of adjusting the distance between the two suction pads 9 according to the distance between the resin outer shells 3 mounted on the lead frame 2.

A plurality of slide rails 16 are arranged side by side on the carriage 24. The sliding rails 16 are arranged at the same extent as the width of the resin outer shell 3, for example, at intervals at the bent positions of the leads on both sides to support and slide the leads. Therefore, if the resin shell mounted on the lead frame 2 has two rows, four sliding rails 16 are required.

On the other hand, the constant-size feed mechanism 23 includes a movable table 20 that slides on the rail 22, an air cylinder 23a attached to the movable table 20, and a holder attached to the piston rod end of the air cylinder 23a. It is composed of 17 and. The holder 17 is provided between the slide rails 16 and has a recess 18 that encloses and holds the lower half of the resin outer shell 3 transferred from the suction pad 9 to the slide rail 16. Further, the holder 17 is configured to surely insert the resin outer shell 3 into the recess 18 so that the resin outer shell 3 is not displaced due to the pressing force when the suction pad 9 is lowered.

Further, while the resin outer shell is picked up by the suction pad and chips and the like fall during the transportation, no problems occur in the transportation, but if necessary, the chips may be attached to the periphery of the opening 11 of the upper die of the cutting die 1. It is desirable to have a nozzle 25 along which the air outlet is arranged. By providing this nozzle 25, air is blown toward the resin outer shell 3 to scatter chips,
It is possible to completely prevent the attachment of chips to the resin outer shell 3 and the die or the lead portion.

Next, the operation of this lead frame separating device will be described. First, the lead frame 2 shown in FIG. 2 is fed through the guide of the cutting die 1. When the die is opened, one frame of the lead frame 2 is fed and the two resin outer shells 3 are positioned on the punch 14 by the pins. Next, the suspension lead 2a is cut by mold clamping, and the resin outer shell 3 is separated.

Next, after the mold is opened, the transport head 8 is lowered and the suction pad 9 protruding from the head main body 19 into the opening 11.
And the resin outer shell 3 is adsorbed. Then, the transport head 8 is raised and the resin outer shell 3 is picked up by the suction pad 9. Next, the transport head 8 slides on the traveling rail 10 and is positioned at a predetermined position on the transport base 24. Then, the transport head 8 descends to transfer the resin shell 3 from the suction pad 9 to the slide rail 16, and at the same time, the holder 17 rises due to the operation of the air cylinder 23a, and the resin shell 3 is inserted into the recess 18. .

When it is confirmed that the resin shell 3 of the holder 17 is securely held, the carrying head 8 is raised and the traveling rail 1 is moved.
Slide 0 to return to the original position. During this time, the movable table 20 travels on the rails 22 and stops at the position designated by the equipment for the next step to position the resin outer shell 3 of the holder 17 and complete the operation.
By repeating such a series of operations, the resin outer shells 3 in a plurality of columns are sequentially sent to a predetermined position in a state of being separated from each other and supplied to the designated stage of the next process equipment.

By the way, when the resin shell of the semiconductor device was separated and supplied to the equipment of the next process by using this device, the number of occurrences of the feeding accident due to the jamming that had occurred in the past was eliminated, and the equipment of the next process was further removed. Conventional problems with supply have been completely resolved.

The cutting-type mechanism, the feeding mechanism of the conveying head, and the detailed driving mechanism of the constant-size feeding device described in this embodiment are not limited to those shown in the drawings.

[0021]

As described above, according to the present invention, the opening for exposing the resin shell is provided in the upper die of the cutting die for cutting the connecting member by separating the resin shell of the semiconductor device and the lead frame. Insert a suction pad into the opening and pick up the resin shell and send it to a position that is separated from the cutting mold by a predetermined distance, a transfer stand to which the resin shell is transferred from this transfer head, and a transfer stand placed on this transfer stand. By wrapping and holding the lower half of the resin shell and positioning it at the designated position of the next process equipment, even if chips are generated, it can be dropped without adhering to the resin shell. In addition, since the two resin outer shells can be separated from each other and can be conveyed to a predetermined position where there is no wall or the like to be taken out from the cutting die and constrained to the surroundings, adhesion of chips and resin bodies that have occurred conventionally Transport accidents jostling becomes nil, the resin outer body of the cutting isolated semiconductor device very smoothly there is an effect that can be positioned at a specified position in the next step.

[Brief description of drawings]

FIG. 1 is a partially cutaway side view of a lead frame separating device according to an embodiment of the present invention.

FIG. 2 is a diagram showing a lead frame on which a resin outer shell of a semiconductor device is mounted.

FIG. 3 is a diagram showing a configuration of a device for explaining an example of a conventional lead frame separating device.

[Explanation of symbols]

 1 Cutting Die 2 Lead Frame 2a Suspended Lead 3 Resin Outer Body 4 Pusher 5,5b Upper Die 5a Clamp 6,6a Lower Die 7 Feeder 8 Conveying Head 9 Adsorption Pad 10 Traveling Rail 11 Opening 12 Die 13 Groove 14 Punch 15 Guide 16 Sliding Rail 17 Holding Tool 18 Dimple 19 Head Main Body 20 Moving Stand 21 Tutor 21a Discharge Port 22 Rail 23 Fixed Size Feeding Mechanism 23a Air Cylinder 24 Conveyor Stand 25 Nozzle

Claims (2)

[Claims] 1. A cutting die for feeding a long lead frame in which resin outer shells of a plurality of semiconductor devices are mounted side by side from one direction to cut a connecting member between the resin outer shell and the lead frame, and a cutting die. A suction pad for adsorbing the flat surface of the resin shell separated from the lead frame exposed to the opening of the upper die of the die, and a suction pad which is moved up and down to be inserted into the opening to form the resin shell. A transport head that moves to a predetermined position separated from the mold and a plurality of sliding rails that are detached from the suction pad of the transport head that has moved to the predetermined position and on which the resin shell is transferred And a fixed-length feed mechanism that slides on the slide rail and moves a fixed distance, including a holder for wrapping and holding the lower half of the resin outer casing placed on the slide rail. Characterized by Lead frame separating device for semiconductor device. 2. The lead frame separating device in a semiconductor device according to claim 1, further comprising a nozzle having an air outlet arranged along a peripheral edge of the opening of the cutting die.