JPH0716667A - Work working method - Google Patents
Work working methodInfo
- Publication number
- JPH0716667A JPH0716667A JP5167087A JP16708793A JPH0716667A JP H0716667 A JPH0716667 A JP H0716667A JP 5167087 A JP5167087 A JP 5167087A JP 16708793 A JP16708793 A JP 16708793A JP H0716667 A JPH0716667 A JP H0716667A
- Authority
- JP
- Japan
- Prior art keywords
- work
- product
- micro
- micro joint
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
- Punching Or Piercing (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ワークから製品の外
形を切断する際に、加工中に製品が切り離されないよう
に複数のミクロジョイント部を残すようにしたワーク加
工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for machining a work, which is designed to leave a plurality of micro joints so as to prevent the product from being separated during machining when the contour of the product is cut from the work.
【０００２】[0002]
【従来の技術】従来、ワークから製品の外形をタレット
パンチプレスなどで切断し、ワークから製品が切り離さ
れないようにワークと製品との間に複数のミクロジョイ
ント部を残す加工方法が知られている。2. Description of the Related Art Conventionally, a processing method has been known in which the outer shape of a product is cut from a work with a turret punch press or the like, and a plurality of micro joints are left between the work and the product so that the product is not separated from the work. There is.
【０００３】すなわち、このミクロジョイント部を残す
ことは、例えばタレットパンチプレスによって、加工さ
れた製品とワークとをつなぐためのもので、このミクロ
ジョイント加工を行わないと、製品とワークとが離れて
しまい、ワーク移動時に製品が残されたままで製品に傷
が付いたり、二枚重ねて打ち抜いてしまう。That is, leaving the micro joint is for connecting the product and the work processed by, for example, a turret punch press. If the micro joint processing is not performed, the product and the work are separated from each other. If the work is moved, the product will be left behind when the work is moved, and the product will be scratched or punched by stacking two products.
【０００４】そして、製品がミクロジョイント部で結合
されたワークから各製品を外すときには、ワークが例え
ば薄い場合には、製品を軽く叩き落したり、ニッパで切
断したりしていた。When the products are detached from the work joined by the micro joints, when the work is thin, for example, the products are lightly tapped or cut with a nipper.
【０００５】[0005]
【発明が解決しようとする課題】ところで、ワークが厚
い場合には、ミクロジョイント部も厚いために、製品を
叩き落すにしても強く叩くから製品に傷ができたりして
しまう。また、ニッパで切断するにしても手間がかかり
作業者にとっては重労働であった。By the way, when the work is thick, the micro joint portion is also thick, and even if the product is knocked down, the product is scratched because it is strongly hit. Further, even if cutting with a nipper, it takes time and labor, which is a heavy labor for the worker.
【０００６】この発明の目的は、上記問題点を改善する
ために、ワークが厚板であっても薄板とほぼ同程度にミ
クロジョイント部を容易にワークから外れるようにする
と共に作業者を労働を軽減せしめるようにしたワーク加
工方法を提供することにある。SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to allow a work piece to be easily detached from a micro joint portion to the same extent as a thin plate even if the work piece is a thick plate, and the worker is required to work. It is to provide a work processing method that can be reduced.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、この発明は、ワークから製品の外形を切断する際
に、加工中に製品が切り離されないように複数のミクロ
ジョイント部をワークと製品との間に残して加工を行っ
た後に、前記ミクロジョイント部における厚さの一部を
除去せしめることを特徴とするワーク加工方法である。In order to achieve the above object, the present invention provides a plurality of micro joint parts with a work so as not to separate the product during processing when cutting the outer shape of the product from the work. It is a work processing method characterized in that a part of the thickness of the micro joint portion is removed after the processing is performed while leaving it between the product and the product.
【０００８】[0008]
【作用】この発明のワーク加工方法を採用することによ
り、加工中に製品がワークから切り離されないように複
数のミクロジョイント部をワークと製品との間に残して
加工を行う。次いで、前記各ミクロジョイント部におけ
る厚さの一部を除去せしめることによって、このミクロ
ジョイント部の厚さは、例えば薄板におけるミクロジョ
イント部の厚さ程度になる。したがって、製品を軽くた
たいたり、あるいはカッタで切り落すことにより、製品
はワークから容易に外されると共に作業者の労働が従来
よりも軽減される。By adopting the work machining method of the present invention, machining is performed while leaving a plurality of micro joints between the work and the product so that the product is not separated from the work during machining. Then, by removing a part of the thickness of each of the micro joint portions, the thickness of the micro joint portion becomes approximately equal to the thickness of the micro joint portion of the thin plate, for example. Therefore, by tapping the product lightly or cutting it with a cutter, the product is easily removed from the work and the labor of the worker is reduced as compared with the conventional case.
【０００９】[0009]
【実施例】以下、この発明の実施例を図面に基いて詳細
に説明する。Embodiments of the present invention will be described in detail below with reference to the drawings.
【００１０】図２を参照するに、例えば板厚が６ｍｍ以
上のワークＷから例えばタレットパンチプレス機にて製
品Ｇの外形を切断した際に、製品ＧがワークＷから切り
離されないように、ミクロジョイント部Ｍ1 ，Ｍ2 が製
品ＧとワークＷとの間に結合されている。ミクロジョイ
ントＭ1 をワイヤージョイントとして、ミクロジョイン
トＭ2 をコーナージョイントとして通称呼ばれている。Referring to FIG. 2, for example, when the outer shape of the product G is cut from a work W having a plate thickness of 6 mm or more by a turret punch press machine, for example, the product G is not separated from the work W by a micro-machine. Joints M 1 and M 2 are connected between the product G and the work W. The micro joint M 1 is commonly called a wire joint, and the micro joint M 2 is commonly called a corner joint.
【００１１】このミクロジョイントＭ1 ，Ｍ2 はワーク
Ｗが厚板の場合には軽く叩いたり、ニッパで切ったりす
ることでは外れないので、本実施例では、図１に示され
ているように、例えばレーザ加工ヘッドＬＨよりレーザ
ビームＬＢを前記ミクロジョイント部Ｍ1 の製品Ｇ側部
分に照射せしめて、厚さのうちの一部（図１においてｔ
1 ）を溶断除去せしめる。すなわち、ミクロジョイント
部Ｍ1 の厚さをｔ1 除去してｔ0 にする。この厚さｔ0
は例えば薄板のワークＷにおける従来のミクロジョイン
ト部の厚さに相当するものである。さらに、ミクロジョ
イント部Ｍ1 以外のミクロジョイント部Ｍ2 を含めたそ
の他のミクロジョイント部をミクロジョイント部Ｍ1 と
ほぼ同様に一部溶断除去せしめる。When the work W is a thick plate, the micro joints M 1 and M 2 cannot be removed by tapping or cutting with a nipper, so in this embodiment, as shown in FIG. , The laser beam LB is irradiated from the laser processing head LH to the product G side portion of the micro joint portion M 1 , and a part of the thickness (t in FIG.
1 ) Melt and remove. That is, the thickness of the micro joint portion M 1 is removed by t 1 to be t 0 . This thickness t 0
Corresponds to the thickness of the conventional micro joint portion in the thin plate work W, for example. Furthermore, the other micro-joint, including a micro-joint portion M 2 other than the micro joints M 1 allowed to substantially the same manner as some blown remove the micro joint M 1.
【００１２】而して、各ミクロジョイント部の厚さをｔ
0 にすることにより、作業者によって、後で製品Ｇを軽
く叩いたり、あるいはニッパで切ることで容易にミクロ
ジョイント部を外すことができる。したがって、製品に
傷が付くことなく、作業者の労働を軽減させることがで
きる。Thus, the thickness of each micro joint is t
By setting the value to 0 , the operator can easily remove the micro joint portion by tapping the product G later or cutting it with a nipper. Therefore, the work of the worker can be reduced without damaging the product.
【００１３】上述した実施例の加工を行う機械として
は、パンチ、レーザ複合機が適しているものである。レ
ーザ加工ヘッドＬＨで各ミクロジョイント部の一部を一
連にて溶断除去するには、ＮＣ装置にワークＷの板厚、
材質などを入力し、各ミクロジョイント部の上方にレー
ザ加工ヘッドＬＨが自動的に位置決めされるように自動
プログラムを作成し、この自動プログラムを実行するよ
うにＮＣ制御させるようにすればよいものである。A punch and a laser compound machine are suitable as machines for performing the above-described working examples. In order to remove a part of each micro joint part by fusion cutting with the laser processing head LH, the thickness of the work W,
It is only necessary to input materials and the like, create an automatic program so that the laser processing head LH is automatically positioned above each micro joint, and perform NC control to execute this automatic program. is there.
【００１４】また、レーザは低出力のＹＡＧレーザを使
用するのが望ましいものである。このワーク加工方法は
パンチレーザ複合機以外に、例えばタレットパンチプレ
ス機で従来と同様のミクロジョイント部を残した切断加
工を行い、別工程にてレーザ加工機、プラズマ加工機な
どの熱切断加工機でミクロジョイント部の一部を溶断除
去するようにしても構わないものである。さらに、ミク
ロジョイント部の一部除去を熱溶断でなく、タレットパ
ンチプレスなどでミクロジョイント部をつぶして板厚を
薄くするようにしてもよいものである。Further, it is desirable to use a low power YAG laser as the laser. In addition to the punch laser compound machine, this work processing method is, for example, a turret punch press machine that performs the same cutting process that leaves the same micro joints as before, and a thermal cutting machine such as a laser processing machine or plasma processing machine in a separate process. Therefore, a part of the micro joint part may be fused and removed. Further, the micro joint portion may be partially removed by turret punch press or the like so as to reduce the plate thickness, instead of thermal fusing.
【００１５】なお、この発明は、前述した実施例に限定
されることなく、適宣な変更を行うことにより、その他
の態様で実施し得るものである。The present invention is not limited to the above-described embodiments, but can be implemented in other modes by making appropriate modifications.
【００１６】[0016]
【発明の効果】以上のごとき実施例の説明より理解され
るように、この発明によれば、特許請求の範囲に記載さ
れているとおりの構成であるから、ワークが厚板であっ
ても薄板とほぼ同程度にミクロジョイント部を容易にワ
ークから外すことができる。しかも、製品に傷を付ける
ことなく、また作業者の労働を軽減させることができ
る。As will be understood from the above description of the embodiments, according to the present invention, since the construction is as described in the claims, even if the work is a thick plate, it is a thin plate. The micro joint part can be easily removed from the work almost as much as the above. Moreover, it is possible to reduce the labor of the worker without damaging the product.
【図１】この発明を実施する一実施例のワークに製品が
結合されているミクロジョイントの一部をレーザ加工ヘ
ッドからのレーザビームで除去する斜視図である。FIG. 1 is a perspective view in which a laser beam from a laser processing head removes a part of a micro joint in which a product is bonded to a work according to an embodiment of the present invention.
【図２】ワークから製品の外形切断を行い、ワークに製
品がミクロジョイント部で結合されている状態の斜視図
である。FIG. 2 is a perspective view showing a state in which a product is cut out from a work and the product is joined to the work by a micro joint portion.
Ｗ ワーク Ｇ 製品 Ｍ1 、Ｍ2 ミクロジョイント部 ＬＨ レーザ加工ヘッド ＬＢ レーザビーム W Work G Product M1, M2 Micro joint part LH Laser processing head LB Laser beam
Claims (1)
加工中に製品が切り離されないように複数のミクロジョ
イント部をワークと製品との間に残して加工を行った後
に、前記各ミクロジョイント部における厚さの一部を除
去せしめることを特徴とするワーク加工方法。1. When cutting the outer shape of a product from a work,
It is characterized in that a plurality of micro joint parts are left between the work and the product so that the product is not separated during the processing, and then a part of the thickness in each of the micro joint parts is removed. Work processing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16708793A JP3540339B2 (en) | 1993-07-06 | 1993-07-06 | Workpiece machining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16708793A JP3540339B2 (en) | 1993-07-06 | 1993-07-06 | Workpiece machining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0716667A true JPH0716667A (en) | 1995-01-20 |
| JP3540339B2 JP3540339B2 (en) | 2004-07-07 |
Family
ID=15843180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16708793A Expired - Fee Related JP3540339B2 (en) | 1993-07-06 | 1993-07-06 | Workpiece machining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3540339B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022125140A1 (en) | 2022-09-29 | 2024-04-04 | TRUMPF Werkzeugmaschinen SE + Co. KG | Method for forming a nanojoint, associated computer program product and workpiece with nanojoint |
| WO2024083991A1 (en) * | 2022-10-20 | 2024-04-25 | TRUMPF Werkzeugmaschinen SE + Co. KG | Method for producing a connecting web with a reduced thickness while cutting a workpiece part from a plate-shaped workpiece, and corresponding control program product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62183920U (en) * | 1986-05-12 | 1987-11-21 | ||
| JPH06142784A (en) * | 1992-11-10 | 1994-05-24 | Komatsu Ltd | Method for working joint in punch press |
| JPH06190576A (en) * | 1992-12-24 | 1994-07-12 | Toshiba Corp | Method and machine for laser beam machine |
| JPH0788571A (en) * | 1993-01-08 | 1995-04-04 | Anritsu Corp | Method for working metal plate |
-
1993
- 1993-07-06 JP JP16708793A patent/JP3540339B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62183920U (en) * | 1986-05-12 | 1987-11-21 | ||
| JPH06142784A (en) * | 1992-11-10 | 1994-05-24 | Komatsu Ltd | Method for working joint in punch press |
| JPH06190576A (en) * | 1992-12-24 | 1994-07-12 | Toshiba Corp | Method and machine for laser beam machine |
| JPH0788571A (en) * | 1993-01-08 | 1995-04-04 | Anritsu Corp | Method for working metal plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022125140A1 (en) | 2022-09-29 | 2024-04-04 | TRUMPF Werkzeugmaschinen SE + Co. KG | Method for forming a nanojoint, associated computer program product and workpiece with nanojoint |
| WO2024083991A1 (en) * | 2022-10-20 | 2024-04-25 | TRUMPF Werkzeugmaschinen SE + Co. KG | Method for producing a connecting web with a reduced thickness while cutting a workpiece part from a plate-shaped workpiece, and corresponding control program product |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3540339B2 (en) | 2004-07-07 |
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