JPH06190576A - Method and machine for laser beam machine - Google Patents
Method and machine for laser beam machineInfo
- Publication number
- JPH06190576A JPH06190576A JP4343003A JP34300392A JPH06190576A JP H06190576 A JPH06190576 A JP H06190576A JP 4343003 A JP4343003 A JP 4343003A JP 34300392 A JP34300392 A JP 34300392A JP H06190576 A JPH06190576 A JP H06190576A
- Authority
- JP
- Japan
- Prior art keywords
- plate thickness
- micro joint
- laser
- cutting
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、切断加工に適用される
レ―ザ加工方法及びレ―ザ加工装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method and a laser processing apparatus applied to cutting processing.
【０００２】[0002]
【従来の技術】一般にレ―ザ加工装置は図６に示すよう
に構成される。すなわち、１が操作卓、２がレ―ザ発振
器、３がレ―ザ制御装置、４がレ―ザ加工機、５がＮＣ
装置、６がＮＣ装置のプログラミングをする自動プログ
ラミング装置、13がレ―ザ発振器２の冷却用の冷却装
置、14がレ―ザ加工機にドライエアを供給するドライエ
ア供給装置、15はレ―ザ加工機に加工ガスを供給する加
工ガス供給装置である。そしてこの様に構成された各機
器の制御を図７を参照して説明する。全ての構成機器を
操作卓が集中制御すると共に、レ―ザ発振器２をレ―ザ
制御装置３が、レ―ザ加工機４をＮＣ装置５が制御し、
レ―ザ加工は自動プログラミング装置６で作成されるＮ
Ｃプログラムで行なわれる。2. Description of the Related Art Generally, a laser processing apparatus is constructed as shown in FIG. That is, 1 is a console, 2 is a laser oscillator, 3 is a laser controller, 4 is a laser processing machine, and 5 is an NC.
Device, 6 is an automatic programming device for programming the NC device, 13 is a cooling device for cooling the laser oscillator 2, 14 is a dry air supply device for supplying dry air to the laser processing machine, and 15 is a laser processing It is a processing gas supply device for supplying the processing gas to the machine. Then, the control of each device thus configured will be described with reference to FIG. The console centrally controls all the components, the laser oscillator 2 is controlled by the laser control device 3, and the laser processing machine 4 is controlled by the NC device 5.
Laser processing is created by the automatic programming device N
It is done by the C program.
【０００３】次に、このようなレ―ザ加工装置を用いた
レ―ザ切断加工とミクロジョイント部を設ける加工（以
下ミクロジョイント加工と称す）について説明する。図
８は加工材料７に切断加工を行なう状態を示したもので
ある。ａがレ―ザ切断のきっかけを作るための穴開け
（以下ピアシングと称す）位置（以下ピアシング点と称
す）であり、８が切断経路、すなわちこには図示してい
ないレ―ザ光によって切断される経路を示している。こ
こでは周辺機器の細かい制御内容は省略するが、この場
合のＮＣプログラムのフロ―は図９に示すように、ピア
シング加工を行なってから切断加工を行なうようになっ
ている。しかし、このように完全切断加工を行なうと、
図10に示すように切断ワ―ク９が加工材料７に引掛か
り、加工ヘッド10が衝突して損傷したり、落下した切断
ワ―ク９を回収するのに手間どるという問題点があっ
た。Next, a laser cutting process using such a laser processing apparatus and a process for providing a micro joint portion (hereinafter referred to as a micro joint process) will be described. FIG. 8 shows a state in which the processing material 7 is cut. Reference numeral a is a hole (hereinafter referred to as piercing) position (hereinafter referred to as piercing point) for creating a trigger for laser cutting, and 8 is a cutting path, that is, cutting by a laser light not shown here. The route is shown. Although detailed control contents of the peripheral devices are omitted here, the flow of the NC program in this case is designed to perform piercing processing and then cutting processing as shown in FIG. However, when complete cutting is performed in this way,
As shown in FIG. 10, the cutting work 9 is caught on the processing material 7, and the processing head 10 collides with and is damaged, and it takes time to collect the cutting work 9 that has fallen. .
【０００４】そこで、図８に示すように、切断完了点ｂ
をピアシング点ａの近傍に設け切断経路８に未切断のミ
クロジョイント部ｃを設けて被加工部が落下しない様に
して加工ヘッド10との衝突を防止すると共に、全ての加
工完了後にミクロジョイント部ｃを外力で破断させて切
断ワ―ク９の回収効率を高めるミクロジョイント加工が
用いられている。Therefore, as shown in FIG. 8, the cutting completion point b
Is provided in the vicinity of the piercing point a to provide an uncut micro-joint portion c in the cutting path 8 to prevent the portion to be machined from falling so as to prevent collision with the machining head 10, and after completion of all machining, the micro-joint portion Micro joint processing is used to increase the recovery efficiency of the cutting work 9 by breaking c by an external force.
【０００５】[0005]
【発明が解決しようとする課題】ミクロジョイント部の
幅は、加工材料７の材質、板厚によっても異なるが、通
常 0.2〜 0.7mmの範囲で設定する。板厚が比較的薄い場
合は、ミクロジョイント部を破断すめためにさほどの力
を要しないが、板厚が６mmを超えるとかなりの力を必要
とするようになる。例えば、板厚６mmの軟鋼の場合、ミ
クロジョイント幅を 0.5mmとすると、ミクロジョイント
部を破断させるためには、 0.5×６×30＝90Kgの力が必
要となる。したがって、このように板厚が厚い場合はミ
クロジョイント部を破断させるためにハンマ―等でたた
いて破断させる必要があり、作業性が極めて悪くなると
共に、製品に無意味な外力を加え、歪みや変形を発生さ
せるという問題点があった。そこで本発明は、板厚が厚
い場合にも簡単にミクロジョイント部を破断することが
きるレ―ザ切断方法及びレ―ザ加工装置を提供すること
にある。The width of the micro joint portion is usually set in the range of 0.2 to 0.7 mm, although it varies depending on the material of the processing material 7 and the plate thickness. When the plate thickness is relatively thin, it does not require much force to break the micro joint portion, but when the plate thickness exceeds 6 mm, considerable force is required. For example, in the case of mild steel with a plate thickness of 6 mm, if the micro joint width is 0.5 mm, a force of 0.5 × 6 × 30 = 90 kg is required to break the micro joint. Therefore, when the plate thickness is large like this, it is necessary to hit it with a hammer or the like in order to break the micro joint part, which leads to extremely poor workability, and to add a meaningless external force to the product, resulting in distortion. However, there is a problem of causing deformation. Therefore, it is an object of the present invention to provide a laser cutting method and a laser processing apparatus capable of easily breaking the micro joint portion even when the plate thickness is large.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の発明は、
レ―ザ光による切断加工経路上に複数箇所のミクロジョ
イント部を形成するとともに、このミクロジョイント部
における板厚を他の部分よりも薄く加工するレ―ザ加工
方法である。The invention according to claim 1 is
This is a laser processing method in which a plurality of micro joint portions are formed on a cutting processing path by laser light and the plate thickness of the micro joint portions is processed thinner than other portions.
【０００７】請求項２記載の発明は、被加工物の板厚を
設定する板厚設定部を備え、この板厚設定部に設定され
た板厚が所定の厚さを越えた場合にミクロジョイント部
の板厚を他の部分よりも薄く加工するレ―ザ加工装置で
ある。According to a second aspect of the present invention, there is provided a plate thickness setting portion for setting the plate thickness of the workpiece, and the micro joint is used when the plate thickness set in the plate thickness setting portion exceeds a predetermined thickness. This is a laser processing device that processes the plate thickness of a part thinner than other parts.
【０００８】[0008]
【作用】請求項１記載のレ―ザ加工方法では、ミクロジ
ョイント部における板厚を他の部分よりも薄く加工す
る。In the laser processing method according to the first aspect of the present invention, the plate thickness in the micro joint portion is processed thinner than other portions.
【０００９】請求項２記載のレ―ザ加工装置では、被加
工物の板厚が所定の厚さを越えた場合には、加工制御装
置によりミクロジョイント部における板厚は非加工部よ
りも薄く加工される。In the laser processing apparatus according to the second aspect, when the plate thickness of the workpiece exceeds a predetermined thickness, the processing control device causes the plate thickness of the micro joint portion to be thinner than that of the non-processed portion. Is processed.
【００１０】[0010]
【実施例】本発明のレ―ザ加工装置の構成図を図１に示
す。従来の加工装置の構成機器に加え、材料，板厚に応
じたミクロジョイント部のスリット加工条件と、ミクロ
ジョイント部の加工を必要とする最低板厚及び加工する
板厚を入力する入力装置11とミクロジョイント部の加工
条件をデ―タベ―スとして記憶しておくと共に、加工す
る板厚を判断して、ミクロジョイント部の加工条件を付
加する制御装置12を追加したものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram of the laser processing apparatus of the present invention. In addition to the constituent devices of the conventional processing device, an input device 11 for inputting the slit processing conditions of the micro joint part according to the material and the plate thickness, the minimum plate thickness required to process the micro joint part, and the plate thickness to be processed. The machining conditions of the micro joint part are stored as a data base, and the control device 12 for adding the machining conditions of the micro joint part by judging the plate thickness to be machined is added.
【００１１】本発明の切断方法のフロ―図を図２に示
す。まず、ピアシング加工条件設定後ピアシング加工を
行ない、次に切断加工条件に設定変更し切断加工を行な
う。更に従来の切断完了点であったｂ点でスリット加工
条件に設定変更し、ミクロジョイント点ａまで加工を行
なう。図２は、本発明の切断方法における加工のタイム
チャ―トの一例を示している。０秒からｔ1 秒までがピ
アシング点ａの穴あけ加工を示しており、ｔ1 秒からｔ
2 秒までがａ→ｂの切断加工、ｔ2 秒からｔ3 秒までが
ミクロジョイント部ｃのスリット加工を示している。レ
―ザ出力、加工速度、加工ガスの種類等の加工条件を各
々で変化させている。A flow chart of the cutting method of the present invention is shown in FIG. First, after setting the piercing processing conditions, piercing processing is performed, and then the cutting processing conditions are changed to perform cutting processing. Further, at the point b, which is the conventional cutting completion point, the setting is changed to the slit processing conditions, and processing is performed up to the micro joint point a. FIG. 2 shows an example of a processing time chart in the cutting method of the present invention. From 0 seconds to t 1 seconds shows the drilling of the piercing point a, t from t 1 seconds
Up to 2 seconds shows cutting of a → b, and from t 2 to t 3 shows slitting of the micro joint part c. Processing conditions such as laser output, processing speed, and type of processing gas are changed for each.
【００１２】これより本発明の切断方法によれば、厚板
の切断においても図４（ａ）に示す切断加工に比べ、図
４（ｂ）に示すミクロジョイント部は断面積を減少させ
ることがきる。Therefore, according to the cutting method of the present invention, the cross-sectional area of the micro joint shown in FIG. 4 (b) can be reduced when cutting a thick plate as compared with the cutting process shown in FIG. 4 (a). Wear.
【００１３】次に、本発明のレ―ザ加工装置の作用につ
いて図５を用いて説明する。予め材料，板厚に応じたミ
クロジョイント部のスリット加工条件を入力装置11から
入力し、制御装置12にデ―タベ―ス化しておき、更に、
ミクロジョイント部のスリット加工を必要とする最低板
厚を入力装置11から入力し、制御装置12に記憶してお
く。レ―ザ加工を行なう際、入力装置11から加工する板
厚を入力することによって、制御装置12のデ―タ処理部
12ａでは、ミクロジョイント部のスリット加工を必要と
する板厚であれば、自動プログラミング装置６で作成さ
れたＮＣプログラムをＮＣ加工プログラム記憶部12ｂか
ら取り込みスリット条件デ―タ記憶部12ｃからのスリッ
ト加工条件を付加してＮＣプログラム出力装置12ｄを介
してＮＣ装置に出力し、必要としない板厚の場合はその
ままＮＣ装置に出力する。Next, the operation of the laser processing apparatus of the present invention will be described with reference to FIG. The slitting conditions of the micro joint portion according to the material and the plate thickness are input from the input device 11 in advance, and the control device 12 is made into a database, and further,
The minimum plate thickness that requires slitting of the micro joint is input from the input device 11 and stored in the control device 12. When performing laser processing, by inputting the plate thickness to be processed from the input device 11, the data processing unit of the control device 12
In the case of 12a, if the plate thickness requires slit machining of the micro joint part, the NC program created by the automatic programming device 6 is taken in from the NC machining program memory 12b and the slit machining from the slit condition data memory 12c is performed. The conditions are added to output to the NC device through the NC program output device 12d, and when the plate thickness is not required, it is output to the NC device as it is.
【００１４】以上説明した通り本発明の実施例の切断方
法によれば、厚板の切断においてもミクロジョイント部
の断面積を減少することができ、薄板と同様に簡単に切
断ワ―クを取り外すことができる。また、本発明の実施
例の加工装置よれば、加工する板厚を入力するだけで、
簡単に本実施例の切断方法に則したＮＣプログラムを作
成することができる。尚、入力装置11、制御装置12の機
能を自動プログラミング装置６や操作卓１に組み込んで
も良い。As described above, according to the cutting method of the embodiment of the present invention, the cross-sectional area of the micro joint can be reduced even when cutting a thick plate, and the cutting work can be easily removed similarly to the thin plate. be able to. Further, according to the processing apparatus of the embodiment of the present invention, simply by inputting the plate thickness to be processed,
An NC program that complies with the cutting method of this embodiment can be easily created. The functions of the input device 11 and the control device 12 may be incorporated in the automatic programming device 6 or the console 1.
【００１５】[0015]
【発明の効果】以上説明したように、本発明によれば、
薄板であっても厚板であってもミクロジョイント加工を
行なって加工ヘッドとの衝突を防止でき、しかも、ミク
ロジョイント部を簡単に破断することができるため、歪
みや変形を発生させることなく切断ワ―クの回収効率を
高めることができ、生産効率が向上する。As described above, according to the present invention,
Both thin and thick plates can be micro-jointed to prevent collisions with the processing head, and the micro-jointed part can be easily broken to cut without causing distortion or deformation. Work recovery efficiency can be increased and production efficiency improved.
【図１】本発明の加工装置の構成図FIG. 1 is a block diagram of a processing apparatus of the present invention.
【図２】本発明の切断方法のフロ―図FIG. 2 is a flow chart of the cutting method of the present invention.
【図３】本発明の切断方法のタイムチャ―トFIG. 3 is a time chart of the cutting method of the present invention.
【図４】ミクロジョイント部の断面図FIG. 4 is a sectional view of a micro joint part.
【図５】制御装置のブロック図FIG. 5 is a block diagram of a control device.
【図６】従来の加工装置の全体構成図FIG. 6 is an overall configuration diagram of a conventional processing apparatus
【図７】従来の加工装置の制御ブロック図FIG. 7 is a control block diagram of a conventional processing apparatus.
【図８】切断経路図FIG. 8: Cutting route map
【図９】従来の切断方法のフロ―図FIG. 9: Flow chart of conventional cutting method
【図１０】切断ワ―クと加工ヘッドが干渉する状態を示
した図FIG. 10 is a diagram showing a state where the cutting work and the processing head interfere with each other.
１…操作卓 ２…レ―ザ発振器 ３…レ―ザ制御装置 ４…レ―ザ加工機 ５…ＮＣ装置 ６…自動プログラミング装置 ７…加工材料 ８…切断経路 ９…切断ワ―ク 10…加工ヘッド 11…入力装置 12…制御装置 13…冷却装置 14…ドライエア供給装置 15…加工ガス供給装置 1 ... Operation console 2 ... Laser oscillator 3 ... Laser control device 4 ... Laser processing machine 5 ... NC device 6 ... Automatic programming device 7 ... Processing material 8 ... Cutting path 9 ... Cutting work 10 ... Machining Head 11 ... Input device 12 ... Control device 13 ... Cooling device 14 ... Dry air supply device 15 ... Processing gas supply device
Claims (2)
被加工物上の所定の位置に照射して切断を行なうレ―ザ
加工方法において、 レ―ザ光による切断加工経路上に複数箇所のミクロジョ
イント部を形成するとともに、このミクロジョイント部
における板厚を非加工部よりも薄く加工することを特徴
とするレ―ザ加工方法。1. A laser processing method for irradiating a predetermined position on a workpiece with laser light output from a laser oscillator to perform cutting, wherein a laser beam cutting processing path is provided. A laser processing method characterized in that a plurality of micro joint portions are formed, and a plate thickness of the micro joint portions is processed thinner than that of a non-processed portion.
被加工物上の所定の位置に照射して切断を行なうレ―ザ
加工装置において、 被加工物の板厚を設定する板厚設定部と、この板厚設定
部に設定された板厚が所定の厚さを越えた場合にミクロ
ジョイント部における板厚を非加工部よりも薄く加工す
る加工制御装置とを具備することを特徴とするレ―ザ加
工装置。2. A laser processing apparatus for irradiating a predetermined position on a workpiece with laser light output from a laser oscillator to perform cutting, and a plate for setting a plate thickness of the workpiece. And a machining control device for machining the plate thickness in the micro joint part thinner than the non-machined part when the plate thickness set in the plate thickness setting part exceeds a predetermined thickness. Characterized laser processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4343003A JPH06190576A (en) | 1992-12-24 | 1992-12-24 | Method and machine for laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4343003A JPH06190576A (en) | 1992-12-24 | 1992-12-24 | Method and machine for laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06190576A true JPH06190576A (en) | 1994-07-12 |
Family
ID=18358189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4343003A Pending JPH06190576A (en) | 1992-12-24 | 1992-12-24 | Method and machine for laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06190576A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716667A (en) * | 1993-07-06 | 1995-01-20 | Amada Co Ltd | Work working method |
| JP2005014009A (en) * | 2003-06-24 | 2005-01-20 | Amada Co Ltd | Workpiece cutting method |
| JP2008200712A (en) * | 2007-02-20 | 2008-09-04 | Fanuc Ltd | Method and apparatus for laser beam machining |
| JP2013507253A (en) * | 2009-10-08 | 2013-03-04 | トモロジック アーベー | Control rules and variables for cutting |
| JP2013176807A (en) * | 2013-05-02 | 2013-09-09 | Mitsubishi Electric Corp | Laser processing apparatus, laser processing method and sheet metal member |
| KR20140052993A (en) * | 2011-04-07 | 2014-05-07 | 토모로직 에이비 | Method of, system and computer program for machine cutting several parts of a piece of material using controlling rules and variables for cutting |
| JP2015522855A (en) * | 2012-06-27 | 2015-08-06 | 三菱電機株式会社 | Evaluation method and laser cutting machine |
| WO2017134964A1 (en) * | 2016-02-05 | 2017-08-10 | 村田機械株式会社 | Laser processing machine and laser processing method |
| WO2019025327A2 (en) | 2017-08-02 | 2019-02-07 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for laser cutting flat workpieces and related computer program product |
| CN111014981A (en) * | 2019-12-26 | 2020-04-17 | 中山市品尚激光科技有限公司 | Processing walking method of laser equipment |
| KR102506881B1 (en) * | 2022-10-24 | 2023-03-07 | 주식회사 조호레이저 | Laser Cutting Method |
| DE102021123520A1 (en) | 2021-09-10 | 2023-03-16 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for cutting out at least one workpiece from a metal sheet |
| DE102022125138A1 (en) | 2022-09-29 | 2024-04-04 | TRUMPF Werkzeugmaschinen SE + Co. KG | Method for laser cutting plate-shaped workpieces and associated computer program product |
| WO2024070449A1 (en) * | 2022-09-28 | 2024-04-04 | 株式会社アマダ | Layout data creating device, layout data creating method, and laser cutting method |
-
1992
- 1992-12-24 JP JP4343003A patent/JPH06190576A/en active Pending
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716667A (en) * | 1993-07-06 | 1995-01-20 | Amada Co Ltd | Work working method |
| JP2005014009A (en) * | 2003-06-24 | 2005-01-20 | Amada Co Ltd | Workpiece cutting method |
| JP4605690B2 (en) * | 2003-06-24 | 2011-01-05 | 株式会社アマダ | Work cutting method |
| JP2008200712A (en) * | 2007-02-20 | 2008-09-04 | Fanuc Ltd | Method and apparatus for laser beam machining |
| JP2013507253A (en) * | 2009-10-08 | 2013-03-04 | トモロジック アーベー | Control rules and variables for cutting |
| US9108272B2 (en) | 2009-10-08 | 2015-08-18 | Tomologic Ab | Controlling rules and variables for cutting |
| KR101866605B1 (en) * | 2011-04-07 | 2018-06-11 | 토모로직 에이비 | Method of, system and computer program for machine cutting several parts of a piece of material using controlling rules and variables for cutting |
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