CN111014981A - Processing walking method of laser equipment - Google Patents
Processing walking method of laser equipment Download PDFInfo
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- CN111014981A CN111014981A CN201911362756.XA CN201911362756A CN111014981A CN 111014981 A CN111014981 A CN 111014981A CN 201911362756 A CN201911362756 A CN 201911362756A CN 111014981 A CN111014981 A CN 111014981A
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- cutting
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- line segment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a processing method of laser equipment, which comprises the following steps: calibrating a cutting track path; calibrating a cutting track path on the workpiece according to the cutting requirement of the workpiece; predicting the weight of the cutting block, and predicting the weight of the cutting block; determining a reserved line segment on a cutting track path according to the weight prediction of the cutting block; planning an annular cutting path, and planning the annular cutting path according to the cutting track path and the reserved line segment; cutting the reserved line segment rapidly and in a high-strength manner, and cutting off the cutting block; the calibration of the cutting trajectory path comprises the following steps: according to the cutting requirement of the workpiece, a cutting track path is drawn on the workpiece; the invention provides a processing walking method of laser equipment, aiming at workpiece laser cutting, a reserved line segment is arranged to conduct laser cutting on a path except a reserved line segment external cutting track, finally, the reserved line segment is cut by high-intensity laser rapidly, a cutting block is cut, the cutting block can be well supported on the workpiece before being cut, and accidents caused by cutting separation are not easy to happen.
Description
Technical Field
The invention belongs to the technical field of laser cutting, and particularly relates to a processing method of laser equipment.
Background
Laser cutting uses a high energy density laser beam to heat a workpiece, causing the temperature to rise rapidly, reaching the boiling point of the material in a very short time, the material begins to vaporize, forming a vapor. These vapors are ejected at a high speed, and a slit is formed in the material at the same time as the vapor is ejected. With the continuous development of the storage tank industry, more and more industries and enterprises apply laser cutting, more and more enterprises enter the storage tank industry, but due to the fact that the cost of subsequent process treatment is reduced, the equipment is feasible to be adopted in large-scale production.
Laser cutting can be divided into four categories, namely laser vaporization cutting, laser melting cutting, laser oxygen cutting and laser scribing and fracture control. Folding laser vaporization cutting: the workpiece is heated by a high energy density laser beam, the temperature rises rapidly, the boiling point of the material is reached in a very short time, the material starts to vaporize, and vapor is formed. These vapors are ejected at a high speed, and a slit is formed in the material at the same time as the vapor is ejected. The heat of vaporization of materials is generally large, so that laser vaporization cutting requires a large power and power density. Laser vaporization cutting is widely used for cutting extremely thin metal materials and non-metal materials (such as paper, cloth, wood, plastics, rubber and the like). In the folded laser fusion cutting, a metal material is melted by laser heating, and then a non-oxidizing gas (Ar, He, N, etc.) is blown through a nozzle coaxial with a beam, so that a liquid metal is discharged by a strong pressure of the gas to form a slit. Laser fusion cutting does not require complete vaporization of the metal, and the only energy required is 1/10 for vaporization cutting. The laser melting cutting is mainly used for cutting some materials or active metals which are not easy to oxidize, such as stainless steel, titanium, aluminum and alloys thereof. Folding laser oxygen cutting: the laser oxygen cutting principle is similar to the oxyacetylene cutting. It uses laser as preheating heat source and active gas such as oxygen as cutting gas. The blown gas reacts with the cutting metal to cause an oxidation reaction and release a large amount of oxidation heat, and blows the molten oxide and the melt out of the reaction zone to form a cut in the metal. Because of the oxidation reaction during cutting, the energy required for laser oxygen cutting is only 1/2 of melting cutting, and the cutting speed is far higher than that of laser vaporization cutting and melting cutting;
the laser oxygen cutting is mainly used for easily oxidized metal materials such as carbon steel, titanium steel, heat treatment steel and the like, but in the existing laser cutting process, a cutting block can be affected by thermal deformation before cutting and can not be well supported on a workpiece, and cutting separation is easy to occur to cause accidents; the solution needs to add a clamp at the cutting end, the structure is complex, and inconvenience is caused, so the inventor provides a processing method of laser equipment by integrating various factors.
Disclosure of Invention
The invention aims to: in order to solve the technical problems related to the background technology, a processing method of laser equipment is provided.
The technical scheme adopted by the invention is as follows:
a method of processing a laser device, comprising the steps of:
s1, calibrating a cutting track path; calibrating a cutting track path on the workpiece according to the cutting requirement of the workpiece;
s2, cutting block weight prediction, and performing weight prediction on the cutting block;
s3, determining a reserved line segment on the cutting track path according to the weight prediction of the cutting block;
s4, planning a circular cutting path, and planning the circular cutting path according to the cutting track path and the reserved line segment;
and S5, cutting the reserved line segment with high speed and high strength, and cutting off the cutting block.
Wherein the step of calibrating the cutting track path in S1 includes the steps of:
s101, according to the cutting requirements of the workpiece, a cutting track path is drawn on the workpiece;
s102, metal strips are pasted on two sides of a cutting track path on a workpiece,
and S103, an ink layer is arranged between the metal strip and the workpiece.
Wherein, the weight prediction of the cutting block in the S2 comprises the following steps:
s201, establishing a cutting block model according to a cutting track path;
s202, calculating the weight of the cutting block according to the cutting block model to obtain the weight of the cutting block;
and S203, carrying out proportional amplification on the weight of the cutting block to obtain the weight of the dynamic cutting block.
Wherein, in the step S3, the step of determining the reserved line segment on the cutting track path according to the weight prediction of the cutting block includes the following steps: s301, obtaining the width of a cutting track path;
s302, the length and the position of the reserved line segment are predicted and determined according to the path width and the weight of the cutting block.
Wherein, planning the annular cutting path in S4, and planning the annular cutting path according to the cutting trajectory path and the reserved line segment includes the following steps:
s401, calculating key nodes in a cutting track according to the cutting track path and the laser cutting dynamic parameters;
s402, determining the key node sequence in the cutting track;
and S403, sequentially connecting the key nodes to form a circumferential cutting path.
Wherein, in the step S5, cutting the reserved line segment with high speed and high strength, the step of cutting off the cutting block includes the following steps:
s501, checking whether all cutting paths except a reserved line segment are cut off or not in a cutting track path;
s502, determining whether secondary routing cutting along the circular cutting path is needed or not according to the detection result in the S501;
and S503, improving laser cutting parameters, cutting the reserved line segment rapidly and in a high-strength manner, and cutting off the cutting block.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the invention provides a processing method of laser equipment, which creatively aims at the laser cutting of a workpiece, sets a reserved line segment to conduct the laser cutting on a path except the reserved line segment and externally cuts a cutting track, and finally quickly cuts the reserved line segment by high-intensity laser to cut off a cutting block, so that the cutting block can be well supported on the workpiece before cutting off, and accidents caused by separation of the cutting block are not easy to happen;
2. the invention further relates to a method for calibrating the cutting track path, which comprises the following steps: according to the cutting requirement of the workpiece, a cutting track path is drawn on the workpiece; metal strips are adhered to two sides of a cutting track path on a workpiece, and an ink layer is arranged between the metal strips and the workpiece; utilize the metal strip to protect the cutting block edge, improve cutting effect, be provided with the printing ink layer simultaneously between metal strip and work piece, be convenient for follow-up metal block of getting rid of.
3. The invention further discloses a method for determining a reserved line segment on a cutting track path according to the weight prediction of the cutting block, which comprises the following steps: obtaining the width of a cutting track path; and the length and the position of the reserved line segment are predicted and determined according to the path width and the weight of the cutting block, so that the length and the position of the reserved line segment can be accurately determined.
4. The invention further relates to a method for cutting the reserved line segment rapidly and in high strength, wherein the cutting block truncation comprises the following steps: checking whether all the cutting paths except the reserved line segments are cut off or not; determining whether secondary routing cutting along the circular cutting path is needed according to the checking result in the S501; and laser cutting parameters are improved, the reserved line segment is cut rapidly and high-strength, and the cutting block is cut off.
Drawings
FIG. 1 is a schematic flow chart of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a machining pass of a laser apparatus includes the steps of:
s1, calibrating a cutting track path; calibrating a cutting track path on the workpiece according to the cutting requirement of the workpiece;
s2, cutting block weight prediction, and performing weight prediction on the cutting block;
s3, determining a reserved line segment on the cutting track path according to the weight prediction of the cutting block;
s4, planning a circular cutting path, and planning the circular cutting path according to the cutting track path and the reserved line segment;
and S5, cutting the reserved line segment with high speed and high strength, and cutting off the cutting block.
Wherein the step of calibrating the cutting track path in S1 includes the steps of:
s101, according to the cutting requirements of the workpiece, a cutting track path is drawn on the workpiece;
s102, metal strips are pasted on two sides of a cutting track path on a workpiece,
and S103, an ink layer is arranged between the metal strip and the workpiece.
Wherein, the weight prediction of the cutting block in the S2 comprises the following steps:
s201, establishing a cutting block model according to a cutting track path;
s202, calculating the weight of the cutting block according to the cutting block model to obtain the weight of the cutting block;
and S203, carrying out proportional amplification on the weight of the cutting block to obtain the weight of the dynamic cutting block.
Wherein, in the step S3, the step of determining the reserved line segment on the cutting track path according to the weight prediction of the cutting block includes the following steps: s301, obtaining the width of a cutting track path;
s302, the length and the position of the reserved line segment are predicted and determined according to the path width and the weight of the cutting block.
Wherein, planning the annular cutting path in S4, and planning the annular cutting path according to the cutting trajectory path and the reserved line segment includes the following steps:
s401, calculating key nodes in a cutting track according to the cutting track path and the laser cutting dynamic parameters;
s402, determining the key node sequence in the cutting track;
and S403, sequentially connecting the key nodes to form a circumferential cutting path.
Wherein, in the step S5, cutting the reserved line segment with high speed and high strength, the step of cutting off the cutting block includes the following steps:
s501, checking whether all cutting paths except a reserved line segment are cut off or not in a cutting track path;
s502, determining whether secondary routing cutting along the circular cutting path is needed or not according to the detection result in the S501;
and S503, improving laser cutting parameters, cutting the reserved line segment rapidly and in a high-strength manner, and cutting off the cutting block.
The working principle is as follows: the invention provides a processing method of laser equipment, which creatively aims at the laser cutting of a workpiece, sets a reserved line segment to conduct the laser cutting on a path except the reserved line segment and externally cuts a cutting track, and finally quickly cuts the reserved line segment by high-intensity laser to cut off a cutting block, so that the cutting block can be well supported on the workpiece before cutting off, and accidents caused by separation of the cutting block are not easy to happen; the invention further relates to a method for calibrating the cutting track path, which comprises the following steps: according to the cutting requirement of the workpiece, a cutting track path is drawn on the workpiece; metal strips are adhered to two sides of a cutting track path on a workpiece, and an ink layer is arranged between the metal strips and the workpiece; utilize the metal strip to protect the cutting block edge, improve cutting effect, be provided with the printing ink layer simultaneously between metal strip and work piece, be convenient for follow-up metal block of getting rid of. The invention further discloses a method for determining a reserved line segment on a cutting track path according to the weight prediction of the cutting block, which comprises the following steps: obtaining the width of a cutting track path; and the length and the position of the reserved line segment are predicted and determined according to the path width and the weight of the cutting block, so that the length and the position of the reserved line segment can be accurately determined. The invention further relates to a method for cutting the reserved line segment rapidly and in high strength, wherein the cutting block truncation comprises the following steps: checking whether all the cutting paths except the reserved line segments are cut off or not; determining whether secondary routing cutting along the circular cutting path is needed or not according to the inspection result; and laser cutting parameters are improved, the reserved line segment is cut rapidly and high-strength, and the cutting block is cut off.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A machining method of a laser device is characterized in that: the method comprises the following steps:
s1, calibrating a cutting track path; calibrating a cutting track path on the workpiece according to the cutting requirement of the workpiece;
s2, cutting block weight prediction, and performing weight prediction on the cutting block;
s3, determining a reserved line segment on the cutting track path according to the weight prediction of the cutting block;
s4, planning a circular cutting path, and planning the circular cutting path according to the cutting track path and the reserved line segment;
and S5, cutting the reserved line segment with high speed and high strength, and cutting off the cutting block.
2. A process kit for a laser apparatus as claimed in claim 1, wherein: the step of marking the cutting track path in the step S1 includes the following steps:
s101, according to the cutting requirements of the workpiece, a cutting track path is drawn on the workpiece;
s102, metal strips are pasted on two sides of a cutting track path on a workpiece,
and S103, an ink layer is arranged between the metal strip and the workpiece.
3. A process kit for a laser apparatus as claimed in claim 2, wherein: and predicting the weight of the cutting block in the S2, wherein the predicting the weight of the cutting block comprises the following steps:
s201, establishing a cutting block model according to a cutting track path;
s202, calculating the weight of the cutting block according to the cutting block model to obtain the weight of the cutting block;
and S203, carrying out proportional amplification on the weight of the cutting block to obtain the weight of the dynamic cutting block.
4. A process kit for a laser apparatus as claimed in claim 3, wherein: in S3, determining the reserved line segment on the cutting trajectory path according to the weight prediction of the cutting block includes the following steps: s301, obtaining the width of a cutting track path;
s302, the length and the position of the reserved line segment are predicted and determined according to the path width and the weight of the cutting block.
5. A method of processing a laser device according to claim 4, characterized by: planning a circular cutting path in the step S4, wherein the planning of the circular cutting path according to the cutting path and the reserved line segment includes the following steps:
s401, calculating key nodes in a cutting track according to the cutting track path and the laser cutting dynamic parameters;
s402, determining the key node sequence in the cutting track;
and S403, sequentially connecting the key nodes to form a circumferential cutting path.
6. A method of processing a laser device according to claim 5, characterized by: in the step S5, cutting the reserved line segment with high speed and high strength, the cutting block truncation step includes:
s501, checking whether all cutting paths except a reserved line segment are cut off or not in a cutting track path;
s502, determining whether secondary routing cutting along the circular cutting path is needed or not according to the detection result in the S501;
and S503, improving laser cutting parameters, cutting the reserved line segment rapidly and in a high-strength manner, and cutting off the cutting block.
7. A laser machining system employing the machining pass of a laser apparatus of any one of claims 1 to 6.
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| CN201911362756.XA CN111014981B (en) | 2019-12-26 | 2019-12-26 | Processing walking method of laser equipment |
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| CN201911362756.XA CN111014981B (en) | 2019-12-26 | 2019-12-26 | Processing walking method of laser equipment |
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| CN110369816A (en) * | 2019-07-12 | 2019-10-25 | 大连理工大学 | A kind of process of the small serpentine spring of Wire EDM |
| CN110497092A (en) * | 2019-08-15 | 2019-11-26 | 大连理工大学 | A kind of laser processing of low sidewall cone angle blind slot |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06190576A (en) * | 1992-12-24 | 1994-07-12 | Toshiba Corp | Method and machine for laser beam machine |
| US5641416A (en) * | 1995-10-25 | 1997-06-24 | Micron Display Technology, Inc. | Method for particulate-free energy beam cutting of a wafer of die assemblies |
| CN107755904A (en) * | 2013-03-21 | 2018-03-06 | 康宁激光技术有限公司 | By the device and method of laser cutting profile from flat substrate |
| CN104014939A (en) * | 2014-06-11 | 2014-09-03 | 沈阳飞机工业（集团）有限公司 | Titanium alloy skin laser cutting method based on flexible supporting device |
| US20170297323A1 (en) * | 2016-04-15 | 2017-10-19 | Machine Tool Technologies Research Foundation | Method for generating control data, data processing device, machine tool, and program |
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Address after: No.5 Shuixian street, Tong'an village, Dongfeng Town, Zhongshan City, Guangdong Province Applicant after: Zhongshan pinshang Laser Technology Co.,Ltd. Address before: 528425 No.5, Shuixian street, Tong'an village, Dongfeng Town, Zhaoqing City, Guangdong Province Applicant before: Zhongshan pinshang Laser Technology Co.,Ltd. |
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