JPS5945092A - Laser working device - Google Patents
Laser working deviceInfo
- Publication number
- JPS5945092A JPS5945092A JP57154794A JP15479482A JPS5945092A JP S5945092 A JPS5945092 A JP S5945092A JP 57154794 A JP57154794 A JP 57154794A JP 15479482 A JP15479482 A JP 15479482A JP S5945092 A JPS5945092 A JP S5945092A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- work
- water
- liquid
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はレーデ光によって破卵」7物に切断、穿孔など
を行うレーザ加工装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing device for cutting, perforating, etc. into broken eggs using Rede light.
従来のレーザ加工機はレーデ亀の核力11工物′\の照
射点近傍に叡化ガスもしく [=J二不活性ガスヶ噴出
せしめ加工を行つ−Cいる。ごのように被加工l吻の加
工点近傍にJfスを噴出ぜ[7めるのはレーザエネルギ
によって刀11熱+谷f:独した被)JI+工゛1勿が
そのままr+i r並冷却凝固しないように、1貝出ガ
スの物理的圧力によって溶融物を飛散せしめて残さない
ためである。なお、酸化ガスは高温で物理作用の他に化
学作用を生じ溶融効率を向上させる。Conventional laser machining machines perform machining by ejecting silica gas or inert gas near the irradiation point of the laser beam. Spray Jf gas near the processing point of the proboscis of the workpiece as shown in the figure. This is to prevent the molten material from being scattered by the physical pressure of the gas released from one shell and not remaining behind. Note that the oxidizing gas causes chemical action in addition to physical action at high temperatures to improve melting efficiency.
し〃)しながら、従来のレーザ刀11 二c +nによ
ると加工時にガスを必要とし、ガスコスト定必要とする
こと、又、ガスゼンベを・必要とし″こ場所をとり、保
(′J゛に困8116がともなうこと、更に加工作業に
ともなうガスの断続を必要とし、ガス制御系が必要とな
ることなど実用上好ましくない点が存在する。However, the conventional laser knife 11 2c +n requires gas during processing, which requires a fixed gas cost, and also requires a gas assembly, which takes up a lot of space and is difficult to maintain. In addition, there are disadvantages in practical use, such as the fact that the process is accompanied by problems 8116, and that gas must be interrupted and disconnected during processing operations, and a gas control system is required.
又、従来のレージ1加工機ではレーザ光に対する表面反
射率の高い被の11工物や、熱伝導率の高い被加工物の
加工が著しく困難てわυ、二酸化炭素レーザでは朔、銅
、アルミニウム、金などの用1工は不可能とされている
。In addition, with the conventional Laser 1 processing machine, it is extremely difficult to process workpieces with high surface reflectance to the laser beam and workpieces with high thermal conductivity. It is said that it is impossible to work with gold, etc.
本発明は上記の手情に鑑み一〇なされたもので、レーザ
光の被加工物への照射位置に液体をイf在せしめ、レー
デ照射時の液体の爆)6的気化作用によっで破卵」7物
を加−[することにより、加工効率を向上し得、且つ9
!n」反射率の高い核力11工物や熱伝2序率の高い
被加工物の加1..k 容易にし得るレーザ加]二装置
f:提供−f /、、 ことを目的とする。The present invention has been made in view of the above-mentioned circumstances, and consists of making a liquid exist at the position where the workpiece is irradiated with the laser beam, and causing the liquid to explode due to the vaporization action of the liquid during laser irradiation. By adding 7 things like eggs, processing efficiency can be improved, and 9
! n'' Nuclear force with high reflectance 11 Workpieces with high heat transfer rate 1. .. The purpose of the present invention is to provide a laser beam that can be easily applied to a laser beam.
以下図面を参照して本発明の一″−J、!:施例を詳細
に説明する。図面は=おいで、IQ;J、レージ4発振
器、2 rヨV −−IJ’ビーム、3は波力11工′
I勿、4 (d、 、4?ンプ、5は液体である。即ち
、レーザ元振器1より射出されたレーザビーム2は被加
工物30所定位置に照射される。この破卵」:′吻3の
レーデビーム照射位置又はその近傍にp」、 +j?7
グ4より液体5が供給される。前記液体5はレーザ光を
よく吸収するものが適当であっで、レージ9として二r
浚化炭素レーザを用いるときは水が適当でるる。Embodiments of the present invention will be described below in detail with reference to the drawings. Force 11 k'
Of course, 4 (d, , 4, 5 are liquids. That is, the laser beam 2 emitted from the laser source 1 is irradiated to a predetermined position on the workpiece 30. p'' at or near the Rade beam irradiation position of proboscis 3, +j?7
A liquid 5 is supplied from the pipe 4. The liquid 5 is suitably one that absorbs laser light well, and the laser beam 9 is 2r.
When using a dredged carbon laser, water is produced appropriately.
而して、レーザエネルギを液体が吸収するとその部位(
こおいて爆発的に気化−Jるりで、その物理的圧力は極
めて太きい。その爆発力によって被加工物3を加工し溶
融物を飛散ゼしめる。従って、被加工l吻がレーデ難力
l工性、リアルミニウム等であっても本装置を用いれば
容易に〕n+工することができるもの−Cあり、液体の
爆発的気化圧力による加IC6る〃)ら被加工物の表面
性グ′↓は加工能力に熱間1糸となる。Therefore, when the liquid absorbs the laser energy, the area (
At this point, it vaporizes explosively, and the physical pressure is extremely strong. The workpiece 3 is processed by the explosive force, and the molten material is scattered and liquefied. Therefore, even if the workpiece is difficult to machine, real aluminum, etc., it can be easily machined using this device, and there are IC6 types that can be machined using the explosive vaporization pressure of the liquid. 〃) The surface properties of the workpiece G'↓ correspond to the hot processing ability.
なお、上記実施クリでtよ液体をボンノ炉ら射出するよ
うに例示したが、被加工物の衣間に液体が存在すれはよ
いのであって、液体の塗布、滴ド、流F寺のt成体供給
装置を用いることができる。In addition, in the above-mentioned implementation example, the liquid was injected from the furnace at t, but it is fine for the liquid to exist between the coatings of the workpiece. An adult feeding device can be used.
以」二述べたよりに本発明によれば、レーデ光の被加工
物への照射位i(tに液体を存在ぜしめ、1/ 、す
°光、照射時の液体の爆発的気化作用によって被7JO
工物を加工することによp1表面反射率の高い被加工物
や熱伝導率の高い破卵」−物の加工葡容易にできる。又
、ガスの使用と異って水などの液体の使用は極めて容易
で、コスI・もほとんど増大せず工業上の利便は著しく
大である。As described above, according to the present invention, a liquid is present at the irradiation position i (t) of the Rede light onto the workpiece, and the amount of light is 1/, which is exposed to the explosive vaporization of the liquid during irradiation. 7JO
By processing the workpiece, it is possible to easily process workpieces with high surface reflectance or cracked objects with high thermal conductivity. Furthermore, unlike the use of gas, the use of liquids such as water is extremely easy, and the cost I• hardly increases, making it extremely convenient for industrial use.
図面eよ本発明の一実施15’!lを示す構成説明図で
ある。
J・・・レージ’ 発振a 、2・・L、/ jJ’
i;−ム、3・・・被加工I[す、4・・・パ?7)
、5・・・液体、。Drawing e, one embodiment of the present invention 15'! FIG. J...Rage' Oscillation a, 2...L, / jJ'
i;-mu, 3...workpiece I [su, 4...pa? 7)
,5...Liquid.
Claims (2)
振器と、前記被加工物のレーザ照射位置に液体全存在せ
しめる液体供給装置とを具11iiiすることを特徴と
するレーザ加工装屑3゜(1) Laser processing equipment 3゜ characterized by comprising a laser V9 oscillator that irradiates a workpiece with a laser beam, and a liquid supply device that makes all the liquid exist at the laser irradiation position of the workpiece.
射光を用い、液体として水を用いること全特徴とする特
許請求の範囲jJ 1項記載のレーザ加工装置0(2) The laser processing apparatus 0 according to claim jJ, which is characterized in that the emitted light of 21 fluoride carbon + C lede is used as the laser beam and water is used as the liquid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57154794A JPS5945092A (en) | 1982-09-06 | 1982-09-06 | Laser working device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57154794A JPS5945092A (en) | 1982-09-06 | 1982-09-06 | Laser working device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5945092A true JPS5945092A (en) | 1984-03-13 |
Family
ID=15592034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57154794A Pending JPS5945092A (en) | 1982-09-06 | 1982-09-06 | Laser working device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5945092A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997007928A3 (en) * | 1995-08-31 | 1997-04-17 | Biolase Tech Inc | User programmable combination of atomized particles for electromagnetically induced cutting |
US5785521A (en) * | 1995-08-31 | 1998-07-28 | Biolase Technology, Inc. | Fluid conditioning system |
WO1998033623A1 (en) * | 1997-02-05 | 1998-08-06 | Biolase Technology, Inc. | Electromagnetically induced cutter with shaped fluid particles |
US5968037A (en) * | 1995-08-31 | 1999-10-19 | Biolase Technology, Inc. | User programmable combination of atomized particles for electromagnetically induced cutting |
US6288499B1 (en) | 1997-06-12 | 2001-09-11 | Biolase Technology, Inc. | Electromagnetic energy distributions for electromagnetically induced mechanical cutting |
EP0916442A3 (en) * | 1997-11-12 | 2001-10-24 | Laser- und Medizin-Technologie GmbH Berlin | Process and device for removal of surface layer |
JP2004247426A (en) * | 2003-02-12 | 2004-09-02 | Inst Of Research & Innovation | Laser dicing apparatus |
JP2007528239A (en) * | 1995-08-31 | 2007-10-11 | バイオレーズ テクノロジー インコーポレイテッド | Tissue removal apparatus and method |
US7320594B1 (en) | 1995-08-31 | 2008-01-22 | Biolase Technology, Inc. | Fluid and laser system |
US7630420B2 (en) | 2004-07-27 | 2009-12-08 | Biolase Technology, Inc. | Dual pulse-width medical laser |
JP2010017864A (en) * | 2008-07-08 | 2010-01-28 | Japan Drilling Co Ltd | Rock processing method using laser beam and its apparatus |
US7970030B2 (en) | 2004-07-27 | 2011-06-28 | Biolase Technology, Inc. | Dual pulse-width medical laser with presets |
US8033825B2 (en) | 1995-08-31 | 2011-10-11 | Biolase Technology, Inc. | Fluid and pulsed energy output system |
JP2016117078A (en) * | 2014-12-19 | 2016-06-30 | 三菱重工業株式会社 | Laser cutting method |
JP2017533537A (en) * | 2014-09-12 | 2017-11-09 | 東莞新能源科技有限公司Dongguan Amperex Technology Limited | Pole piece coating removal equipment |
-
1982
- 1982-09-06 JP JP57154794A patent/JPS5945092A/en active Pending
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007528239A (en) * | 1995-08-31 | 2007-10-11 | バイオレーズ テクノロジー インコーポレイテッド | Tissue removal apparatus and method |
EP0847319A2 (en) | 1995-08-31 | 1998-06-17 | Biolase Technology, Inc. | User programmable combination of atomized particles for electromagnetically induced cutting |
US5785521A (en) * | 1995-08-31 | 1998-07-28 | Biolase Technology, Inc. | Fluid conditioning system |
US5968037A (en) * | 1995-08-31 | 1999-10-19 | Biolase Technology, Inc. | User programmable combination of atomized particles for electromagnetically induced cutting |
WO1997007928A3 (en) * | 1995-08-31 | 1997-04-17 | Biolase Tech Inc | User programmable combination of atomized particles for electromagnetically induced cutting |
US8033825B2 (en) | 1995-08-31 | 2011-10-11 | Biolase Technology, Inc. | Fluid and pulsed energy output system |
US7696466B2 (en) | 1995-08-31 | 2010-04-13 | Biolase Technology, Inc. | Electromagnetic energy distributions for electromagnetically induced mechanical cutting |
US6610053B1 (en) | 1995-08-31 | 2003-08-26 | Biolase Technology, Inc. | Methods of using atomized particles for electromagnetically induced cutting |
US7320594B1 (en) | 1995-08-31 | 2008-01-22 | Biolase Technology, Inc. | Fluid and laser system |
WO1998033623A1 (en) * | 1997-02-05 | 1998-08-06 | Biolase Technology, Inc. | Electromagnetically induced cutter with shaped fluid particles |
US6288499B1 (en) | 1997-06-12 | 2001-09-11 | Biolase Technology, Inc. | Electromagnetic energy distributions for electromagnetically induced mechanical cutting |
US6419996B2 (en) | 1997-11-12 | 2002-07-16 | Laser-Und Medizin-Technologie Ggmbh | Laser-supported process for cleaning a surface |
EP0916442A3 (en) * | 1997-11-12 | 2001-10-24 | Laser- und Medizin-Technologie GmbH Berlin | Process and device for removal of surface layer |
JP2004247426A (en) * | 2003-02-12 | 2004-09-02 | Inst Of Research & Innovation | Laser dicing apparatus |
JP4633335B2 (en) * | 2003-02-12 | 2011-02-16 | 株式会社ディスコ | Laser processing apparatus and laser processing method |
US7630420B2 (en) | 2004-07-27 | 2009-12-08 | Biolase Technology, Inc. | Dual pulse-width medical laser |
US7957440B2 (en) | 2004-07-27 | 2011-06-07 | Biolase Technology, Inc. | Dual pulse-width medical laser |
US7970030B2 (en) | 2004-07-27 | 2011-06-28 | Biolase Technology, Inc. | Dual pulse-width medical laser with presets |
JP2010017864A (en) * | 2008-07-08 | 2010-01-28 | Japan Drilling Co Ltd | Rock processing method using laser beam and its apparatus |
JP2017533537A (en) * | 2014-09-12 | 2017-11-09 | 東莞新能源科技有限公司Dongguan Amperex Technology Limited | Pole piece coating removal equipment |
JP2016117078A (en) * | 2014-12-19 | 2016-06-30 | 三菱重工業株式会社 | Laser cutting method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5945092A (en) | Laser working device | |
US3749878A (en) | Gas assisted laser cutting apparatus | |
EP0600098B1 (en) | Laser beam machining method | |
US4010345A (en) | Gas delivery means for cutting with laser radiation | |
US20180178328A1 (en) | Methods for removing interstitial material from superabrasive materials of cutting elements using energy beams | |
Shin et al. | Cutting performance of thick steel plates up to 150 mm in thickness and large size pipes with a 10-kW fiber laser for dismantling of nuclear facilities | |
JPS60216989A (en) | Laser beam machining device | |
JPH0237985A (en) | Method and device for laser beam processing | |
Sarfraz et al. | A review of technical challenges of laser drilling manufacturing process | |
JP2021049547A (en) | Deburring device | |
Lawrence et al. | Prediction of melt depth in selected architectural materials during high-power diode laser treatment | |
WO2021200667A1 (en) | Concrete surface processing method and laser-processed concrete surface | |
Leidinger et al. | Improved manufacturing processes with high power lasers | |
JP2000317659A (en) | Method and device for cutting by laser beam, and cutting method for graphite block when demolishing waste nuclear reactor | |
JPS61283486A (en) | Method and device for piercing by laser | |
JPH0130796B2 (en) | ||
KR102631280B1 (en) | Cutting device for decommissioning nuclear facilities and nuclear facilities decommissioning method using thereof | |
WO2003018276A1 (en) | Method of processing brittle material and processing device | |
Li et al. | Grit blast assisted laser milling/grooving of metallic alloys | |
JPS59153591A (en) | Surface scarfing method | |
JPH02241688A (en) | Combination machining method | |
JPH11841A (en) | Laser-water jet composite cutting device | |
JP2019018303A (en) | Cutting device | |
Yilbas | Theoretical and experimental investigation into laser melting of steel samples | |
Harry et al. | Electrothermal cutting processes using a CO 2 laser |