JPS5945092A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS5945092A
JPS5945092A JP57154794A JP15479482A JPS5945092A JP S5945092 A JPS5945092 A JP S5945092A JP 57154794 A JP57154794 A JP 57154794A JP 15479482 A JP15479482 A JP 15479482A JP S5945092 A JPS5945092 A JP S5945092A
Authority
JP
Japan
Prior art keywords
laser
work
water
liquid
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57154794A
Other languages
Japanese (ja)
Inventor
Tadao Kato
忠男 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Denpa Koki Kk
Fuji Electronics Industry Co Ltd
Original Assignee
Fuji Denpa Koki Kk
Fuji Electronics Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Denpa Koki Kk, Fuji Electronics Industry Co Ltd filed Critical Fuji Denpa Koki Kk
Priority to JP57154794A priority Critical patent/JPS5945092A/en
Publication of JPS5945092A publication Critical patent/JPS5945092A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To facilitate the working for the work having high reflectivity and heat conductivity by the explosive evaporation effect of a liquid, by providing a device which supplies the liquid to the position where lasr light is irradiated to a laser oscillator. CONSTITUTION:The carbon dioxide laser beam 2 ejected from a laser oscillator 1 irradiates the prescribed position of a work 3. Water 5 is supplied from a pump 4 to the position of the work 3 where the laser beam is irradiated or near the same. Then the water 5 absorbs the laser energy and evaporates explosively. The work 3 is worked by the explosive force thereof and the melt thereof is scattered. Aluminum or the like which is hardly workable with a laser is thus easily worked. Although the water 5 is ejected from the pump 4 to the irradiation position of the carbon dioxide laser, the laser working is accomplished as far as water is present on the surface of the work 3 and therefore the use of devices for supplying water by coating, dropping, streaming downward, etc. is also possible.

Description

【発明の詳細な説明】 本発明はレーデ光によって破卵」7物に切断、穿孔など
を行うレーザ加工装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing device for cutting, perforating, etc. into broken eggs using Rede light.

従来のレーザ加工機はレーデ亀の核力11工物′\の照
射点近傍に叡化ガスもしく [=J二不活性ガスヶ噴出
せしめ加工を行つ−Cいる。ごのように被加工l吻の加
工点近傍にJfスを噴出ぜ[7めるのはレーザエネルギ
によって刀11熱+谷f:独した被)JI+工゛1勿が
そのままr+i r並冷却凝固しないように、1貝出ガ
スの物理的圧力によって溶融物を飛散せしめて残さない
ためである。なお、酸化ガスは高温で物理作用の他に化
学作用を生じ溶融効率を向上させる。
Conventional laser machining machines perform machining by ejecting silica gas or inert gas near the irradiation point of the laser beam. Spray Jf gas near the processing point of the proboscis of the workpiece as shown in the figure. This is to prevent the molten material from being scattered by the physical pressure of the gas released from one shell and not remaining behind. Note that the oxidizing gas causes chemical action in addition to physical action at high temperatures to improve melting efficiency.

し〃)しながら、従来のレーザ刀11 二c +nによ
ると加工時にガスを必要とし、ガスコスト定必要とする
こと、又、ガスゼンベを・必要とし″こ場所をとり、保
(′J゛に困8116がともなうこと、更に加工作業に
ともなうガスの断続を必要とし、ガス制御系が必要とな
ることなど実用上好ましくない点が存在する。
However, the conventional laser knife 11 2c +n requires gas during processing, which requires a fixed gas cost, and also requires a gas assembly, which takes up a lot of space and is difficult to maintain. In addition, there are disadvantages in practical use, such as the fact that the process is accompanied by problems 8116, and that gas must be interrupted and disconnected during processing operations, and a gas control system is required.

又、従来のレージ1加工機ではレーザ光に対する表面反
射率の高い被の11工物や、熱伝導率の高い被加工物の
加工が著しく困難てわυ、二酸化炭素レーザでは朔、銅
、アルミニウム、金などの用1工は不可能とされている
In addition, with the conventional Laser 1 processing machine, it is extremely difficult to process workpieces with high surface reflectance to the laser beam and workpieces with high thermal conductivity. It is said that it is impossible to work with gold, etc.

本発明は上記の手情に鑑み一〇なされたもので、レーザ
光の被加工物への照射位置に液体をイf在せしめ、レー
デ照射時の液体の爆)6的気化作用によっで破卵」7物
を加−[することにより、加工効率を向上し得、且つ9
 !n」反射率の高い核力11工物や熱伝2序率の高い
被加工物の加1..k 容易にし得るレーザ加]二装置
f:提供−f /、、 ことを目的とする。
The present invention has been made in view of the above-mentioned circumstances, and consists of making a liquid exist at the position where the workpiece is irradiated with the laser beam, and causing the liquid to explode due to the vaporization action of the liquid during laser irradiation. By adding 7 things like eggs, processing efficiency can be improved, and 9
! n'' Nuclear force with high reflectance 11 Workpieces with high heat transfer rate 1. .. The purpose of the present invention is to provide a laser beam that can be easily applied to a laser beam.

以下図面を参照して本発明の一″−J、!:施例を詳細
に説明する。図面は=おいで、IQ;J、レージ4発振
器、2 rヨV −−IJ’ビーム、3は波力11工′
I勿、4 (d、 、4?ンプ、5は液体である。即ち
、レーザ元振器1より射出されたレーザビーム2は被加
工物30所定位置に照射される。この破卵」:′吻3の
レーデビーム照射位置又はその近傍にp」、 +j?7
グ4より液体5が供給される。前記液体5はレーザ光を
よく吸収するものが適当であっで、レージ9として二r
浚化炭素レーザを用いるときは水が適当でるる。
Embodiments of the present invention will be described below in detail with reference to the drawings. Force 11 k'
Of course, 4 (d, , 4, 5 are liquids. That is, the laser beam 2 emitted from the laser source 1 is irradiated to a predetermined position on the workpiece 30. p'' at or near the Rade beam irradiation position of proboscis 3, +j?7
A liquid 5 is supplied from the pipe 4. The liquid 5 is suitably one that absorbs laser light well, and the laser beam 9 is 2r.
When using a dredged carbon laser, water is produced appropriately.

而して、レーザエネルギを液体が吸収するとその部位(
こおいて爆発的に気化−Jるりで、その物理的圧力は極
めて太きい。その爆発力によって被加工物3を加工し溶
融物を飛散ゼしめる。従って、被加工l吻がレーデ難力
l工性、リアルミニウム等であっても本装置を用いれば
容易に〕n+工することができるもの−Cあり、液体の
爆発的気化圧力による加IC6る〃)ら被加工物の表面
性グ′↓は加工能力に熱間1糸となる。
Therefore, when the liquid absorbs the laser energy, the area (
At this point, it vaporizes explosively, and the physical pressure is extremely strong. The workpiece 3 is processed by the explosive force, and the molten material is scattered and liquefied. Therefore, even if the workpiece is difficult to machine, real aluminum, etc., it can be easily machined using this device, and there are IC6 types that can be machined using the explosive vaporization pressure of the liquid. 〃) The surface properties of the workpiece G'↓ correspond to the hot processing ability.

なお、上記実施クリでtよ液体をボンノ炉ら射出するよ
うに例示したが、被加工物の衣間に液体が存在すれはよ
いのであって、液体の塗布、滴ド、流F寺のt成体供給
装置を用いることができる。
In addition, in the above-mentioned implementation example, the liquid was injected from the furnace at t, but it is fine for the liquid to exist between the coatings of the workpiece. An adult feeding device can be used.

以」二述べたよりに本発明によれば、レーデ光の被加工
物への照射位i(tに液体を存在ぜしめ、1/  、す
°光、照射時の液体の爆発的気化作用によって被7JO
工物を加工することによp1表面反射率の高い被加工物
や熱伝導率の高い破卵」−物の加工葡容易にできる。又
、ガスの使用と異って水などの液体の使用は極めて容易
で、コスI・もほとんど増大せず工業上の利便は著しく
大である。
As described above, according to the present invention, a liquid is present at the irradiation position i (t) of the Rede light onto the workpiece, and the amount of light is 1/, which is exposed to the explosive vaporization of the liquid during irradiation. 7JO
By processing the workpiece, it is possible to easily process workpieces with high surface reflectance or cracked objects with high thermal conductivity. Furthermore, unlike the use of gas, the use of liquids such as water is extremely easy, and the cost I• hardly increases, making it extremely convenient for industrial use.

【図面の簡単な説明】[Brief explanation of drawings]

図面eよ本発明の一実施15’!lを示す構成説明図で
ある。 J・・・レージ’ 発振a 、2・・L、/  jJ’
 i;−ム、3・・・被加工I[す、4・・・パ?7)
、5・・・液体、。
Drawing e, one embodiment of the present invention 15'! FIG. J...Rage' Oscillation a, 2...L, / jJ'
i;-mu, 3...workpiece I [su, 4...pa? 7)
,5...Liquid.

Claims (2)

【特許請求の範囲】[Claims] (1)  レーザ光を被加工物に照射するレーーv9発
振器と、前記被加工物のレーザ照射位置に液体全存在せ
しめる液体供給装置とを具11iiiすることを特徴と
するレーザ加工装屑3゜
(1) Laser processing equipment 3゜ characterized by comprising a laser V9 oscillator that irradiates a workpiece with a laser beam, and a liquid supply device that makes all the liquid exist at the laser irradiation position of the workpiece.
(2)  レーザ光として二1フ化炭−+Cレーデの出
射光を用い、液体として水を用いること全特徴とする特
許請求の範囲jJ 1項記載のレーザ加工装置0
(2) The laser processing apparatus 0 according to claim jJ, which is characterized in that the emitted light of 21 fluoride carbon + C lede is used as the laser beam and water is used as the liquid.
JP57154794A 1982-09-06 1982-09-06 Laser working device Pending JPS5945092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57154794A JPS5945092A (en) 1982-09-06 1982-09-06 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57154794A JPS5945092A (en) 1982-09-06 1982-09-06 Laser working device

Publications (1)

Publication Number Publication Date
JPS5945092A true JPS5945092A (en) 1984-03-13

Family

ID=15592034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57154794A Pending JPS5945092A (en) 1982-09-06 1982-09-06 Laser working device

Country Status (1)

Country Link
JP (1) JPS5945092A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997007928A3 (en) * 1995-08-31 1997-04-17 Biolase Tech Inc User programmable combination of atomized particles for electromagnetically induced cutting
US5785521A (en) * 1995-08-31 1998-07-28 Biolase Technology, Inc. Fluid conditioning system
WO1998033623A1 (en) * 1997-02-05 1998-08-06 Biolase Technology, Inc. Electromagnetically induced cutter with shaped fluid particles
US5968037A (en) * 1995-08-31 1999-10-19 Biolase Technology, Inc. User programmable combination of atomized particles for electromagnetically induced cutting
US6288499B1 (en) 1997-06-12 2001-09-11 Biolase Technology, Inc. Electromagnetic energy distributions for electromagnetically induced mechanical cutting
EP0916442A3 (en) * 1997-11-12 2001-10-24 Laser- und Medizin-Technologie GmbH Berlin Process and device for removal of surface layer
JP2004247426A (en) * 2003-02-12 2004-09-02 Inst Of Research & Innovation Laser dicing apparatus
JP2007528239A (en) * 1995-08-31 2007-10-11 バイオレーズ テクノロジー インコーポレイテッド Tissue removal apparatus and method
US7320594B1 (en) 1995-08-31 2008-01-22 Biolase Technology, Inc. Fluid and laser system
US7630420B2 (en) 2004-07-27 2009-12-08 Biolase Technology, Inc. Dual pulse-width medical laser
JP2010017864A (en) * 2008-07-08 2010-01-28 Japan Drilling Co Ltd Rock processing method using laser beam and its apparatus
US7970030B2 (en) 2004-07-27 2011-06-28 Biolase Technology, Inc. Dual pulse-width medical laser with presets
US8033825B2 (en) 1995-08-31 2011-10-11 Biolase Technology, Inc. Fluid and pulsed energy output system
JP2016117078A (en) * 2014-12-19 2016-06-30 三菱重工業株式会社 Laser cutting method
JP2017533537A (en) * 2014-09-12 2017-11-09 東莞新能源科技有限公司Dongguan Amperex Technology Limited Pole piece coating removal equipment

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007528239A (en) * 1995-08-31 2007-10-11 バイオレーズ テクノロジー インコーポレイテッド Tissue removal apparatus and method
EP0847319A2 (en) 1995-08-31 1998-06-17 Biolase Technology, Inc. User programmable combination of atomized particles for electromagnetically induced cutting
US5785521A (en) * 1995-08-31 1998-07-28 Biolase Technology, Inc. Fluid conditioning system
US5968037A (en) * 1995-08-31 1999-10-19 Biolase Technology, Inc. User programmable combination of atomized particles for electromagnetically induced cutting
WO1997007928A3 (en) * 1995-08-31 1997-04-17 Biolase Tech Inc User programmable combination of atomized particles for electromagnetically induced cutting
US8033825B2 (en) 1995-08-31 2011-10-11 Biolase Technology, Inc. Fluid and pulsed energy output system
US7696466B2 (en) 1995-08-31 2010-04-13 Biolase Technology, Inc. Electromagnetic energy distributions for electromagnetically induced mechanical cutting
US6610053B1 (en) 1995-08-31 2003-08-26 Biolase Technology, Inc. Methods of using atomized particles for electromagnetically induced cutting
US7320594B1 (en) 1995-08-31 2008-01-22 Biolase Technology, Inc. Fluid and laser system
WO1998033623A1 (en) * 1997-02-05 1998-08-06 Biolase Technology, Inc. Electromagnetically induced cutter with shaped fluid particles
US6288499B1 (en) 1997-06-12 2001-09-11 Biolase Technology, Inc. Electromagnetic energy distributions for electromagnetically induced mechanical cutting
US6419996B2 (en) 1997-11-12 2002-07-16 Laser-Und Medizin-Technologie Ggmbh Laser-supported process for cleaning a surface
EP0916442A3 (en) * 1997-11-12 2001-10-24 Laser- und Medizin-Technologie GmbH Berlin Process and device for removal of surface layer
JP2004247426A (en) * 2003-02-12 2004-09-02 Inst Of Research & Innovation Laser dicing apparatus
JP4633335B2 (en) * 2003-02-12 2011-02-16 株式会社ディスコ Laser processing apparatus and laser processing method
US7630420B2 (en) 2004-07-27 2009-12-08 Biolase Technology, Inc. Dual pulse-width medical laser
US7957440B2 (en) 2004-07-27 2011-06-07 Biolase Technology, Inc. Dual pulse-width medical laser
US7970030B2 (en) 2004-07-27 2011-06-28 Biolase Technology, Inc. Dual pulse-width medical laser with presets
JP2010017864A (en) * 2008-07-08 2010-01-28 Japan Drilling Co Ltd Rock processing method using laser beam and its apparatus
JP2017533537A (en) * 2014-09-12 2017-11-09 東莞新能源科技有限公司Dongguan Amperex Technology Limited Pole piece coating removal equipment
JP2016117078A (en) * 2014-12-19 2016-06-30 三菱重工業株式会社 Laser cutting method

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