JPH07164185A - Wire for gas shielded arc welding - Google Patents

Wire for gas shielded arc welding

Info

Publication number
JPH07164185A
JPH07164185A JP34151793A JP34151793A JPH07164185A JP H07164185 A JPH07164185 A JP H07164185A JP 34151793 A JP34151793 A JP 34151793A JP 34151793 A JP34151793 A JP 34151793A JP H07164185 A JPH07164185 A JP H07164185A
Authority
JP
Japan
Prior art keywords
wire
impurities
arc welding
gas shielded
shielded arc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34151793A
Other languages
Japanese (ja)
Other versions
JP2723793B2 (en
Inventor
Akira Wada
陽 和田
Keiichi Suzuki
鈴木啓一
Masato Konishi
小西正人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP5341517A priority Critical patent/JP2723793B2/en
Publication of JPH07164185A publication Critical patent/JPH07164185A/en
Application granted granted Critical
Publication of JP2723793B2 publication Critical patent/JP2723793B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Arc Welding In General (AREA)

Abstract

PURPOSE:To provide a wire for gas shielded arc welding capable of decreasing the short-time short circuit between a wire and a molten pool and arc cut off. CONSTITUTION:The wire for gas shielded arc welding is ultrasonically cleaned in an org. solvent, such as petroleum ether, and the solvent after removal of the wire body is filtered by using filter paper (membrane filter) having 0.2mum pore size. The residues on the filter paper are regarded as impurities and the impurities sticking to the wire surface are decreased in such a manner that the mass thereof attains <=5mug per square cm of the apparent surface area of the wire. Further, the mass of the impurities failing to pass the filter paper of 10mum pore size is preferably decreased to >=40% of the extracted impurity mass and further, the copper component quantity of the extracted impurities is preferably specified to >=30%.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はガスシールドアーク溶接
用ワイヤの改良に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved wire for gas shielded arc welding.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】産業機
械、自動車或いは鉄骨などの製造に当たって行われるガ
スシールドアーク溶接は、年々性能向上の要求が厳しく
なっており、高速・高品質・高能率とするための改良が
行われている。改良の一つの方法として、シールドガス
成分の検討や溶接電源のインバータ制御化などが行われ
ている。
2. Description of the Related Art Gas shielded arc welding, which is carried out in manufacturing industrial machinery, automobiles, steel frames, etc., is required to improve performance year after year, and high speed, high quality, and high efficiency are required. Improvements have been made. As one of the improvement methods, the examination of the shield gas component and the inverter control of the welding power source are being carried out.

【0003】しかしながら、高品質な溶接部を安価に能
率良く得るためには、溶接アークの不安定さに起因する
欠陥を防ぎ、安定した溶接アークを長時間維持すること
が最も重要である。ここで言う溶接アークの不安定さと
は、肉眼で分かるアーク長さの変動は勿論、肉眼では認
めることのできない短時間のアーク切れや、ワイヤと溶
融プール間の短時間の短絡(以下、短絡と記す)などを含
めたものである。
However, in order to efficiently obtain a high quality welded portion at low cost, it is most important to prevent defects due to instability of the welding arc and maintain a stable welding arc for a long time. The instability of the welding arc referred to here is, of course, not only fluctuations in the arc length that can be seen with the naked eye, but also short breaks in the arc that cannot be recognized with the naked eye, and short-circuiting between the wire and the molten pool for a short time (hereinafter, short-circuiting). Note) etc. are included.

【0004】溶接アークが不安定となると、溶融プール
の形状が不規則に変動し、アンダカットやオーバラップ
などのビード形状の欠陥を発生し易くなる。また、多層
盛り溶接では、スラグ巻き込み欠陥を発生し易くなる。
また、不安定なアークは作業者の疲労を招き、溶接能率
の低下を引き起こす。
When the welding arc becomes unstable, the shape of the molten pool fluctuates irregularly, and defects such as bead shapes such as undercuts and overlaps are likely to occur. In addition, in the multi-layer welding, a slag inclusion defect is likely to occur.
In addition, the unstable arc causes fatigue of the operator and causes a decrease in welding efficiency.

【0005】これまでにも、アークを安定すべく種々の
提案がなされてきた。例えば、特公平3−77035号
では、残存潤滑剤を除去した後にワイヤ表面にカルボン
酸カリウム塩を固着させ、その固着量と固着過程で発生
する遊離鉄粉或いは遊離銅粉の量を規制することにより
アーク放電現象を安定化させることが述べられている。
また、特開昭61−3696号では、銅メッキを有する
ワイヤの表面に残留する銅粉の量を規制することによ
り、通電銅チップの摩耗とワイヤ送給用のフレキシブル
コンジットチューブの閉塞を防止することが述べられて
いる。
Various proposals have been made so far for stabilizing the arc. For example, in Japanese Examined Patent Publication No. 3-77035, a potassium carboxylic acid salt is fixed to the wire surface after removing the residual lubricant, and the amount of the fixed amount and the amount of free iron powder or free copper powder generated in the fixing process are regulated. Describes that the arc discharge phenomenon is stabilized.
Further, in Japanese Patent Laid-Open No. 61-3696, the amount of copper powder remaining on the surface of a wire having a copper plating is regulated to prevent abrasion of a conductive copper chip and blockage of a flexible conduit tube for wire feeding. It is stated.

【0006】しかしながら、これらの従来の技術では、
肉眼では認めることのできない短時間のアーク切れや短
絡などの発生を充分に減少させることができておらず、
溶接欠陥の発生や作業者の無用の疲労を招いていた。
However, in these conventional techniques,
We have not been able to sufficiently reduce the occurrence of short-term arc breaks and short circuits that cannot be recognized with the naked eye.
This caused welding defects and unnecessary fatigue of workers.

【0007】本発明の目的は、上記従来技術の欠点を解
消して、溶接欠陥や作業者の疲労につながるような、ワ
イヤと溶融プール間の短時間の短絡やアーク切れを充分
に減少させ得るガスシールドアーク溶接用ワイヤを提供
することにある。
The object of the present invention is to solve the above-mentioned drawbacks of the prior art and to sufficiently reduce short-circuits and arc breaks between the wire and the molten pool, which lead to welding defects and operator fatigue. It is to provide a wire for gas shielded arc welding.

【0008】[0008]

【課題を解決するための手段】前記課題を解決するため
の手段として、本発明は、ガスシールドアーク溶接用ワ
イヤの不純物を、該ワイヤを石油エーテル等の有機溶媒
中で超音波洗浄し、ワイヤ本体を除去した後に、孔径
0.2μmのろ紙(メンブレンフィルタ)を用いてろ過し、
ろ紙上の残査を不純物とする方法で抽出した不純物の質
量を、ワイヤ見掛け表面積を(ワイヤ見掛け表面積)=
(ワイヤ径の平均値)×(円周率)×(ワイヤの長さ)とする
とき、ワイヤ見掛け表面積1平方cm当たり5μg以下に
したことを特徴とするガスシールドアーク溶接用ワイヤ
を要旨としている。
Means for Solving the Problems As a means for solving the above problems, according to the present invention, the impurities in a gas shielded arc welding wire are ultrasonically cleaned in an organic solvent such as petroleum ether, After removing the main body, it is filtered using a filter paper (membrane filter) with a pore size of 0.2 μm,
The apparent surface area of the wire (wire apparent surface area) =
When (average value of wire diameter) × (circularity) × (wire length), the wire for gas shield arc welding is characterized in that the apparent surface area of the wire is 5 μg or less per 1 cm 2. .

【0009】また、他の本発明は、更に、孔径10μm
のろ紙(メンブレンフィルタ)を通過しない不純物の質量
を、前記抽出された不純物質量の40%以下にしたこと
を特徴としている。
Further, in another invention, the pore size is further 10 μm.
It is characterized in that the mass of impurities that do not pass through the filter paper (membrane filter) is set to 40% or less of the mass of the extracted impurities.

【0010】更に、他の本発明は、更に、前記抽出され
た不純物の銅成分量(銅化合物の場合は銅に換算した量)
を30%以上としたことを特徴としている。
Further, in another aspect of the present invention, the amount of the copper component of the extracted impurities (in the case of a copper compound, the amount converted to copper)
Is set to 30% or more.

【0011】[0011]

【作用】以下に本発明を更に詳細に説明する。The present invention will be described in more detail below.

【0012】本発明者らは溶接アーク現象を高速度ビテ
オやデータレコーダーを用いて観察した結果と、ワイヤ
及びワイヤ表面の分析結果から、ワイヤ表面付着してい
る物質が、通電チップとワイヤとの電気的な接触を妨
げ、アークを不安定にさせることを見つけた。ここで言
う物質とは、ほこりや残留した伸線潤滑剤、それらが変
質したもの、銅粉や鉄粉、アーク安定剤として付着させ
たアルカリ或いはアルカリ土類化合物などである。
From the results of observing the welding arc phenomenon using a high-speed video or a data recorder and the results of analysis of the wire and the wire surface, the present inventors have confirmed that the substances adhering to the wire surface are different from the current-carrying tip and the wire. It was found to interfere with electrical contact and destabilize the arc. The substances referred to here are dust and residual wire drawing lubricants, those that have been altered, copper powder or iron powder, and alkali or alkaline earth compounds attached as an arc stabilizer.

【0013】つまり、通電チップとワイヤとの電気的な
接触を考えるならば、ワイヤ表面に付着している物質は
すべて悪い影響を与えることが分かった。但し、物質に
より影響の大小があり、寸法が大きい物質は成分の違い
以上に大きな悪影響を与え、また、金属系の不純物は非
金属系の不純物と比較して悪影響が小さい傾向が認めら
れた。
That is, it was found that all substances adhering to the surface of the wire adversely affect the electrical contact between the current-carrying tip and the wire. However, depending on the substance, there was a large influence, and a substance having a large size had a greater adverse effect than the difference in the components, and it was recognized that the metallic impurities tended to have a smaller adverse effect than the non-metallic impurities.

【0014】ワイヤ表面に付着している物質を分析する
方法は種々考えられるが、本発明者らが諸々の試験を行
った結果、ワイヤを石油エーテル等の有機溶媒中で超音
波洗浄する方法が最も有効であった。この方法は、ワイ
ヤを石油エーテル等の有機溶媒中中で超音波洗浄し、ワ
イヤ本体を除去した後に、孔径0.2μmのろ紙(メンブ
レンフィルタ)を用いてろ過し、ろ紙上の残査を不純物
(以下、不純物と記す)とする方法である。この方法によ
れば、数kg以上のワイヤを容易に分析することができ
るので微量の不純物を精度良く捕らえることができる。
このときの超音波洗浄の程度であるが、健全なワイヤ表
面が傷ついて銅粉や鉄粉を生じるようでは強すぎる。洗
浄時間については、洗浄時間を増加させていき、不純物
量が安定した時点を終点とする。
There are various possible methods for analyzing the substance adhering to the wire surface. As a result of various tests conducted by the present inventors, a method of ultrasonically cleaning the wire in an organic solvent such as petroleum ether is found. It was the most effective. In this method, the wire is ultrasonically cleaned in an organic solvent such as petroleum ether, and after removing the wire body, it is filtered using a filter paper (membrane filter) with a pore size of 0.2 μm, and the residue on the filter paper is treated as impurities.
(Hereinafter referred to as impurities). According to this method, a wire of several kg or more can be easily analyzed, so that a trace amount of impurities can be accurately captured.
Although it is the degree of ultrasonic cleaning at this time, it is too strong that a sound wire surface is damaged and copper powder or iron powder is generated. With respect to the cleaning time, the cleaning time is increased, and the end point is when the amount of impurities is stable.

【0015】また、通電チップとワイヤとの電気的な接
触の観点から、ワイヤ見掛け表面積当たりの不純物の量
で規定した。ここでワイヤ見掛け表面積は、 (ワイヤ見掛け表面積)=(ワイヤ径の平均値)×(円周率)
×(ワイヤの長さ) で表わされる。
From the viewpoint of electrical contact between the current-carrying tip and the wire, the amount of impurities per apparent surface area of the wire is defined. Here, the apparent surface area of wire is (apparent surface area of wire) = (average value of wire diameter) x (circularity)
It is represented by x (wire length).

【0016】次に本発明における数値限定理由を詳述す
る。
Next, the reasons for limiting the numerical values in the present invention will be described in detail.

【0017】本発明の溶接ワイヤは、不純物が、ワイヤ
見掛け表面積1平方cm当たり5μg以下にしたことを特
徴としている。不純物が5μg/cm2を超えるとアークが
不安定となり、アーク切れ及び短絡が著しく増大するの
でアンダカットやオーバラップなどの溶接欠陥を生じ易
くなると共に、作業者が疲労を感じ易くなる。不純物量
を更に減少させ2μg以下にすると、溶接欠陥数が急減
するので、より良い結果が得られる。
The welding wire of the present invention is characterized in that the amount of impurities is 5 μg or less per 1 cm 2 of the apparent surface area of the wire. If the impurities exceed 5 μg / cm 2 , the arc becomes unstable, and arc breaks and short circuits remarkably increase, so that welding defects such as undercuts and overlaps are likely to occur, and the operator is likely to feel fatigue. If the amount of impurities is further reduced to 2 μg or less, the number of welding defects sharply decreases, and better results are obtained.

【0018】そして、その不純物の大きさは、孔径10
μmのろ紙(メンブレンフィルタ)を通過しない不純物の
質量が、抽出された不純物質量の40%以下ならばより
好ましい。40%を超えると比較的に長い時間のアーク
不安定が急増し、大きめの溶接欠陥が発生し易くなる。
更に20%以下にするのが好ましく、大きめの溶接欠陥
が急減するので品質が向上する。
The size of the impurities is 10
It is more preferable that the mass of impurities that do not pass through the filter paper (membrane filter) of μm is 40% or less of the mass of impurities extracted. If it exceeds 40%, arc instability for a relatively long time increases rapidly, and large welding defects are likely to occur.
Further, it is preferably 20% or less, and large welding defects are sharply reduced, so that the quality is improved.

【0019】更に加えて、不純物の銅成分量(銅化合物
の場合は銅に換算した量)が30%以上ならば、より一
層好ましい。不純物量が同じならば、銅成分量の増加に
従い、アーク不安定現象が減少する傾向が認められ、3
0%以上になると顕著であり、50%以上では急減す
る。
Further, it is even more preferable that the amount of copper component of impurities (in the case of a copper compound, the amount converted to copper) is 30% or more. If the amount of impurities is the same, the arc instability phenomenon tends to decrease as the amount of copper component increases.
It is remarkable when it is 0% or more, and sharply decreases when it is 50% or more.

【0020】なお、溶接用ソリッドワイヤの組成につい
ては、JIS Z3312に規定されている範囲内であ
れば、いずれのものであっても良く、本発明の効果を充
分に発揮できる。例えば、C:0.001〜0.15%、
Si:0.30〜1.10%、Mn:0.85〜2.60%、
P:0.001〜0.030%、S:0.001〜0.03
0%、Cu:0.01〜0.50%を含み、残部が鉄及び
不可避不純物からなる組成が望ましい。各成分の規制理
由は以下のとおりである。
The composition of the solid wire for welding may be any as long as it is within the range specified in JIS Z3312, and the effects of the present invention can be sufficiently exhibited. For example, C: 0.001 to 0.15%,
Si: 0.30 to 1.10%, Mn: 0.85 to 2.60%,
P: 0.001 to 0.030%, S: 0.001 to 0.03
A composition containing 0% and Cu: 0.01 to 0.50% with the balance being iron and inevitable impurities is desirable. The reasons for controlling each component are as follows.

【0021】C:0.001〜0.15% Cは溶接金属の脱酸及び強度を得る上で必要不可欠の成
分であるが、0.001%未満では脱酸と強度が共に不
十分であり、また、0.15%を超えると溶接金属に高
温割れが発生し易くなるため、0.001〜0.15%が
望ましい。
C: 0.001 to 0.15% C is an essential component for obtaining deoxidation and strength of the weld metal, but if it is less than 0.001%, both deoxidation and strength are insufficient. Further, if it exceeds 0.15%, high temperature cracking is likely to occur in the weld metal, so 0.001 to 0.15% is desirable.

【0022】Si:0.30〜1.10% Siは溶接金属の脱酸に必要不可欠の成分であるが、0.
30%未満では脱酸不足であり、また1.10%を超え
ると溶接金属の靭性が低下し易くなるため、0.30〜
1.10%が望ましい。
Si: 0.30 to 1.10% Si is an indispensable component for deoxidizing the weld metal.
If it is less than 30%, deoxidation is insufficient, and if it exceeds 1.10%, the toughness of the weld metal is likely to decrease, so that it is 0.30 to.
1.10% is desirable.

【0023】Mn:0.85〜2.60% Mnは溶接金属の脱酸及び強度を得る上で必要不可欠の
成分であるが、0.85%未満では脱酸と強度共に不十
分であり、また2.60%を超えると溶接金属に低温割
れが発生し易くなるため、0.85〜2.60%が望まし
い。
Mn: 0.85 to 2.60% Mn is an essential component for obtaining deoxidation and strength of the weld metal, but if it is less than 0.85%, both deoxidation and strength are insufficient. Further, if it exceeds 2.60%, low temperature cracking tends to occur in the weld metal, so 0.85 to 2.60% is desirable.

【0024】P:0.001〜0.030% Pはワイヤ先端からの溶滴の滑らかな離脱を得る上で必
要不可欠の成分であるが、0.001%未満ではその効
果が不十分であり、また、0.030%を超えると溶接
金属に高温割れが発生し易くなるため、0.001〜0.
030%が望ましい。
P: 0.001 to 0.030% P is an essential component for obtaining a smooth detachment of the droplet from the tip of the wire, but if it is less than 0.001%, its effect is insufficient. Further, if it exceeds 0.030%, high temperature cracking easily occurs in the weld metal, and therefore 0.001 to 0.001.
030% is desirable.

【0025】S:0.001〜0.030% Sはワイヤ先端からの溶滴の滑らかな離脱を得る上で必
要不可欠の成分であるが、0.001%未満ではその効
果が不十分であり、また、0.030%を超えると溶接
金属に高温割れが発生し易くなるため、0.001〜0.
030%が望ましい。
S: 0.001 to 0.030% S is an essential component for obtaining a smooth detachment of the droplet from the tip of the wire, but if it is less than 0.001%, its effect is insufficient. Further, if it exceeds 0.030%, high temperature cracking easily occurs in the weld metal, and therefore 0.001 to 0.001.
030% is desirable.

【0026】Cu:0.01〜0.50%以下 Cuはワイヤの通電性及び溶接金属の強度を得る上で必
要不可欠の成分であるが、0.01%未満では通電性と
強度共に不十分であり、また0.50%を超えると溶接
金属に高温割れが発生し易くなるため、0.01〜0.5
0%が望ましい。Cuはワイヤ表面のメッキの形でも、
固溶した形でも、ワイヤ結晶粒界析出物の形のいずれで
あってもかまわないが、ワイヤの通電性をより良くする
ためには、ワイヤ表面のメッキの形が0.10〜0.40
%であることが望ましい。
Cu: 0.01 to 0.50% or less Cu is an essential component for obtaining the electrical conductivity of the wire and the strength of the weld metal, but if it is less than 0.01%, the electrical conductivity and strength are insufficient. If it exceeds 0.50%, high temperature cracking is likely to occur in the weld metal, and therefore 0.01 to 0.5.
0% is desirable. Cu is also a form of plating on the wire surface,
It may be either a solid solution form or a wire grain boundary precipitate form, but in order to improve the electric conductivity of the wire, the form of plating on the wire surface is 0.10 to 0.40.
% Is desirable.

【0027】残部:鉄及び不可避的不純物 不可避的不純物としては、例えば、Be、B、N、Mg、
Ca、V、Co、Zn、As、Se、Sr、Y、Nb、Cd、I
n、Sn、Sb、Te、Ba、W、Hg、Tl、Pb、Biなど
を、それぞれ0.05%以下、合計で0.50%以下を含
有してもよい。不純物は少ないほうが望ましいが、いた
ずらに不純物を取り除くことは製造費用の急増につなが
る。上記の元素のいずれの一つでも0.05%を超える
とアーク不安定の増加や割れ感受性の上昇などの悪影響
を与えるので、それぞれ0.05%以下が望ましい。ま
た、それらの元素の合計で0.50%を超えても同様な
悪影響を与えるので、合計で0.50%以下が望まし
い。
Remainder: Iron and inevitable impurities Examples of inevitable impurities include Be, B, N, Mg,
Ca, V, Co, Zn, As, Se, Sr, Y, Nb, Cd, I
The content of n, Sn, Sb, Te, Ba, W, Hg, Tl, Pb, Bi, etc. may be 0.05% or less, respectively, and 0.50% or less in total. It is desirable that the amount of impurities is small, but removing impurities unnecessarily leads to a rapid increase in manufacturing costs. If any one of the above elements exceeds 0.05%, adverse effects such as an increase in arc instability and an increase in crack susceptibility are adversely affected, so 0.05% or less is preferable for each. Further, even if the total amount of these elements exceeds 0.50%, the same adverse effect is exerted, so the total amount is preferably 0.50% or less.

【0028】上記成分のほか、必要に応じて、以下の成
分の1種又は2種以上を適量にて含有させることができ
る。
In addition to the above components, if necessary, one or more of the following components may be contained in appropriate amounts.

【0029】Ni:0.01〜1.80% Niは溶接金属の低温靭性及び強度を得る上で有効な成
分であるが、0.01%未満では低温靭性と強度共に不
十分であり、また、1.80%を超えると溶接金属の高
温割れが発生し易くなるため、0.01〜1.80%が望
ましい。
Ni: 0.01 to 1.80% Ni is an effective component for obtaining the low temperature toughness and strength of the weld metal, but if it is less than 0.01%, both the low temperature toughness and the strength are insufficient, and If it exceeds 1.80%, hot cracking of the weld metal is likely to occur, so 0.01 to 1.80% is desirable.

【0030】Cr:0.01〜0.70% Crは溶接金属の強度を得る上で有効な成分であるが、
0.01%未満では不十分であり、また、0.70%を超
えると溶接金属の伸びが不足し易く、また低温割れが発
生し易くなるため、0.01〜0.70%が望ましい。
Cr: 0.01 to 0.70% Cr is an effective component for obtaining the strength of the weld metal,
If it is less than 0.01%, it is insufficient, and if it exceeds 0.70%, the weld metal tends to have insufficient elongation and cold cracking tends to occur, so 0.01 to 0.70% is desirable.

【0031】Mo:0.01〜0.65% Moは溶接金属の低温靭性及び強度を得る上で有効な成
分であるが、0.01%未満では低温靭性と強度共に不
十分であり、また0.65%を超えると溶接金属に高温
割れが発生し易く、また溶接金属の伸びが不足し易くな
るため、0.01〜0.65%が望ましい。
Mo: 0.01 to 0.65% Mo is an effective component for obtaining the low temperature toughness and strength of the weld metal, but if it is less than 0.01%, both the low temperature toughness and the strength are insufficient. If it exceeds 0.65%, high-temperature cracking is likely to occur in the weld metal and the elongation of the weld metal tends to be insufficient, so 0.01 to 0.65% is desirable.

【0032】Al:0.01〜0.50% Alは溶接金属の脱酸及び溶接ビードを整形する上で有
効な成分であるが、0.01%未満では脱酸とビード整
形性共に不十分であり、また0.50%を超えると溶接
金属に高温割れが発生し易くなるため、0.01〜0.5
0%が望ましい。
Al: 0.01 to 0.50% Al is an effective component for deoxidizing the weld metal and shaping the weld bead, but if less than 0.01%, both deoxidation and bead shaping properties are insufficient. If it exceeds 0.50%, high temperature cracking is likely to occur in the weld metal, and therefore 0.01 to 0.5.
0% is desirable.

【0033】Ti+Zr:0.01〜0.30% Ti及びZrは溶接金属の脱酸及びスパッタの減少に有効
な成分であるが、0.01%未満では脱酸とスパッタの
減少共に不十分であり、また0.30%を超えると溶接
金属に高温割れが発生し易くなるため、0.01〜0.3
0%が望ましい。また、ZrよりもTiの方がスパッタの
減少にはより有効であり、Ti>Zrの範囲がより望まし
い。
Ti + Zr: 0.01 to 0.30% Ti and Zr are effective components for deoxidizing the weld metal and reducing spatter. However, if less than 0.01%, both deoxidation and spatter are insufficient. Yes, and if it exceeds 0.30%, high temperature cracking is likely to occur in the weld metal, so 0.01 to 0.3
0% is desirable. Further, Ti is more effective than Zr in reducing spatter, and a range of Ti> Zr is more desirable.

【0034】次に本発明の実施例を示す。Next, examples of the present invention will be described.

【実施例】【Example】

【0035】圧延又は伸線→熱処理(必要に応じて)→洗
浄→銅メッキ→洗浄→仕上げ伸線→洗浄→送給用又は防
錆用の油付与→スプール巻き替え或いは大容量パック製
造の各工程条件を適宜変更することにより作成した直径
1.2mmの溶接ワイヤについて、不純物とアーク切れ、
短絡、溶接欠陥及び作業者の疲労度を調べたところ、表
1に示すような結果を得た。
Rolling or wire drawing → Heat treatment (if necessary) → Washing → Copper plating → Washing → Finishing wiredrawing → Washing → Adding oil for feeding or rust prevention → Rewinding spool or manufacturing large capacity pack Regarding the welding wire with a diameter of 1.2 mm created by appropriately changing the process conditions, impurities and arc breakage,
When the short circuit, the welding defect and the fatigue degree of the operator were examined, the results shown in Table 1 were obtained.

【0036】これらの工程の中で、仕上げ伸線工程の寄
与が相対的に大きく、潤滑剤や伸線ダイスの適切な管理
を行わなければ、後続の洗浄工程で不純物を充分に取り
除くことが難しかった。また、各洗浄工程においてワイ
ヤ表面を傷めることを最少に抑えなければ、ワイヤが使
用される時にワイヤ表面がフレキシブルコンジットチュ
ーブとの接触で剥離し易くなり、送給を阻害することに
つながった。また、洗浄方法は、除去すべき不純物の種
類と量によって適切に選択されねばならないので留意し
た。
Among these processes, the contribution of the finish wire drawing process is relatively large, and it is difficult to sufficiently remove impurities in the subsequent cleaning process unless proper management of the lubricant and wire drawing die is performed. It was Further, unless damage to the wire surface is minimized in each cleaning step, the wire surface is likely to peel off due to contact with the flexible conduit tube when the wire is used, which impedes feeding. It was also noted that the cleaning method must be properly selected according to the type and amount of impurities to be removed.

【0037】なお、不純物量は前記方法で抽出した量で
ある。表中、「不純物の総量」は、孔径0.2μmのろ紙
に捕らえられた不純物の質量を、ワイヤ見かけ表面積当
りで表した。「10μm以上の物の割合」は、孔径10
μmのろ紙で捕らえられた物が不純物総量に占める割合
である。「不純物中の銅の割合」は、不純物中の銅(銅
化合物は銅に換算)が不純物総量に占める割合である。
The amount of impurities is the amount extracted by the above method. In the table, "total amount of impurities" represents the mass of impurities trapped in a filter paper having a pore size of 0.2 µm per apparent surface area of the wire. "Proportion of 10 μm or more" is 10
This is the ratio of the amount of impurities captured by μm filter paper to the total amount of impurities. “Ratio of copper in impurities” is the ratio of copper in impurities (copper compound converted to copper) in the total amount of impurities.

【0038】また、アーク安定性については、DCE
P、220A−30V−60cm/min、シールドガスC
2の溶接条件で、アーク電圧が20V以下を短絡、4
0V以上をアーク切れとし、1秒当りのこれらの発生回
数を調べた。溶接欠陥については、各ワイヤについて溶
接長さで20m程度ずつ溶接し、1m当りのアンダカット
及びオーギラップ数を調べた。
Regarding the arc stability, DCE
P, 220A-30V-60cm / min, shield gas C
Under the welding condition of O 2 , the arc voltage is shorted to 20V or less, 4
The arc was cut off at 0 V or more, and the number of times of occurrence of these per second was examined. Regarding welding defects, each wire was welded at a welding length of about 20 m, and the number of undercuts and the number of Augi laps per 1 m were examined.

【0039】なお、使用したソリッドワイヤの化学成分
は、C:0.04%、Si:0.75%、Mn:1.70
%、P:0.015%、S:0.010%、Cu:0.25
%、Ni:0.02%、Cr:0.04%、Mo<0.005
%、Al:0.008%、残部が96.5%以上のFeと不
可避的不純物である。
The chemical composition of the solid wire used was C: 0.04%, Si: 0.75%, Mn: 1.70.
%, P: 0.015%, S: 0.010%, Cu: 0.25
%, Ni: 0.02%, Cr: 0.04%, Mo <0.005
%, Al: 0.008%, and the balance of 96.5% or more Fe and unavoidable impurities.

【0040】表1において、本発明例No.1〜25に示
すように、不純物量をワイヤ表面積1平方cm当たり5μ
g以下にすることにより、溶接欠陥につながるようなア
ーク不安定を充分に減少させることができることが分か
る。不純物量は少ないほうが良く、同2μg以下にでき
れば更にアークを安定化できる。
In Table 1, as shown in Examples Nos. 1 to 25 of the present invention, the amount of impurities is 5 μ per 1 cm 2 of the wire surface area.
It can be seen that the arc instability that leads to welding defects can be sufficiently reduced by setting the g or less. It is better that the amount of impurities is small, and if it is less than 2 μg, the arc can be further stabilized.

【0041】また、本発明例No.11〜25に示すよう
に、10μm以上の大粒の不純物を40%以下に減少さ
せれば、アーク不安定を更に減少できることが分かる。
Further, as shown in Examples Nos. 11 to 25 of the present invention, it is understood that the arc instability can be further reduced by reducing the large-sized impurities of 10 μm or more to 40% or less.

【0042】また、不純物中の銅は主に銅粉の形状で存
在し、それは非金属系の不純物と比較して悪影響が小さ
い傾向が認められた。これは、銅粉の密度が大きいので
体積が相対的に小さいこと、銅の電気伝導度が高いこと
が原因と推定される。本発明例No.20〜25に示すよ
うに、抽出された不純物の銅成分量(銅化合物は、銅に
換算する)が30%以上でこの傾向が顕著であった。
Further, the copper in the impurities was mainly present in the form of copper powder, and it was recognized that the adverse effect thereof was smaller than that of the non-metallic impurities. It is presumed that this is because the density of the copper powder is high, so the volume is relatively small, and the electrical conductivity of copper is high. As shown in Inventive Examples Nos. 20 to 25, this tendency was remarkable when the amount of the copper component of the extracted impurities (the copper compound was converted to copper) was 30% or more.

【0043】なお、この実施例に示した直径1.2mmの
ワイヤに限られず、他の直径及び化学成分のワイヤでも
同様な結果が得られた。また、銅メッキを施したフラッ
クス入りワイヤでも同様な結果が得られた。
The same result was obtained not only for the wire having a diameter of 1.2 mm shown in this embodiment but also for wires having other diameters and chemical components. Similar results were obtained with a copper-plated flux-cored wire.

【0044】[0044]

【表1】 [Table 1]

【0045】[0045]

【発明の効果】以上詳述したように、本発明によれば、
ワイヤ表面の不純物量を限界内に管理したガスシールド
アーク溶接用ワイヤを提供できるので、溶接アークの安
定性に優れ、高速溶接でもアーク不安定による溶接欠陥
が発生し難く、また作業者の疲労が減少して品質及び能
率が向上する等、産業界に寄与する効果は極めて顕著で
ある。
As described in detail above, according to the present invention,
Since we can provide a wire for gas shielded arc welding in which the amount of impurities on the wire surface is controlled within the limit, the welding arc has excellent stability, welding defects due to arc instability do not easily occur even at high speed welding, and worker fatigue is reduced. The effect of contributing to the industry such as reduction and improvement of quality and efficiency is extremely remarkable.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 ガスシールドアーク溶接用ワイヤの不純
物を、該ワイヤを石油エーテル等の有機溶媒中で超音波
洗浄し、ワイヤ本体を除去した後に、孔径0.2μmのろ
紙(メンブレンフィルタ)を用いてろ過し、ろ紙上の残査
を不純物とする方法で抽出した不純物の質量を、ワイヤ
見掛け表面積を(ワイヤ見掛け表面積)=(ワイヤ径の平
均値)×(円周率)×(ワイヤの長さ)とするとき、ワイヤ
見掛け表面積1平方cm当たり5μg以下にしたことを特
徴とするガスシールドアーク溶接用ワイヤ。
1. A wire for gas shielded arc welding is cleaned with ultrasonic waves in an organic solvent such as petroleum ether to remove the wire body, and then a filter paper (membrane filter) having a pore diameter of 0.2 μm is used. The mass of impurities extracted by the method of filtering the residue on the filter paper as impurities is calculated by calculating the apparent surface area of the wire as (apparent surface area of wire) = (average value of wire diameter) x (circular ratio) x (length of wire). Sa)), the wire for gas shielded arc welding is characterized in that the apparent surface area of the wire is 5 μg or less per square cm.
【請求項2】 更に、孔径10μmのろ紙(メンブレンフ
ィルタ)を通過しない不純物の質量を、前記抽出された
不純物質量の40%以下にしたことを特徴とする請求項
1に記載のガスシールドアーク溶接用ワイヤ。
2. The gas shielded arc welding according to claim 1, wherein the mass of impurities that do not pass through a filter paper (membrane filter) having a pore size of 10 μm is set to 40% or less of the mass of the extracted impurities. For wire.
【請求項3】 更に、前記抽出された不純物の銅成分量
(銅化合物の場合は銅に換算した量)を30%以上とした
ことを特徴とする請求項1又は2に記載のガスシールド
アーク溶接用ワイヤ。
3. The amount of copper component of the extracted impurities
(The amount converted to copper in the case of a copper compound) is 30% or more, The wire for gas shield arc welding according to claim 1 or 2, characterized in that
【請求項4】 ソリッドワイヤの組成が、重量%で(以
下同じ)、C:0.001〜0.15%、Si:0.30〜
1.10%、Mn:0.85〜2.60%、P:0.001
〜0.030%、S:0.001〜0.030%、Cu:
0.01〜0.50%を含み、残部が鉄及び不可避不純物
からなる請求項1、2又は3に記載のガスシールドアー
ク溶接用ワイヤ。
4. The composition of the solid wire in% by weight (hereinafter the same), C: 0.001 to 0.15%, Si: 0.30 to.
1.10%, Mn: 0.85 to 2.60%, P: 0.001
~ 0.030%, S: 0.001-0.030%, Cu:
The gas shielded arc welding wire according to claim 1, 2 or 3, comprising 0.01 to 0.50% and the balance being iron and inevitable impurities.
【請求項5】 更にNi:0.01〜1.80%、Cr:
0.01〜0.70%、Mo:0.01〜0.65%、Al:
0.01〜0.50%、Ti+Zr:0.01〜0.30%以
下、の1種又は2種以上を含有する請求項4に記載のガ
スシールドアーク溶接用ワイヤ。
5. Ni: 0.01 to 1.80%, Cr:
0.01 to 0.70%, Mo: 0.01 to 0.65%, Al:
The gas shielded arc welding wire according to claim 4, which contains one or more of 0.01 to 0.50% and Ti + Zr: 0.01 to 0.30% or less.
JP5341517A 1993-12-10 1993-12-10 Gas shielded arc welding wire Expired - Fee Related JP2723793B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5341517A JP2723793B2 (en) 1993-12-10 1993-12-10 Gas shielded arc welding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5341517A JP2723793B2 (en) 1993-12-10 1993-12-10 Gas shielded arc welding wire

Publications (2)

Publication Number Publication Date
JPH07164185A true JPH07164185A (en) 1995-06-27
JP2723793B2 JP2723793B2 (en) 1998-03-09

Family

ID=18346682

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2723793B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152341A1 (en) * 2010-05-31 2011-12-08 株式会社神戸製鋼所 Copper-plated solid welding wire

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62248594A (en) * 1986-04-21 1987-10-29 Daido Steel Co Ltd Gas shielded arc welding wire
JPH0246994A (en) * 1988-08-04 1990-02-16 Daido Steel Co Ltd Solid wire for gas shielded arc welding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62248594A (en) * 1986-04-21 1987-10-29 Daido Steel Co Ltd Gas shielded arc welding wire
JPH0246994A (en) * 1988-08-04 1990-02-16 Daido Steel Co Ltd Solid wire for gas shielded arc welding

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152341A1 (en) * 2010-05-31 2011-12-08 株式会社神戸製鋼所 Copper-plated solid welding wire
JP2012011461A (en) * 2010-05-31 2012-01-19 Kobe Steel Ltd Copper-plated solid wire for welding
CN102905844A (en) * 2010-05-31 2013-01-30 株式会社神户制钢所 Copper-plated solid welding wire

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