JPH0715151Y2 - Case structure of hybrid integrated circuit device - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a case structure of a hybrid integrated circuit device incorporated in an electric component for automobiles, etc., which is strictly required to have environmental resistance.

[Prior art]

Conventionally, as a hybrid integrated circuit device having a built-in HIC substrate such as an igniter, for example, there is one disclosed in Japanese Utility Model Application No. 62-94254. FIG. 3 is a diagram showing a structural example of the conventional hybrid integrated circuit device.

A HIC substrate 3 is adhered on the metal plate 2, and the periphery is covered with a case portion molded with a thermoplastic material. The case part is divided into an upper case 11 and a lower case 12, and the lower case 12 is mounted on the metal plate 2 together with the HIC substrate 3 so that the ultrasonic wire bonding process can be performed.

In addition to the electronic circuit components, the HIC board 3 is preliminarily joined to the lower case 12 by a solder reflow process after the automatic mound, in which the lead frame 15 is lowered in height to stabilize its posture. These, HIC board 3 and lower case 1
2 is attached to the metal plate 2 after applying adhesive together,
After that, the lower case 12 is fixed to the metal plate 2 by screws.

Further, the HIC substrate 3 and the lower case 12 are joined by simultaneous heat curing of the adhesive. Next, the silicone in the lower case 12
Fill with gel 8 and heat cure.

Next, the connector 4 is temporarily fixed to the lower case 12, and the terminal 14 and the lead frame 15 are joined by the solder 9. Next, the upper case 11 having the opening surface into which the connector 4 is fitted is placed on the lower case 12 by the method of fitting the connector 4 into the opening surface (see FIG. 1). Both ultrasonic welding surfaces 12 are set in a fitted state. After the setting, both of the ultrasonic welding surfaces 13 are joined by ultrasonic welding.

Next, the epoxy resin 7 is filled from the upper end opening 19 (see FIG. 1) of the upper case 11 and cured to complete the assembly of the hybrid integrated circuit device containing the HIC substrate.

[Problems to be solved by the device]

However, as described above, the epoxy resin 7 is filled in the process of assembling the hybrid integrated circuit device having the above-mentioned configuration. In this filling, the epoxy resin of the upper case 11 is attached to the joint of the lower case 12 and the upper case 11. Since the area of the upper end opening 19 for filling the resin 7 is small, there is a problem in that if careless filling is performed, air remains inside the case and an unfilled portion of the epoxy resin 7 occurs.

This often occurs particularly at four corners due to the structure of the case, and in order to prevent the generation of the unfilled portion of the epoxy resin 7, the epoxy resin 7 is filled in the pressure reducing device or the air inside is easily released. As described above, it is necessary to take special consideration such as providing an inclination at the time of filling, which increases the number of work steps and the cost. Further, in a state where the unfilled portion of the epoxy resin 7 is generated, moisture or the like is easily drawn from the outside due to the absorbing action due to the temperature change of the residual air, and the moisture resistance is deteriorated, so that the reliability may be deteriorated.

The present invention has been made in view of the above points, and improves reliability by preventing the unfilled portion of the resin material due to residual air, and simplifies the filling work to reduce the work man-hours. An object is to provide a case structure for an integrated circuit device.

[Means for Solving the Problems]

In order to solve the above problems, the present invention provides, as shown in FIG.
A case using a thermoplastic agent that covers the HIC substrate 3 mounted on the metal plate 2 is divided into an upper case 11 and a lower case 12, and both cases are joined by ultrasonic welding or the like to be integrated. In the case structure of the hybrid integrated circuit device configured to be filled with a resin material inside,
When filling the resin material into the case at a plurality of positions facing each other on the joint surface of the upper case 11 or the joint surface of the lower case 12,
It is characterized in that a slit 17 for leading the air in the case to the outside is provided.

[Action]

According to the present invention, by adopting the above configuration, the upper case 11
When the resin material is filled in the case at a plurality of positions facing each other on the joint surface of the joint surface of the lower case 12 or the joint surface of the lower case 12, since the slit 17 for leading the air in the case to the outside is provided, the resin filling step In, without the need for special air removal work,
It is possible to prevent a portion not filled with resin in the case and improve reliability.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the main structure of a hybrid integrated circuit device according to the present invention, and FIG. 2 is a partial cross-sectional view for explaining the details of the air vent path of the perspective view (XX in FIG. 1). FIG. An ultrasonic welding surface 13 is formed on the entire circumference of the lower case 12 except for the mounting portion of the connector 4. Although not shown, the upper case 11 also has an ultrasonic welding surface formed in a shape corresponding to the ultrasonic welding surface 13.

Slits 17 are provided at four corners of the ultrasonic welding surface 13 of the lower case 12 for the purpose of venting air. Further, slits 18 are provided on a part of the outer peripheral upper surface 20 of the lower case 12 in the present embodiment at two places, that is, the slit 17 at the corner and the intermediate portion of the slit 17.

When the ultrasonic welding surfaces 13 and 13 of the upper case 11 and the lower case 12 are ultrasonically welded, the outer peripheral surface of the upper case 11 and the lower case 12 are
The outer peripheral surface 20 is in close contact, but the ultrasonic welding surface of the lower case 12
Since the slit 17 is provided at 13 and the slit 18 is provided at the outer peripheral surface 20, an air vent passage that penetrates the inside and the outside of the case is formed at the joint surface between the upper case 11 and the lower case 12.

When the epoxy resin 7 is filled in this state, the air remaining especially in the corners of the case is pushed by the filled epoxy resin 7, and as shown by the arrow in FIG.
It is extracted from 17 into a groove 21 between the ultrasonic welding surface 13 and the surface 20 on the outer circumference. And this extracted air is further slit 18
Exit through the case.

Since the slit 17 and the slit 18 are for forming the passage of air, there is no need to make them larger than necessary, and as an example, the slit 17 has a width of about 1 mm and a depth of 0.5 mm or less, and the slit 18 has a width of 2 mm or less. A depth of 0.5 mm or less is sufficient.

As described above, since the air vent passages for removing the inside and the outside of the case by the slits 17 and 18 are formed in the joint surface of the upper case 11 and the lower case 12, when filling the epoxy resin 7, especially in a pressure reducing device or the like. The air inside the case is discharged through this air vent passage by the self-weight pressure of the injected epoxy resin 7 without consideration. As an example, a change in viscosity of the epoxy resin 7, for example, 1-2 after mixing
It was experimentally confirmed that no air remained at any corner of the case after the passage of time and when the case was installed at an angle of 20 to 30 degrees with respect to the horizontal.

In addition, the size of the slit 18 is 2 mm or less and the depth is
When the thickness is 0.5 mm or less, the epoxy resin 7 that has passed through the slit 17 does not leak out from the slit 18 due to its viscosity and the conduit resistance of the case until reaching the slit 18. .

In the above embodiment, the lower case 12 is provided with the slit 17 and the slit 18 for extracting the air inside the case to the outside, but the slits for extracting the air inside the case to the outside may be provided in the upper case 11. .

[Effect of device]

As described above, according to the present invention, when the resin material is filled into the case at a plurality of locations on the joint surface of the upper case or the joint surface of the lower case facing each other, the air in the case is led to the outside. Since a slit is provided, no special air bleeding work is required in the resin filling process, cost can be reduced by shortening the working time of assembly and the like, and the occurrence of unfilled resin in the case can be prevented, which improves reliability. The excellent effect that the case structure of the hybrid integrated circuit device which can be improved can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing the main structure of a hybrid integrated circuit device according to the present invention, and FIG. 2 is a partial sectional view for explaining the details of the air vent path in the perspective view (X-X sectional view of FIG. 1). ), FIG. 3 is a diagram showing an example of the configuration of the conventional hybrid integrated circuit device. In the figure, 2 ... metal plate, 3 ... HIC board, 4 ... connector, 11 ... upper case, 12 ... lower case, 13 ...
Ultrasonic welding surface, 14 …… Terminal, 15 …… Lead frame, 16
…… Screw, 17 …… Slit, 18 …… Slit, 19 …… Opening, 20 …… Outer peripheral surface, 21 …… Groove.

Claims (1)

[Scope of utility model registration request] 1. A case using a thermoplastic material for covering a HIC substrate mounted on a metal plate and an upper case are divided into two parts, and both cases are joined by ultrasonic welding or the like to be integrated, In a case structure of a hybrid integrated circuit device having a structure in which the case is filled with a resin material, the case is provided with resin material in a plurality of cases facing each other on the joint surface of the upper case or the joint surface of the lower case. When filling
A case structure of a hybrid integrated circuit device, wherein a slit for leading out air in the case to the outside is provided.