JPH07151401A - Recovery heat pump - Google Patents

Abstract

PURPOSE:To improve the utility and functionality of a thermal apparatus of a recovery heat pump. CONSTITUTION:A heat pump circuit where refrigerant passages are independent of each other, includes a high temperature side heat pump circuit Sa where a high boiling point refrigerant Ra is circulated over high temperature side condensation Ca and high temperature side vaporization means Ea, and a low temperature side heat pump circuit Sb where a low boiling point refrigerant Rb is circulated over low temperature side condenser means Cb and low temperature side vaporization means Eb. The low temperature side condenser means Cb includes a condenser Cbi for delivery of inter-circuit heat for mutual heat exchange with the high temperature side vaporization means Ea and a condenser Cbo for delivery of outside-heat for heat exchange with an outside-circuit heat radiation object Mh. Otherwise, the high temperature side vaporization means Ea inclides an evaporator for delivery of inter-circuit heat for heat exchange with the low temperature side condenser means Cb and an evaporator for delivery of outside-circuit heat for heat exchange with an outside-circuit heat absorption object.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dual heat pump, and more particularly, as a heat pump circuit having independent refrigerant paths, a high temperature side heat pump circuit for circulating a high boiling point refrigerant between a high temperature side condensing means and a high temperature side evaporating means. , A low temperature side heat pump circuit for circulating the low boiling point refrigerant over the low temperature side condensing means and the low temperature side evaporating means,
The present invention relates to a heat pump configured to mutually exchange heat between the high temperature side evaporating means and the low temperature side condensing means.

[0002]

2. Description of the Related Art The above-mentioned dual heat pump (see FIG. 8) has a structure in which a high temperature side evaporating means Ea in a high temperature side heat pump circuit Sa and a low temperature side condensing means Cb in a low temperature side heat pump circuit Sb exchange heat with each other. As a result, the low temperature side condensing means Cb acts as a heat absorption source of the high temperature side evaporating means Ea (that is, a low heat source for the high temperature side heat pump circuit Sa), and the high temperature side evaporating means Ea serves as a heat radiation source of the low temperature side condensing means Cb ( That is, the high-temperature side heat pump circuit Sb is operated as a high heat source), and thus the high-temperature side heat pump circuit Sa and the low-temperature side heat pump circuit Sb have a stepwise heat pump action (in other words, a refrigerating action) and a high-temperature side heat pump circuit. High temperature generated in the high temperature side condensation means Ca in the circuit Sa and low temperature side heat pump Between the generation low at a low temperature side evaporator means Eb in road Sb, is obtained by that can secure a large temperature difference.

Conventionally, in this type of heat pump, as shown in FIG. 8, the high temperature side evaporating means Ea and the low temperature side condensing means Cb, which exchange heat with each other, are the only objects of heat exchange. That is, for the high temperature side evaporating means Ea, only the low temperature side condensing means Cb is always the heat absorbing source, and for the low temperature side condensing means Cb, only the high temperature side evaporating means Ea is always the heat radiating source. The evaporation means Ea and the low temperature side condensation means Cb were configured.

[0004]

However, in the above prior art, the heat absorption capacity of the high temperature side evaporation means Ea and the heat dissipation capacity of the low temperature side condensation means Cb match, and the high temperature side evaporation means Ea and the low temperature side condensation means are matched. Both heat pump circuits Sa, only in such a form that thermal excess and deficiency do not occur in heat exchange with the means Cb.
Since Sb cannot be operated, it lacks flexibility as a heat device,
From this, in terms of device functionality, the following (a), (b),
There was an inconvenience such as (C).

(A) High temperature side heat pump circuit Sa and low temperature side heat pump circuit S whose refrigerant paths are independent of each other
Although b basically has an independent heat pump function (refrigeration function), the operation of the other heat pump circuit is capacitatively restricted due to the operational restriction in one heat pump circuit. In the other thermal application of the heat pump circuit side, there is a problem that the demand cannot be accurately and stably met.

That is, the operating condition of the high temperature side heat pump circuit Sa is satisfactorily regulated due to operational restrictions in the high temperature side heat pump circuit Sa such as the heat radiation operating condition of the high temperature side condensing means Ca (heating operating condition in heating application). While the heat absorption capacity of the high temperature side evaporating means Ea is regulated, the low temperature side condensing means Cb also applies to the low temperature side heat pump circuit Sb.
The operating state is capacitatively regulated so that the heat dissipation capacity of the high temperature side evaporation means Ea matches the heat absorption capacity of the high temperature side evaporation means Ea.
The heat absorption capacity (cooling capacity in the case of cooling) of the low temperature side evaporation means Eb may be greatly different from the heat absorption capacity required from the heat absorption target side of the low temperature side evaporation means Eb.

On the contrary, the operating condition of the low temperature side heat pump circuit Sb is satisfactorily defined due to operational restrictions of the low temperature side heat pump circuit Sb, such as the heat absorption operating condition of the low temperature side evaporating means Eb (cooling operating condition for cooling application). Accordingly, the heat radiation capacity of the low temperature side condensing means Cb is regulated, whereas the high temperature side heat pump circuit Sa also has the high temperature side evaporating means E.
The operating state is regulated so that the heat absorption capacity of a matches the heat radiation capacity of the low temperature side condensing means Cb. Therefore, the heat radiation capacity (heating capacity in heating applications) of the high temperature side condensing means Ca is There is also a case where the heat radiation capacity of the high temperature side condensation means Ca greatly differs from the heat radiation ability required from the heat radiation target side.

(B) As described above, the operation restriction of one heat pump circuit restricts the operation of the other heat pump circuit, so that the other heat pump circuit itself can effectively exhibit its own holding capacity. From this, therefore, there is a problem that the effective utilization rate (in other words, the capacity utilization rate of the capacity) with respect to the possession capacity of the entire apparatus becomes low, and the apparatus cost becomes relatively high.

That is, the low-temperature side heat pump circuit Sb has a sufficient holding capacity, and the low-temperature side heat pump circuit Sb itself has no operational restrictions. Although the low temperature side evaporating means Eb can be used with a larger heat absorbing capacity or the low temperature side condensing means Cb can be used with a larger heat radiating capacity, the operational restrictions on the high temperature side heat pump circuit Sa side can be used. Therefore, a situation occurs in which the operation of the low temperature side heat pump circuit Sb is limited to a low capacity level, which results in a low effective utilization rate of the holding capacity in the low temperature side heat pump circuit Sb.

On the contrary, the high temperature side heat pump circuit Sa has a sufficient holding capacity, and the high temperature side heat pump circuit Sa itself has no operational restrictions.
Although the high-temperature side heat pump circuit Sa alone can be used for various thermal applications, the high-temperature side condensing means Ca can be used with a larger heat radiation capacity and the high temperature side evaporating means Ea can be used with a larger heat absorption capacity. There is also a situation in which the operation of the high temperature side heat pump circuit Sa is limited to a low capacity level due to the operational restriction on the low temperature side heat pump circuit Sb side. From this, the effective utilization rate of the possessed capacity in the high temperature side heat pump circuit Sa Will be low.

(C) Although it is advantageous that a large temperature difference can be secured between the high temperature generated in the high temperature side condensation means Ca and the low temperature generated in the low temperature side evaporation means Eb, the heat absorbed by the low temperature side evaporation means Eb is obtained. Is radiated only by the high temperature side condensing means Ca, and all the heat radiated by the high temperature side condensing means Ca is absorbed only by the low temperature side evaporating means Eb. As for the case where there are a plurality of heat dissipation targets whose temperature levels are significantly different from each other, or when the temperature level of the heat dissipation targets varies greatly depending on the situation, the high temperature side condensation means Ca may have a larger temperature difference than necessary with respect to the heat dissipation targets. There is a situation where there is no choice but to use a heat dissipation function, and there are multiple endothermic targets that have greatly different temperature levels. Or if that, like if the temperature level of the heat absorption target is greatly changed depending on the situation, situation arises such inevitably is endothermic feature in a large temperature difference than necessary low-temperature side evaporator means Eb to endothermic subject.

However, when the high temperature side condensing means Ca and the low temperature side evaporating means Eb are made to radiate and absorb heat with respect to the heat radiating object, that is, when heat is exchanged with the heat radiating object with an excessive temperature difference, the heat There is a problem that effective energy loss due to replacement becomes large, which is disadvantageous in terms of energy saving.

Moreover, in the high temperature side condensation means Ca, there is an excessive temperature difference between the refrigerant condensation temperature and the heat radiation target temperature, and in the low temperature side evaporation means Eb, the refrigerant evaporation temperature and the heat absorption target temperature. There is also a problem that the operation itself of the heat pump circuit becomes unstable, because the refrigerant pressure is likely to be abnormally lowered or abnormally increased due to an excessive temperature difference.

An object of the present invention is to increase the flexibility of the dual heat pump as a heat device and solve the above-mentioned problems in terms of device functionality.

[0015]

[Means for Solving the Problems]

[First Characteristic Configuration] First of the dual heat pump according to the present invention
The characteristic configuration is a heat pump circuit in which the refrigerant paths are independent of each other, a high temperature side heat pump circuit for circulating the high boiling point refrigerant over the high temperature side condensing means and the high temperature side evaporating means,
A dual heat pump having a configuration in which a low-temperature heat pump circuit that circulates a low-boiling-point refrigerant over the low-temperature side condensation means and the low-temperature side evaporation means is provided, and the high-temperature side evaporation means and the low-temperature side condensation means are heat-exchanged with each other. A circuit for exchanging heat between the low temperature side condensing means and the high temperature side evaporating means for exchanging heat with each other, and a circuit for exchanging heat with an external heat radiation target outside the high temperature side heat pump circuit and the low temperature side heat pump circuit It is composed of a condenser for exchanging external heat.

[Second Characteristic Configuration] A second characteristic configuration of the dual heat pump according to the present invention is a heat pump circuit having independent refrigerant paths, in which high boiling point refrigerant is circulated between the high temperature side condensing means and the high temperature side evaporating means. A side heat pump circuit, a low temperature side heat pump circuit for circulating a low boiling point refrigerant over the low temperature side condensing means and the low temperature side evaporating means, and a structure for mutually exchanging heat between the high temperature side evaporating means and the low temperature side condensing means; In the dual heat pump, an evaporator for heat transfer between circuits for mutually exchanging heat between the high temperature side evaporating means and the low temperature side condensing means, and an external heat absorption target outside the high temperature side heat pump circuit and the low temperature side heat pump circuit And an evaporator for exchanging heat outside the circuit for exchanging heat with.

[Third Characteristic Configuration] A third characteristic configuration of the dual heat pump according to the present invention is a heat pump circuit in which refrigerant paths are independent from each other, and is a high temperature for circulating a high boiling point refrigerant between the high temperature side condensing means and the high temperature side evaporating means. A side heat pump circuit, a low temperature side heat pump circuit for circulating a low boiling point refrigerant over the low temperature side condensing means and the low temperature side evaporating means, and a structure for mutually exchanging heat between the high temperature side evaporating means and the low temperature side condensing means; In the dual heat pump, a condenser for heat exchange between circuits for mutually exchanging heat between the low temperature side condensing means and the high temperature side evaporating means, and an external heat radiation target outside the high temperature side heat pump circuit and the low temperature side heat pump circuit And a condenser for external heat transfer for exchanging heat with the high temperature side evaporating means, and a condenser for heat transfer between circuits described above. An evaporator for exchanging heat between circuits for mutual heat exchange, and an evaporator for exchanging heat for outside the circuit for exchanging heat with the outside heat absorption target outside the high temperature side heat pump circuit and the low temperature side heat pump circuit. It is in.

[0018]

[Action]

[Operation of First Characteristic Configuration] In the first characteristic configuration (see FIG.
Among the condensers Cbi for heat transfer between circuits and the condenser Cbo for heat transfer outside the circuit constituting the low temperature side condensing means Cb, the condenser Cbi for heat transfer between circuits is the high temperature side evaporating means E.
a functions as a heat absorption source of a (that is, a low heat source for the high temperature side heat pump circuit Sa), whereas the condenser Cbo for external heat transfer is a high temperature side heat pump circuit Sa and a low temperature side during operation of the low temperature side heat pump circuit Sb. External heat radiation target Mh outside the side heat pump circuit Sb
For heat dissipation function.

That is, in the first characteristic configuration, the low temperature side heat pump circuit Sb is not limited to the operation using the high temperature side evaporation means Ea in the high temperature side heat pump circuit Sa as a heat radiation source, but also the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb. It is also possible to perform an operation using the external circuit heat radiation target Mh as a heat radiation source.

[Operation of Second Characteristic Configuration] In the second characteristic configuration (see FIG. 3), an evaporator Eai for transferring heat between circuits and an evaporator Eao for transferring heat outside the circuit, which constitute the high temperature side evaporation means Ea. Among them, the evaporator Eai for exchanging heat between circuits functions as a heat source of the low temperature side condensing means Cb (that is, a high heat source for the low temperature side heat pump circuit Sb), while the evaporator for exchanging heat outside the circuit is Eao is the high temperature side heat pump circuit S during the operation of the high temperature side heat pump circuit Sa.
The heat absorption function is performed with respect to the external circuit heat absorption target Mc outside the a and the low temperature side heat pump circuit Sb.

That is, in the second characteristic configuration, the high temperature side heat pump circuit Sa is not only operated by using the low temperature side condensing means Cb in the low temperature side heat pump circuit Sb as a heat absorption source, but also by the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb. It is also possible to perform an operation in which the external heat absorption target Mc is used as the heat absorption source.

[Operation of Third Characteristic Configuration] In the third characteristic configuration (see FIG. 7), a condenser Cbi for exchanging heat between circuits and a condenser Cbo for exchanging heat outside the circuit, which constitute the low temperature side condenser means Cb. Among them, the condenser Cbi for heat exchange between circuits functions as a heat absorption source of the high temperature side evaporating means Ea (that is, a low heat source for the high temperature side heat pump circuit Sa), while the condenser for heat exchange outside the circuit is Cbo is a high temperature side heat pump circuit S during operation of the low temperature side heat pump circuit Sb.
The heat radiation function is performed with respect to the external heat radiation target Mh outside the a and the low temperature side heat pump circuit Sb.

Further, the evaporator Eai for exchanging heat between circuits and the evaporator E for exchanging heat outside the circuit which constitute the high temperature side evaporating means Ea.
Among ao, the evaporator Eai for heat exchange between circuits functions as a heat radiation source of the condenser Cbi for heat exchange between circuits (that is, a high heat source for the heat pump circuit Sb on the low temperature side), and The evaporator Eao for heat transfer functions to absorb heat from the outside heat absorption target Mc outside the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb during the operation of the high temperature side heat pump circuit Sa.

That is, in the third characteristic configuration, the low temperature side heat pump circuit Sb is not only operated by using the high temperature side evaporation means Ea in the high temperature side heat pump circuit Sa as a heat radiation source, but also the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb. It is possible to perform an operation using the external circuit heat radiation target Mh as a heat radiation source. Further, the high temperature side heat pump circuit Sa performs not only the low temperature side condensing means Cb of the low temperature side heat pump circuit Sb as a heat absorbing source but also the high temperature side heat pump. It is also possible to perform an operation in which the external heat absorption target Mc outside the circuit Sa and the low temperature side heat pump circuit Sb is used as the heat absorption source.

[0025]

【The invention's effect】

[Effects of First Characteristic Configuration] According to the first characteristic structure of the present invention, the versatility of the compound heat pump as a heat device can be enhanced, and the following effects (a) to (c) can be obtained.

(A) The heat absorption capacity of the high temperature side evaporating means is defined due to operational restrictions in the high temperature side heat pump circuit,
On the other hand, even if the heat radiation capacity of the inter-circuit heat transfer condenser is regulated to match the heat absorption capacity of the high temperature side evaporating means, the low temperature side heat pump circuit is adjusted by adjusting the heat radiation capacity of the outside circuit heat transfer condenser. It is possible to adjust the heat absorption capacity of the low temperature side evaporation means to the heat absorption capacity required from the heat absorption target side of the low temperature side evaporation means by adjusting the capacity.

That is, regardless of the operational restrictions on the high temperature side heat pump circuit side, it is possible to accurately and stably respond to the demand for thermal use on the low temperature side heat pump circuit side within a certain range. .

(B) Even if the operation of the inter-circuit heat transfer condenser in the low temperature side heat pump circuit is limited to a low capacity level due to operational restrictions on the high temperature side heat pump circuit side, the low temperature side heat pump circuit as a whole Can be operated at a high capacity level by radiating both the inter-circuit heat transfer condenser and the out-of-circuit heat transfer condenser, which allows for operation restrictions on the high temperature side heat pump circuit side. Instead, the low-temperature side heat pump circuit's unique holding capacity is effectively utilized, and the low-temperature side heat pump circuit's low-temperature side evaporating means and external circuit heat transfer condenser are used with great heat absorption / radiation capacity for various heat applications. It becomes possible.

That is, the effective utilization rate of the holding capacity in the low temperature side heat pump circuit, and consequently the effective utilization rate of the holding capacity of the entire apparatus can be improved, and the apparatus cost can be relatively reduced.

(C) While maintaining the advantage that a large temperature difference can be secured between the high temperature generated by the high temperature side condensing means and the low temperature generated by the low temperature side evaporation means, while maintaining the same as before, the temperature of the heat radiating object can be kept at the mutual temperature. When there are multiple heat dissipation targets with greatly different levels, or when the temperature level of the heat dissipation targets changes significantly depending on the situation, etc., the high temperature side condenser means and the outside circuit heat transfer condenser with a lower generated temperature than that The heat radiation function can be selectively performed according to the temperature level of the heat radiation target.

As a result, it is possible to reduce the situation in which the condensing means performs the heat radiation function (heat exchange) with an excessive temperature difference with respect to the object to be radiated, and it is possible to effectively perform the heat radiation operation with an excessive temperature difference. An increase in energy loss and instability of heat pump circuit operation can be suppressed.

[Effects of Second Characteristic Configuration] According to the second characteristic structure of the present invention, it is possible to enhance the flexibility of the compound heat pump as a heat device and obtain the following effects (d) to (f). it can.

(D) The heat dissipation capability of the low temperature side condenser means is defined due to operational restrictions in the low temperature side heat pump circuit,
On the other hand, even if the heat absorption capacity of the inter-circuit heat transfer evaporator is regulated so as to match the heat dissipation capacity of the low temperature side condensation means, the high temperature side heat pump circuit is adjusted by adjusting the heat absorption capacity of the outside circuit heat transfer evaporator. It is possible to adjust the heat dissipation capacity of the high temperature side condenser means to the heat dissipation capacity required by the heat dissipation target side of the high temperature side condenser means by adjusting the capacity of the above.

In other words, regardless of the operational restrictions on the low temperature side heat pump circuit side, it is possible to accurately and stably meet the demand for thermal use on the high temperature side heat pump circuit side within a certain range. .

(E) Even if the operation of the inter-circuit heat transfer evaporator in the high temperature side heat pump circuit is restricted to a low capacity level due to operational restrictions on the low temperature side heat pump circuit side, the high temperature side heat pump circuit as a whole Is capable of operating at a high capacity level by endothermic operation of both the inter-circuit heat transfer evaporator and the outside-circuit heat transfer evaporator, which prevents operating restrictions on the low temperature side heat pump circuit side. Instead, the high temperature side heat pump circuit's unique holding capacity is effectively utilized, and the high temperature side condensing means in the high temperature side heat pump circuit and the external heat transfer evaporator are used with a large heat releasing and absorbing capacity for various heat applications. It becomes possible.

That is, the effective utilization rate of the holding capacity in the high temperature side heat pump circuit, and consequently the effective utilization rate of the holding capacity of the entire apparatus, can be improved, and the apparatus cost can be relatively reduced.

(F) The advantage that a large temperature difference can be secured between the high temperature generated by the high temperature side condensing means and the low temperature generated by the low temperature side evaporation means is maintained as before, but the temperature of the heat absorbing objects is kept at the mutual temperature. If there are multiple endothermic objects with greatly different levels, or if the temperature level of the endothermic objects changes significantly depending on the situation, etc., the low temperature side evaporating means and the external heat transfer evaporator with a higher generated temperature than that are used. The heat absorption function can be selectively performed according to the temperature level of the heat absorption target.

As a result, it is possible to reduce the situation in which the evaporating means has an endothermic function (heat exchange) with an excessive temperature difference with respect to the endothermic object, which is effective due to the endothermic operation with an excessive temperature difference. An increase in energy loss and instability of heat pump circuit operation can be suppressed.

[Effect of Third Characteristic Configuration] According to the third characteristic configuration of the present invention, (a) to (a) of the first characteristic configuration described above
It is possible to obtain both the effect of (c) and the effects of (d) to (f) according to the second characteristic configuration, and to secure higher flexibility and device functionality as a heat device of the multiple heat pump. You can

[0040]

【Example】

[First Embodiment] FIGS. 1 and 2 show a binary heat pump device for hot water supply and cooling and heating using two kinds of refrigerants, a high boiling point refrigerant Ra and a low boiling point refrigerant Rb. In FIG. 1, hot water supply and cooling are performed. FIG. 2 shows the refrigerant flow in the “summer mode”, and FIG. 2 shows the refrigerant flow in the “winter mode” for hot water supply and heating.

Cpa is a high temperature side compressor that circulates the high boiling point refrigerant Ra, Cpb is a low temperature side compressor that circulates the low boiling point refrigerant Rb, and Nw is a heat exchanger for heating water for heating the hot water W in the water heater Zw. A unit, No is an outdoor heat exchanger that absorbs and radiates the outside air OA, and Ni is an indoor heat exchanger that controls the temperature of the air SA supplied to the cooling and heating target area (cooling in cooling, heating in heating).

Fo is an outside air fan that ventilates the outside air OA to the outdoor heat exchanger No, and Fi is an air supply fan that feeds the air SA whose temperature is controlled by the indoor heat exchanger Ni to the cooling / heating target area.

Nx is a relay heat exchanger having an evaporator passage Ex and a condenser passage Cx as mutual heat exchange passages. In this relay heat exchanger Nx, a high boiling point refrigerant after decompression expansion with respect to the evaporator passage Ex. Supply Ra and condenser path Cx
By supplying the high-boiling-point low-boiling-point refrigerant Rb to Rx, heat exchange between the paths Ex and Cx (that is, heat of condensation,
By exchanging heat of vaporization), the high-boiling-point refrigerant Ra is evaporated in the evaporator path Ex as it passes, and the low-boiling-point refrigerant Rb is condensed in the condenser path Cx as it passes.

Ex1 is the evaporator path E of the relay heat exchanger Nx.
The first expansion valve for x, ex2 is the second expansion valve for the indoor heat exchanger Ni, and ex3 is the third expansion valve for the outdoor heat exchanger No. These expansion valves ex1, ex2, ex3
Is configured to be switchable between a state in which it functions as an original expansion valve and a state in which it functions as a simple flow rate adjusting valve.

Reference numerals v1 to v5 are first to fifth adjusting valves for switching the refrigerant path and adjusting the refrigerant flow rate.

In the figure, the black valves show the closed state, and the white valves show the open state.

In this dual heat pump device, a high temperature side heat pump circuit Sa and a low temperature side heat pump circuit Sb having independent refrigerant paths are formed in the device in each of the summer mode and the winter mode, and the high temperature side heat pump circuit S is formed.
In a, the high boiling point refrigerant Ra is circulated by the high temperature side compressor Cpa over the high temperature side condensing means Ca and the high temperature side evaporating means Ea, while in the low temperature side heat pump circuit Sb, the low boiling point refrigerant Rb is passed by the low temperature side compressor Cpb. This is an apparatus configuration in which the low temperature side condensation means Cb and the low temperature side evaporation means Eb are circulated.

In each of the summer mode and the winter mode, the low temperature side condensing means Cb in the low temperature side heat pump circuit Sb is composed of a condenser Cbi for exchanging heat between circuits and a condenser Cbo for exchanging heat outside the circuit. , And the condenser Cbi for heat exchange between circuits is the high temperature side heat pump circuit Sa.
And heat exchange with the high temperature side evaporation means Ea in
The condenser Cbo for exchanging heat from the outside of the circuit is in a device form for exchanging heat with the outside heat radiation target Mh outside the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb.

That is, as a basic form of handling heat, a part of the heat that is pumped up by the low temperature side heat pump circuit Sb from the low temperature endothermic target L (cooling target in the cooling application) and is heated outside the circuit. Transfer condenser Cbo
In the middle temperature outside heat dissipation target Mh (in the heating application, the middle temperature heating target), the other part is transferred to the high temperature side heat pump circuit Sa via the inter-circuit heat transfer condenser Cbi, and is transferred to the high temperature side heat pump circuit. After the temperature is further raised by Sa, the heat is radiated to the high-temperature heat radiating target H (high-temperature heat target in the heating application) in the high temperature side condensing means Ca.

Specific operation modes of the summer mode and the winter mode are as follows.

(Summer Mode) In the summer mode (see FIG. 1), the evaporator path Ex in the relay heat exchanger Nx serves as the high temperature side evaporating means Ea, and the water heating heat exchanger Nw serves as the high temperature side condensing means Ca. , High temperature side heat pump circuit Sa
To form.

The indoor heat exchanger Ni is used as the low temperature side evaporation means Eb, the condenser path Cx in the relay heat exchanger Nx is used as the inter-circuit heat transfer condenser Cbi, and the outdoor heat exchanger No is used. A low temperature side heat pump circuit Sb is formed as a condenser Cbo for transferring and receiving heat from outside the circuit.

That is, for the high-boiling-point refrigerant Ra as a concrete refrigerant flow, the high-boiling-point refrigerant R in the high-pressure gas phase (indicated by a thick black line in the figure) discharged from the high temperature side compressor Cpa.
a is condensed in the water heating heat exchanger Nw at a high condensing temperature, and the condensing heat heats the hot water supply water W as the high temperature heat radiation target H to a hot water supplyable temperature.

The high-boiling-point refrigerant Ra in the liquid phase (shown by the hatched thick line in the figure) delivered from the water heating heat exchanger Nw is decompressed and expanded by the first expansion valve ex1 to form a low-pressure wet vapor state. (Indicated by a thick line with dot hatching in the figure), it is sent to the evaporator path Ex of the relay heat exchanger Nx, and due to the heat of condensation of the low boiling point refrigerant Rb given from the side of the condenser path Cx in the evaporator path Ex. Evaporate at medium evaporation temperature.

Then, the evaporator path E of the relay heat exchanger Nx
The high-boiling-point refrigerant Ra delivered from x in the low-pressure gas phase state (indicated by a white thick line in the figure) is returned to the suction side of the high-temperature side compressor Cpa.

On the other hand, for the low boiling point refrigerant Rb, the high pressure gas phase discharged from the low temperature side compressor Cpb (black thick line)
Low-boiling-point refrigerant Rb of the relay heat exchanger Nx is split-flow-supplied to the condenser path Cx and the outdoor heat exchanger No, and the condenser path Cx and the outdoor heat exchanger No are condensed at medium condensing temperatures. Which causes the condenser path Cx
The heat of condensation in the above is given to the high-boiling-point refrigerant Ra on the side of the evaporator path Ex, and the heat of condensation in the outdoor heat exchanger No is radiated to the outside air OA as the medium temperature outside heat radiation target Mh.

Condenser path C in relay heat exchanger Nx
x and the low boiling point refrigerant Rb in the liquid phase (thick line with hatching) sent from each of the outdoor heat exchanger No.
The low pressure wet steam is expanded by the expansion valve ex2 and sent to the indoor heat exchanger Ni in a low-pressure wet vapor state (thick line with hatching), and is evaporated at a low evaporation temperature in the indoor heat exchanger Ni. The temperature control target air SA as the low temperature heat absorption target L is cooled by heat absorption (desorption of heat of vaporization).

Then, the low boiling point refrigerant Rb delivered from the indoor heat exchanger Ni in a low pressure gas phase state (white thick line) is returned to the suction side of the low temperature side compressor Cpb.

In the summer mode, the heating of the water heating heat exchanger Nw as the high temperature side condensing means Ca is performed by adjusting the output of the high temperature side compressor Cpa so that a desired hot water supply capacity can be obtained in the water heater Zw. Adjust the capacity (heat dissipation capacity).

With the adjustment of the hot water supply capacity, the cooling / heating target area is brought into a desired cooling state, and the heat dissipation capacity of the condenser path Cx as the inter-circuit heat transfer condenser Cbi in the relay heat exchanger Nx is high. The cooling capacity (heat absorption capacity) of the indoor heat exchanger Ni as the low temperature side evaporation means Eb is adjusted by adjusting the output of the low temperature side compressor Cpb so as to match the heat absorption capacity of the evaporator path Ex as the side evaporation means Ea. At the same time, by adjusting the first adjusting valve v1 and the second adjusting valve v2, the condenser path C as the inter-circuit heat transfer condenser Cbi
The heat radiation capacity of x and the heat radiation capacity of the outdoor heat exchanger No as the condenser Cbo for external heat transfer are adjusted.

(Winter Mode) In the winter mode (see FIG. 2), as in the summer mode, the evaporator path Ex in the relay heat exchanger Nx serves as the high temperature side evaporating means Ea, and the water heating heat exchanger Nw has a high temperature. A high temperature side heat pump circuit Sa is formed as the side condensing means Ca.

On the other hand, the outdoor heat exchanger No is used as the low temperature side evaporation means Eb, the condenser path Cx in the relay heat exchanger Nx is used as the inter-circuit heat transfer condenser Cbi, and the indoor heat exchanger Ni is used. A low temperature side heat pump circuit Sb is formed as a condenser Cbo for transferring and receiving heat from outside the circuit.

That is, for the high boiling point refrigerant Ra as a specific refrigerant flow, the high temperature side compressor C is used as in the summer mode.
The high-boiling-point refrigerant Ra of a high-pressure gas phase (thick black line) discharged from pa is condensed at a high condensing temperature in the water heating heat exchanger Nw, and this condensing heat causes the above-mentioned high-temperature heat dissipation target H
The hot water W for heating is heated to a temperature at which hot water can be supplied.

The high-boiling-point refrigerant Ra in the liquid phase (thick line with hatching) sent from the water heating heat exchanger Nw is the first
It is expanded under reduced pressure by the expansion valve ex1 and sent to the evaporator path Ex of the relay heat exchanger Nx in the state of low-pressure wet steam (thick line with point hatching), and is given from the condenser path Cx side in this evaporator path Ex. The heat of condensation of the low boiling point refrigerant Rb evaporates at a medium evaporation temperature.

Then, the evaporator path E of the relay heat exchanger Nx
The high-boiling-point refrigerant Ra sent from x in the low-pressure gas phase state (white thick line) is returned to the suction side of the high-temperature side compressor Cpa.

On the other hand, for the low boiling point refrigerant Rb, the high pressure gas phase discharged from the low temperature side compressor Cpb (black thick line)
Low-boiling-point refrigerant Rb of the relay heat exchanger Nx is diverted and supplied to the condenser path Cx and the indoor heat exchanger Ni, and condensed in each of the condenser path Cx and the indoor heat exchanger Ni at an intermediate condensing temperature. Which causes the condenser path Cx
The condensation heat in the high-boiling-point refrigerant Ra on the side of the evaporator path Ex, and the condensation heat in the indoor heat exchanger Ni heats the temperature-controlled air SA as the medium-temperature outside heat radiation target Mh. To do.

Condenser path C in relay heat exchanger Nx
x and the low-boiling-point refrigerant Rb in the liquid phase (thick line with hatching) sent from each of the indoor heat exchanger Ni are the third
It is decompressed and expanded by the expansion valve ex3 and sent to the outdoor heat exchanger No in a low-pressure wet steam state (thick line with hatching), and is evaporated at a low evaporation temperature in this outdoor heat exchanger No. The outside air OA as the above-mentioned low temperature heat absorption target L is made to absorb heat (take heat of vaporization).

Then, the low boiling point refrigerant Rb delivered from the outdoor heat exchanger No in a low pressure gas phase state (white thick line) is returned to the suction side of the low temperature side compressor Cpb.

In this winter mode, the water heating heat exchanger Nw as the high temperature side condenser Ca is heated by adjusting the output of the high temperature side compressor Cpa so that the desired hot water supply capacity can be obtained in the water heater Zw. Adjust the capacity (heat dissipation capacity).

In addition to the adjustment of the hot water supply capacity, the heating / cooling target area becomes a desired heating state, and the heat dissipation capacity of the condenser path Cx as the inter-circuit heat transfer condenser Cbi in the relay heat exchanger Nx becomes high. The output adjustment of the low temperature side compressor Cpb, and the first adjustment valve v1 and the third adjustment valve v1 and the third adjustment valve v1 so as to match the heat absorption capacity of the evaporator path Ex as the side evaporation means Ea.
By adjusting the adjusting valve v3, the condenser Cb for external heat transfer
Heating capacity of indoor heat exchanger Ni as o (radiation capacity)
And a condenser path C as a condenser Cbi for heat transfer between circuits
x heat dissipation capability.

[Second Embodiment] FIGS. 3 and 4 show a binary heat pump device for refrigerating and cooling / heating using two kinds of refrigerants, a high boiling point refrigerant Ra and a low boiling point refrigerant Rb. In FIG. Fig. 4 shows the refrigerant flow in the "summer mode" for cooling, and Fig. 4 shows the refrigerant flow in the "winter mode" for refrigeration and heating.

In the binary heat pump apparatus shown in the second embodiment, as the high boiling point refrigerant Ra, a refrigerant having a lower boiling point than the high boiling point refrigerant adopted in the binary heat pump apparatus in the first embodiment is used. Also, as the low boiling point refrigerant Rb, a refrigerant having a lower boiling point than the low boiling point refrigerant used in the binary heat pump device in the first embodiment described above is used.

Cpa is a high temperature side compressor that circulates the high boiling point refrigerant Ra, Cpb is a low temperature side compressor that circulates the low boiling point refrigerant Rb, and Nr is a heat exchanger for cooling the inside of the refrigerator Zr. , No is an outdoor heat exchanger that absorbs and radiates the outside air OA, and Ni is an indoor heat exchanger that controls the temperature of the air SA supplied to the cooling and heating target area (cooling in cooling, heating in heating).

Fo is an outside air fan for ventilating the outside air OA to the outdoor heat exchanger No, and Fi is an air supply fan for feeding the air SA temperature-controlled by the indoor heat exchanger Ni to the cooling / heating target area.

Ny is a relay heat exchanger having an evaporator passage Ey and a condenser passage Cy as mutual heat exchange passages. In this relay heat exchanger Ny, a high boiling point refrigerant after decompression expansion with respect to the evaporator passage Ey. Ra is supplied and the condenser path Cy
By supplying the low-boiling-point refrigerant Rb in the high-pressure gas phase to the heat exchange between the paths Ey and Cy (that is, the heat of condensation,
By exchanging heat of vaporization), the high-boiling-point refrigerant Ra is evaporated in the evaporator path Ey as it passes, and the low-boiling-point refrigerant Rb is condensed in the condenser path Cy as it passes.

Ex2 is a second expansion valve for the indoor heat exchanger Ni, ex3 is a third expansion valve for the outdoor heat exchanger No,
ex4 is a fourth expansion valve for the evaporator passage Ey of the relay heat exchanger Ny, ex5 is a fifth expansion valve for the internal cooling heat exchanger Nr, and these ex2 to ex5 are functions as the original expansion valve. And a state in which it functions as a simple flow rate adjusting valve.

Reference numerals v2 to v5 are second to fifth adjusting valves for switching the refrigerant paths.

In the figure, the black valves show the closed state, and the white valves show the open state.

In this binary heat pump device, a high temperature side heat pump circuit Sa and a low temperature side heat pump circuit Sb having mutually independent refrigerant paths are formed in the device in each of the summer mode and the winter mode, and the high temperature side heat pump circuit S is formed.
In a, the high boiling point refrigerant Ra is circulated by the high temperature side compressor Cpa over the high temperature side condensing means Ca and the high temperature side evaporating means Ea, while in the low temperature side heat pump circuit Sb, the low boiling point refrigerant Rb is passed by the low temperature side compressor Cpb. This is an apparatus configuration in which the low temperature side condensation means Cb and the low temperature side evaporation means Eb are circulated.

In each of the summer mode and the winter mode, the high temperature side evaporating means Ea in the high temperature side heat pump circuit Sa is composed of an evaporator Eai for transferring heat between circuits and an evaporator Eao for transferring heat outside the circuit. And, the evaporator Eai for heat exchange between circuits is the low temperature side heat pump circuit Sb.
At the low temperature side condensing means Cb,
The external circuit heat transfer evaporator Eao is in the form of a device that exchanges heat with the external circuit heat absorption target Mc outside the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb.

That is, as a basic form of heat treatment, the evaporator for transferring heat between the circuits heats the pumped-up heat from the low-temperature heat absorption target L (cooling target in cooling application) by the low-temperature side heat pump circuit Sb. In Eai, the high temperature side heat pump circuit Sa is made to absorb heat, and also from the medium temperature outside circuit heat absorption target Mc (medium temperature cooling target in cooling application), the high temperature side heat pump circuit Sa is made to absorb heat in the outside circuit heat transfer evaporator Eao, and Then, after the absorbed heat is raised by the high temperature side heat pump circuit Sa, it is radiated to the high temperature heat radiating target H (high temperature heating target in the heating application) in the high temperature side condensing means Ca.

Specific operation modes of the summer mode and the winter mode are as follows.

(Summer Mode) In the summer mode (see FIG. 3), the outdoor heat exchanger No is used as the high temperature side condensing means Ca, and the evaporator path Ey in the relay heat exchanger Ny is used for the heat transfer between circuits. Eai and indoor heat exchanger N
The high temperature side heat pump circuit Sa is formed by using i as an evaporator Eao for transferring and receiving heat outside the circuit.

Further, the condenser path Cy in the relay heat exchanger Ny is used as the low temperature side condensing means Cb, and the internal heat exchanger Nr is used as the low temperature side evaporation means Eb to form the low temperature side heat pump circuit Sb.

That is, for the high-boiling-point refrigerant Ra as a concrete refrigerant flow, the high-boiling-point refrigerant R in the high-pressure gas phase (indicated by a thick black line in the figure) discharged from the high temperature side compressor Cpa.
a is condensed at a high condensation temperature in the outdoor heat exchanger No, and the heat of condensation is converted into the outside air O as the high-temperature heat radiation target H.
Dissipate heat to A.

High-boiling-point refrigerant Ra in the liquid phase (shown by hatched thick line in the figure) delivered from the outdoor heat exchanger No.
Is a low-pressure wet steam state after being decompressed and expanded by the second and fourth expansion valves ex2 and ex4 (indicated by a thick line with dot hatching in the figure), and the indoor heat exchange with the evaporator path Ey of the relay heat exchanger Ny. It is separately supplied to the evaporator Ni and vaporized at a medium evaporation temperature in each of the evaporator passage Ey and the indoor heat exchanger Ni, so that the low boiling point refrigerant from the condenser passage Cy side in the relay heat exchanger Ny. In addition to absorbing the condensation heat of Rb, it also absorbs heat from the temperature control target air SA as the medium temperature external heat absorption target Mc, and cools the temperature control target air SA.

Then, the evaporator path E of the relay heat exchanger Ny
y and the high-boiling-point refrigerant Ra sent out from each of the indoor heat exchangers Ni in a low-pressure gas phase state (indicated by a thick white line in the drawing) is returned to the suction side of the high-temperature side compressor Cpa.

On the other hand, for the low boiling point refrigerant Rb, the high pressure gas phase discharged from the low temperature side compressor Cpb (black thick line)
The low boiling point refrigerant Rb is condensed in the condenser path Cy in the relay heat exchanger Ny at an intermediate condensing temperature, and the heat of condensation is applied to the high boiling point refrigerant Ra in the evaporator path Ey in the relay heat exchanger Ny.

The low-boiling-point refrigerant Rb in the liquid phase (thick line with hatching) sent out from the condenser path Cy of the relay heat exchanger Ny is decompressed and expanded by the fifth expansion valve ex5 to be in a low-pressure wet vapor state (point The thick line (hatched) is sent to the inside cooling heat exchanger Nr, and this inside cooling heat exchanger Nr is sent.
At the low evaporation temperature, the air in the refrigerator Zr as the low temperature endothermic object L is cooled by heat absorption (vaporization heat removal) at the time of this evaporation.

Then, the low boiling point refrigerant R sent out from the heat exchanger Nr for cooling the inside of the refrigerator in a low-pressure vapor phase state (white thick line).
b is returned to the suction side of the low temperature side compressor Cpb.

In this summer mode, in order to obtain a desired refrigerating capacity in the refrigerator Zr, the output of the low temperature side compressor Cpb is adjusted to cool the inside heat exchanger Nr as the low temperature side evaporation means Eb. Adjust the capacity (heat absorption capacity).

In addition to the adjustment of the refrigerating capacity, the cooling / heating target area is brought into the desired cooling state, and the heat absorption capacity of the evaporator path Ey as the inter-circuit heat transfer evaporator Eai in the relay heat exchanger Ny is low. For the heat transfer outside the circuit by adjusting the output of the high temperature side compressor Cpa and adjusting the second expansion valve ex2 and the fourth expansion valve ex4 so as to match the heat radiation capacity of the condenser path Cy as the side condensation means Cb. The cooling capacity (heat absorption capacity) of the indoor heat exchanger Ni as the evaporator Eao and the heat absorption capacity of the evaporator path Ey as the inter-circuit heat transfer evaporator Eai are adjusted.

(Winter Mode) In the winter mode (see FIG. 4), the indoor heat exchanger Ni is used as the high temperature side condensing means Ca, and the evaporator path Ey in the relay heat exchanger Ny is an evaporator for exchanging heat between circuits. Eai, and outdoor heat exchanger N
The high temperature side heat pump circuit Sa is formed by using o as an evaporator Eao for exchanging heat outside the circuit.

As for the low temperature side heat pump circuit Sb, as in the summer mode, the condenser path Cy in the relay heat exchanger Ny is used as the low temperature side condensing means Cb, and the inside cooling heat exchanger Nr is used as the low temperature side evaporating means. As Eb, the low temperature side heat pump circuit Sb is formed.

That is, for the high boiling point refrigerant Ra as a concrete refrigerant flow, the high boiling point refrigerant Ra in the high pressure gas phase (thick black line) discharged from the high temperature side compressor Cpa is condensed at high temperature in the indoor heat exchanger Ni. The temperature control target air S as the high temperature heat radiation target H is condensed by the temperature
Heat A.

The high-boiling-point refrigerant Ra in the liquid phase (thick line with hatching) delivered from the indoor heat exchanger Ni is decompressed and expanded by the third and fourth expansion valves ex3 and ex4 to form a low-pressure wet vapor state (point A thick line (hatched) is used to separately supply the evaporator path Ey and the outdoor heat exchanger No of the relay heat exchanger Ny, and the evaporator path Ey and the outdoor heat exchanger No.
In each of the relay heat exchangers Ny, thereby absorbing the condensation heat of the low-boiling-point refrigerant Rb from the side of the condenser path Cy in the relay heat exchanger Ny, and as the medium-temperature external heat absorption target Mc. It also absorbs heat from the outside air OA.

Then, the evaporator path E of the relay heat exchanger Ny
y and the high-boiling-point refrigerant Ra sent out from each of the outdoor heat exchanger No in a low-pressure gas phase state (white thick line) is returned to the suction side of the high temperature side compressor Cpa.

On the other hand, for the low boiling point refrigerant Rb, the high pressure gas phase discharged from the low temperature side compressor Cpb (black thick line)
The low boiling point refrigerant Rb is condensed in the condenser path Cy in the relay heat exchanger Ny at an intermediate condensing temperature, and the heat of condensation is applied to the high boiling point refrigerant Ra in the evaporator path Ey in the relay heat exchanger Ny.

The low-boiling-point refrigerant Rb in the liquid phase (thick line with hatching) sent out from the condenser path Cy of the relay heat exchanger Ny is decompressed and expanded by the fifth expansion valve ex5 to be in a low-pressure wet vapor state (point The thick line (hatched) is sent to the inside cooling heat exchanger Nr, and this inside cooling heat exchanger Nr is sent.
At the low evaporation temperature, the air in the refrigerator Zr as the low temperature endothermic object L is cooled by heat absorption (vaporization heat removal) at the time of this evaporation.

Then, the low boiling point refrigerant R sent out from the heat exchanger Nr for cooling the inside of the refrigerator in a low pressure gas phase state (white thick line).
b is returned to the suction side of the low temperature side compressor Cpb.

In this winter mode, in order to obtain a desired refrigerating capacity in the refrigerator Zr, the output of the low temperature side compressor Cpb is adjusted to cool the inside heat exchanger Nr as the low temperature side evaporation means Eb. Adjust the capacity (heat absorption capacity).

Further, with the adjustment of the refrigerating capacity, the cooling / heating target area is brought into a desired heating state, and the heat absorption capacity of the evaporator path Ey as the inter-circuit heat transfer evaporator Eai in the relay heat exchanger Ny is low. The heating capacity (heat radiation capacity) of the indoor heat exchanger Ni as the high temperature side condensation means Ca is adjusted by adjusting the output of the high temperature side compressor Cpa so as to match the heat radiation capacity of the condenser path Cy as the side condensation means Cb. At the same time, by adjusting the third expansion valve ex3 and the fourth expansion valve ex4, the heat absorption capacity of the outdoor heat exchanger No serving as the external heat transfer evaporator Eao and the evaporator path serving as the inter-circuit heat transfer evaporator Eai. Adjust the heat absorption capacity of Ey.

[Third Embodiment] FIG. 5 and FIG. 6 show a three-way heat pump device for supplying hot water, cooling and heating, and refrigerating by using three kinds of refrigerants R1, R2, and R3 having different boiling points. FIG. 6 shows the refrigerant flow in the “summer mode” for cooling and refrigeration, and FIG. 6 shows the refrigerant flow in the “winter mode” for hot water supply, heating and refrigeration.

Cp1 is a first compressor for circulating the first refrigerant R1 having the highest boiling point among the three kinds of refrigerants R1 to R3, Cp1
2 is a second compressor that circulates a second refrigerant R2 having the next highest boiling point after the first refrigerant R1, and Cp3 is a third refrigerant R having the lowest boiling point.
It is a third compressor that circulates 3 and other than the above-mentioned first
The same parts as those shown in the embodiment or the second embodiment are designated by the same reference numerals as those used in the first and second embodiments.

The ternary heat pump device shown in the third embodiment is the low temperature side heat pump circuit Sb in the binary heat pump device shown in the first embodiment and the high temperature side heat pump in the binary heat pump device shown in the second embodiment. The circuit Sa and the binary heat pump device are combined as a common circuit, and the operation modes in the summer mode and the winter mode are as follows.

(Summer mode) Regarding the first refrigerant R1,
The first refrigerant R1 in the high pressure gas phase (indicated by the thick black line in the figure) discharged from the first compressor Cp1 is used as the water heating heat exchanger N.
At w, the water is condensed at a high condensation temperature, and the water for hot water supply W is heated to a temperature at which hot water can be supplied by this condensation heat.

The first refrigerant R in the liquid phase (indicated by the thick line with hatching in the figure) delivered from the water heating heat exchanger Nw
1 is a state of low-pressure wet steam after being decompressed and expanded by the first expansion valve ex1 (indicated by a thick line with dot hatching in the figure)
Then, the evaporator path Ex in the relay heat exchanger Nx on the high temperature side
In the evaporator path Ex, the heat of condensation of the second refrigerant R2 provided from the side of the condenser path Cx evaporates at a higher intermediate temperature.

Then, the first refrigerant R1 delivered in the low-pressure gas phase state (indicated by a thick white line in the figure) from the evaporator path Ex in the relay heat exchanger Nx on the high temperature side is supplied to the first compressor C.
Return to the suction side of p1.

For the second refrigerant R2, the second compressor Cp
The second refrigerant R2 in the high-pressure gas phase (thick black line) discharged from 2 is diverted to the condenser path Cx and the outdoor heat exchanger No in the relay heat exchanger Nx on the high temperature side, and these condensers are supplied. In each of the path Cx and the outdoor heat exchanger No, the heat is condensed at a condensing temperature close to the high temperature, whereby the heat of condensation in the condenser path Cx in the relay heat exchanger Nx on the high temperature side is converted to the first heat on the side of the evaporator path Ex. The heat of condensation in the outdoor heat exchanger No is radiated to the outside air OA while being given to one refrigerant R1.

The second refrigerant R1 in the liquid phase (thick line with hatching) sent from each of the condenser path Cx in the relay heat exchanger Nx on the high temperature side and the outdoor heat exchanger No,
Low-pressure wet steam state after decompressing and expanding by the second and fourth expansion valves ex2 and ex4 (dotted thick line)
Then, the evaporator path Ey in the relay heat exchanger Ny on the low temperature side
And the indoor heat exchanger Ni are separately supplied, and vaporized at an evaporation temperature of a medium temperature, which is close to a low temperature, in each of the evaporator path Ey and the indoor heat exchanger Ni, thereby condensing in the relay heat exchanger Ny on the low temperature side. The third refrigerant R from the side of the device path Cy
In addition to absorbing the heat of condensation of No. 3, the indoor heat exchanger Ni also absorbs heat from the temperature control target air SA, and the temperature control target air S
Cool A.

Then, the second refrigerant R2 sent out in a low-pressure gas phase state (white thick line) from each of the evaporator path Ey in the relay heat exchanger Ny on the low temperature side and the indoor heat exchanger Ni is 2 Return to the suction side of the compressor Cp2.

As for the third refrigerant R3, the high-pressure gas-phase (thick black line) third refrigerant R3 discharged from the third compressor Cp3 is passed through the condenser path Cy in the relay heat exchanger Ny on the low temperature side. Condensation is performed at a condensing temperature near the low temperature, and this condensation heat is applied to the second refrigerant R2 in the evaporator path Ey in the relay heat exchanger Ny on the low temperature side.

The third refrigerant R3 in the liquid phase (thick line with hatching) delivered from the condenser path Cy in the relay heat exchanger Ny on the low temperature side is decompressed and expanded by the fifth expansion valve ex5 to form low-pressure wet steam. It is sent to the inside cooling heat exchanger Nr in the state (thick line with hatching), and is evaporated at a low evaporation temperature in this inside cooling heat exchanger Nr, and the heat absorption (vaporization heat removal) at the time of this evaporation is carried out. ), The air in the refrigerator Zr is cooled.

Then, the third refrigerant R3 is sent from the heat exchanger Nr for cooling the inside of the refrigerator in a low-pressure gas phase state (white thick line).
To the suction side of the third compressor Cp3.

(Winter Mode) Regarding the first refrigerant Ra,
Similar to the summer mode, the first refrigerant R1 in the high-pressure gas phase (thick black line) discharged from the first compressor Cp1 is condensed at a high condensing temperature in the water heating heat exchanger Nw, and hot water is supplied by this condensing heat. The water W is heated to a temperature at which hot water can be supplied.

The first refrigerant R1 in the liquid phase (thick line with hatching) delivered from the water heating heat exchanger Nw is decompressed and expanded by the first expansion valve ex1 to form a low-pressure wet vapor state (dotted hatching). The thick line) is sent to the evaporator path Ex in the relay heat exchanger Nx on the high temperature side, and this evaporator path E
At x, the heat of condensation of the second refrigerant R2 given from the side of the condenser path Cx evaporates at a high-temperature medium-temperature evaporation temperature.

Then, the state of the low pressure gas phase from the evaporator path Ex in the relay heat exchanger Nx on the high temperature side (white thick line)
The first refrigerant R1 sent out in step 1 is returned to the suction side of the first compressor Cp1.

For the second refrigerant R2, the second compressor Cp
The second refrigerant R2 in the high pressure gas phase (thick black line) discharged from 2 is diverted to the condenser path Cx and the indoor heat exchanger Ni in the relay heat exchanger Nx on the high temperature side, and these condensers are supplied. In each of the route Cx and the indoor heat exchanger Ni, the heat is condensed at a condensing temperature close to the high temperature, so that the heat of condensation in the condenser route Cx in the relay heat exchanger Nx on the high temperature side is converted to the first heat on the side of the evaporator route Ex. The temperature control target air S is given by the heat of condensation in the indoor heat exchanger Ni while being given to one refrigerant R1.
Heat A.

The second refrigerant R2 in the liquid phase (thick line with hatching) delivered from each of the condenser path Cx in the relay heat exchanger Nx on the high temperature side and the indoor heat exchanger Ni,
Low-pressure wet steam state after being decompressed and expanded by the third and fourth expansion valves ex3 and ex4 (dotted thick line)
Then, the evaporator path Ey in the relay heat exchanger Ny on the low temperature side
And the outdoor heat exchanger No. are supplied in a branched manner to evaporate at a low-temperature intermediate temperature evaporation temperature in each of the evaporator path Ey and the outdoor heat exchanger No., thereby condensing in the relay heat exchanger Ny on the low temperature side. The third refrigerant R from the side of the device path Cy
The heat of condensation of No. 3 is absorbed, and the heat of the outdoor heat exchanger No is also absorbed from the outside air OA.

Then, the second refrigerant R2 delivered in a low-pressure gas phase state (white thick line) from each of the evaporator passage Ey in the relay heat exchanger Ny on the low temperature side and the outdoor heat exchanger No. 2 Return to the suction side of the compressor Cp2.

For the third refrigerant R3, the third compressor Cp
The high-pressure gas phase (thick black line) third refrigerant R3 discharged from No. 3 is condensed in the condenser path Cy in the relay heat exchanger Ny on the low temperature side at a condensing temperature close to the low temperature, and the heat of condensation is low. It is applied to the second refrigerant R2 in the evaporator path Ey in the relay heat exchanger Ny on the side.

The third refrigerant R3 in the liquid phase (thick line with hatching) delivered from the condenser path Cy in the relay heat exchanger Ny on the low temperature side is decompressed and expanded by the fifth expansion valve ex5 to form low-pressure wet steam. In the state (thick line with hatching), it is sent to the inside cooling heat exchanger Nr, and is evaporated at a low evaporation temperature in this inside cooling heat exchanger Nr, and the heat absorption (vaporization heat removal) at the time of this evaporation is carried out. ), The air in the refrigerator Zr is cooled.

Then, the third refrigerant R3 is sent out from the inside cooling heat exchanger Nr in a low-pressure gas phase state (white thick line).
To the suction side of the third compressor Cp3.

In other words, in this ternary heat pump device, in the summer mode and the winter mode, the first refrigerant R1 and the second refrigerant R2 among the three kinds of refrigerants are viewed as the binary heat pump shown in the first embodiment. Device configuration equivalent to the device, that is, the first refrigerant R as the high boiling point refrigerant Ra
The high temperature side heat pump circuit Sa that circulates 1 through the high temperature side condensing means Ca and the high temperature side evaporating means Ea, and the second refrigerant R2 as the low boiling point refrigerant Rb is the low temperature side condensing means C.
b and the low temperature side heat pump circuit Sb which circulates between the low temperature side evaporation means Eb are formed in the apparatus, and the low temperature side condensing means Cb in the low temperature side heat pump circuit Sb is a condenser Cbi for inter-circuit heat transfer. The condenser Cbi for external heat transfer between circuits is configured to exchange heat with the high temperature side evaporating means Ea in the high temperature side heat pump circuit Sa, and the external circuit heat transfer is performed. The condenser Cbo is a high temperature side heat pump circuit S
The apparatus configuration is such that heat is exchanged with the external heat radiation target Mh outside the a and the low temperature side heat pump circuit Sb.

In the summer mode (see FIG. 5), the evaporator path E in the relay heat exchanger Nx on the high temperature side is used.
The high temperature side heat pump circuit Sa is formed by using x as the high temperature side evaporating means Ea and the water heating heat exchanger Nw as the high temperature side condensing means Ca, while the evaporator in the low temperature side relay heat exchanger Ny is formed. The route Ey and the indoor heat exchanger Ni are used as the low temperature side evaporation means Eb, and the high temperature side relay heat exchanger N is used.
The condenser path Cx at x is the condenser C for exchanging heat between circuits.
Further, the low temperature side heat pump circuit Sb is formed by using the outdoor heat exchanger No as the bi and the outdoor heat exchanger No as the condenser Cbo for exchanging the external heat.

In the winter mode (see FIG. 6),
The high temperature side heat pump circuit S is constituted by using the evaporator path Ex in the high temperature side relay heat exchanger Nx as the high temperature side evaporation means Ea and the water heating heat exchanger Nw as the high temperature side condensing means Ca.
In contrast to forming a, the evaporator path Ey and the outdoor heat exchanger No in the low temperature side relay heat exchanger Ny are used as the low temperature side evaporation means Eb, and the condenser path in the high temperature side relay heat exchanger Nx is used. The low temperature side heat pump circuit Sb is formed by using Cx as a condenser Cbi for heat exchange between circuits and further using the indoor heat exchanger Ni as a condenser Cbo for heat exchange between outside circuits.

On the other hand, regarding the second refrigerant R2 and the third refrigerant R3 among the three kinds of refrigerants, as the apparatus form equivalent to the binary heat pump apparatus shown in the above-mentioned second embodiment, that is, as the high boiling point refrigerant Ra '. High temperature side heat pump circuit Sa 'for circulating the second refrigerant R2 of the second refrigerant R2 over the high temperature side condensing means Ca' and the high temperature side evaporating means Ea ', and the low boiling point refrigerant R
Each of the low temperature side heat pump circuits Sb 'for circulating the second refrigerant R2 as b'through the low temperature side condensing means Cb' and the low temperature side evaporating means Eb 'is formed in the apparatus, and in the high temperature side heat pump circuit Sa'. The high temperature side evaporating means Ea ′ is composed of an evaporator Eai ′ for heat transfer between circuits and an evaporator Eao ′ for heat transfer between outside circuits, and the evaporator Eai ′ for heat transfer between circuits is a low temperature side heat pump. The evaporator Eao 'for exchanging heat with the low temperature side condensing means Cb' in the circuit Sb 'and for exchanging heat outside the circuit includes a high temperature side heat pump circuit Sa' and a low temperature side heat pump circuit S.
An apparatus configuration is adopted in which heat is exchanged with the external heat absorption target Mc outside the b '.

In the summer mode (see FIG. 5), the condenser path C in the high temperature side relay heat exchanger Nx is used.
x and the outdoor heat exchanger No are the high temperature side condensing means Ca ′, and the evaporator path Ey in the low temperature side relay heat exchanger Ny.
Is used as an evaporator Eai ′ for heat transfer between circuits, and the indoor heat exchanger Ni is used as an evaporator Eao ′ for heat transfer between outside circuits to form a high temperature side heat pump circuit Sa ′. Condenser path Cy in relay heat exchanger Ny
Is used as the low temperature side condensing means Cb ', and the internal heat exchanger Nr for low temperature side is used as the low temperature side evaporation means Eb' to form the low temperature side heat pump circuit Sb '.

In the winter mode (see FIG. 6),
The condenser path Cx and the indoor heat exchanger Ni in the high temperature side relay heat exchanger Nx are used as the high temperature side condensing means Ca ′, and the evaporator path Ey in the low temperature side relay heat exchanger Ny is used for inter-circuit heat transfer. The high temperature side heat pump circuit Sa 'is formed by using the evaporator Eai' as the evaporator Eao 'and the outdoor heat exchanger No as the outside circuit heat transfer evaporator Eao', while the condenser in the relay heat exchanger Ny on the low temperature side is formed. The path Cy is used as the low temperature side condensing means Cb ′, and the internal heat exchanger Nr is used as the low temperature side evaporation means Eb ′, and the low temperature side heat pump circuit S is used.
forming b '.

[Fourth Embodiment] FIG. 7 shows a binary heat pump device used for various purposes, and includes a high temperature side heat pump circuit Sa and a low temperature side heat pump circuit Sb as heat pump circuits having mutually independent refrigerant paths, In the high temperature side heat pump circuit Sa, the high boiling point refrigerant Ra is supplied to the high temperature side compressor Cpa, the high temperature side condensing means Ca, and the high temperature side expanding means ex.
a and high temperature side evaporation means Ea are circulated in this order, while
In the low temperature side heat pump circuit Sb, the low boiling point refrigerant Rb is circulated in the order of the low temperature side compressor Cpb, the low temperature side condensing means Cb, the low temperature side expansion means exb, and the low temperature side evaporation means Eb.

The low temperature side condensing means Cb in the low temperature side heat pump circuit Sb is the condenser C for transferring heat between circuits.
The condenser Cbi for exchanging heat between circuits among the condensers Cbi and Cbo is a condenser Cbo for exchanging heat from outside the circuit, and the condenser Cbi for exchanging heat between circuits is a mutual heat exchange with the high temperature side evaporation means Ea in the high temperature side heat pump circuit Sa. On the other hand, the condenser Cbo for exchanging heat outside the circuit is designed to exchange heat with the outside heat radiation target Mh outside the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb.

The high temperature side evaporation means Ea in the high temperature side heat pump circuit Sa is an evaporator Ea for transferring heat between circuits.
i and an evaporator Eao for exchanging heat outside the circuit, and among these evaporators Eai and Eao, an evaporator E for exchanging heat between circuits
ai mutually exchanges heat with the inter-circuit heat transfer condenser Cbi in the low temperature side heat pump circuit Sa, while the outside circuit heat transfer evaporator Eao includes the high temperature side heat pump circuit Sa and the low temperature side heat pump circuit Sb. The heat is exchanged with the external circuit heat absorption target Mc.

That is, as a basic form of heat treatment, a part of the heat that is pumped up from the low temperature endothermic target L (cooling target in the case of cooling) by the low temperature side heat pump circuit Sb and is heated outside the circuit. Transfer condenser Cbo
In, the heat is radiated to the medium temperature outside heat radiation target Mh (the medium temperature heating target in the heating application), and the other part is transferred to the high temperature side heat pump circuit Sa via the inter-circuit heat transfer condenser Cbi.

In the high temperature side heat pump circuit Sa, the heat from the low temperature side heat pump circuit Sb is absorbed in the inter-circuit heat transfer evaporator Eai, and at the same time, the medium temperature outside heat absorption object Mc (medium temperature cooling for cooling purpose) is used. The object) also absorbs heat in the evaporator Eao for transferring heat outside the circuit, raises the temperature of the absorbed heat, and then the high temperature side condensing means C
In a, heat is radiated to the high-temperature heat-dissipation target H (high-temperature heat-target in heating applications).

Note that vbi and vbo are condensers Cbi for exchanging heat between circuits in the low temperature side heat pump circuit Sb.
And a condenser Cbo for exchanging heat from the outside of the circuit, which is a flow rate adjusting valve for adjusting the heat radiation capacity ratio, and also vai, vao
Is a flow rate adjusting valve for adjusting the heat absorption capacity ratio of the evaporator Eai for heat exchange between circuits and the evaporator Eao for heat exchange between outside circuits in the high temperature side heat pump circuit Sa. In the dual heat pump device,
By adjusting the flow rate adjusting valves vai, vao, vbi, vbo and adjusting the outputs of the high temperature side compressor Cpa and the low temperature side compressor Cpb, the heat radiation capacity of the inter-circuit heat transfer condenser Cbi and the inter-circuit heat transfer evaporation While matching the heat absorption capacity of the condenser Eai, the heat absorption capacity of the low temperature side evaporation means Eb and the heat dissipation capacity of the high temperature side condensation means Ca, or the heat dissipation capacity of the outside circuit heat transfer condenser Cbo and the outside circuit heat transfer Evaporator E
Adjust each capacity such as ao's heat absorption capacity.

[Other Example]

(1) The object of heat radiation of the high temperature side condensing means Ca and the external heat transfer condenser Cbo is not limited to air or water, but a gas other than air or a liquid other than water, or a solid or the like. May be

When the high temperature side condensation means Ca and the outside-circuit heat transfer condenser Cbo are used for heating purposes, the heating applications are not limited to hot water supply and heating, but can be applied to various heating applications.

(2) The heat absorption target of the low temperature side evaporation means Eb and the outside circuit heat transfer evaporator Eao is not limited to air or water, but a gas other than air or a liquid other than water, or a solid or the like. May be

When the low temperature side evaporating means Eb and the external heat transfer evaporator Eao are used for cooling purposes, the cooling applications are not limited to refrigeration and cooling but can be applied to various cooling applications.

(3) Inter-circuit heat transfer condenser Cbi and high temperature side evaporation means Ea (or inter-circuit heat transfer evaporator Ea)
i) specific mutual heat exchange, and specific mutual heat exchange between the inter-circuit heat transfer evaporator Eai and the low temperature side condensing means Cb (or the inter-circuit heat transfer condenser Cbi), respectively.
Various heat exchange structures can be adopted.

It should be noted that reference numerals are added to the claims for convenience of comparison with the drawings, but the present invention is not limited to the structures of the accompanying drawings by the entry.

[Brief description of drawings]

FIG. 1 is a circuit diagram showing a refrigerant flow in a summer mode in a first embodiment.

FIG. 2 is a circuit diagram showing a refrigerant flow in a winter mode in the first embodiment.

FIG. 3 is a circuit diagram showing a refrigerant flow in a summer mode in the second embodiment.

FIG. 4 is a circuit diagram showing a refrigerant flow in a winter mode in the second embodiment.

FIG. 5 is a circuit diagram showing a refrigerant flow in a summer mode in the third embodiment.

FIG. 6 is a circuit diagram showing a refrigerant flow in a winter mode according to a third embodiment.

FIG. 7 is a basic circuit diagram in the fourth embodiment.

FIG. 8 is a circuit diagram showing a conventional example.

[Explanation of symbols]

 Ra High boiling point refrigerant Rb Low boiling point refrigerant Sa High temperature side heat pump circuit Sb Low temperature side heat pump circuit Ca High temperature side condensing means Cb Low temperature side condensing means Cbi Circuit heat transfer condenser Cbo Circuit outside heat transfer condenser Ea High temperature side evaporation means Eb Evaporator for low temperature side Eai Evaporator for heat transfer between circuits Eao Evaporator for heat transfer outside circuit Mh Target for heat dissipation outside circuit Mc Target for heat absorption outside circuit

Claims (3)

[Claims] 1. A high-boiling-point refrigerant (Ra) is used as a high-temperature side condensing means (C) as a heat pump circuit having independent refrigerant paths.
a) and a high temperature side heat pump circuit (Sa) that circulates between the high temperature side evaporation means (Ea) and a low boiling point refrigerant (R).
b) is a low temperature side condensation means (Cb) and a low temperature side evaporation means (E
b) is provided with a low temperature side heat pump circuit (Sb), the high temperature side evaporating means (Ea) and the low temperature side condensing means (C).
A dual heat pump configured to mutually exchange heat with b), wherein the condenser for inter-circuit heat transfer exchanges heat between the low temperature side condensing means (Cb) and the high temperature side evaporating means (Ea). (Cbi) and an external heat transfer condenser (Cbo) for exchanging heat with an external heat radiation target (Mh) outside the high temperature side heat pump circuit (Sa) and the low temperature side heat pump circuit (Sb). There is a compound heat pump. 2. A high-boiling-point refrigerant (Ra) serving as a high-temperature side condensing means (C) as a heat pump circuit having refrigerant paths independent of each other.
a) and a high temperature side heat pump circuit (Sa) that circulates between the high temperature side evaporation means (Ea) and a low boiling point refrigerant (R).
b) is a low temperature side condensation means (Cb) and a low temperature side evaporation means (E
b) is provided with a low temperature side heat pump circuit (Sb), the high temperature side evaporating means (Ea) and the low temperature side condensing means (C).
A dual heat pump configured to mutually exchange heat with b), wherein the evaporator for inter-circuit heat transfer exchanges heat between the high temperature side evaporation means (Ea) and the low temperature side condensation means (Cb). (Eai), and an evaporator (Eao) for external heat transfer for exchanging heat with the external heat absorption target (Mc) outside the high temperature side heat pump circuit (Sa) and the low temperature side heat pump circuit (Sb). There is a compound heat pump. 3. A high-boiling-point refrigerant (Ra) serving as a high-temperature-side condensing means (C) as a heat pump circuit having independent refrigerant paths.
a) and a high temperature side heat pump circuit (Sa) that circulates between the high temperature side evaporation means (Ea) and a low boiling point refrigerant (R).
b) is a low temperature side condensation means (Cb) and a low temperature side evaporation means (E
b) is provided with a low temperature side heat pump circuit (Sb), the high temperature side evaporating means (Ea) and the low temperature side condensing means (C).
A dual heat pump configured to mutually exchange heat with b), wherein the condenser for inter-circuit heat transfer exchanges heat between the low temperature side condensing means (Cb) and the high temperature side evaporating means (Ea). (Cbi) and an external heat transfer condenser (Cbo) for exchanging heat with an external heat radiation target (Mh) outside the high temperature side heat pump circuit (Sa) and the low temperature side heat pump circuit (Sb). , An inter-circuit heat transfer evaporator (Eai) for exchanging heat between the high temperature side evaporation means (Ea) and the inter circuit heat transfer condenser (Cbi), and the high temperature side heat pump circuit (S).
A dual heat pump configured by a) and an evaporator (Eao) for external heat exchange for exchanging heat with an external heat absorption target (Mc) outside the low temperature side heat pump circuit (Sb).