JPH07167518A - Heat pump type air conditioning humidifier - Google Patents

Abstract

PURPOSE:To drive with refrigerants adapted for air cooling means by composing air cooling means for cooling of a heat absorbing evaporator out of a circuit, and composing air cooling means for dehumidifying of a low-temperature side evaporator, and providing relay heat transfer means for heat exchanging the evaporator for heat transferring between circuits with a low-temperature side condenser. CONSTITUTION:A high-temperature side evaporator Ev1 is divided to an evaporator Evs for heat transferring between circuits formed of a low-pressure vapor- phase refrigerant flowing unit 8 of a relay heat exchanger 8, and an evaporator Evm for absorbing heat out of the circuit formed of a second indoor heat exchanger. Accordingly, air cooling means F for cooling is formed of an evaporator Evm, and an air cooling means D for humidifying is formed of a low- temperature side evaporator Ev2. A relay heat exchanger 8 for heat exchanging the evaporator Evs with a low-temperature side condenser Cd2 is formed as relay heat transferring means. Thus, various boiling point refrigerants are adapted for utilities of humidifying, cooling air cooling means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air-cooling unit for cooling, which cools and regulates the temperature-controlled air by absorbing heat due to refrigerant evaporation, and cools the dehumidifying air by absorbing heat due to refrigerant evaporation to remove water. The present invention relates to a heat pump type air conditioner / dehumidifier provided with an air cooling unit for dehumidification.

[0002]

2. Description of the Related Art Conventionally, in this type of heat pump type air-conditioning dehumidifier, an evaporator which constitutes an air cooling means for cooling for adjusting the temperature of the air to be temperature-controlled by the heat absorption due to the evaporation of the refrigerant, and the evaporation of the refrigerant The evaporator that constitutes the air cooling means for dehumidification that cools the air to be dehumidified by absorbing heat and removes the moisture is installed in parallel in the same heat pump circuit in which one type of refrigerant circulates, and is passed to each evaporator. The capacities of the cooling air cooling means and the dehumidifying air cooling means are adjusted by adjusting the flow rate of the refrigerant.

[0003]

However, according to the above-mentioned prior art, in the evaporator which constitutes the air cooling means for dehumidification, the air cooling means for cooling is constituted in order to effectively dehumidify. Since a considerably lower evaporation temperature is required compared to the evaporator, the refrigerant in the heat pump circuit is
The use of relatively low boiling point refrigerants is essential.

Therefore, in the heat pump circuit of the above-mentioned conventional structure, even in the evaporator constituting the air cooling means for cooling, the considerably low evaporation temperature as described above (that is, the cooling temperature of the cooling air is adjusted). (For example, if the temperature is unnecessarily low), the cooling temperature of the cooling air is adjusted, so the refrigerant flow rate of the evaporator that constitutes the cooling air cooling means is always squeezed to a very low temperature. And, since the cooling air is cooled by the refrigerant having a small flow rate, the thermal efficiency of the cooling air cooling means is lowered, and the uniformity of the air cooling state of the cooling air cannot be improved. In addition, there is a disadvantage that an effective energy loss is increased by cooling an object to be cooled by a cold heat source having an unnecessarily low temperature.

Further, when a refrigerant having a relatively low boiling point is used, the condensation temperature in the condenser must be kept at a relatively low temperature, so that the heat radiation source in the condenser is, for example, the atmosphere in summer. , When the heat source has a relatively high temperature, the temperature of the heat source may be close to or higher than the condensation temperature of the condenser, and heat may be released effectively in the condenser. There was an inconvenience that I could not forget.

Incidentally, the air cooling means for dehumidification is constituted by an independent heat pump circuit different from the heat pump circuit of the air cooling means for cooling, and a high boiling point type is used in the heat pump circuit of the air cooling means for cooling. It is possible to use low-boiling point refrigerants in the heat pump circuit of the air cooling means for dehumidification, but if the atmosphere is used as a heat source, outdoor installation or an outside air intake duct facility is required. For example, the heat dissipation condensers are provided with various restrictions for installation, and the heat dissipation circuit is provided with two independent heat pump circuits. The inconvenience that the heat dissipation is not performed effectively due to the low temperature,
It was something that could not be resolved.

An object of the present invention is to eliminate various inconveniences in the prior art as described above.

[0008]

A first characteristic configuration of a heat pump type air conditioning dehumidifier according to the present invention is a high temperature side heat pump circuit for circulating a high boiling point refrigerant between a high temperature side condenser for heat radiation and a high temperature side evaporator. , And a low temperature side heat pump circuit for circulating the low boiling point refrigerant over the low temperature side condenser and the low temperature side evaporator, and the high temperature side evaporator is an evaporator for heat transfer between circuits and an evaporator for heat absorption outside the circuit. The air cooling means for cooling is constituted by the evaporator for absorbing heat outside the circuit, and the air cooling means for dehumidification is constituted by the evaporator on the low temperature side. A relay heat transfer means for exchanging heat between the condenser and the low temperature side condenser is provided.

The second and third characteristic constitutions of the heat pump type air conditioning / dehumidifying device according to the present invention specify a preferable concrete constitution for carrying out the first characteristic constitution,

A second characteristic configuration is to provide reheating air heating means for heating the air dehumidified by the dehumidifying air cooling means, and the reheating air heating means is the high temperature side. It is composed of a part of the condenser.

A third characteristic configuration is that the high temperature side heat pump circuit and the low temperature side heat pump circuit are configured to circulate a high boiling point refrigerant and a low boiling point refrigerant in a mixed state by a common compressor for sucking and discharging. It is in.

[0012]

According to the first characteristic configuration of the present invention, a high temperature side heat pump circuit for circulating a high boiling point refrigerant over a high temperature side condenser for heat dissipation and a high temperature side evaporator, and a low boiling point refrigerant for a low temperature side condenser. And a low temperature side heat pump circuit that circulates between the low temperature side evaporator and the low temperature side evaporator, and the high temperature side evaporator is divided into an evaporator for heat transfer between circuits and an evaporator for heat absorption outside the circuit, and the air cooling means for cooling is Since it is composed of an evaporator for heat absorption outside the circuit, and the air cooling means for dehumidification is composed of a low temperature side evaporator, each of the air cooling means for dehumidification and the air cooling means for cooling is respectively provided. It is possible to operate with a refrigerant of a boiling point type suitable for the use (required temperature) of the air cooling means,
Moreover, since the relay heat transfer means for exchanging heat between the evaporator for heat transfer between circuits and the low temperature side condenser is provided, the heat radiation source of the low temperature side condenser is used for heat transfer between circuits in the high temperature side evaporator. In the form of an evaporator of, both the high and low heat pump circuits can be operated, and thus, although the high and low heat pump circuits are provided, a condenser for heat dissipation to a heat source outside the circuit, that is, as a whole device The heat radiating condenser can be only one of the high temperature side condensers, and the heat radiating temperature of the heat radiating condenser to the heat radiating source outside the circuit and the heat absorption of the low temperature side evaporator as the dehumidifying air cooling means. A large temperature difference from the temperature can be taken.

According to the second characteristic constitution, the reheating air heating means for heating the air dehumidified by the dehumidifying air cooling means is provided, and the reheating air heating means is provided on the high temperature side. Since it is composed of a part of the condenser, it is possible to use a part of high temperature heat to be exhausted to a heat radiation source outside the circuit without providing another heating source (for example, an electric heater). The air after being cooled and dehumidified can be efficiently reheated to be dried air.

According to the third characteristic configuration, the high temperature side heat pump circuit and the low temperature side heat pump circuit are configured to circulate the high boiling point refrigerant and the low boiling point refrigerant by a common compressor that sucks and discharges the high boiling point refrigerant in a mixed state. Therefore, it is not necessary to provide a dedicated compressor for each of the high temperature side and low temperature side heat pump circuits.

[0015]

According to the first characteristic configuration of the present invention, each of the dehumidifying air cooling means and the cooling air cooling means is provided.
It is possible to operate with a refrigerant of a boiling point type suitable for the use (required temperature) of each air cooling means, and only one of the high temperature side condensers has a condenser for heat radiation to a heat source outside the circuit. The temperature difference between the heat radiation temperature with respect to the heat radiation source outside the circuit and the heat absorption temperature of the low temperature side evaporator serving as the dehumidifying air cooling means can be made large. Inconvenience, that is, because the cooling air has to be cooled at an unnecessarily low temperature, the thermal efficiency of the cooling air cooling means decreases, and the uniformity of the air cooling state of the cooling air improves. The inconvenience, the increase in effective energy loss, and the inability to radiate heat effectively in the condenser are solved, and the heat radiation structure for the heat radiation source outside the circuit such as the atmosphere is eliminated. Structure and heat source configured surface may be provided an air conditioning dehumidifier simple heat pump.

According to the second characteristic configuration, the air after being cooled and dehumidified in a form of utilizing a part of the high temperature heat to be exhausted to the heat radiation source outside the circuit without providing another heat source. Since the air can be efficiently reheated to produce dry air, the operating efficiency can be improved by utilizing the exhaust heat.

According to the third characteristic configuration, since it is not necessary to provide a dedicated compressor for each of the high temperature side and low temperature side heat pump circuits, the structure of the apparatus can be further simplified.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. 1, 3 and 5 show an air conditioner as an example of a heat pump type air conditioner / dehumidifier having an air cooling means F for cooling and an air cooling means D for dehumidification.

The air conditioner heats the first indoor heat exchanger 1 for heating or cooling the air to the first air conditioning target area, and the dehumidified air cooled by the air cooling means D for dehumidification. The heat exchanger 2 for reheating as the air heating means H for reheating, and the temperature control air in the first indoor heat exchanger 1 and the heat exchanger 2 for reheating as the supply air SA1 in the first air conditioning target area. To the second indoor heat exchanger 4, which heats or cools the air to the second air conditioning target area, and the ventilation air of the second indoor heat exchanger 1. The second air supply fan 5 that supplies the second air conditioning target area as SA2, the outdoor heat exchanger 6 that absorbs and releases heat to and from the atmosphere OA, and the outside air fan 7 that ventilates the atmosphere OA to the outdoor heat exchanger 6. Are provided to cool the first indoor heat exchanger 1 (and the reheating heat exchanger 2), the second indoor heat exchanger 4, and the outdoor heat exchanger 6. By circulating the atmospheric O
A heat pump circuit that controls the heating or cooling temperature of the supply air SA1 and SA2 is configured by using A as the heat absorbing and radiating source.

The heat pump circuit of the air conditioner of the present embodiment is composed of a mixed refrigerant heat pump circuit in which two kinds of refrigerants, a high boiling point refrigerant A and a low boiling point refrigerant B, are mixed and circulated in a refrigerant circulating path. Has been done. The low boiling point refrigerant B is
The evaporation temperature is set to a relatively low temperature suitable for cooling the air to be cooled and dehumidified, and the condensation temperature overlaps the evaporation temperature of the high boiling point refrigerant A. The high-boiling-point refrigerant A has a condensing temperature higher than the temperature of the atmosphere OA, and an evaporation temperature that is suitable for cooling the first or second air-conditioning target area, that is, a temperature suitable for cooling and dehumidifying. In comparison, the one set to a relatively high temperature is used.

In the refrigerant circulation path, as a basic structure of a heat pump, a common compressor Cmp which sucks and discharges the above-mentioned two kinds of refrigerants A and B in a mixed state, a high boiling point refrigerant Aw in a liquid state and a low boiling point in a high pressure gas phase state. Gas-liquid separator S for separating the boiling point refrigerant Bhg
p, the relay heat exchanger 8 that performs heat exchange between the high-boiling-point refrigerant A and the low-boiling-point refrigerant B, the first indoor heat exchanger 1, the reheat heat exchanger 2, and the second indoor heat exchanger 4 described above. And the outdoor heat exchanger 4
And an expansion valve exp1 that expands the high-boiling-point refrigerant Aw in the liquid phase state from the gas-liquid separator Sp under reduced pressure and supplies the low-boiling-point high-boiling-point refrigerant Awg to the relay heat exchanger 8.
An expansion valve exp2 that supplies a low-boiling-point high-boiling-point refrigerant Awg to the second indoor heat exchanger 4 and the first indoor heat exchanger 1 operate as an air cooling means D for dehumidification. In this case, the low-boiling-point refrigerant Bw in the liquid phase state from the relay heat exchanger 8 is decompressed and expanded to supply the low-boiling-point low-boiling point refrigerant Bwg in the gas-liquid two-phase state to the first indoor heat exchanger 1. When the expansion valve exp3 to be operated and the first indoor heat exchanger 1 are operated as the air cooling means F for cooling, the high boiling point refrigerant Aw in the liquid phase state is decompressed and expanded to form the low pressure gas-liquid two phase state. An expansion valve exp4 for supplying the high-boiling-point refrigerant Awg to the first indoor heat exchanger 1, and an expansion valve exp5 for decompressing and expanding the liquid-phase high-boiling-point refrigerant Aw when the outdoor heat exchanger 4 is used as an evaporator. And are equipped with.

The gas-liquid separator Sp is constructed so as to be able to extract the gas-phase refrigerant from the upper part and the liquid-phase refrigerant from the lower part by means of a liquid reservoir, and the liquid reservoir part has a cooling operation state and In the heating operation state, a capacity capable of recovering and storing all of the low-boiling-point refrigerant B that is not used is provided, and is configured to also function as a liquid receiver. The refrigerant passage 9 through which the low-pressure gas-phase refrigerants Acg and Bcg are in the process of returning to the compressor Cmp is pierced in the liquid reservoir portion so that the liquid-phase refrigerant and the low-pressure gas-phase refrigerant are heat-exchanged. This ensures the degree of superheat and the degree of subcooling of the heat pump cycle to prevent so-called liquid back accident to the compressor Cmp.

The relay heat exchanger 8 is a high-pressure gas-phase refrigerant flow section 8
a and a low-pressure vapor-phase refrigerant flow section 8b.
The high-pressure vapor-phase refrigerant flow section 8a and the low-pressure vapor-phase refrigerant flow section 8b are configured to be capable of exchanging heat with each other. The refrigerant flow section 8b is configured to function as a refrigerant evaporator.

Reference numeral 10 is a liquid receiver for the low boiling point refrigerant B. The liquid receiver 10 is also provided with the refrigerant passage 9 through which the high-boiling-point refrigerant Acg and the low-boiling-point refrigerant Bcg in the low-pressure gas phase flow, similar to the gas-liquid separator Sp.

VR1 to vR4 are flow rate adjusting valves. v
1 to v7 are switching valves that switch the configuration of the refrigerant circulation path according to the operation mode and the like.

FIG. 1 shows an air cooling means F for the cooling.
And a circuit configuration of an air conditioner in a dehumidifying and cooling operation state in which the dehumidifying air cooling means D and the reheating air heating means H are operated. FIG. 3 shows the circuit configuration of the air conditioner in the cooling operation state in which the refrigerant operation is performed for both the first and second air conditioning target areas. FIG. 5 shows the circuit configuration of the air conditioner in the heating operation state in which the heating operation is performed for both the first and second air conditioning target areas.

In FIGS. 1, 3 and 5, the thick black line indicates that the refrigerant state in that portion is the high pressure gas phase,
The thick hatched thick line indicates that the refrigerant state of that part is high-pressure gas-liquid two-phase, the thin hatched thick line indicates that the refrigerant state of that part is liquid phase, and dot hatching. The thick line marked with indicates that the refrigerant state of the part is low-pressure gas-liquid two-phase, and the thick white line indicates that the refrigerant state of the part is low-pressure gas phase. Shows the state of the mixed refrigerant as a whole when the flowing refrigerant of that portion is a mixed refrigerant of a plurality of types, and when the flowing refrigerant is a single type of refrigerant, the single refrigerant Shows the state of.

Further, in the expansion valves exp1 to exp5, the flow rate adjusting valves vR1 to vR4, and the switching valves v1 to v7, the white ones show the flowing state of the refrigerant, and the black ones do not flow. It shows a state or a closed state.

First, the dehumidifying and cooling operation state in which the dehumidifying operation is performed on the first air conditioning target area and the cooling operation is performed on the second air conditioning target area shown in FIG. 1 will be described. In the refrigerant circulation path in the dehumidifying and cooling operation state, the outdoor heat exchanger 6 and the reheat heat exchanger 2 (the two are connected in parallel to each other), and the high-pressure gas-phase refrigerant flow section 8 a of the relay heat exchanger 8. And the compressor Cm
p is connected in series to the refrigerant discharge path rh, and the compressor C
The two-type refrigerants Ahg and Bhg in a high-pressure gas phase discharged in a mixed state from mp are condensed in order from the refrigerant A having a higher boiling point.

That is, the compressor Cmp sucks, compresses and discharges the two kinds of refrigerants A and B in a mixed state. The high-pressure gas-phase refrigerants Ahg and Bhg from the compressor Cmp are passed through the outdoor heat exchanger 6 and the reheat heat exchanger 2, and after being dehumidified by the atmosphere OA and the first indoor heat exchanger 1. Only the high-boiling-point refrigerant A is condensed with air as a heat-dissipation target, and is rejoined, and the liquid-phase refrigerant Aw and the high-pressure gas-phase refrigerant Bhg are sent to the gas-liquid separator Sp. Therefore, the outdoor heat exchanger 6 and the reheat heat exchanger 2 are arranged on the high temperature side condenser C for condensing the high boiling point refrigerant A.
It functions as d1.

The liquid-phase refrigerant Aw and the high-pressure gas-phase refrigerant Bhg from the outdoor heat exchanger 6 and the reheat heat exchanger 2 are separated by the gas-liquid separator Sp, and the high-pressure gas-phase refrigerant Bhg is the relay heat. The high-pressure gas-phase refrigerant flow section 8a of the exchanger 8 is caused to flow. On the other hand, the liquid-phase refrigerant Aw is appropriately distributed by the expansion valve exp1 and the expansion valve exp2, and after being decompressed and expanded into the low-pressure gas-liquid two-phase refrigerant Awg, the low-pressure gas of the relay heat exchanger 8 is respectively supplied. It flows through the phase refrigerant flow section 8b and the second indoor heat exchanger 4.

High-pressure gas-phase refrigerant flow section 8a of relay heat exchanger 8.
In the above, the high-pressure gas-phase refrigerant Bhg is condensed using the gas-liquid two-phase refrigerant Awg flowing through the low-pressure gas-phase refrigerant flowing portion 8 b as a heat source, and the liquid-phase refrigerant Bw is sent to the liquid receiver 10.
On the other hand, in the low-pressure vapor-phase refrigerant flow section 8b, the vapor-liquid two-phase refrigerant Awg is evaporated by using the high-pressure vapor-phase refrigerant Bhg flowing in the high-pressure vapor-phase refrigerant flow section 8a as an endothermic source, and the low-pressure vapor-phase refrigerant Acg. Then, it is returned to the compressor Cmp through the refrigerant passage 9 of the gas-liquid separator Sp. Therefore, the high-pressure gas-phase refrigerant flow section 8a of the relay heat exchanger 8 functions as a low-temperature side condenser Cd2 for condensing the low-boiling-point refrigerant B, while the low-pressure gas-phase refrigerant flow section 8b is high-boiling-point refrigerant A. It functions as a high temperature side evaporator Ev1 for evaporating the.

Further, the low-pressure gas-liquid two-phase refrigerant Awg flowing through the second indoor heat exchanger 4 supplies the air S to the second air conditioning target area.
A2 is evaporated as an endothermic target to become a low-pressure gas-phase refrigerant Acg, joins the low-boiling-point refrigerant Bcg in the low-pressure gas phase from the first indoor heat exchanger 1 (described later), and is returned to the compressor Cmp. It Therefore, the second indoor heat exchanger 4 also functions as the high temperature side evaporator Ev1 that evaporates the high boiling point refrigerant A.

The liquid-phase refrigerant Bw sent to the liquid receiver 10 is decompressed and expanded by the expansion valve exp3, and the low-pressure gas-liquid two-phase refrigerant Bw.
After reaching g, it is passed through the first indoor heat exchanger 1 and evaporated with the supply air SA1 to the first air conditioning target area as the heat absorption target, becoming the aforementioned low-pressure gas-phase refrigerant Bcg, and the liquid receiver 10 Is returned to the compressor Cmp through the refrigerant passage 9, the relay heat exchanger 8, and the refrigerant passage 9 of the gas-liquid separator Sp. Therefore,
The first indoor heat exchanger 1 functions as a low temperature side evaporator Ev2 that evaporates the low boiling point refrigerant B.

In the air conditioner in the cooling / dehumidifying operation state, in the first indoor heat exchanger 1, the dehumidifying air cooling means D for cooling the dehumidifying target air by absorbing heat accompanying the evaporation of the refrigerant to remove the moisture is formed. In the second indoor heat exchanger 4, an air cooling means F for cooling that controls the cooling temperature of the temperature-controlled air by the heat absorption due to the evaporation of the refrigerant is configured.

FIG. 2 shows the refrigerant circulation form in the dehumidifying and cooling operation state.
Shown in. In the figure, the alternate long and short dash line indicates the circulation path of the high boiling point refrigerant A, and the broken line indicates the circulation path of the low boiling point refrigerant B. The reference numerals in the figure are the same as those in FIG.

In each circulation path, a common compressor Cmp and a condenser Cd1 as a basic structure of a heat pump circuit are provided.
Alternatively, Cd2, the expansion valve exp1 or exp2, and the evaporator Ev1 or Ev2 are interposed. Therefore, the high boiling point refrigerant A is circulated by the circulation path (dashed line) of the high boiling point refrigerant A.
A high temperature side heat pump circuit Ka for circulating the high temperature side condenser Cd1 and the high temperature side evaporator Ev1 is configured,
Through the circulation path (broken line) of the low boiling point refrigerant B, the low boiling point refrigerant B is transferred to the low temperature side condenser Cd2 and the low temperature side evaporator Ev2 for absorbing heat.
A low-temperature side heat pump circuit Kb is configured to circulate over.

The high temperature side evaporator Ev1 is composed of an evaporator Evs for exchanging heat between circuits, which is constituted by the low-pressure gas-phase refrigerant flow portion 8b of the relay heat exchanger 8, and a second indoor heat exchanger 2. And an evaporator Evm for absorbing heat outside the circuit.
Therefore, the air cooling means F for cooling is composed of the evaporator Evm for absorbing heat from outside the circuit. Air cooling means D for dehumidification
Is composed of the low temperature side evaporator Ev2.

The high temperature side condenser Cd1 is composed of an exhaust heat condenser Cdr composed of the outdoor heat exchanger 6 and a reheat heat exchanger 2 constituting an air heating means H for reheating. It is divided into a reheat condenser Cds and a reheat condenser Cds. Therefore, the air heating means H for reheating is constituted by a part of the high temperature side condenser Cd1.

Since the low boiling point refrigerant B also passes through the high temperature side condenser Cd1 and the high temperature side evaporator Ev1, the condenser Cd1 and the evaporator Ev1 also absorb and release a little heat. Further, some heat exchange between the refrigerants is performed by separating or joining the refrigerant A in the middle of the refrigerant circulation path. However, ignoring some of these heat absorption and heat dissipation and heat exchange, if only focusing on heat absorption and heat dissipation and heat exchange due to condensation heat release and vaporization heat removal in the low temperature side condenser Cd2 and the low temperature side evaporator Ev2, the low temperature side heat pump The circuit Kb constitutes a heat pump circuit independent of the high temperature side heat pump circuit Ka in terms of heat balance. Therefore, the mixed refrigerant heat pump circuit of this embodiment includes two heat pump circuits, a high temperature side heat pump circuit Ka and a low temperature side heat pump circuit Kb.

Referring to FIG. 2, the flow of cold heat will be described. First, in the high temperature side condenser Cd1 of the high temperature side heat pump circuit Ka, cold heat is obtained from the atmosphere OA by releasing condensation heat. A part of the cold heat acquired in the high temperature side heat pump circuit Ka is an evaporator Evm for absorbing heat outside the circuit.
Is used for cooling the second air conditioning target area, and the rest is accompanied by the acquisition of warm heat from the low temperature side condenser Cd2 by the vaporization heat removal in the evaporator Evs for transferring heat between circuits. And is transmitted to the low temperature side heat pump circuit Kb.

The cold heat transferred to the low temperature side heat pump circuit Kb in the low temperature side condenser Cd2 is the low temperature side evaporator Ev.
With the absorption of warm heat due to the heat of vaporization in 2
It is released to the heat absorption target outside the circuit, that is, to the air supply SA1 to the first air conditioning target region, and is used for cooling and dehumidifying the first air conditioning target region.

Therefore, the relay heat exchanger 8 is constructed as a relay heat transfer means for mutually exchanging heat between the inter-circuit heat transfer evaporator Evs and the low temperature side condenser Cd2.

Next, the cooling operation state shown in FIG. 3 will be described. In the cooling operation state, all the low boiling point refrigerant B is collected and stored in the liquid reservoir of the liquid receiver 10, and only the high boiling point refrigerant A is circulated by the compressor Cmp, and the first indoor heat exchanger 1 and the second Both of the indoor heat exchangers 4 are configured to function as an evaporator for cooling.

The high-pressure gas-phase refrigerant Ahg discharged from the compressor Cmp is condensed in the outdoor heat exchanger 6, and only the high-boiling-point refrigerant Aw in the liquid phase passes through the gas-liquid separator Sp and the expansion valve e
The high-boiling-point refrigerant A in a gas-liquid two-phase state at a low pressure, which is appropriately distributed by the xp4 and the expansion valve exp2 to the first indoor heat exchanger 1 and the second indoor heat exchanger 4 and is decompressed and expanded.
After the wg is evaporated at the same evaporation temperature in the first indoor heat exchanger 1 and the second indoor heat exchanger 4, the liquid receiver 10, the relay heat exchanger 8, and the refrigerant passage of the gas-liquid separator Sp. It is configured to pass through 9 and be returned to the compressor Cmp.

As shown in FIG. 4, in the refrigerant circulation mode, the high temperature side condenser Cd1 which obtains cold heat from the outdoor heat exchanger 6 by radiating the heat from the atmosphere OA and radiating heat by condensing heat release.
And the first indoor heat exchanger 1 and the second indoor heat exchanger 4 both target the supply air SA1 and SA2 as endothermic objects, and emit high-temperature side evaporator Ev1 that emits cold heat along with the heat absorption by vaporization heat removal. It is configured to function as.

The cold heat released by the high temperature side evaporator Ev1 is used for cooling the first and second air conditioning target areas. Therefore, the high temperature side evaporator Ev1, that is, the first indoor heat exchanger 1 and the second indoor heat exchanger 4 serve as an air cooling means F for cooling that controls the cooling temperature of the temperature-controlled air by the heat absorption accompanying the evaporation of the refrigerant. It is functioning.

Next, the heating operation state shown in FIG. 5 will be described. Even in the heating operation state, all the low boiling point refrigerant B is collected and stored in the liquid reservoir of the liquid receiver 10, and only the high boiling point refrigerant A is circulated by the compressor Cmp, and the first indoor heat exchanger 1
Both the second indoor heat exchanger 4 and the second indoor heat exchanger 4 function as an evaporator for heating.

The high-pressure gas-phase refrigerant Ahg discharged from the compressor Cmp is used as the first indoor heat exchanger 1 and the second indoor heat exchanger 4.
It is distributed to and condensed. Distribution ratio is 1st indoor heat exchanger 1
And flow rate adjusting valves vR3 and vR4 provided on the downstream side of the second indoor heat exchanger 4. The high-boiling-point refrigerant Aw in the liquid phase condensed in the first indoor heat exchanger 1 and the second indoor heat exchanger 4 merges again to form a gas-liquid separator Sp.
Through the expansion valve exp5, the low-pressure gas-liquid two-phase high-boiling-point refrigerant Awg is evaporated in the outdoor heat exchanger 6, and then the low-pressure gas-phase refrigerant Acg is transferred to the liquid receiver 10.
The relay heat exchanger 8 and the refrigerant passage 9 of the gas-liquid separator Sp
And is returned to the compressor Cmp.

As shown in FIG. 6, in the refrigerant circulation mode, the outdoor heat exchanger 6 is made to function as a high temperature side evaporator Ev1 which absorbs the heat by vaporization heat absorption with the air OA as the heat absorption target. Both the exchanger 1 and the second indoor heat exchanger 4 are configured to function as the high temperature side condenser Cd1 that releases warm heat by condensing heat release, with the supply air SA1 and SA2 as heat dissipation targets.

[Other Embodiment] The configuration of the heat pump circuit is as follows.
Not only the mixed-refrigerant heat pump circuit, but also a so-called multiple heat pump circuit in which plural kinds of refrigerants are independently circulated without being mixed may be configured.

The relay heat transfer means is the relay heat exchanger 8
The configuration is not limited to the above, and can be changed as appropriate. For example, a plurality of three or more refrigerants including a third medium-boiling-point refrigerant having a boiling point temperature between the high-boiling-point refrigerant A and the low-boiling-point refrigerant B are circulated, and are configured by a heat pump circuit for the medium-boiling-point refrigerant. May be. Also, a plurality of heat pump circuits for medium boiling point refrigerant may be configured in multiple stages.

The air cooling means F for cooling is the air supply fan 5
The air supply SA2 is ventilated by the air supply SA2 and is not limited to the duct type air supply to the second air conditioning target area.
May be provided in the air conditioning target area to directly heat the air conditioning target air.

The heat radiation source outside the circuit is not limited to the atmosphere OA, but can be changed appropriately. Air for temperature control and air for dehumidification are
Not only the air supply SA1 to the first air conditioning target area and the air supply SA2 to the second air conditioning target area, other gas, liquid, heat transfer medium (apparatus), object, or the like can be appropriately changed. Also,
The temperature control target and the dehumidification target do not have to be separated into the first air conditioning target region and the second air conditioning target region as in the above-described embodiment, and may be the same air or the same target.

It should be noted that reference numerals are given in the claims for convenience of comparison with the drawings, but the present invention is not limited to the structures of the accompanying drawings by the entry.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a circuit configuration of a dehumidifying and cooling operation state of an air conditioner.

FIG. 2 is an explanatory view showing a circulation mode of refrigerant in a dehumidifying and cooling operation state.

FIG. 3 is a configuration diagram showing a circuit configuration of an air conditioner in a cooling operation state.

FIG. 4 is an explanatory diagram showing a circulation mode of refrigerant in a cooling operation state.

FIG. 5 is a configuration diagram showing a circuit configuration in a heating operation state of an air conditioner.

FIG. 6 is an explanatory view showing a circulation mode of refrigerant in a heating operation state.

[Explanation of symbols]

 A High boiling point refrigerant B Low boiling point refrigerant Cd1 High temperature side condenser Cd2 Low temperature side condenser Cmp Common compressor D Air cooling means for dehumidification Evm Evaporator for heat absorption outside the circuit Evs Evaporator for heat transfer between circuits Ev1 High temperature side evaporation Device Ev2 low temperature side evaporator F air cooling means for cooling Ka high temperature side heat pump circuit Kb low temperature side heat pump circuit 8 relay heat transfer means

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location F25B 7/00 A 29/00 391 A

Claims (3)

[Claims] 1. An air cooling means (F) for cooling, which cools and regulates the temperature-controlled air by heat absorption due to refrigerant evaporation, and a dehumidifier for cooling the dehumidified air by heat absorption due to refrigerant evaporation to remove moisture. A heat pump type air-conditioning dehumidifying device provided with an air cooling means (D), wherein a high boiling point refrigerant (A) is circulated between a high temperature side condenser (Cd1) for heat dissipation and a high temperature side evaporator (Ev1). And a low temperature side heat pump circuit (Kb) for circulating the low boiling point refrigerant (B) over the low temperature side condenser (Cd2) and the low temperature side evaporator (Ev2). (Ev1) is divided into an evaporator (Evs) for heat transfer between circuits and an evaporator (Evm) for heat absorption outside the circuit, and the air cooling means (F) for cooling is an evaporator for heat absorption outside the circuit. It consists of a container (Evm), The dehumidifying air cooling means (D) is composed of the low temperature side evaporator (Ev2), and the inter-circuit heat transfer evaporator (Evs) and the low temperature side condenser (Cd2) exchange heat with each other. A heat pump type air conditioner / dehumidifier provided with a relay heat transfer means (8). 2. A reheating air heating means (H) for heating the air dehumidified by the dehumidification air cooling means (D) is provided, and the reheating air heating means (H) is provided. The heat pump type air conditioning / dehumidifying device according to claim 1, wherein the heat pump type air conditioning / dehumidifying device comprises a part of the high temperature side condenser (Cd1). 3. The high temperature side heat pump circuit and the low temperature side heat pump circuit are a common compressor (Cm) for sucking and discharging a high boiling point refrigerant (A) and a low boiling point refrigerant (B) in a mixed state.
The heat pump type air-conditioning dehumidifier according to claim 1 or 2, wherein the refrigerant is circulated according to p).