JPH07167516A - Heat pump type heating humidifier - Google Patents

Abstract

PURPOSE:To drive with refrigerants adapted for humidifying and air heating means by composing air heating means for heating of a heat dissipating condenser out of a circuit and water heating means of the humidifying means of a high-temperature side condenser, and providing relay heat transfer means for heat exchanging the condenser for heat transferring between circuits with a high-temperature side evaporator. CONSTITUTION:The heat pump type heating humidifier comprises a low- temperature side heat pump circuit Kc for circulating low boiling point refrigerant and a high-temperature side heat pump circuit Ka for circulating high boiling point refrigerant, wherein a low-temperature side condenser Cd3 is divided to a condenser Cds for heat transferring between circuits and a condenser Cdm for heat dissipating out of the circuit. Air heating means for heating is formed of the condenser Cdm, and water heating means for humidifying is formed of a high-temperature side condenser Cdl. Further, the condenser Cds is heat exchanged with a high-temperature side evaporator Evl via relay heat transfer means Kb. Thus, the humidifying means and the air heating means can be driven with various boiling point refrigerants adapted for utilities.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air heating means for heating air which is heated by the heat of condensation of a refrigerant, and a humidifying means for humidifying the heated air by the air heating means with steam generated by heating water for humidification. The present invention relates to a heat pump type heating and humidifying device provided with and.

[0002]

2. Description of the Related Art Conventionally, in this type of heat pump type heating / humidifying device, one type of refrigerant is used for the condenser constituting the air heating means for heating and the condenser constituting the water heating means in the humidifying means. In the same circulating heat pump circuit, the capacities of the air heating means and the water heating means are adjusted by adjusting the flow rates of the refrigerants that are provided in parallel and flow through the respective condensers.

[0003]

However, according to the above-mentioned prior art, the condenser constituting the water heating means has a sufficiently high temperature (that is, 10 ° C) to generate steam.
Since a high temperature of 0 ° C. or higher is required, a refrigerant of a relatively high boiling point type (that is, a refrigerant having a condensation temperature of 100 ° C. or higher) is used as the refrigerant of the heat pump circuit.

Therefore, in the condenser constituting the air heating means, the temperature control target temperature of the heating air is generally 30 to.
Despite the relatively low temperature of about 40 ° C., the temperature of the heating air is controlled by the high temperature of 100 ° C. or higher similar to that of the condenser on the water heating means side. , Since the air is constantly squeezed and the air is heated by the high temperature and small flow rate of the refrigerant, the thermal efficiency in the air heating means is reduced and the uniformity of the air heating state of the heating air is improved. In addition, there is an inconvenience in that the effective energy loss is increased by heating the object to be heated with a heat source having a temperature higher than necessary.

Further, when a high boiling point refrigerant is used, the evaporation temperature in the evaporator must be relatively high. Therefore, when the heat absorbing source in the evaporator is, for example, the atmosphere in winter, the heat absorbing source is used. There is a problem that the temperature of 1 approaches the evaporation temperature of the evaporator or becomes higher than the evaporation temperature, and the heat absorption is not effectively performed in the evaporator.

By the way, if the water heating means in the humidifying means is constituted by another dedicated heating source such as an electric heater, an appropriate low boiling point refrigerant is used in the heat pump circuit constituting the air heating means. It is possible,
Although the above inconvenience is solved, there is an inconvenience that the configuration and control of the device are complicated by using a plurality of types of heat sources in one device.

Further, the water heating means in the humidifying means is constituted by another independent heat pump circuit, and a low boiling point refrigerant is used in the heat pump circuit of the air heating means and a high boiling point refrigerant is used in the heat pump circuit of the water heating means. It is possible to use it, but when the atmosphere is used as a heat absorption source, it is necessary to install an outdoor facility or an outside air intake duct facility, etc. In addition, it is possible to solve the problems that the device is complicated by providing two independent heat pump circuits and that the heat absorption is not performed effectively due to the evaporation temperature of the high boiling point refrigerant becoming relatively high. It was impossible.

An object of the present invention is to eliminate various inconveniences in the prior art as described above.

[0009]

A first characteristic configuration of a heat pump type heating / humidifying device according to the present invention is a low temperature side heat pump circuit for circulating a low boiling point refrigerant between a low temperature side condenser and a low temperature side evaporator for absorbing heat. , And a high temperature side heat pump circuit that circulates the high boiling point refrigerant over the high temperature side condenser and the high temperature side evaporator, and the low temperature side condenser is a condenser for exchanging heat between circuits and a condenser for radiating outside the circuit. The heating air heating means is composed of the condenser for heat dissipation outside the circuit, the water heating means in the humidifying means is composed of the high temperature side condenser, and the condenser for heat exchange between the circuits is formed. A relay heat transfer means for exchanging heat between the container and the high temperature side evaporator is provided.

The second and third characteristic configurations of the heat pump type heating and humidifying device according to the present invention specify a preferable specific configuration for implementing the first characteristic configuration.

A second characteristic configuration is that the low-temperature side heat pump circuit and the high-temperature side heat pump circuit are configured to circulate a high-boiling-point refrigerant and a low-boiling-point refrigerant in a mixed state by a common compressor for sucking and discharging the refrigerant. It is in.

A third characteristic configuration is that the relay heat transfer means uses the condenser for heat transfer between circuits as a heat absorption source, and
The high temperature side evaporator is constituted by a heat pump circuit for a medium boiling point refrigerant which acts as a heat radiation source.

[0013]

According to the first characteristic configuration of the present invention, a low temperature side heat pump circuit for circulating a low boiling point refrigerant through a low temperature side condenser and a low temperature side evaporator for heat absorption, and a high boiling point refrigerant for a high temperature side condenser. And a high temperature side heat pump circuit to circulate between the high temperature side evaporator and the high temperature side evaporator, the low temperature side condenser is divided into a condenser for heat exchange between circuits and a condenser for heat radiation outside the circuit, and the air heating means for heating is Since it is composed of a condenser for radiating heat outside the circuit, and the water heating means in the humidifying means is composed of a high temperature side condenser, the humidifying means and the air heating means are used as a refrigerant of a boiling point species suitable for each application (temperature). Since the relay heat transfer means for exchanging heat between the condenser for heat transfer between circuits and the high temperature side evaporator is provided, the heat absorption source of the high temperature side evaporator is set to the low temperature side. A condenser for exchanging heat between circuits in the condenser In this mode, both the high and low heat pump circuits can be operated, and as a result, the evaporator for absorbing heat to the heat absorption source outside the circuit, that is, the evaporator for heat absorption as a whole, is equipped with the high and low heat pump circuits. , The temperature of the heat absorption temperature of the heat absorbing evaporator with respect to the heat absorbing source outside the circuit and the heat radiation temperature of the high temperature side condenser serving as the water heating means in the humidifying means. The difference, that is, the temperature rise range can be made large.

According to the second characteristic configuration, since the common compressor for the low temperature side heat pump circuit and the high temperature side heat pump circuit is provided, each dedicated compressor is provided for both the high temperature side and low temperature side heat pump circuits. No need to provide.

According to the third characteristic configuration, the relay heat transfer means is a heat pump circuit for medium boiling point refrigerant, in which the condenser for heat transfer between circuits is used as a heat absorption source and the high temperature side evaporator is used as a heat radiation source. Since it is configured, the temperature rise range from the evaporator for heat absorption to the heat absorption source outside the circuit to the high temperature side condenser can be further increased, and the heat pump circuit for the medium boiling point refrigerant in the relay heat transfer means can be used. With a multi-stage structure, it is possible to obtain a wider temperature rise range.

[0016]

According to the first characteristic configuration of the present invention, the humidifying means and the air heating means can be operated by the refrigerant of the boiling point species suitable for each use, and the heat absorbing means for the heat absorbing source outside the circuit can be used. Can be only one of the low temperature side evaporator, and the temperature difference between the heat absorption temperature for the heat absorption source outside the circuit and the heat radiation temperature of the high temperature side condenser used as the water heating means in the humidifying means. Therefore, various inconveniences in the above-mentioned conventional technique, that is, the inconvenience that the heat efficiency of the air heating means is lowered by controlling the heating temperature of the heating air by an unnecessarily high temperature of 100 ° C. or higher. , Inconvenience that the uniformity of air heating state in heating and air conditioning cannot be improved, inconvenience that effective energy loss increases,
And, the temperature of the heat absorption source approaches the evaporation temperature of the evaporator, or, in some cases occurs higher than the evaporation temperature, the above inconvenience in which the heat absorption is not effectively performed in the evaporator is eliminated, and, It is possible to provide a heat pump-type heating / humidifying device having a simple structure in terms of the heat absorption configuration surface and the heat source configuration surface with respect to the heat absorption source outside the circuit such as the atmosphere.

According to the second characteristic configuration, since it is not necessary to provide a dedicated compressor for each of the high temperature side and low temperature side heat pump circuits, the structure of the device can be further simplified.

According to the third characteristic configuration, since the temperature rise range from the heat absorption source outside the circuit to the high temperature side condenser can be further drastically increased, it is possible to target an object having a relatively low temperature such as the atmosphere in winter. It is possible to generate a sufficiently high temperature for generating water vapor in the water heating means of the humidifying means while using it as a heat absorption source.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 3, the air heating means H and the humidifying means M are shown.
An air conditioner is shown as an example of a heat pump type heating and humidifying device provided with and.

The air conditioner has an indoor heat exchanger 1 for heating or cooling the supply air SA to the area to be air-conditioned and a heat exchanger for steam generation as water heating means for heating the humidifying water to generate steam. Supplying the temperature control in the device 2 and the indoor heat exchanger 1
Air supply fan 3 that supplies air to the air-conditioning target, outdoor heat exchanger 4 that absorbs and radiates heat from the air OA, and outdoor heat exchanger 4
Is provided with an outside air fan 5 for ventilating the atmosphere OA, and by circulating the refrigerant through the indoor heat exchanger 1, the steam generating heat exchanger 2, and the outdoor heat exchanger 4, the atmosphere OA is used as an absorption and heat radiation source. A heat pump circuit for heating or cooling the supply air SA is configured.

The heat pump circuit of the air conditioner of this embodiment has a high boiling point refrigerant A, a medium boiling point refrigerant B, and a low boiling point refrigerant C.
The mixed refrigerant heat pump circuit in which the three kinds of refrigerants are mixed and circulated in the refrigerant circulation path. As the high boiling point refrigerant A, one having a condensation temperature set to 100 ° C. or higher is used. As the low boiling point refrigerant C, one whose evaporation temperature is lower than the temperature of the atmospheric air OA is used. As the medium boiling point refrigerant B, a refrigerant whose condensation temperature overlaps with the evaporation temperature of the high boiling point refrigerant A and whose evaporation temperature overlaps with the condensation temperature of the low boiling point refrigerant C is used.

In the refrigerant circulation path, as a basic structure of a heat pump, a common compressor Cmp for sucking and discharging the above three kinds of refrigerants A, B and C in a mixed state, a high boiling point refrigerant Aw in a liquid state and a high pressure gas phase state. A gas-liquid separator Sp1 for separating the medium and low boiling point refrigerants Bhg and Chg, and a medium boiling point refrigerant Bw in a liquid phase state.
A liquid-liquid separator Sp2 for separating high-pressure gas phase low-boiling-point refrigerant Chg, a relay heat exchanger 6 for exchanging heat between high-boiling-point refrigerant A and medium-boiling-point refrigerant B, medium-boiling-point refrigerant B and low-boiling point Refrigerant C
A relay heat exchanger 7 for exchanging heat with, an indoor heat exchanger 1, a steam generating heat exchanger 2 and an outdoor heat exchanger 4,
Expansion valve exp1 for decompressing and expanding the high-boiling-point refrigerant Aw in the liquid phase state from the gas-liquid separator Sp1, and expansion valve e for decompressing and expanding the medium-boiling-point refrigerant Bw in the liquid phase state from the gas-liquid separator Sp2.
xp2, an expansion valve exp3 for decompressing and expanding the low boiling point refrigerant Cw in a liquid phase when the outdoor heat exchanger 4 is used as an evaporator, and the indoor heat exchanger 1 is used as an evaporator. It is equipped with an expansion valve exp4 for decompressing and expanding the low boiling point refrigerant Cw in the liquid phase.

The gas-liquid separators Sp1 and Sp2 are constructed so that the gas-phase refrigerant can be extracted from the upper part and the liquid-phase refrigerant from the lower part by the liquid reservoir, and the liquid reservoir part has a cooling operation described later. In such a state, the high boiling point refrigerant A and the medium boiling point refrigerant B which are not used are all provided with a capacity capable of being collected and stored, and configured to function also as a liquid receiver. The refrigerant passage 8 through which the low-pressure gas-phase refrigerants Acg, Bcg, and Ccg flow back to the compressor Cmp is penetrated through the liquid storage portion because the liquid-phase refrigerant and the low-pressure gas-phase refrigerant are heated. By exchanging, the superheat degree and the supercooling degree of the heat pump cycle are secured, and the compressor Cmp
This is to prevent a so-called liquid back accident.

The relay heat exchanger 6 has a high-pressure gas-phase refrigerant flow section 6
a and a low-pressure vapor-phase refrigerant flow section 6b.
Similarly, the relay heat exchanger 7 includes the high-pressure gas-phase refrigerant flow section 7a.
And a low-pressure gas-phase refrigerant flow section 7b.

Reference numeral 9 is a liquid receiver for the low boiling point refrigerant C. The liquid receiver 9 is also provided with the refrigerant passage 8 through which the low-boiling-point refrigerant Ccg in the low-pressure vapor phase state flows, similar to the gas-liquid separators Sp1 and Sp2.

In the expansion valve exp3, the refrigerant is the outdoor heat exchanger 4
When the refrigerant flows toward the side, it functions as an expansion valve as the original refrigerant expansion means, and when the refrigerant flows toward the side away from the outdoor heat exchanger 4, it functions simply as a flow rate adjusting valve. Is configured. Expansion valve exp4
When the refrigerant flows toward the indoor heat exchanger 1, it functions as an expansion valve as the original refrigerant expansion means,
When the refrigerant flows toward the side away from the outdoor heat exchanger 1, the refrigerant simply functions as a flow rate adjusting valve.

VR1 and vR2 are flow rate adjusting valves for adjusting the distribution ratio of the refrigerant flow rate from the gas-liquid separator Sp2 to the indoor heat exchanger 1 and the relay heat exchanger 7. vR3 is also a flow rate adjusting valve. v1 to v9 are switching valves that switch the configuration of the refrigerant circulation path according to the operation mode and the like.

FIG. 1 shows a circuit configuration of an air conditioner in a heating and humidifying operation state in which the air heating means H and the humidifying means M are operated. FIG. 3 shows the circuit configuration of the air conditioner in the cooling operation state.

In FIGS. 1 and 3, the thick black line indicates
The refrigerant state of the part indicates that it is a high-pressure gas phase, the thick line with thick hatching indicates that the refrigerant state of the part is a high-pressure gas-liquid two-phase, the thick line with thin hatching, It shows that the refrigerant state of the part is liquid phase,
The thick line with dot hatching indicates that the refrigerant state of the part is low-pressure gas-liquid two-phase, and further, the white thick line indicates that the refrigerant state of the part is low-pressure gas phase, These thick lines show the state of the mixed refrigerant as a whole when the flowing refrigerant of that portion is a mixed refrigerant of a plurality of types, and when the flowing refrigerant is a single type of refrigerant, the single line It shows the state of one refrigerant.

Further, in the expansion valves exp1 to exp4, the flow rate adjusting valves vR1 to vR3, and the switching valves v1 to v9, the white ones show the flowing state of the refrigerant, and the black ones do not flow. It shows a state or a closed state.

First, the heating / humidifying operation state shown in FIG. 1 will be described. In the heating and humidifying operation state, the steam-generating heat exchanger 2 and the high-pressure gas-phase refrigerant flow section 6a of the relay heat exchanger 6 are provided.
And the high-pressure gas-phase refrigerant flow section 7a of the indoor heat exchanger 1 and the relay heat exchanger 7 (the two are connected in parallel to each other) are connected in series to the refrigerant discharge passage rh of the compressor Cmp. The three types of high-pressure gas phase refrigerants Ahg, Bhg, and Chg that are discharged from the compressor Cmp in a mixed state are condensed separately in descending order of boiling point.

That is, the compressor Cmp sucks, compresses and discharges the three kinds of refrigerants A, B and C in a mixed state.
High-pressure gas phase refrigerant Ahg, Bhg, Ch from the compressor Cmp
g is passed through the water vapor generation heat exchanger 2, only the high-boiling-point refrigerant A is condensed using the humidifying water for steam generation as a heat radiation source, and the liquid-phase refrigerant Aw and the high-pressure gas-phase refrigerants Bhg, Chg are: It is sent to the gas-liquid separator Sp1. Therefore, the water vapor generation heat exchanger 2 functions as a high temperature side condenser Cd1 for condensing the high boiling point refrigerant A.

The high-pressure vapor-phase refrigerants Bhg, Chg and the liquid-phase refrigerant Aw from the steam-generating heat exchanger 2 are vapor-liquid separator Sp.
1, the high-pressure gas-phase refrigerants Bhg and Chg are passed through the high-pressure gas-phase refrigerant flow portion 6a of the relay heat exchanger 6, and the liquid-phase refrigerant Aw is decompressed and expanded by the expansion valve exp1 to have a low pressure. After becoming the gas-liquid two-phase refrigerant Awg, it is passed through the low-pressure gas-phase refrigerant flow section 6b of the relay heat exchanger 6.

High-pressure gas-phase refrigerant flow section 6a of relay heat exchanger 6.
In, the high-pressure gas-phase refrigerant Bhg is condensed using the gas-liquid two-phase refrigerant Awg as a heat source, and the liquid-phase refrigerant Bw and the high-pressure gas-phase refrigerant Chg are sent to the gas-liquid separator Sp2. on the other hand,
In the low-pressure gas-phase refrigerant flow section 6b, the gas-liquid two-phase refrigerant Aw
g is evaporated by using the high-pressure gas-phase refrigerants Bhg and Chg as heat absorption sources to become a low-pressure gas-phase refrigerant Acg, and the gas-liquid separator Sp.
It is returned to the compressor Cmp via the first refrigerant passage 8. Therefore, the high-pressure gas-phase refrigerant flow section 6a of the relay heat exchanger 6 functions as a high-temperature side evaporator Ev1 that evaporates the high-boiling-point refrigerant A, and the low-pressure gas-phase refrigerant flow section 6b condenses the medium-boiling-point refrigerant B. It functions as a medium temperature condenser Cd2.

High-pressure gas-phase refrigerant flow section 6a of relay heat exchanger 6
The high-pressure gas-phase refrigerant Chg and the liquid-phase refrigerant Bw are separated by the gas-liquid separator Sp2, and the high-pressure gas-phase refrigerant Chg is exchanged with the high-pressure gas-phase refrigerant passage portion 7a of the relay heat exchanger 7 and the indoor heat exchange. Bowl 1
The liquid-phase refrigerant Bw is divided into
After decompressed and expanded at xp2 to become a low-pressure gas-liquid two-phase refrigerant Bwg, it is passed through the low-pressure gas-phase refrigerant flow section 7b of the relay heat exchanger 7.

High-pressure gas-phase refrigerant flow section 7a of relay heat exchanger 7.
In, the high-pressure gas-phase refrigerant Chg is condensed using the gas-liquid two-phase refrigerant Bwg as a heat radiation source, and the liquid-phase refrigerant Cw is sent to the liquid receiver 9. On the other hand, in the low-pressure gas-phase refrigerant flow section 7b, the gas-liquid two-phase refrigerant Bwg is evaporated by using the high-pressure gas-phase refrigerant Chg as an endothermic source to become the low-pressure gas-phase refrigerant Bcg, and the refrigerant path of the gas-liquid separator Sp2. After passing through 8, the high-boiling-point refrigerant A merges with the low-pressure vapor-phase refrigerant Acg and is returned to the compressor Cmp. Therefore, the high-pressure gas-phase refrigerant flow section 7a of the relay heat exchanger 7
Functions as a medium-temperature evaporator Ev2 that evaporates the medium-boiling-point refrigerant B, and the low-pressure vapor-phase refrigerant flow section 7b functions as a low-temperature side condenser Cd3 that condenses the low-boiling-point refrigerant C.

In the indoor heat exchanger 1, the high-pressure gas-phase refrigerant Chg is condensed using the supply air SA as a heat radiation source, and the liquid-phase refrigerant Cw is also sent to the liquid receiver 9. Therefore, the indoor heat exchanger 1 is also the low temperature side condenser C for condensing the low boiling point refrigerant C.
It functions as d3.

The liquid-phase refrigerant Cw from the liquid receiver 9 is supplied to the expansion valve e.
After being decompressed and expanded at xp3 to become a low pressure gas-liquid two-phase refrigerant Cwg, it is passed through the outdoor heat exchanger 4. Outdoor heat exchanger 4
In the above, the low pressure gas-liquid two-phase refrigerant Cwg is evaporated by using the atmospheric air OA as a heat absorption source to become the low pressure gas phase refrigerant Ccg. The low-pressure gas-phase refrigerant Ccg from the outdoor heat exchanger 4 is supplied to the liquid receiver S.
Low-pressure vapor-phase refrigerant B of medium-boiling-point refrigerant B via the refrigerant passage 8 of p2
It merges with cg and is returned to the compressor Cmp. Therefore,
The outdoor heat exchanger 4 functions as a low temperature side evaporator Ev3 that evaporates the low boiling point refrigerant C.

In the air conditioner in the heating / humidifying operation state, the indoor heat exchanger 1 is provided with the air heating means H for heating the air by the heat of condensation of the refrigerant, and the heat exchanger 2 for generating steam is provided with the air heating means H. A humidifying means M for humidifying the heated air by the air heating means H by the steam generated by heating the humidifying water is constructed.

FIG. 2 shows the refrigerant circulation form in the heating and humidifying operation state.
Shown in. In the figure, the two-dot chain line indicates the circulation path of the high-boiling-point refrigerant A, the one-dot chain line indicates the circulation path of the medium-boiling-point refrigerant B, and the broken line indicates
The circulation path of the low boiling point refrigerant C is shown. The reference numerals in the figure are the same as those in FIG.

In each circulation path, the compressor Cmp and the condensers Cd1 and Cd, which are the basic components of the heat pump circuit, are provided.
d2 or Cd3 and expansion valves exp1, exp2 or ex
The p3 and the evaporators Ev1, Ev2 or Ev3 are interposed. Therefore, the circulation path of the high boiling point refrigerant A (two-dot chain line)
The high-temperature side heat pump circuit Ka that circulates the high-boiling-point refrigerant A through the high-temperature side condenser Cd1 and the high-temperature side evaporator Ev1 is configured, and the low-boiling-point refrigerant C is circulated by the circulation path (broken line) of the low-boiling-point refrigerant C. A low temperature side heat pump circuit Kc is configured to circulate over the condenser Cd3 and the heat absorbing low temperature side evaporator Ev3. Further, the heat pump circuit Kb of the medium boiling point refrigerant B, which functions as the heat absorption source of the condenser Cds for heat exchange between circuits and the heat source of the high temperature side evaporator Ev1 by the circulation path (dashed line) of the medium boiling point refrigerant B. Is configured.

The low temperature side condenser Cd3 is constituted by the indoor heat exchanger 1 and a condenser Cds for transferring heat between circuits which is constituted by the high pressure vapor phase refrigerant flow portion 7a of the relay heat exchanger 7. It is divided into a condenser Cdm for heat radiation outside the circuit. Therefore, the air heating means H for heating is composed of the condenser Cdm for radiating heat outside the circuit. The water heating means in the humidifying means M is composed of the high temperature side condenser Cd1.

Since the medium boiling point refrigerant B also passes through the high temperature side condenser Cd1 and the high temperature side evaporator Ev1, the condenser Cd1 and the evaporator Ev1 also absorb and release some heat. Further, in the middle of the refrigerant circulation path, another refrigerant A
Alternatively, some heat exchange between the refrigerants is performed by separating or joining with C. However, ignoring some of those heat absorption and heat dissipation and heat exchange, if only focusing on heat absorption and heat dissipation and heat exchange due to condensation heat release and vaporization heat removal in the middle temperature condenser Cd2 and the middle temperature evaporator Ev2,
The heat pump circuit Kb for the medium boiling point refrigerant B constitutes a heat pump circuit independent of the high temperature side heat pump circuit Ka and the low temperature side heat pump circuit Kc in terms of heat balance. The same applies to the low temperature side heat pump circuit Kc of the low boiling point refrigerant C. Therefore, the high temperature side heat pump circuit Ka, the medium boiling point refrigerant B heat pump circuit Kb,
The low temperature side heat pump circuit Kc constitutes three independent heat pump circuits in terms of heat balance.

In FIG. 2, focusing on the flow of heat,
First, the low temperature side evaporator Ev of the low temperature side heat pump circuit Kc
In 3, the heat of vaporization is absorbed to absorb heat from the air OA. A part of the heat absorbed in the low temperature side heat pump circuit Kc is radiated from the condenser Cdm for outside heat radiation and is used for the air heating means H, while the rest is a condenser for heat exchange between circuits. In Cds, heat is radiated by condensing heat release, and at the same time, the heat pump circuit Kb for the medium boiling point refrigerant B
In the middle temperature evaporator Ev2, the heat is absorbed by the heat of vaporization and is pumped up to the heat pump circuit Kb for the medium boiling point refrigerant B.

The heat absorbed by the heat of vaporization in the medium temperature evaporator Ev2 is absorbed by the heat pump circuit K of the medium boiling point refrigerant B.
In the middle-temperature condenser Cd2 of b, heat is released again by condensation heat release, and at the same time, it is absorbed by vaporization heat removal in the high temperature side evaporator Ev1 of the high temperature side heat pump circuit Ka and is pumped up to the high temperature side heat pump circuit Ka.

The heat absorbed in the high temperature side evaporator Ev1 is used as the high temperature side condenser Cd1 of the high temperature side heat pump circuit Ka.
The heat is radiated from and is used for the water heating means of the humidifying means M.

Therefore, the heat pump circuit Kb for the medium boiling point refrigerant B is constructed as a relay heat transfer means for exchanging heat between the condenser Cds for heat transfer between the circuits and the high temperature side evaporator Ev1.

Next, the refrigerant operating state shown in FIG. 3 will be described. In the refrigerant operation state, the high boiling point refrigerant A and the medium boiling point refrigerant B are all collected and stored in the liquid reservoirs of the gas-liquid separators Sp1 and Sp2, and only the low boiling point refrigerant C is circulated by the compressor Cmp, and As shown in, the outdoor heat exchanger 4 is made to function as a condenser Cd3, and the indoor heat exchanger 1 is made to function as an evaporator Ev3. Expansion valve exp
4 functions as an original expansion valve, and the expansion valve exp3 is
It functions as a flow control valve. Relay heat exchangers 6 and 7
Are simply provided as passages for the refrigerant.

[First Alternative Embodiment] The structure of the heat pump circuit is not limited to the mixed-refrigerant heat pump circuit.
It may be configured by a dual heat pump circuit. Also,
The relay heat transfer means is not limited to the case of being configured by the heat pump circuit Kb, but can be changed as appropriate.

FIGS. 5 and 7 show the circuit configuration of an air conditioner using a multiple heat pump circuit. Also in the figure, as in FIGS. 1 and 3, 1 is an indoor heat exchanger, 2
Is a steam generator heat exchanger, 3 is an air supply fan, 4 is an outdoor heat exchanger, 5 is an outdoor air fan, and the indoor heat exchanger 1, the steam generator heat exchanger 2 and the outdoor heat exchanger 4 are connected to each other. By circulating the refrigerant, a heat pump circuit that controls the heating or cooling temperature of the supply air SA using the air OA as a heat absorption and heat radiation source is configured.

The dual heat pump circuit according to this embodiment is composed of a dual heat pump circuit in which two kinds of refrigerants, a high boiling point refrigerant A and a low boiling point refrigerant C, are independently circulated without being mixed. The high boiling point refrigerant A has a condensation temperature of 10
The one set to 0 ° C or higher is used. In the low boiling point refrigerant C, the evaporation temperature becomes lower than the temperature of the atmospheric OA,
In addition, a refrigerant whose condensation temperature overlaps with the evaporation temperature of the high boiling point refrigerant A is used.

A compressor Cmp1 for compressing and discharging only the high-boiling-point refrigerant A and a humidifying means M are provided in the refrigerant circulation path of the high-boiling-point refrigerant A.
The water vapor generating heat exchanger 2 as the water heating means, the expansion valve exp1, and the relay heat exchanger 10 are provided.
In the refrigerant circulation path of the low boiling point refrigerant C, a compressor Cmp2 that compresses and discharges only the low boiling point refrigerant C, the relay heat exchanger 10, the indoor heat exchanger 1 as the air heating means H for heating, and the outdoor heat. An expansion valve exp3 when the exchanger 4 is used as an evaporator and an expansion valve exp4 when the indoor heat exchanger 1 is used as an evaporator are provided.

The relay heat exchanger 10 is composed of a high-pressure vapor-phase refrigerant passage portion 10a and a low-pressure vapor-phase refrigerant passage portion 10b.
It is configured to be able to exchange heat with each other.

V1 to v4 are switching valves. vR1 is
It is a flow rate adjusting valve that adjusts the distribution ratio of the low boiling point refrigerant C to the indoor heat exchanger 1 and the relay heat exchanger 10 together with the expansion valve exp4 that is functioning as a flow rate adjusting valve.

FIG. 5 shows a circuit configuration of an air conditioner in a heating and humidifying operation state in which the air heating means H and the humidifying means M are operated. FIG. 7 shows the circuit configuration of the air conditioner in the cooling operation state.

In the heating / humidifying operation state shown in FIG. 5, the steam generating heat exchanger 2 functions as a high temperature side condenser Cd1 for condensing the high boiling point refrigerant A, and the relay heat exchanger 1
The low-pressure vapor-phase refrigerant passage portion 10b of 0 functions as a high-temperature side evaporator Ev1 for evaporating the high-boiling-point refrigerant A, and the high-pressure vapor-phase refrigerant passage portion 10a of the indoor heat exchanger 1 and the relay heat exchanger 10
Functions as a low temperature side condenser Cd3 that condenses the low boiling point refrigerant C, and the outdoor heat exchanger 4 functions as a low temperature side evaporator Ev3 that evaporates the low boiling point refrigerant C.

Therefore, as shown in FIG. 6, in the air conditioner in the cooling operation state, the low temperature side heat pump circuit Kc for circulating the low boiling point refrigerant C through the low temperature side condenser Cd3 and the heat absorbing low temperature side evaporator Ev3, Also, a high temperature side heat pump circuit Ka for circulating the high boiling point refrigerant A over the high temperature side condenser Cd1 and the high temperature side evaporator Ev1 is configured, and the low temperature side condenser Cd3 is used for the high pressure gas phase refrigerant communication of the relay heat exchanger 10. The flow section 10a is formed as a condenser Cds for heat exchange between circuits, the indoor heat exchanger 1 is divided and formed as a condenser Cdm for heat radiation outside the circuit, and the air heating means H for heating is a condenser for heat radiation outside the circuit. The water heating means in the humidifying means M is a high temperature side condenser Cd1.

The relay heat exchanger 10 constitutes a relay heat transfer means for mutually exchanging heat between the inter-circuit heat transfer condenser Cds and the high temperature side evaporator Ev1.

On the other hand, in the cooling operation state shown in FIG. 7, the compressor Cmp1 is stopped, the outdoor heat exchanger 4 functions as the condenser Cd3 of the low boiling point refrigerant C, and the indoor heat exchanger 1 becomes the low boiling point refrigerant. This is a mode of functioning as the evaporator Ev3 of C. The expansion valve exp4 functions as an original expansion valve, and the expansion valve exp3 functions as a flow rate adjusting valve. Therefore, as shown in FIG. 8, it is constituted only by the low temperature side heat pump circuit Kc of the low boiling point refrigerant C.

[Other Embodiment] The relay heat transfer means is
Medium boiling point refrigerant B in the above mixed refrigerant heat pump circuit
It is not limited to the heat pump circuit Kb or the relay heat exchanger 10 in the multiple heat pump circuit, and can be appropriately changed.
For example, the dual heat pump circuit is not limited to the relay heat exchanger 10, and may be a heat pump circuit using a medium boiling point refrigerant. Further, in both the mixed refrigerant heat pump circuit and the dual heat pump circuit, a plurality of refrigerants may be formed in a plurality of stages.

Low-temperature side evaporator E in the heating and humidifying operation state
The heat absorption source of v3 is not limited to the atmospheric air OA, but can be changed appropriately.
Further, the air heating means H and the humidification means M are provided in the air supply fan 3
The air supply SA is ventilated by the air supply system and is not limited to being ducted to the air conditioning target area, and the indoor heat exchanger 1 and the steam generating heat exchanger 2 are provided in the air conditioning target area to supply the air conditioning target air. It may be configured to directly heat and humidify.

It should be noted that reference numerals are added to the claims for convenience of comparison with the drawings, but the present invention is not limited to the configurations of the accompanying drawings by the entry.

[Brief description of drawings]

FIG. 1 is a configuration diagram illustrating a circuit configuration of a heating and humidifying operation state of an air conditioner.

FIG. 2 is an explanatory diagram showing a circulation mode of refrigerant in a heating and humidifying operation state.

FIG. 3 is a configuration diagram showing a circuit configuration of an air conditioner in a cooling operation state.

FIG. 4 is an explanatory diagram showing a circulation mode of refrigerant in a cooling operation state.

FIG. 5 is a configuration diagram showing a circuit configuration of a heating and humidifying operation state of an air conditioner of a first another embodiment.

FIG. 6 is an explanatory diagram showing a circulation mode of a refrigerant in a heating and humidifying operation state of a first alternative embodiment.

FIG. 7 is a configuration diagram showing a circuit configuration of a cooling operation state of an air conditioner of a first another embodiment.

FIG. 8 is an explanatory diagram showing a circulation mode of refrigerant in a cooling operation state of a first alternative embodiment.

[Explanation of symbols]

 A High boiling point refrigerant B Medium boiling point refrigerant C Low boiling point refrigerant Cd1 High temperature side condenser Cd3 Low temperature side condenser Cdm Condenser for heat dissipation outside the circuit Cmp Common compressor Cds Condenser for heat exchange between circuits Ev1 High temperature side evaporator Ev3 Low temperature Side evaporator H Air heating means Ka High temperature side heat pump circuit Kb Relay heat transfer means (heat pump circuit) Kc Low temperature side heat pump circuit M Humidification means 10 Relay heat transfer means

Continuation of front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display area F25B 29/00 431 Z

Claims (3)

[Claims] 1. An air heating means (H) for heating, which heats the air by the heat of condensation of the refrigerant, and a humidifying means, which humidifies the heated air by the air heating means (H) with steam generated by heating the humidifying water. (M) is a heat pump type heating and humidifying device, and a low temperature side heat pump circuit for circulating a low boiling point refrigerant (C) between a low temperature side condenser (Cd3) and a low temperature side evaporator (Ev3) for absorbing heat. (Kc) and a high temperature side heat pump circuit (Ka) for circulating the high boiling point refrigerant (A) over the high temperature side condenser (Cd1) and the high temperature side evaporator (Ev1), and the low temperature side condenser (Cd3) Is divided into a condenser (Cds) for heat exchange between circuits and a condenser (Cdm) for heat radiation outside the circuit, and the air heating means (H) for heating is a condenser (Cdm) for heat radiation outside the circuit. ) Consists of The water heating means in the humidifying means (M) is composed of the high temperature side condenser (Cd1), and the condenser (Cds) for heat exchange between circuits and the high temperature side evaporator (Ev1) are mutually heat-exchanged. A heat pump type heating and humidifying device provided with relay heat transfer means (Kb, 10). 2. The common compressor (Cm) for sucking and discharging a high boiling point refrigerant (A) and a low boiling point refrigerant (C) in a mixed state in the low temperature side heat pump circuit and the high temperature side heat pump circuit.
The heat pump type heating and humidifying device according to claim 1, wherein the refrigerant is circulated by p). 3. The relay heat transfer means (Kb) uses the inter-circuit heat transfer condenser (Cds) as a heat absorption source, and
3. The heating / humidifying device of a heat pump type according to claim 1, wherein the high temperature side evaporator (Ev1) is configured by a heat pump circuit (Kb) of a medium boiling point refrigerant (B) that acts as a heat radiation source.