JPH0714951A - Vertical surface-mounted resin shielding type semiconductor device - Google Patents
Vertical surface-mounted resin shielding type semiconductor deviceInfo
- Publication number
- JPH0714951A JPH0714951A JP14246393A JP14246393A JPH0714951A JP H0714951 A JPH0714951 A JP H0714951A JP 14246393 A JP14246393 A JP 14246393A JP 14246393 A JP14246393 A JP 14246393A JP H0714951 A JPH0714951 A JP H0714951A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- vertical surface
- mounting
- semiconductor chip
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は縦型表面実装樹脂封止型
半導体装置に関し、特に高密度縦型表面実装樹脂封止型
半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vertical surface mount resin-encapsulated semiconductor device, and more particularly to a high density vertical surface mount resin-encapsulated semiconductor device.
【０００２】[0002]
【従来の技術】従来の縦型表面実装樹脂封止型半導体装
置は、図２（ａ），（ｂ）に示す様に、リードフレーム
のアイランド３に搭載された１個の半導体チップ５が封
入樹脂１により封止されてパッケージを形成し、このパ
ッケージの１辺の封入樹脂１から外部リード７が外部へ
導出され、その先端が一方向に直角に折り曲げられてい
る。又、外部リード７の列の両端部には、ダミー外部リ
ード９が植立され、その先端は外部リード７と反対方向
に直角に折り曲げられて基板８に実装されるときに位置
決めを行っている。2. Description of the Related Art As shown in FIGS. 2 (a) and 2 (b), a conventional vertical surface mount resin-sealed semiconductor device has a single semiconductor chip 5 mounted on an island 3 of a lead frame. A package is formed by sealing with a resin 1, an external lead 7 is led out from the encapsulating resin 1 on one side of the package, and its tip is bent at a right angle in one direction. Further, dummy external leads 9 are erected at both ends of the row of external leads 7, and their tips are bent at a right angle in the opposite direction to the external leads 7 and positioned when mounted on the substrate 8. .
【０００３】[0003]
【発明が解決しようとする課題】この従来の縦型表面実
装樹脂封止型半導体装置は、パッケージに半導体チップ
が１個だけしか実装できないので実装密度が高められな
いという問題点があった。The conventional vertical surface-mounting resin-encapsulated semiconductor device has a problem that the packaging density cannot be increased because only one semiconductor chip can be mounted in the package.
【０００４】又、外部リードの先端が直角に折り曲げら
れたまま基板に実装されるのですべり易く、実装位置が
ずれてしまうという問題点があった。Further, since the external leads are mounted on the substrate while being bent at a right angle, they are easily slipped and the mounting position is displaced.
【０００５】さらに、封入樹脂外に露出しているのは外
部リードとダミー外部リードだけであり、熱抵抗が高く
放熱上の問題点もあった。Further, only the external leads and the dummy external leads are exposed to the outside of the encapsulating resin, and the thermal resistance is high and there is a problem in heat dissipation.
【０００６】本発明の目的は、実装密度を高め、実装時
の位置ずれがなく、放熱性が高く安定して動作できる縦
型表面実装樹脂封止型半導体装置を提供することにあ
る。An object of the present invention is to provide a vertical surface-mounting resin-encapsulated semiconductor device which has a high mounting density, is free from displacement during mounting, has a high heat radiation property and can be stably operated.
【０００７】[0007]
【課題を解決するための手段】本発明の縦型表面実装樹
脂封止型半導体装置は、一端が基板の溝に挿され固定さ
れる放熱板と、アイランドの一方の面が絶縁性接着剤に
て前記放熱板に固定される２つのリードフレームと、こ
の２つのリードフレームの前記アイランドのそれぞれの
他方の面に搭載される２つの半導チップと、前記放熱板
の一部を外部に露出させて前記２つの半導体チップを封
止する封入樹脂と、前記２つの半導体チップのそれぞれ
に接続し前記放熱板を挟んで前記封入樹脂から導出され
る先端が直角に折り曲げられ前記基板に接続するととも
に位置決めを行う外部リードとを有する。A vertical surface-mounting resin-encapsulated semiconductor device of the present invention includes a heat sink whose one end is inserted and fixed in a groove of a substrate, and one surface of an island using an insulating adhesive. Two lead frames fixed to the heat sink, two semiconductor chips mounted on the other surface of each of the islands of the two lead frames, and a part of the heat sink exposed to the outside. And a sealing resin for sealing the two semiconductor chips, and a tip connected to each of the two semiconductor chips and led out of the sealing resin sandwiching the heat dissipation plate is bent at a right angle to be connected to the substrate and positioned. With external leads.
【０００８】[0008]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００９】図１（ａ），（ｂ）は本発明の一実施例を
基板に実装した正面図およびその側面図である。図１
（ａ），（ｂ）に示す様に、まず、リードフレームのア
イランド３の一面に半導体チップ５を搭載する。次に、
同様にリードフレームのアイランド３の一面に半導体チ
ップ５を搭載したもう１つのリードフレームをアイラン
ドの他の面が向い合う様に金属製の放熱板２の両面に絶
縁性接着剤４にて固定し、それぞれの半導体チップ５の
パッドと外部リード７同士を接続ワイヤ６にて接続す
る。次、外部リード７と放熱板２の一部を残してそれぞ
れの半導体チップ５を封入樹脂１にて封止する。FIGS. 1 (a) and 1 (b) are a front view and a side view of one embodiment of the present invention mounted on a substrate. Figure 1
As shown in (a) and (b), first, the semiconductor chip 5 is mounted on one surface of the island 3 of the lead frame. next,
Similarly, another lead frame having the semiconductor chip 5 mounted on one surface of the island 3 of the lead frame is fixed to both surfaces of the metal heat sink 2 with the insulating adhesive 4 so that the other surface of the island faces each other. , The pads of the respective semiconductor chips 5 and the external leads 7 are connected by the connecting wires 6. Next, the semiconductor chip 5 is sealed with the encapsulating resin 1 while leaving the external lead 7 and the heat sink 2 partially.
【００１０】この様に構成された縦型表面実装樹脂封止
型半導体装置を基板８に実装する場合には、放熱板２の
下端をあらかじめ基板８に形成された溝に挿入すること
により固定し、又、外部リード７をあらかじめ直角に折
り曲げておくことにより、接続端子とあわせて位置決め
用の端子としても使用できるので図２（ａ），（ｂ）に
示す従来のダミー外部リード９は不要となる。When the vertical surface-mounting resin-encapsulated semiconductor device thus constructed is mounted on the substrate 8, the lower end of the heat sink 2 is fixed by inserting it into a groove formed in the substrate 8 in advance. Also, by bending the external lead 7 at a right angle in advance, it can be used as a positioning terminal together with the connection terminal, so that the conventional dummy external lead 9 shown in FIGS. 2A and 2B is unnecessary. Become.
【００１１】さらに、半導体チップ５で発生した熱は放
熱板２により外部へ放散できるので半導体チップ５の温
度上昇をおさえ、安定した動作の縦型表面実装樹脂封止
型半導体装置が得られる。Further, since the heat generated in the semiconductor chip 5 can be dissipated to the outside by the heat radiating plate 2, the temperature rise of the semiconductor chip 5 can be suppressed, and the vertical type surface mount resin-sealed semiconductor device of stable operation can be obtained.
【００１２】[0012]
【発明の効果】以上説明したように本発明は、１つのパ
ッケージ内に２個の半導体チップを搭載できるので実装
密度を高めることができるという効果がある。As described above, according to the present invention, since two semiconductor chips can be mounted in one package, the mounting density can be increased.
【００１３】又、金属製の放熱板を備えており、この放
熱板の下端を基板の溝に挿入して固定する為、実装位置
ずれを防止でき、半導体チップの温度上昇をおさえ安定
した動作が得られるという効果がある。Further, since a metal heat radiating plate is provided and the lower end of this heat radiating plate is inserted and fixed in the groove of the substrate, displacement of the mounting position can be prevented, and stable operation of suppressing the temperature rise of the semiconductor chip can be achieved. It has the effect of being obtained.
【図１】（ａ），（ｂ）は本発明の一実施例を基板に実
装した正面図およびその側面図である。1 (a) and 1 (b) are a front view and a side view of a substrate mounted on a substrate according to an embodiment of the present invention.
【図２】（ａ），（ｂ）は従来の縦型表面実装樹脂封止
型半導体装置の一例を基板に実装した正面図およびその
側面図である。2A and 2B are a front view and a side view of an example of a conventional vertical surface mount resin-sealed semiconductor device mounted on a substrate.
１ 封入樹脂 ２ 放熱板 ３ アイランド ４ 絶縁性接着剤 ５ 半導体チップ ６ 接続ワイヤ ７ 外部リード ８ 基板 ９ ダミー外部リード 1 Encapsulation Resin 2 Heat Sink 3 Island 4 Insulating Adhesive 5 Semiconductor Chip 6 Connecting Wire 7 External Lead 8 Substrate 9 Dummy External Lead
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 25/07 25/18 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical indication H01L 25/07 25/18
Claims (1)
板と、アイランドの一方の面が絶縁性接着剤にて前記放
熱板に固定される２つのリードフレームと、この２つの
リードフレームの前記アイランドのそれぞれの他方の面
に搭載される２つの半導チップと、前記放熱板の一部を
外部に露出させて前記２つの半導体チップを封止する封
入樹脂と、前記２つの半導体チップのそれぞれに接続し
前記放熱板を挟んで前記封入樹脂から導出される先端が
直角に折り曲げられ前記基板に接続するとともに位置決
めを行う外部リードとを有することを特徴とする縦型表
面実装樹脂封止型半導体装置。1. A heat dissipation plate having one end inserted in and fixed to a groove of a substrate, two lead frames having one surface of an island fixed to the heat dissipation plate with an insulating adhesive, and the two lead frames. Two semiconductor chips mounted on the other surface of each of the islands, an encapsulating resin that exposes a part of the heat sink to the outside to seal the two semiconductor chips, and the two semiconductor chips. Vertical surface-mounting resin encapsulation, characterized in that each of the external leads is connected to each of the Type semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14246393A JP2880878B2 (en) | 1993-06-15 | 1993-06-15 | Vertical surface-mount resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14246393A JP2880878B2 (en) | 1993-06-15 | 1993-06-15 | Vertical surface-mount resin-encapsulated semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0714951A true JPH0714951A (en) | 1995-01-17 |
| JP2880878B2 JP2880878B2 (en) | 1999-04-12 |
Family
ID=15315906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14246393A Expired - Lifetime JP2880878B2 (en) | 1993-06-15 | 1993-06-15 | Vertical surface-mount resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2880878B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015120367A (en) * | 2013-12-20 | 2015-07-02 | 日本精工株式会社 | Electronic control unit, electric power steering device and vehicle |
| US9472538B2 (en) | 2013-07-04 | 2016-10-18 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method and semiconductor device |
| US9944312B2 (en) | 2013-12-13 | 2018-04-17 | Nsk Ltd. | Electronic control unit, electric power steering device, and vehicle |
-
1993
- 1993-06-15 JP JP14246393A patent/JP2880878B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9472538B2 (en) | 2013-07-04 | 2016-10-18 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method and semiconductor device |
| JP6065978B2 (en) * | 2013-07-04 | 2017-01-25 | 三菱電機株式会社 | Semiconductor device manufacturing method, semiconductor device |
| US9944312B2 (en) | 2013-12-13 | 2018-04-17 | Nsk Ltd. | Electronic control unit, electric power steering device, and vehicle |
| JP2015120367A (en) * | 2013-12-20 | 2015-07-02 | 日本精工株式会社 | Electronic control unit, electric power steering device and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2880878B2 (en) | 1999-04-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990105 |