JPH07147473A - Connecting auxiliary component of printed board - Google Patents
Connecting auxiliary component of printed boardInfo
- Publication number
- JPH07147473A JPH07147473A JP29232893A JP29232893A JPH07147473A JP H07147473 A JPH07147473 A JP H07147473A JP 29232893 A JP29232893 A JP 29232893A JP 29232893 A JP29232893 A JP 29232893A JP H07147473 A JPH07147473 A JP H07147473A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- hole
- printed circuit
- circuit board
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、プリント基板に部品を
搭載してプリント基板の回路露出部に部品の電極を接続
したり、プリント基板に設けてあるヴィアホールにリー
ド線を接続するときに使用するプリント基板の接続用補
助用品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case where a component is mounted on a printed circuit board and an electrode of the component is connected to a circuit exposed portion of the printed circuit board or a lead wire is connected to a via hole provided in the printed circuit board. The present invention relates to auxiliary equipment for connecting printed circuit boards to be used.
【0002】[0002]
【従来の技術】図5は、プリント基板に部品を搭載して
プリント基板の回路露出部に部品の電極を接続した従来
の状態の一例を示す図で、(a)は分解斜視図、(b)
は斜視図である。図6は図5の例のA−A線断面図であ
る。2. Description of the Related Art FIG. 5 is a diagram showing an example of a conventional state in which a component is mounted on a printed circuit board and an electrode of the component is connected to a circuit exposed portion of the printed circuit board. FIG. )
Is a perspective view. FIG. 6 is a sectional view taken along the line AA of the example of FIG.
【0003】プリント基板上に部品を搭載し、プリント
基板の回路露出部に部品の電極を接続するときの従来の
手段は、図5および図6に示すように、プリント基板2
1上に搭載部品23の形状および大きさに合わせた回路
露出部であるパッド(またはランド)22を設けてお
き、搭載部品23の電極23aをパッド22に直接搭載
し、電極23aとパッド22とをはんだ26で接続して
いる。As shown in FIGS. 5 and 6, the conventional means for mounting a component on a printed circuit board and connecting the electrode of the component to the circuit exposed portion of the printed circuit board is as follows.
A pad (or a land) 22 which is a circuit exposed portion corresponding to the shape and size of the mounting component 23 is provided on the device 1, and the electrode 23a of the mounting component 23 is directly mounted on the pad 22 to form the electrode 23a and the pad 22. Are connected by solder 26.
【0004】[0004]
【発明が解決しようとする課題】上述したような従来の
プリント基板の回路露出部の搭載部品の電極との接続手
段は、搭載部品が変更になってパッドの位置および大き
さと搭載部品の形状および大きさが適合しなくなると、
はんだの量が少なくなって充分な接続強度がえられなく
なるか、または全くはんだ付けができなくなるという欠
点を有している。In the conventional means for connecting the circuit exposed portion of the printed circuit board to the electrodes of the mounted component as described above, the position and size of the pad and the shape and shape of the mounted component are changed when the mounted component is changed. When the size does not fit,
There is a drawback that the amount of solder becomes small and sufficient connection strength cannot be obtained, or soldering cannot be performed at all.
【0005】また、多層のプリント基板において、一つ
の層の信号線を他層の信号線に接続するために設けてあ
るヴィアホールと呼ばれるスルーホールにリード線を接
続するとき、リード線とヴィアホールとの間に充分な量
のはんだを供給できないため、充分な接続強度がえられ
ないという問題点も有している。In a multilayer printed circuit board, when a lead wire is connected to a through hole called a via hole provided to connect a signal line of one layer to a signal line of another layer, the lead wire and the via hole There is also a problem that a sufficient connection strength cannot be obtained because a sufficient amount of solder cannot be supplied between and.
【0006】[0006]
【課題を解決するための手段】本発明の第一の接続用補
助用品は、プリント基板に設けてあるパッドよりも大き
な外形を有し、内部に前記パッドとほぼ同じ大きさおよ
び形状の穴を有する平板状の導電部と、前記導電部とお
なじ大きさおよび形状を有し前記導電部の下面に固着し
た平板状の絶縁部とを備えている。A first auxiliary accessory for connection according to the present invention has an outer shape larger than a pad provided on a printed circuit board, and has a hole having substantially the same size and shape as the pad therein. It has a flat plate-shaped conductive portion and a flat plate-shaped insulating portion having the same size and shape as the conductive portion and fixed to the lower surface of the conductive portion.
【0007】本発明の第二の接続用補助用品は、プリン
ト基板に設けてあるヴィアホールの接続部よりも大きな
外形を有し、内部に前記ヴィアホールの接続部とほぼ同
じ大きさの穴を有する平板状の導電部と、前記導電部と
おなじ大きさおよび形状を有し前記導電部の下面に固着
した平板状の絶縁部とを備えている。The second connecting auxiliary article of the present invention has an outer shape larger than the connecting portion of the via hole provided on the printed circuit board, and has a hole having substantially the same size as the connecting portion of the via hole therein. It has a flat plate-shaped conductive portion and a flat plate-shaped insulating portion having the same size and shape as the conductive portion and fixed to the lower surface of the conductive portion.
【0008】[0008]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【0009】図1は本発明の第一の実施例を示す分解斜
視図、図2は図1の実施例の断面図である。FIG. 1 is an exploded perspective view showing a first embodiment of the present invention, and FIG. 2 is a sectional view of the embodiment shown in FIG.
【0010】図1および図2において、プリント基板1
にはパッド2が設けてある。搭載部品3の大きさは、パ
ッド2よりも大きいものである。このような搭載部品3
をパッド2に接続するために、搭載部品3とパッド2と
の間に、補助用品4を介装する。1 and 2, the printed circuit board 1
The pad 2 is provided on the. The size of the mounted component 3 is larger than that of the pad 2. Such mounting parts 3
In order to connect the pad 2 to the pad 2, an auxiliary article 4 is interposed between the mounting component 3 and the pad 2.
【0011】補助用品4は、パッド2よりも大きな外形
を有し、内部にパッド2とほぼ同じ大きさおよび形状の
穴を有する平板状の導電部4aと、導電部4aとおなじ
大きさおよび形状を有し、導電部4aの下面に接着した
平板状の絶縁部4bとで構成されている。The auxiliary article 4 has an outer shape larger than that of the pad 2 and has a flat plate-like conductive portion 4a having a hole having substantially the same size and shape as the pad 2, and the same size and shape as the conductive portion 4a. And a flat plate-shaped insulating portion 4b adhered to the lower surface of the conductive portion 4a.
【0012】このように構成した補助用品4を、絶縁部
4bをプリント基板1に接触させ、その穴の部分をパッ
ド2の位置に合わせてプリント基板1上に搭載し、穴の
中にはんだ6bを充填すると、パッド2は、はんだ6b
を介して導電部4aに接続される。この補助用品4の上
に搭載部品3の電極3aを搭載し、電極3aと導電部4
aとをはんだ6aによって接続して固定すると、搭載部
品3の電極3aは、はんだ6aおよび導電部4aおよび
はんだ6bを介してパッド2に接続される。このとき、
絶縁部4bは、導電部4aとプリント基板1に設けてあ
る他の回路露出部5とが短絡するとを防止する。The auxiliary component 4 thus constructed is mounted on the printed board 1 with the insulating portion 4b brought into contact with the printed board 1 and the hole portions thereof aligned with the positions of the pads 2 and the solder 6b is placed in the hole. Pad 2 is filled with solder 6b
Is connected to the conductive portion 4a via. The electrode 3a of the mounting component 3 is mounted on the auxiliary article 4, and the electrode 3a and the conductive portion 4 are mounted.
When a and a are connected and fixed by the solder 6a, the electrode 3a of the mounting component 3 is connected to the pad 2 via the solder 6a, the conductive portion 4a, and the solder 6b. At this time,
The insulating portion 4b prevents a short circuit between the conductive portion 4a and another circuit exposed portion 5 provided on the printed circuit board 1.
【0013】図3は本発明の第二の実施例を示す分解斜
視図、図4は図3の実施例の断面図である。FIG. 3 is an exploded perspective view showing a second embodiment of the present invention, and FIG. 4 is a sectional view of the embodiment shown in FIG.
【0014】図3および図4において、プリント基板1
1にはヴィアホール17が設けてある。リード線18
は、このヴィアホール17に接続するための線である。
補助用品14は、リード線18を、このヴィアホール1
7に接続するとき、それらの接続を確実にするため、リ
ード線18とヴィアホール17との間に介装する。3 and 4, the printed circuit board 1
1 is provided with a via hole 17. Lead wire 18
Is a line for connecting to the via hole 17.
For the auxiliary article 14, the lead wire 18 is attached to the via hole 1
When connecting to the wire 7, it is interposed between the lead wire 18 and the via hole 17 to ensure their connection.
【0015】補助用品14は、ヴィアホール17の接続
部よりも大きな外形を有しており、、内部にヴィアホー
ル17の接続部とほぼ同じ大きさの穴を有する平板状の
導電部14aと、導電部14aとおなじ大きさおよび形
状を有し、導電部14aの下面に接着した平板状の絶縁
部14bとで構成されている。The auxiliary article 14 has a larger outer shape than the connecting portion of the via hole 17, and has a flat plate-like conductive portion 14a having a hole having substantially the same size as the connecting portion of the via hole 17 therein. The conductive portion 14a has the same size and shape as the conductive portion 14a, and is composed of a flat plate-shaped insulating portion 14b bonded to the lower surface of the conductive portion 14a.
【0016】このように構成した補助用品14の穴の部
分をヴィアホール17の接続部の位置に合わせてプリン
ト基板11上に搭載し、補助用品14の上にリード線1
8を搭載してヴィアホール17の穴の中にはんだ16を
充填すると、ヴィアホール17は、はんだ16を介して
導電部14aとリード線18とに接続される。導電部1
4aは、リード線18にも直接に接続される。The hole portion of the auxiliary article 14 thus constructed is mounted on the printed circuit board 11 in alignment with the position of the connection portion of the via hole 17, and the lead wire 1 is placed on the auxiliary article 14.
When 8 is mounted and the solder 16 is filled in the hole of the via hole 17, the via hole 17 is connected to the conductive portion 14 a and the lead wire 18 via the solder 16. Conductive part 1
4a is also directly connected to the lead wire 18.
【0017】このように、補助用品14を介してヴィア
ホール17とリード線18とを接続することにより、リ
ード線18と補助用品14との接触面積が、リード線1
8とヴィアホール17の接続部との接触面積よりも大き
くなるため、確実な接続を行うことが可能になる。As described above, by connecting the via hole 17 and the lead wire 18 via the auxiliary article 14, the contact area between the lead wire 18 and the auxiliary article 14 is reduced.
Since it is larger than the contact area between 8 and the connection portion of the via hole 17, it is possible to make a reliable connection.
【0018】上述の第一および第二の実施例において、
絶縁部の表面に粘着性を持たせると、補助用品をプリン
ト基板上に搭載するときの位置決めが容易になる。ま
た、この粘着性の絶縁部によって補助用品をシート上に
接着しておくことにより、補助用品の取扱いを容易にす
ることが可能となる。In the above first and second embodiments,
When the surface of the insulating portion is made to have adhesiveness, positioning of the auxiliary article when mounting it on the printed circuit board becomes easy. Also, by adhering the auxiliary product on the sheet by means of this adhesive insulating portion, it becomes possible to handle the auxiliary product easily.
【0019】[0019]
【発明の効果】以上説明したように、本発明のプリント
基板の接続用補助用品は、導電部と絶縁部とを上下に接
着し、プリント基板のパッドまたはヴィアホールの接続
部よりも大きな外形とし、内部にパッドまたはヴィアホ
ールの接続部とほぼ同し形状の穴を設け、絶縁部をプリ
ント基板と接触させて補助用品の穴とパッドまたはヴィ
アホールとをはんだによって接続することにより、搭載
部品とパッドとの接続、またはヴィアホールとリード線
との接続を確実に行うことが可能になるという効果が効
果がある。As described above, the auxiliary article for connecting a printed circuit board according to the present invention has a conductive portion and an insulating portion which are vertically bonded to each other, and has an outer shape larger than a connecting portion of a pad or a via hole of the printed circuit board. By providing a hole inside the pad or via hole that has almost the same shape as the connection part and contacting the insulating part with the printed circuit board and connecting the hole of the auxiliary item and the pad or via hole with solder, The effect is that the connection with the pad or the connection between the via hole and the lead wire can be surely performed.
【図1】本発明の第一の実施例を示す分解斜視図であ
る。FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.
【図2】図1の実施例の断面図である。2 is a cross-sectional view of the embodiment of FIG.
【図3】本発明の第二の実施例を示す分解斜視図であ
る。FIG. 3 is an exploded perspective view showing a second embodiment of the present invention.
【図4】図3の実施例の断面図である。FIG. 4 is a cross-sectional view of the embodiment of FIG.
【図5】プリント基板に部品を搭載してプリント基板の
回路露出部に部品の電極を接続した従来の状態の一例を
示すで、(a)は分解斜視図、(b)は斜視図である。5A and 5B show an example of a conventional state in which a component is mounted on a printed circuit board and an electrode of the component is connected to a circuit exposed portion of the printed circuit board. FIG. 5A is an exploded perspective view and FIG. 5B is a perspective view. .
【図6】図5の例のA−A線断面図である。6 is a cross-sectional view taken along the line AA of the example of FIG.
1・11・21 プリント基板 2・22 パッド 3・23 搭載部品 3a・23a 電極 4・14 補助用品 4a・14a 導電部 4b・14b 絶縁部 5 回路露出部 6a・6b・16・26 はんだ 17 ヴィアホール 18 リード線 1 ・ 11 ・ 21 Printed circuit board 2 ・ 22 Pad 3 ・ 23 Mounting component 3a ・ 23a Electrode 4 ・ 14 Auxiliary item 4a ・ 14a Conductive part 4b ・ 14b Insulation part 5 Circuit exposed part 6a ・ 6b ・ 16 ・ 26 Solder 17 Via hole 18 lead wire
Claims (2)
大きな外形を有し、内部に前記パッドとほぼ同じ大きさ
および形状の穴を有する平板状の導電部と、前記導電部
とおなじ大きさおよび形状を有し前記導電部の下面に固
着した平板状の絶縁部とを備えることを特徴とするプリ
ント基板の接続用補助用品。1. A flat plate-shaped conductive portion having an outer shape larger than that of a pad provided on a printed circuit board and having a hole having substantially the same size and shape as the pad therein, and the same size as the conductive portion. A supplementary article for connecting a printed circuit board, which has a shape and a flat plate-shaped insulating portion fixed to the lower surface of the conductive portion.
の接続部よりも大きな外形を有し、内部に前記ヴィアホ
ールの接続部とほぼ同じ大きさの穴を有する平板状の導
電部と、前記導電部とおなじ大きさおよび形状を有し前
記導電部の下面に固着した平板状の絶縁部とを備えるこ
とを特徴とするプリント基板の接続用補助用品。2. A flat plate-shaped conductive portion having an outer shape larger than a connection portion of a via hole provided on a printed circuit board and having a hole therein having substantially the same size as the connection portion of the via hole, and the conductive portion. An auxiliary article for connecting a printed circuit board, comprising: a plate-shaped insulating portion having the same size and shape as the portion and fixed to the lower surface of the conductive portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29232893A JPH07147473A (en) | 1993-11-24 | 1993-11-24 | Connecting auxiliary component of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29232893A JPH07147473A (en) | 1993-11-24 | 1993-11-24 | Connecting auxiliary component of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07147473A true JPH07147473A (en) | 1995-06-06 |
Family
ID=17780369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29232893A Withdrawn JPH07147473A (en) | 1993-11-24 | 1993-11-24 | Connecting auxiliary component of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07147473A (en) |
-
1993
- 1993-11-24 JP JP29232893A patent/JPH07147473A/en not_active Withdrawn
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6570271B2 (en) | Apparatus for routing signals | |
JPH07147473A (en) | Connecting auxiliary component of printed board | |
JPH02134890A (en) | Circuit element mounting board | |
JPH0677623A (en) | Electronic circuit device and manufacture thereof | |
JP2817715B2 (en) | Ball grid array type circuit board | |
JPH05102621A (en) | Conductive pattern | |
JPH0519974Y2 (en) | ||
JP3807874B2 (en) | Electronic circuit unit | |
JPH02250388A (en) | Hybrid integrated circuit | |
JP2636332B2 (en) | Printed board | |
JPH0672249U (en) | Integrated circuit device | |
JPH05167202A (en) | Flexrigid substrate | |
JPH0414286A (en) | Printed wiring board for surface mounting | |
JPH0590728A (en) | Hybrid integrated circuit board | |
JP2530783Y2 (en) | Chip component mounting structure | |
JPH0250464A (en) | Lattice array type semiconductor element package | |
JPH06302933A (en) | Mounting structure for chip component | |
JP2000269628A (en) | Method and structure for fitting chip component by reflow | |
JPH0710969U (en) | Printed board | |
JPS62208691A (en) | Double-sided mounting hybrid integrated circuit | |
JPH0288268U (en) | ||
JPS6330795B2 (en) | ||
JPH01130484A (en) | Ceramic chip parts | |
JPH10154862A (en) | Ground case for surface mounting parts and semiconductor device | |
JPS63158770A (en) | Jack mounting apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010130 |