JPH07142666A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To enable an integrated circuit device to be positioned high in accuracy to an IC socket or a mounting board. CONSTITUTION:Die pad suspensions 12 continuously connected to a die pad 14 on which an integrated circuit chip 13 is mounted and positioning holes 15 bored in the die pad suspensions 12 to be engaged with positioning projections provided to a mounting member are provided in a molded package 16, wherein projection insertion holes 17 provided to the molded package 16 are made to communicate with the positioning holes 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device which improves the positioning accuracy with respect to a mounting board or the like.

[0002]

2. Description of the Related Art In recent years, as the functionality of integrated circuit devices (hereinafter referred to as ICs) has increased, there has been an increasing demand for ICs with more pins. As the size becomes smaller, it becomes necessary to improve the positioning accuracy with respect to the IC socket and the mounting board.

FIG. 4 shows a positioning structure of an IC by a conventional quad flat package (QFP). In the figure, 1 is an IC, 2 is a lead of IC1,
Reference numeral 3 is a lower mold for accommodating the IC 1, and 4 is a positioning portion provided on the lower mold 3 for positioning the edge of the IC 1.

Next, the operation will be described. When the IC 1 is installed on the lower mold 3, the IC 1 is positioned by bringing the edge portion (the inclined surface in the figure) of the IC 1 into contact with the positioning portion 4 of the lower mold 3.

A conventional example of such a positioning structure is shown in FIG. This is to position the end pin 6 of the lead so as to contact the edge portion of the mold member 5 when the IC 1 is arranged between the mold members 5.

[0006]

Since the conventional integrated circuit device is constructed as described above, as shown in FIG.
In the method of positioning using the lower mold 3 of the mold, the IC 1
Due to the relative displacement of the mold and frame in the assembly process of, there is a limit to the improvement of positioning accuracy, and the method of manufacturing the mold is often the method of encapsulating resin in the mold. There were some problems such as accuracy problems.

Further, as shown in FIG. 5, in the method of using the lead end pin 6 for positioning, the lead end pin 6 and the edge of the molding member 5 serving as the positioning portion come into contact with each other.
There is a problem that the lead end pin 6 is bent.

The present invention has been made to solve the above problems, and an object of the present invention is to obtain an integrated circuit device which can be accurately positioned with respect to an IC socket or a mounting substrate.

[0009]

An integrated circuit device according to the present invention is provided with a plurality of die pad suspending portions connected to a die pad for mounting an integrated circuit chip in a mold package, and the die pad suspending portion. A positioning hole engaged with the positioning protrusion on the mounting member side is provided, and the protrusion insertion opening provided in the mold package is communicated with the positioning hole.

[0010]

In the integrated circuit device according to the present invention, since the die pad suspension portion has the positioning hole and the die pad is integrated with the lead, by inserting the positioning hole into the positioning protrusion of the mounting board or the like, By positioning, each lead can be positioned with high accuracy with respect to the contact pin of the IC socket or the pad of the mounting substrate.

[0011]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 11 is an IC and 12 is an I
A die pad suspension portion as a frame partially embedded in C11 is integrally connected to a die pad 14 for mounting an IC chip 13 as shown in FIG.

Numeral 15 is a positioning hole provided at a position symmetrical with respect to the die pad 14, for example, two positioning holes drilled in the die pad suspending portion 12, which are symmetrical with respect to the die pad 14. One piece or a plurality of pieces are provided at the positions or more. The size of the positioning hole 15 is, for example, 1 mm or less in diameter.

Further, 16 is an I as an integrated circuit chip.
A mold package for enclosing and sealing a part of the die pad 14 and the die pad suspending portion 12 together with the C chip 13, and 17 is a protrusion insertion opening formed in the mold package 16 and communicating with the positioning hole 15 for positioning. It is larger than the hole 15 and is formed so that a positioning protrusion described later can be smoothly inserted and removed.

Although the die pad suspension portion 12 as a frame is not directly connected to the chip external pin, it is connected to the die pad 14 and is basically grounded for use.

Next, the operation will be described. As described above, in the IC 11, the die pad suspension portion 12 and the mold package 16 are provided with the positioning hole 15 and the protrusion insertion opening 17, respectively.

Therefore, when the IC 11 is mounted on a mounting board or an IC socket, for example, a protrusion of the IC 11 is inserted into a positioning protrusion 19 which is provided in advance on the mounting board 18 as shown in FIG. Insert the opening 17. As a result, the positioning protrusion 19 is guided to the protrusion insertion opening 17 and enters into the positioning hole 15 of the die pad suspension portion 12, and finally, the positioning hole 15 is partially locked in the positioning hole 15 and stopped.

Therefore, the positioning hole 15 provided in the die pad suspension 12 made of a metal material is positioned with respect to the positioning protrusion 19, and as a result, the positioning of the IC 11 with respect to the mounting substrate 18 is performed with high accuracy, and It is possible to cope with the increase in the number of pins of the IC 11. In this case, the positioning protrusion 19 and the positioning hole 1
By setting the engagement with 5 at two or more locations, it is possible to further prevent the positional deviation after the positioning.

Example 2. In the above embodiment, the IC11
Although the positioning protrusion 19 is inserted into the positioning hole 15 from below, the same effect as that of the above embodiment can be obtained by inserting the positioning protrusion 19 from above the IC.

[0019]

As described above, according to the present invention, a plurality of die pad suspending portions connected to a die pad for mounting an integrated circuit chip in a mold package and a plurality of die pad suspending portions are provided by being punched and mounted. Since a positioning hole to be engaged with the positioning protrusion on the member side is provided and the protrusion insertion opening provided in the mold package is made to communicate with the positioning hole, an IC socket of an integrated circuit device or mounting There is an effect that the positioning with respect to the substrate can be achieved easily and with high precision without bending the pin legs.

[Brief description of drawings]

FIG. 1 is a front view showing an integrated circuit device of the present invention partially broken away.

FIG. 2 is a schematic diagram showing an internal structure of the integrated circuit device in FIG.

FIG. 3 is a partially cutaway front view showing the positioning structure of the integrated circuit device of FIG.

FIG. 4 is a front view showing a positioning structure of a conventional integrated circuit device.

FIG. 5 is a plan view showing a positioning structure of a conventional integrated circuit device.

[Explanation of symbols]

 12 Die pad hanging part 13 Integrated circuit chip 14 Die pad 15 Positioning hole 16 Mold package 17 Protrusion insertion opening

Claims (1)

[Claims] 1. In an integrated circuit device in which an integrated circuit chip is sealed in a mold package, a plurality of die pad suspending portions connected to a die pad for installing the integrated circuit chip in the mold package, and the die pad suspending unit. And a positioning hole that is provided in the mold package and that engages with the positioning protrusion on the mounting member side, and a protrusion insertion opening that is provided in the mold package and communicates with the positioning hole. Integrated circuit device.