JPH04364761A - Semiconductor device and mounting method therefor - Google Patents

Abstract

PURPOSE:To perform an exact positioning operation in various kinds of processes regarding a semiconductor device wherein bumpers are formed in the semiconductor device provided with high pin counts. CONSTITUTION:Bumpers 41 to 44 which protrude from lead terminals 3 are formed in four corners of a package body 2 from which the lead terminals 3 are extracted. Through holes 71 to 74 for positioning use are made in at least two corners out of the bumpers 41 to 44.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-pin semiconductor device in which a bumper is formed. In recent years, semiconductor devices that have become larger and more highly integrated have more pins and narrower pitches, and the package shape is SOP (Small).
Outline Package), QFP (Qu
Ad Flat Package) etc. are adopted. As the number of pins becomes narrower, packages with so-called bumpers for protecting lead terminals are being used. Even in such packages, the positional accuracy during mounting has become stricter due to the narrow pitch and increased number of pins, and it is desired to easily achieve high positional accuracy.

0002

2. Description of the Related Art FIG. 4 shows an external view of a conventional bumper-equipped semiconductor package. Figure 4 shows a QFP-type bumper-equipped semiconductor package (BQFP) for mounting large, highly integrated ICs.
).

In FIG. 4, a semiconductor package 1A has a plurality of lead terminals 3 extending from four directions of a package body 2 and is packaged using a resin mold. In this case, there are bumpers 41 to 44 at the four corners.
is formed. As described above, these bumpers 41 to 44 serve to protect the lead terminals 3 by preventing them from bending or breaking when they receive an impact.

[0004] For example, QFPs in which the pitch of the outer leads (lead terminals 3) is generally 0.5 mm have been used;
QF with a pitch of 0.4 to 0.3 mm due to the demand for miniaturization
P is being developed.

[0005]

By the way, in each process such as testing, burn-in, and mounting, the positioning of the above-mentioned multi-pin QFP semiconductor device is performed by matching the external shape. However, with resin molds, the external shape depends on the mold,
There is a problem that packaging with a highly accurate shape cannot be performed due to the wobbling of the mold, and strict positioning cannot be performed in each of the above steps.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device that can be precisely positioned in various processes.

[0007]

[Means for Solving the Problems] The above-mentioned problem is solved by a resin-molded semiconductor device in which protrusions projecting from the lead terminals are formed at each of the four corners of a rectangular shape from which the lead terminals extend from a predetermined side. Through-holes for positioning are formed in the protrusions in at least two corners, and a plate-shaped lead frame is appropriately positioned within the protrusion, so that the plate-shaped lead frame has a predetermined size at the position of the through-holes. This problem can be solved by forming a through hole.

[0008]

[Operation] As described above, through holes for positioning are formed in at least two corners of the protrusions formed at the four corners of the package of the semiconductor device. Further, a plate-shaped lead frame is positioned within the protrusion, and a through hole of a predetermined size is formed at the position of the through hole.

[0009] Therefore, by inserting a positioning pin or the like into the through hole (and the through hole), it is possible to obtain high positional accuracy. In other words, when positioning a semiconductor package, by forming the position of the through hole with high precision, it is possible to easily and accurately perform strict positioning in various processes, regardless of the external shape of the resin mold. Become.

0010

Embodiment FIG. 1 shows a configuration diagram of an embodiment of the present invention. Note that the same components as in FIG. 4 are given the same reference numerals.

In FIG. 1, a semiconductor package 1B shows a QFP semiconductor device, in which a lead frame 5 on which a chip (not shown) is mounted is molded with resin. That is, lead terminals (outer leads) 3 extend from the sides in four directions of the rectangular package body 2, and bumpers 41 to 44, which are protrusions projecting from the lead terminals 3, are formed at the four corners. In this case, the lead frame 5 has an outer lead group (
For example, a bumper 4 with a pitch of 0.4 to 0.3 mm)
The protruding pieces 6 for forming the numbers 1 to 44 are integrally formed.

In the bumpers 41 to 44, through holes 71 to 74 are formed between the projecting pieces 6. The through holes 71 to 74 serve as positioning during attachment, and are drilled with high positional accuracy between the lead terminals 3 and the lead terminals 3.

Such a semiconductor package 1B is positioned on a mounting board by inserting positioning pins (not shown) into the through holes 71 to 74 of the bumpers 41 to 44 during various processes such as testing, burn-in, and mounting. . After that, it is mounted on the mounting board by soldering. As a result, the lead terminals 3 arranged with many pins at a narrow pitch
connection can be established reliably. That is, by positioning using the through holes 71 to 74, strict positioning can be performed easily and with high precision, regardless of variations in the external shape during resin molding.

[0014] Since positioning can be performed with at least two points, in order to obtain stricter positional accuracy, the through holes 71 are provided in all of the bumpers 41 to 44.
74 may be provided, or, for example, through holes may be formed in two diagonally (not necessarily diagonally) bumper locations.

FIG. 2 shows a manufacturing process diagram of the present invention. In FIG. 2, first, a lead frame (5) is supplied (step (hereinafter referred to as "ST") 1), a chip and an adhesive such as Ag paste are supplied by a dispenser, and die-bonded at room temperature ( ST2). Then, curing is performed at 150° C. for 2 hours to harden the adhesive used for die attachment (ST3), and the surface is inspected for its condition (ST4).

[0016] Subsequently, a 30 μΦ gold wire was supplied,
Wire bonding is performed at 320°C between the pads on the chip and the inner leads of the lead frame (ST5),
Its condition is inspected on the surface (ST6).

After the wire bonding is completed, the wire is placed in a mold and molded with a sealing resin at about 175° C. (ST7). In this case, the through holes 71 to 7 are formed by molding in the molding process in the mold.
2 may be formed.

[0018] When the molding is completed, the appearance of the mold condition is inspected (ST8). Then, the lead terminal 3 is externally plated with solder (ST9), and the lead terminal 3 is shaped by bending, cutting, etc. (ST10).

Therefore, if the through holes 71 to 74 are not formed using a mold in ST7, the through holes 71 to 74 are bored at this stage (ST11), and the appearance of this state is inspected (ST12).

[0020] Then, an initial test of functions etc. is carried out (ST
13) and shipped (ST14).

Next, FIG. 3 shows a configuration diagram of another embodiment of the present invention. In the semiconductor package 1C in FIG. 3, a plate portion 8, which is a plate-shaped lead frame 5, is located in bumpers 41 to 44, and through holes 71 to 74 in the plate portion 8 are provided.
Through holes 91 to 94 are formed in the portions. In this case, the through holes 71 to 44 of the bumpers 41 to 44
74 is bored in a larger shape than the through holes 91 to 94. That is, a portion of the plate portion 8 of the lead frame 5 is exposed.

The through holes 91 to 94 are drilled in advance before resin molding, and can be formed with higher positional accuracy than when the holes are drilled after molding.

[0023] Therefore, positioning of the semiconductor package 1C in each process is performed using the through holes 91 to 94, thereby making it possible to position the semiconductor package 1C with high positional accuracy. That is, for this purpose, the through holes 71 to 74 are replaced with the through hole 91.
~94 It is formed in a larger shape.

[0024] In the above embodiment, a QFP type was shown, but a similar effect can be obtained in a narrow pitch, multi-pin SOP type.

[0025]

As described above, according to the present invention, through holes are formed in at least two corners of the protrusions formed at the four corners of a semiconductor package, or through holes are formed in at least two corners of the protrusions formed at the four corners of the semiconductor package. By forming a through hole in the through hole part,
Strict positioning can be performed with high precision in various processes of semiconductor packages.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a manufacturing process diagram of the present invention.

FIG. 3 is a configuration diagram of another embodiment of the present invention.

FIG. 4 is an external view of a conventional bumper-equipped semiconductor package.

[Explanation of symbols]

1A ~ 1C Semiconductor package 2 Package body 3 Lead terminal 41 ~ 44 Bumper 5 Lead frame 6 Projection piece 71 ~ 74 Through hole 8 Plate part 91 ~ 94 Through holes

Claims (3)

[Claims] 1. A resin-molded semiconductor in which protrusions (41 to 44) protruding from the lead terminal (3) are formed at each of the four corners of a rectangular shape from which the lead terminal (3) extends from a predetermined side. A semiconductor device characterized in that through holes (71 to 74) for positioning are formed in the projections (41 to 44) at at least two corners. 2. A plate-shaped lead frame (8) is positioned within the protrusion (41 to 44), and the through hole (7) is inserted into the through hole (7).
2. The semiconductor device according to claim 1, wherein through-holes (91-94) of a predetermined size are formed in the plate-shaped lead frame (8) at positions 1-74). 3. Positioning the semiconductor device (1B, 1C) on the substrate, in which the through holes (71 to 74) are formed in the protrusions (41 to 44) provided at the four corners of the package (2); It is characterized by comprising the steps of positioning the through holes (71 to 74) on the substrate using positioning pins, and fixing and mounting the positioned semiconductor devices (1B, 1C) on the substrate. A method for mounting a semiconductor device.