JPS61139052A - Semiconductor integrated circuit part - Google Patents

Abstract

PURPOSE:To mount terminal leads at four corners with holes in a printed board as guides, when an integrated circuit part is mounted on the board, by providing the terminal leads at the four corners of a main body part, which is molded by a resin, forming the terminal leads at the four corners in an inserting shape that fits into the board, and using the same material for the leads as that of a die-bonding land, on which inner IC chips are mounted. CONSTITUTION:Terminal leads 2, which are protruded from the four sides of a main body part 1, have a surface mounting shape. Terminal leads 3, which are protruded from the four corners, have an inserting shape. When this semiconductor integrated circuit part is mounted on a printed board 5, the terminal leads 3 are inserted into insertion holes 7 of the printed board 5 and also connected to copper foils 6. The terminal leads 2 are also connected to the copper foil 6. Meanwhile, since the terminal leads 3 comprises the same material as that of a die-bonding land 4 for an IC chip, the leads can be used as common grounding parts. When the integrated circuit part is mounted on the board, the terminal leads at the four corners and the holes of the printed board can be used as guides. Thus, highly accurate mounting can be accomplished by any methods such as mechanical mounting, jig and tool mounting and manual mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor integrated circuit component that can be used in electronic equipment.

BACKGROUND OF THE INVENTION In recent years, semiconductor integrated circuit components have been widely used in electronic devices.

Conventional semiconductor integrated circuit components will be described below with reference to the drawings.

FIG. 5 shows a perspective view of a conventional semiconductor integrated circuit component. In FIG. 6, 1 is a resin-molded main body of a semiconductor integrated circuit component, and 2 is a terminal lead protruding from the four sides of the main body.

The semiconductor integrated circuit component configured as described above is generally used by being surface mounted on a printed circuit board. In that case, the mounting on the printed circuit board is carried out by machine mounting, mounting with a jig or tool, or manual mounting.

Problems to be Solved by the Invention However, with the above configuration, in the case of a mechanical mounting method for mounting semiconductor integrated circuit components on the copper foil of a printed circuit board, a dedicated machine is required, and equipment investment is required. In order to increase mechanical efficiency, it was necessary to install many similar surface-mounted parts, making it difficult to obtain high efficiency. In addition, in the case of mounting with jigs or by hand, it is extremely difficult and impractical to align the mounting position of the terminal lead 2 with the copper foil of the printed circuit board, and the installation may be defective or may cause manufacturing defects such as misalignment. The problem was that it occurred frequently.

On the other hand, electrically speaking, the semiconductor integrated circuit component shown in FIG. Providing a ground potential foil at the bottom was a means to obtain stability of electrical characteristics. However, since a grounding foil is required under the semiconductor integrated circuit component, it becomes difficult to connect the copper foil to the printed circuit board, and as a result, there is a problem in that sufficient electrical stability cannot be obtained.

In view of the above-mentioned problems, the present invention provides a semiconductor integrated circuit component that has a simple structure, has extremely high electrical stability, and can be mounted with high precision by machine mounting, tool mounting, or manual mounting. be.

Means for Solving the Problems In order to solve the above-mentioned problems, the semiconductor integrated circuit component of the present invention is a semiconductor integrated circuit component having terminal leads on the four sides of a resin-molded main body. At least two of the four corners of the
It is equipped with the same terminal leads as the Guibon land frame on which the C chip is mounted.

Effects of the present invention With the above-described configuration, when mounting a semiconductor integrated circuit component on a board, holes are made at the positions of the board corresponding to the terminal leads at the four corners, and the terminal leads at the four corners are inserted into the holes. Semiconductor integrated circuit components can be mounted on the board using the holes into which the terminal leads are inserted as guides, and the mounting can be done with high precision regardless of whether it is mounted by machine, tool, or hand. By making it the same as the Guibon land on which the IC chip is mounted inside the semiconductor integrated circuit component, the terminal leads at the four corners can be used as ground terminals, and a copper foil with a ground potential is provided at the bottom of the semiconductor integrated circuit component. This eliminates the need for circuit wiring, facilitates circuit connection, and at the same time ensures high stability, especially in high-frequency amplification circuits.

EXAMPLES Below, the semiconductor integrated circuit component of the present invention will be explained with reference to the drawings of examples.

FIG. 1 is a perspective view of a semiconductor integrated circuit component according to an embodiment of the present invention, FIG. 2 is a side view of the semiconductor integrated circuit component when it is mounted on a board, and FIG. 3 is a plan view of the semiconductor integrated circuit component. Figure 1~
In Fig. 3, 1 is a resin-molded main body of a semiconductor integrated circuit component, 2 is terminal leads provided on four sides, and 3 is a resin-molded body of a semiconductor integrated circuit component.
are terminal leads provided at the four corners. 5 is a printed circuit board, 6 is a copper foil, and 7 is a hole into which the terminal lead 3 is inserted.

Reference numeral 4 denotes a guide land on which an IC chip is mounted, and a terminal lead 3 is integrally provided.

Regarding the semiconductor integrated circuit components configured as above,
The operation will be explained below using FIGS. 1, 2, and 3. The terminal leads 2 protruding from the four sides of the main body 1 have a surface mounting shape, and the terminal leads 3 protruding from the four corners have an insertion shape. When this semiconductor integrated circuit component is mounted on the printed circuit board 6, the shape shown in FIG. As shown, the terminal leads 3 are inserted into the insertion holes 7 of the printed circuit board 6 and are connected to the copper foils 6, respectively, and the terminal leads 2 are also connected to the copper foils 6, respectively. On the other hand, the terminal lead 3 is connected to the IC as shown in FIG.
Since it is the same as the Gui bond land 4 of the chip, it can be used as a common ground. Also, this Guibon Land 4
The terminal leads 3 and 3 can be realized by simply shaping a frame mold or etching plate into a desired shape when manufacturing semiconductor integrated circuit components, and do not result in any increase in costs.

As described above, according to this embodiment, in a semiconductor integrated circuit component having terminal leads on the four sides of the resin-molded main body, the terminal leads are provided at the four corners of the resin-molded main body, and the terminal leads at the four corners are provided. By making the board insertion shape and making it the same as the Guibon land that mounts the internal IC chip, when mounting the board, the terminal leads at the four corners can be used as guides to the holes in the printed board, making it easy to install machines and jigs. It can be installed with high precision regardless of whether it is worn by hand or by hand.

Moreover, the terminal leads at the four corners can be used as ground terminals, and very high stability can be ensured in the high frequency amplifier circuit without providing a copper foil at ground potential below the semiconductor integrated circuit component. Further, since the copper foil at the bottom of the semiconductor integrated circuit component can be connected relatively freely, the design becomes easier.

In the above embodiment, the terminal lead 3 was shaped to be inserted into a board, but as shown in FIG.
It is clear that similar results can be obtained by forming the material more open.

Effects of the Invention As described above, the present invention provides a semiconductor integrated circuit component having terminal leads on the four sides of a resin-molded main body.
Terminal leads are provided at the four corners of the resin-molded main body.
In addition, by making the terminal leads at the four corners into a board insertion shape and making them the same as the die bond lands on which the internal IC chip is mounted, the terminal leads at the four corners can be installed using the holes in the printed circuit board as guides when mounting on the board. Therefore, it can be mounted with high precision regardless of whether it is mounted by machine, jig, or hand, and the leads at the four corners can be used as ground terminals, making it possible to perform especially high-frequency amplification without placing copper foil at ground potential below the semiconductor integrated circuit components. High electrical stability can be ensured in the circuit. Further, since the copper foil at the bottom of the semiconductor integrated circuit component can be connected relatively freely, the design can be facilitated.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a semiconductor integrated circuit component according to an embodiment of the present invention, FIG. 2 is a side view of the semiconductor integrated circuit component when it is mounted on a board, and FIG. 3 is a plan view of the semiconductor integrated circuit component. 4 is an enlarged view of a terminal lead in another embodiment of the present invention, and FIG. 5 is a perspective view of a conventional semiconductor integrated circuit component. 1... Resin-molded main body of semiconductor integrated circuit component, 2... Terminal leads provided on four sides, 3
...Terminal leads provided at the four corners, 4...
・Dibond land equipped with engineering C chip, 6...
...Printed circuit board, 6...Copper foil, 7...
A hole into which the terminal lead 3 is inserted.

Claims (3)

[Claims] (1) Terminal leads are provided on the four sides of the resin-molded main body, and the same terminal leads as the die bond land on which the internal IC chip is mounted are provided in at least two of the four corners of the main body. Characteristic semiconductor integrated circuit components. (2) The terminal leads on the four sides are surface-mounted to the board,
The semiconductor integrated circuit component according to claim 1, wherein the terminal leads at the four corners have a shape to be inserted into the board. (3) Only the tips of the terminal leads at the four corners are divided into two parts, and one part is expanded by about 90 degrees so that it has a shape for insertion into the board, and the other part has a shape for surface mounting on the board. The semiconductor integrated circuit component according to item 1.