KR970000647B1 - Method and apparatus for holding semiconductor chip - Google Patents

Method and apparatus for holding semiconductor chip Download PDF

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Publication number
KR970000647B1
KR970000647B1 KR1019930017936A KR930017936A KR970000647B1 KR 970000647 B1 KR970000647 B1 KR 970000647B1 KR 1019930017936 A KR1019930017936 A KR 1019930017936A KR 930017936 A KR930017936 A KR 930017936A KR 970000647 B1 KR970000647 B1 KR 970000647B1
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KR
South Korea
Prior art keywords
elastic
fixing member
elastic fixing
semiconductor chip
chip
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KR1019930017936A
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Korean (ko)
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KR950009990A (en
Inventor
원영식
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원영식
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Priority to KR1019930017936A priority Critical patent/KR970000647B1/en
Publication of KR950009990A publication Critical patent/KR950009990A/en
Application granted granted Critical
Publication of KR970000647B1 publication Critical patent/KR970000647B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Abstract

The elastic fixed member(5) is inserted onto the internal wall of the hollow(4) formed on the establishing mold(1), and projections(6) are inserted into each the elastic fixed member and fixed onto the internal walls of the hollow. When inserting semiconductor chip into the elastic fixed member, each side of the chip opens outside the elastic fixed member contacting with the elastic grasping part(51), and the chip is inserted. When each side of the chip passes through the elastic grasping part, the elastic fixed member recovers to its original place by elasticity, and the chip is fixed to hooked up on the elastic grasping part. Therefore, the semiconductor chip is fixed on a stable point and made it easier to set up the lead.

Description

반도체칩의 파지장치와 그 제조방법Holding device of semiconductor chip and manufacturing method thereof

제1도는 종래의 반도체칩파지장치의 일부발췌사시도.1 is a partial perspective view of a conventional semiconductor chip holding device.

제2도는 본 발명의 반도체칩파지장치의 분해사시도.2 is an exploded perspective view of the semiconductor chip holding device of the present invention.

제3도는 본 발명의 반도체칩파지장치의 단면도.3 is a cross-sectional view of the semiconductor chip holding device of the present invention.

제4도는 제3도의 (가)부분 확대도.4 is an enlarged view of part (a) of FIG.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 설치틀 2 : 돌출대1: mounting frame 2: protrusion

3 : 탄성안내막대 4 : 요함부3: elastic guide bar 4: essential parts

5 : 탄성고정부재 6 : 돌출대5 elastic fixing member 6 protrusion

21 : 결합구멍 31 : 내측돌출부21: coupling hole 31: inner projection

41 : 내벽면 51 : 탄성파지부41: inner wall surface 51: elastic gripping portion

52 : 바닥판52: bottom plate

본 발명은 반도체칩에 리드선을 부착하는 공정 즉, 반도체칩의 와이어링(Wiring) 공정에 있어서, 칩을 일정위치에 파지시키기 위한 장치와 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for holding a chip at a predetermined position and a manufacturing method thereof in a step of attaching a lead wire to a semiconductor chip, that is, a wiring step of a semiconductor chip.

회로가 인쇄된 반도체칩에는 소정위치에 리드선을 부착하여야 하며, 이와 같이 리드선을 부착하기 위하여는 반도체칩을 항상 일정한 위치에 고정설치시켜야 한다.The lead wire should be attached to the semiconductor chip on which the circuit is printed, and in order to attach the lead wire, the semiconductor chip should be fixed at a fixed position at all times.

반도체칩을 일정위치에 고정설치시키기 위하여 종래에는 제1도에 도시된 바와 같은 파지장치를 사용하여 왔다. 즉, 종래의 반도체칩 파지장치는 설치틀(1)위에 다수개의 돌출대(2)를 형성시키고, 각 돌출대(2)의 네변에 중앙부가 내축으로 돌출된 탄성안내막대(3)를 설치하였다. 그리하여 각 탄성안내막대(3)의 내측돌출부(31)가 이루는 사각형의 내면에 반도체칩을 끼워 넣으므로서 반도체칩이 네개의 탄성안내막대(3)에 의하여 고정설치되게 하였다.In order to fix the semiconductor chip at a predetermined position, a holding device as shown in FIG. 1 has been conventionally used. That is, in the conventional semiconductor chip holding device, a plurality of protrusions 2 are formed on the mounting frame 1, and the elastic guide rods 3 with the central portion protruding to the inner shaft are provided on four sides of each protrusion 2. . Thus, the semiconductor chip was fixed by the four elastic guide bars 3 while sandwiching the semiconductor chip on the inner surface of the quadrangle formed by the inner protrusions 31 of the elastic guide bars 3.

그런데 이와 같은 종래의 반도체칩파지장치를 제조함에 있어서는 먼저 철사를 소정의 형태로 구부려야 하는데 철사는 그 자체가 탄성체이어서 철사를 구부려 제조한 모든 탄성안내막대(3)가 구부리고자 하는 대로 일정하게 구부려지지 않을 뿐 아니라 구부려 형성시킨 탄성안내막대(3)를 돌출대(2)의 결합구멍(21)에 끼워 설치함에 있어서는 이를 일일이 수작업에 의하지 않을 수 없었고 따라서 탄성안내막대(3)는 이를 설치할때에도 약간 정도의 변형이 일어날 수 있어 반도체칩을 일정위치에 설치하기가 곤란한 결점이 있었다.However, in manufacturing such a conventional semiconductor chip holding device, first, the wire must be bent in a predetermined form, and the wire is itself an elastic body, so that all the elastic guide bars 3 manufactured by bending the wire are bent constantly as desired. In addition, the elastic guide bar 3 bent and formed into the coupling hole 21 of the protrusion 2 was forced to be manually operated. Therefore, the elastic guide bar 3 may be slightly installed when it is installed. There is a drawback that it is difficult to install the semiconductor chip at a certain position because deformation of the degree can occur.

이에 본 발명은 탄성안내막대(3)와 같은 고정부재의 제조시에나 제조된 고정부재를 설치틀(1)에 설치할때에 있어서의 오차를 제거하여 반도체칩이 항상 일정위치에 고정되게 하고 또 고정부재의 제조작업을 용이케 할 수 있는 파지장치와 제조방법을 제공하기 위한 것인바 이와 같은 발명을 첩부된 도면에 의하여 설명하면 다음과 같다.Accordingly, the present invention eliminates errors in the manufacture of the holding member such as the elastic guide bar (3) or when the prepared holding member is installed in the mounting frame (1) so that the semiconductor chip is always fixed at a predetermined position and the holding member It is to provide a gripping apparatus and a manufacturing method that can facilitate the manufacturing operation of the invention described with reference to the attached drawings as follows.

첨부된 도면 제2도 및 제3도에 도시되는 바와 같이, 설치틀(1)에 사각형상을 이루는 요함부(4)를 형성시키고, 요함부(4)의 내벽면에, 자체탄성력을 보유하며, 상단부의 내측에 칩의 각 변이 걸리어 고정되는 탄성파지부(51)를 구비한 탄성고정부재(5)를 밀착설치시키고, 각 탄성고정부재(5)의 내측에, 탄성고정부재(5)를 요함부의 내벽면에 고정시키는 돌출대(1)를 삽입시켜 구성되는 것으로, 상기 각 탄성고정부재(5)는 서로 이격 설치되되, 하부에 바닥판(52)을 형성시켜 각 탄성부재(5)가 하나의 몸체를 이루게 함으로써, 제조공정 및 조립작업을 보다 편리하고, 신속하게 이룰 수 있도록 하는 것이 바람직하다.As shown in FIGS. 2 and 3 of the accompanying drawings, a recess 4 having a rectangular shape is formed in the installation frame 1, and the inner wall of the recess 4 has its own elastic force. The elastic fixing member 5 having the elastic gripping portion 51 fixed to each side of the chip is fixed to the inside of the upper end, and the elastic fixing member 5 is provided inside the elastic fixing member 5. It is configured by inserting the protrusion (1) to be fixed to the inner wall surface of the recess, the elastic fixing members 5 are spaced apart from each other, the bottom plate 52 is formed at the bottom of each elastic member (5) By forming one body, it is desirable to make the manufacturing process and assembly work more convenient and quick.

이와 같이 구성되는 본 발명은 설치틀(1)에 형성된 요함부(4)의 내부면에 각 탄성고정부재(5)가 밀착되게 삽입시킨 다음, 각 탄성고정부재(5)의 내측에 돌출대(6)를 삽입시켜 탄성고정부재(5)가 요함부(4)의 내벽면에 밀착고정 되게 한다.According to the present invention configured as described above, each elastic fixing member 5 is inserted in close contact with the inner surface of the recess 4 formed in the mounting frame 1, and then a protrusion ( 6) is inserted so that the elastic fixing member 5 is closely fixed to the inner wall surface of the recess 4.

이와 같이 설치되는 각 탄성고정부재(5)의 상단은 돌출대(6)의 각면 상부로 돌출된 상태를 이루게 되며, 돌출된 각 탄성고정부재(5)의 내부로 반도체칩을 삽입시키게 되면 칩의 각면이 각 탄성고정부재(5)의 상단부에 형성된 탄성파지부(51)와 접촉되면서 탄성고정부재(5)를 외측으로 벌리며 삽입되다가, 칩의 각면이 탄성파지부(51)를 통과하는 시점에서 탄성고정부재(5)가 자체적으로 보유하는 탄성력에 의하여 본래의 위치로 복귀됨에 따라 탄성파지부(51)가 칩의 각변 상단부에 걸리어 칩을 고정시키게 되는 것이다.The upper end of each elastic fixing member (5) installed as described above is in a state of protruding to the upper surface of each surface of the protrusion (6), and when the semiconductor chip is inserted into each of the protruding elastic fixing member (5) of the chip Each surface is inserted while opening the elastic fixing member 5 while contacting the elastic gripping portion 51 formed at the upper end of each elastic fixing member 5, the elastic fixing at the time when each side of the chip passes through the elastic gripping portion 51 As the member 5 returns to its original position by the elastic force held by the member 5, the elastic gripping portion 51 is caught by the upper end of each side of the chip to fix the chip.

이와 같은 본 발명은, 탄성고정부재(5)를 형성시킴에 있어서, 이를 금형에 의해 절단절곡 성형시킬 수 있게 하므로서 탄성고정부재(5)를 일정하게 형성시킬 수 있게 하였으며 특히 탄성고정부재(5)가 요함부(4)와 돌출대(6)의 사이에서 일정위치에 설치될 수 있으므로 설치상에 있어서의 오차가 발생할 여지가 없게 되었다.In the present invention, in forming the elastic fixing member 5, it is possible to form the elastic fixing member 5 by cutting and bending it by a mold, and in particular, the elastic fixing member 5 Since it can be installed at a predetermined position between the required portion 4 and the projection 6, there is no room for error in the installation.

그리하여 본 발명은 일정형태로 이루어지고 또 정 위치로 설치되는 탄성고정부재(5)로 반도체칩에 파지케 하여 반도체칩이 항상 일정위치에 위치될 수 있게 하고, 그리하여 칩에의 리드선설치작업을 용이하게 하고, 제품의 불량률을 감소시킬 수 있게 되는 효과가 있다.Therefore, the present invention allows the semiconductor chip to be always positioned at a certain position by holding the semiconductor chip with an elastic fixing member 5 which is made in a certain shape and installed at a fixed position, thereby facilitating the installation of lead wires to the chip. And it is effective to reduce the defective rate of the product.

Claims (3)

설치틀(1)에 사각형상을 이루는 요함부(4)를 형성시키고, 요함부(4)의 내벽면에, 자체탄성력을 보유하며, 상단부의 내측에 칩의 각변이 걸리어 고정되는 탄성파지부(51)를 구비한 탄성고정부재(5)를 밀착설치시키고, 각 탄성고정부재(5)의 내측에, 탄성고정부재(5)를 요함부의 내벽면에 고정시크는 돌출대(6)를 삽입시켜 구성되는 것을 특징으로 하는 반도체칩의 파지장치.An elastic gripping portion is formed in the installation frame 1 to form a recess 4 having a quadrangular shape, and retains its own elastic force on the inner wall surface of the recess 4, and the sides of the chip are fixed to the inside of the upper end portion. 51, the elastic fixing member 5 having a close contact with the elastic fixing member 5 is installed, and the elastic fixing member 5 is fixed to the inner wall surface of the recess to insert the projection 6 inside the elastic fixing member 5, A holding device for a semiconductor chip, comprising: 제1항에 있어서, 각 탄성고정부재(5)는 하단부가 바닥판(52)에 의하여 하나의 몸체를 이루도록 형성시키되, 각 탄성고정부재(5)는 서로 이격되어 자체탄성력을 보유토록 형성시킨 것을 특징으로 하는 반도체칩의 파지장치.According to claim 1, wherein each of the elastic fixing member 5 is formed so that the lower end forms a body by the bottom plate 52, each elastic fixing member 5 is formed so as to maintain its own elastic force apart from each other A holding device for semiconductor chips. 설치틀(1)에 요함부(4)를 형성시키고, 요함부(4)의 내벽면에 탄성고정부재(5)를 설치하며, 탄성고정부재(5)는 소정의 금형에 의해 하나의 판체를 타발하고 압착하여 바닥판(52)과 함께 성형시키고, 탄성고정부재(5)의 내측에 벽돌모양의 돌출대(6)를 넣어 설치함을 특징으로 하는 반도체칩파지장치의 제조방법.The recessed part 4 is formed in the installation frame 1, the elastic fixing member 5 is installed in the inner wall surface of the recessed part 4, and the elastic fixing member 5 carries out one plate | board body by a predetermined metal mold | die. A method of manufacturing a semiconductor chip holding device, characterized in that it is molded and pressed together with the bottom plate (52), and a brick-shaped protrusion (6) is placed inside the elastic fixing member (5).
KR1019930017936A 1993-09-07 1993-09-07 Method and apparatus for holding semiconductor chip KR970000647B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930017936A KR970000647B1 (en) 1993-09-07 1993-09-07 Method and apparatus for holding semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930017936A KR970000647B1 (en) 1993-09-07 1993-09-07 Method and apparatus for holding semiconductor chip

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Publication Number Publication Date
KR950009990A KR950009990A (en) 1995-04-26
KR970000647B1 true KR970000647B1 (en) 1997-01-16

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