JPH07142556A - Wafer holder for film forming device - Google Patents
Wafer holder for film forming deviceInfo
- Publication number
- JPH07142556A JPH07142556A JP31276093A JP31276093A JPH07142556A JP H07142556 A JPH07142556 A JP H07142556A JP 31276093 A JP31276093 A JP 31276093A JP 31276093 A JP31276093 A JP 31276093A JP H07142556 A JPH07142556 A JP H07142556A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding
- holding member
- claw
- film forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体ウェハ−に種々
の膜を形成する成膜装置のウェハ−保持装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer holding device of a film forming apparatus for forming various films on a semiconductor wafer.
【０００２】[0002]
【従来の技術】従来、この種のスパッタリング装置等の
成膜装置のウェハ−保持装置においては、ウェハ−表面
にアルミ等の膜をスパッタリング等により成膜する場
合、ダスト防止等の関係からウェハーを垂直に立てて処
理する方法をとっており、このような製造方法により成
膜するには、ウェハ−を保持する装置が必要であり、こ
のため保持装置としては従来から図３のようなウェハ−
の周端部を保持部材１で保持する形式のものがあった。
この保持装置は、図３に図示のように保持部材１の先端
部近傍に設けられた爪８の底面（接触面）による押圧ま
たは摩擦力によりウェハ−４を保持するものであった。2. Description of the Related Art Conventionally, in a wafer holding device of a film forming device such as a sputtering device of this type, when a film of aluminum or the like is formed on the surface of the wafer by sputtering or the like, the wafer should be protected from the viewpoint of dust prevention. A method of vertically standing is used, and a film holding device is required to hold a wafer in order to form a film by such a manufacturing method. Therefore, as a holding device, a wafer holding device as shown in FIG.
There is a type in which the peripheral end of the above is held by the holding member 1.
As shown in FIG. 3, this holding device holds the wafer-4 by pressing or frictional force by the bottom surface (contact surface) of the claw 8 provided near the tip of the holding member 1.
【０００３】しかし、前記従来の保持装置でウェハ−４
を保持しながらウェハ−４の表面にアルミ等をスパッタ
リングにより成膜する場合、アルミによる爪８とウェハ
ー４との癒着が問題になる。However, with the conventional holding device, the wafer-4 is used.
When aluminum or the like is deposited on the surface of the wafer-4 by sputtering while holding the wafer, adhesion between the nail 8 and the wafer 4 due to aluminum becomes a problem.
【０００４】これを防止するために、図３（ロ）に示す
ように、爪８部分を被う保持部材１を設け、爪８を保持
部材１で隠すことにより、図４に示すようにアルミが爪
８まで達しないような構造としてある。しかしながら、
保持部材１の下のウェハー４表面にはアルミが保持部材
１の両側面から回り込んで成膜されるため、この部分の
アルミの膜厚が非常に薄くなる。この薄くなった部分に
位置する半導体チップは、回路的には電気的接続が取ら
れているので、社内試験や、ユーザ−においても良品と
して取り扱われる確率が高いものの、膜厚が薄いために
ある程度時間が経過した後に不良品となるケースが報告
されており、このような不良品が良品として市場に出荷
されることは製品全体に対する信頼性を大幅に低下させ
てしまう。In order to prevent this, as shown in FIG. 3B, a holding member 1 for covering the claw 8 portion is provided, and the claw 8 is hidden by the holding member 1, so that the aluminum member is formed as shown in FIG. Has a structure that does not reach the nail 8. However,
On the surface of the wafer 4 below the holding member 1, aluminum wraps around from both side surfaces of the holding member 1 to form a film, so that the film thickness of aluminum in this portion becomes very thin. Since the semiconductor chip located in this thinned portion is electrically connected in terms of circuit, it is highly likely that it will be handled as a non-defective product by in-house tests and users, but the thickness is thin to some extent. It has been reported that after a lapse of time, the product becomes a defective product, and shipping such a defective product to the market as a non-defective product greatly reduces the reliability of the entire product.
【０００５】上記膜厚の薄い部分を完全に無くすことは
不可能である。ウェハー４と保持部材１とのスペースを
少なくする（保持部材１の高さを低くする）ことにより
上記膜厚の薄い部分を少なくすることはできるものの、
前記スペースを被着するアルミの膜厚より小さくしてし
まうと今度は保持部材１とウェハー４との癒着が問題に
なる。このように、保持部材１とウェハー４とのスペー
スは、前記回り込みによるアルミ膜に極端に薄い部分Ｌ
ができるという問題があるものの、このスペースを無く
すことはできない。また、この爪８の位置はウェハー４
の位置に対して決まった位置にくるわけではないので、
マスク処理（工程）によって保持部材（爪）１の跡の部
分だけを部分的に除去するという処理ができない。It is impossible to completely eliminate the thin portion. Although the space between the wafer 4 and the holding member 1 can be reduced (the height of the holding member 1 can be reduced), the thin portion can be reduced.
If the space is made smaller than the film thickness of the aluminum to be deposited, then the adhesion between the holding member 1 and the wafer 4 becomes a problem. As described above, the space between the holding member 1 and the wafer 4 is a portion L extremely thin in the aluminum film due to the wraparound.
Although there is a problem that you can do this, you can not eliminate this space. The position of the claw 8 is the wafer 4
Since it does not come to a fixed position with respect to
It is impossible to partially remove only the traces of the holding member (nails) 1 by the masking process (process).
【０００６】[0006]
【発明が解決しようとする課題】上記膜厚の薄い部分の
半導体チップの個数を少なくするためには、ウェハー４
の上を覆う爪８および保持部材１の大きさを限界まで小
さくして、保持部材１の跡をできるだけ小さくすること
である。また、上記膜厚の薄い部分Ｌの半導体チップの
出荷を完全に無くすには、ウェハー４の周端部の全周に
わたり前記保持部材（爪）１の跡の大きさだけマスク処
理によってこの部分を使用しないようにしていた。しか
しながら、従来の保持装置の形状では、ウェハー４と保
持装置とのズレとの関係から、（１）爪８の位置がウェ
ハー４の端部より前記ズレを見込んだ距離だけ内側に位
置すること、（２）爪８がある程度の面積を要するこ
と、（３）アルミ５の回り込みによる爪８とウェハー４
との癒着を防止するため、保持部材１の先端を爪８の位
置からさらにウェハー４の内側にまで延在させること、
などの制約があり、小型化にはおのずと限界があるとい
う欠点があった。特に、ウェハ−の周端部の爪跡の部分
を使用しないようにする後者の手法を採用すると、ウェ
ハー４に対するチップの収率が大幅に悪化してしまう。In order to reduce the number of semiconductor chips in the thin portion, the wafer 4 is used.
The size of the claw 8 and the holding member 1 that cover the top of the holding member 1 is made as small as possible, and the trace of the holding member 1 is made as small as possible. Further, in order to completely eliminate the shipment of the semiconductor chip in the thin portion L, this portion is masked over the entire circumference of the peripheral edge portion of the wafer 4 by the size of the trace of the holding member (claws) 1. I was not using it. However, in the shape of the conventional holding device, due to the relationship between the wafer 4 and the holding device, (1) the position of the claw 8 is located inside the end of the wafer 4 by a distance that allows for the above-mentioned deviation. (2) The claw 8 requires a certain area, and (3) the claw 8 and the wafer 4 due to the wraparound of the aluminum 5
In order to prevent adhesion with the holding member 1, the tip of the holding member 1 extends further from the position of the claw 8 to the inside of the wafer 4.
However, there is a limitation that miniaturization is naturally limited. In particular, if the latter method that does not use the claw marks at the peripheral edge of the wafer is adopted, the yield of chips for the wafer 4 will be significantly deteriorated.
【０００７】[0007]
【課題を解決するための手段】本発明は、前記従来の問
題点を解決した成膜装置のウェハ−保持装置であり、本
発明は、保持部材（爪）とウェハーとのズレに対し、ど
のような場合でもスペ−スを確保し、保持部材（爪）を
限界まで小さくするため、ウェハ−を保持する爪の形状
を略直角三角形の板状体とし、その三角形の斜辺に形成
される面の一部をウェハ−保持面とすることを特徴とす
る成膜装置の保持装置である。The present invention is a wafer-holding device for a film-forming apparatus which solves the above-mentioned problems of the prior art. The present invention relates to the deviation between the holding member (claw) and the wafer. Even in such a case, in order to secure the space and reduce the holding member (claw) to the limit, the shape of the claw that holds the wafer is a substantially right-angled triangular plate, and the surface formed on the hypotenuse of the triangle. Is a holding device for a film forming apparatus, characterized in that a part thereof is a wafer-holding surface.
【０００８】[0008]
【作用】本発明によれば、従来の面接触となる爪に代え
て、その形状を略直角三角形の板状体とし、その三角形
の斜辺に形成される面の一部をウェハ−保持面とするこ
とにより、保持部材とウェハーとのズレに対してどのよ
うな場合にもスペ−スが確保でき、保持部材を限界まで
小さくすることができる。According to the present invention, instead of the conventional surface-contacting claw, the shape thereof is a substantially right-angled triangular plate-like body, and a part of the surface formed on the hypotenuse of the triangle is used as a wafer-holding surface. By doing so, the space can be secured against the deviation between the holding member and the wafer in any case, and the holding member can be reduced to the limit.
【０００９】[0009]
【実施例】以下、本発明のー実施例について、図面に基
づいて説明する。図１は本発明の成膜装置のウェハ−保
持装置を示す図であり、図１（イ）はそれの側面図であ
り、図１（ロ）は正面図である。前記成膜装置はウェハ
ーを垂直に立てて保持する方法を採っているので、紙面
の上下方向が実際は水平方向であり、紙面の左右方向が
実際は垂直方向となる。本発明は、ウェハ−４を押圧、
保持する爪８として略直角三角形の板状体１を用い、こ
の板状体１の三角形の斜辺に形成される面５の一部をウ
ェハ−保持面（接触面Ｐ）とするものであり、以下、ウ
ェハ−４を前記爪８により保持する際の詳細を図２によ
り説明する。前記爪８の略直角三角形ＡＢＣおよびＤＥ
Ｆの板状体の三角形の斜辺ＡＣおよびＤＦで形成される
面ＡＣＦＤ（点線（斜線）で描いた部分）をウェハ−保
持面５とし、その一部（２つの交叉する斜線により描い
た部分）Ｐでウェハ−４を押圧、保持する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a wafer holding device of a film forming apparatus of the present invention, FIG. 1 (a) is a side view thereof, and FIG. 1 (b) is a front view. Since the film forming apparatus employs a method of vertically holding the wafer, the vertical direction of the paper surface is actually the horizontal direction, and the horizontal direction of the paper surface is actually the vertical direction. The present invention presses the wafer-4,
A substantially right-angled triangular plate-shaped body 1 is used as the holding claw 8, and a part of the surface 5 formed on the oblique side of the triangle of the plate-shaped body 1 is used as a wafer-holding surface (contact surface P). The details of holding the wafer-4 by the claw 8 will be described below with reference to FIG. Substantially right triangles ABC and DE of the claw 8
A surface ACFD (a portion drawn by a dotted line (hatched)) formed by the hypotenuses AC and DF of the triangular plate-like body of F is defined as a wafer-holding surface 5, and a part thereof (a portion drawn by two intersecting hatched lines). Wafer-4 is pressed and held by P.
【００１０】次に、前記爪８をウェハ−４に接近させ、
押圧、保持させるための構成を図１により説明する。ウ
ェハ−保持台７に載置されたウェハ−４の周端部の複数
箇所が保持されるようにウェハ−４の周囲には複数のウ
ェハ−保持装置単体が設けられ、これらウェハ−保持装
置単体は前記爪８である略直角三角形の板状体と、前記
爪８を支持、固定する垂直方向保持部材２および水平方
向保持部材３と、前記水平方向保持部材３の一端に設置
され前記爪８のウェハ−保持面５がウェハ−表面に接近
する方向又はウェハ−表面から離反する方向に移動させ
る水平方向保持部材駆動（移動）装置６から構成され
る。Next, the claw 8 is brought close to the wafer-4,
The structure for pressing and holding will be described with reference to FIG. A plurality of wafer-holding devices are provided around the wafer-4 so that a plurality of peripheral edge portions of the wafer-4 placed on the wafer-holding table 7 are held. Is a substantially right-angled triangular plate member that is the pawl 8, a vertical holding member 2 and a horizontal holding member 3 that support and fix the pawl 8, and the pawl 8 installed at one end of the horizontal holding member 3. The horizontal holding member driving (moving) device 6 is configured to move the wafer-holding surface 5 in the direction toward the wafer surface or away from the wafer surface.
【００１１】そして、前記水平方向保持部材駆動（移
動）装置６が作動して、前記爪８はウェハ−４の周端部
の表面に接近した後、前記表面を押圧し、その結果、ウ
ェハ−４は複数の爪８により複数箇所で保持される。な
お、爪８の上部に固定された垂直方向保持部材２は、従
来例の図３の保持部材１と同様に、ウェハー接触面Ｐを
被い、付着するアルミ５がウェハー接触面Ｐまで達する
ことを防止することにより、爪８とウェハー４との癒着
を防止する。本発明においては、ウェハ−保持用の爪８
として略直角三角形状の板状体を用い、その三角形の斜
辺に形成される面５をウェハ−保持面としているので、
前記保持面の内側先端部Ａ、Ｄ付近を接触面としない限
り、所定のスペ−スが確保でき、そして、前記板状体の
板厚を適宜選択することにより、所定の保持力を得るこ
とができる。さらに本発明によれば、垂直方向保持部材
２がウェハー４上にオーバーラップする量（保持部材の
跡）を従来のものより大幅に小さくできる。これは、ま
ず従来例の爪８の接触面積が不要になること、次にウェ
ハー接触面が必ずウェハー４の周端面になるので、接触
面がウェハー４の周端より内側になる従来例に比べてウ
ェハー４と爪８とのズレに対する許容度が高いこと（従
来例は爪８が必ずウェハー４表面に位置しなければなら
ないので、爪８からウェハー４周端までの距離が前記ズ
レ量より大きくなってはならないのに対し、本発明の装
置では爪８のＡＢ間の距離が前記ズレ量に対応していれ
ば済む）、そして、ウェハー接触面Ｐが必ずウェハー４
の周端面になるので、その分、ウェハー接触面へのアル
ミの被着を防止するための垂直方向保持部材２の先端を
ウェハー４の周端側へ後退させることができること、な
どの理由によるものである。これらによって、従来は保
持部材（爪）１の跡が５〜６ｍｍ程度の幅（奥行き）だ
ったものが、本発明の装置により１．５〜２．０ｍｍま
で小さくすることができた。この程度まで小さくできれ
ば（チップサイズにもよるが）、アルミ膜厚が非常に薄
い部分が生じたとしても、ウェハー４周辺のチップは他
の理由により大部分が不良品となるので、膜厚が薄いこ
とになる信頼性の乏しいチップが市場に出荷される確率
は極めて小さい。また、信頼性に乏しいチップの出荷を
完全に防止するには、ウェハー４の周端部全周にわたり
故意的にチップをＮＧにすればよい。 この程度の大き
さであれば、チップの収率を悪化させることもない。Then, the horizontal holding member driving (moving) device 6 is actuated, the claw 8 approaches the surface of the peripheral end portion of the wafer-4, and then presses the surface, and as a result, the wafer- 4 is held at a plurality of locations by a plurality of claws 8. The vertical holding member 2 fixed to the upper portion of the claw 8 covers the wafer contact surface P as in the conventional holding member 1 of FIG. 3, and the attached aluminum 5 reaches the wafer contact surface P. By preventing this, adhesion between the nail 8 and the wafer 4 is prevented. In the present invention, the wafer-holding claw 8 is used.
As a plate-shaped body of a substantially right triangle is used as and the surface 5 formed on the hypotenuse of the triangle is the wafer-holding surface,
A predetermined space can be secured unless the inner tip portions A and D of the holding surface are contact surfaces, and a predetermined holding force can be obtained by appropriately selecting the plate thickness of the plate-shaped body. You can Further, according to the present invention, the amount of overlap of the vertical holding member 2 on the wafer 4 (trace of the holding member) can be made significantly smaller than that of the conventional one. This is because the contact area of the claw 8 of the conventional example is unnecessary first, and the wafer contact surface is always the peripheral end surface of the wafer 4, so that the contact surface is inside the peripheral edge of the wafer 4 as compared with the conventional example. Therefore, the tolerance between the wafer 4 and the claw 8 is high. (In the conventional example, since the claw 8 must be located on the surface of the wafer 4, the distance from the claw 8 to the peripheral edge of the wafer 4 is larger than the deviation amount. However, in the apparatus of the present invention, it is sufficient if the distance between the ABs of the claws 8 corresponds to the deviation amount), and the wafer contact surface P is always the wafer 4
Since it becomes the peripheral end surface of the wafer, the tip of the vertical holding member 2 for preventing aluminum from adhering to the wafer contact surface can be retracted to the peripheral end side of the wafer 4 by that amount. Is. As a result, the width (depth) of the holding member (claws) 1 having a width of about 5 to 6 mm in the related art can be reduced to 1.5 to 2.0 mm by the device of the present invention. If it can be made small to this extent (depending on the chip size), even if there is a very thin aluminum film, the chips around the wafer 4 will be mostly defective for other reasons. The probability of shipping a thin, unreliable chip to the market is extremely small. Further, in order to completely prevent the shipment of the unreliable chip, the chip may be intentionally made NG over the entire periphery of the wafer 4. With such a size, the yield of chips is not deteriorated.
【００１２】なお、前記爪８の形状として、他に図５お
よび図６のような略直角三角形の板状体の斜辺（ウェハ
−保持面５）が円弧または湾曲したものがあり、図５の
ものはその斜辺がウェハ−側に凸状になっており、この
場合はウェハ−との接触面積がより少なくなる。図６の
ものはその斜辺がウェハ−に対して凹状になっており、
この場合はウェハ−との接触面積がより多くなるので保
持力は大となり大きなウェハ−を保持する場合には有効
となる。また、前記爪８の略直角三角形の板状体におけ
る角Ａおよび角Ｄ（斜辺と垂直保持部材に接する辺との
なす角）の角度は約３０度前後が適当であるが、保持
力、接触面積等に応じて適宜選択可能である。また、前
記爪８の形状としては、垂直保持部材および水平保持部
材ともに板状、角柱または円柱状のもの、垂直保持部材
および水平保持部材が一体になったＬ字状のもの、前記
保持部材および２つの支持部材を一体成形したもの等が
ある。In addition, as the shape of the claw 8, there is another shape in which the hypotenuse (wafer-holding surface 5) of a substantially right-angled triangular plate-like body as shown in FIGS. 5 and 6 is an arc or a curve. The oblique side of the object is convex toward the wafer side, and in this case, the contact area with the wafer becomes smaller. In FIG. 6, the hypotenuse is concave with respect to the wafer,
In this case, since the contact area with the wafer becomes larger, the holding force becomes large, which is effective when holding a large wafer. Further, the angle A and the angle D (angle formed by the hypotenuse and the side in contact with the vertical holding member) in the substantially right-angled triangular plate-shaped body of the pawl 8 are appropriately about 30 degrees, but the holding force and contact It can be appropriately selected according to the area or the like. As for the shape of the claw 8, the vertical holding member and the horizontal holding member are plate-shaped, prismatic or cylindrical, L-shaped in which the vertical holding member and the horizontal holding member are integrated, the holding member, and There is one in which two support members are integrally molded.
【００１３】[0013]
【発明の効果】以上説明したように、本発明のウェハ−
保持装置はその爪８を略直角三角形状の板状体とし、そ
の三角形の斜辺５に形成される面をウェハ−保持面（接
触面）とすることにより、ウェハー４のズレ（図１
（イ）紙面左右または前後方向の）に対してどのような
場合にもスペ−スが確保でき、爪の跡を限界まで小さく
することができる。その結果、信頼性に乏しいチップが
出荷されるという不都合を解消することができる。As described above, the wafer of the present invention
In the holding device, the claw 8 is formed into a substantially right-angled triangular plate-like body, and the surface formed on the hypotenuse 5 of the triangle is used as a wafer-holding surface (contact surface), whereby the wafer 4 is displaced (see FIG. 1).
(A) A space can be secured in any case with respect to the right and left or the front and back direction of the paper surface, and the trace of the nail can be reduced to the limit. As a result, the inconvenience of shipping unreliable chips can be eliminated.
【図１】（イ）は本発明一実施例のウェハ−保持装置の
側面図であり、（ロ）は同保持装置の正面図である。FIG. 1A is a side view of a wafer holding device according to an embodiment of the present invention, and FIG. 1B is a front view of the holding device.
【図２】本発明一実施例のウェハ−保持装置の保持部材
の詳細図である。FIG. 2 is a detailed view of a holding member of the wafer holding device according to the embodiment of the present invention.
【図３】（イ）は従来のウェハ−保持装置の側面図であ
り、（ロ）は同保持装置の矢印Ａ1 、Ａ2 方向から見た
図である。FIG. 3A is a side view of a conventional wafer holding device, and FIG. 3B is a view of the same holding device seen from the directions of arrows A 1 and A 2 .
【図４】従来のウェハ−保持装置による成膜後の概略図
である。FIG. 4 is a schematic view after film formation by a conventional wafer holding device.
【図５】本発明のウェハ−保持装置の爪の他の実施例を
示す図である。FIG. 5 is a view showing another embodiment of the claw of the wafer holding device of the present invention.
【図６】本発明のウェハー保持装置の爪の他の実施例を
示す図である。FIG. 6 is a view showing another embodiment of the claw of the wafer holding device of the present invention.
１ 保持部材 ２ 垂直方向保持部材 ３ 水平方向保持部材 ４ ウェハ− ５ ウェハ−保持面 ６ 水平方向保持部材駆動（移動）装置 ７ ウェハ−保持台 ８ 爪 Ｌ 極薄のアルミ膜 Ｐ ウェハ−接触面 Ｓ スペ−ス DESCRIPTION OF SYMBOLS 1 Holding member 2 Vertical holding member 3 Horizontal holding member 4 Wafer 5 Wafer-holding surface 6 Horizontal holding member driving (moving) device 7 Wafer-holding table 8 Claw L Ultra-thin aluminum film P Wafer-contact surface S Space
Claims (3)
直角三角形の板状体からなる爪と前記爪を支持、固定す
る保持部材、前記保持部材をウェハーに近接する方向ま
たは離反する方向に移動させる保持部材駆動装置および
前記ウェハーの裏面を保持する保持台からなることを特
徴とする成膜装置のウェハー保持装置。1. A claw formed of a substantially right-angled triangular plate member for pressing and holding the peripheral edge of the wafer, a holding member for supporting and fixing the claw, and a direction in which the holding member approaches or separates from the wafer. A wafer holding device of a film forming apparatus, comprising a holding member driving device for moving and a holding table for holding the back surface of the wafer.
該三角形の斜辺に形成される面の一部をウェハー保持面
とすることを特徴とする前記請求項１に記載の成膜装置
のウェハー保持装置。2. The film forming apparatus according to claim 1, wherein the claw formed of the substantially right-angled triangular plate-like body uses a part of a surface formed on the hypotenuse of the triangle as a wafer holding surface. Wafer holding device.
であることを特徴とする前記請求項１に記載の成膜装置
のウェハー保持装置。3. The wafer holding device of the film forming apparatus according to claim 1, wherein the triangular hypotenuse of the claw has an arc shape or a curved shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31276093A JPH07142556A (en) | 1993-11-19 | 1993-11-19 | Wafer holder for film forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31276093A JPH07142556A (en) | 1993-11-19 | 1993-11-19 | Wafer holder for film forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07142556A true JPH07142556A (en) | 1995-06-02 |
Family
ID=18033100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31276093A Pending JPH07142556A (en) | 1993-11-19 | 1993-11-19 | Wafer holder for film forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07142556A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008211252A (en) * | 1996-07-30 | 2008-09-11 | Applied Materials Inc | Apparatus for shielding fringe of workpiece |
| JP2016152264A (en) * | 2015-02-16 | 2016-08-22 | 東京エレクトロン株式会社 | Substrate holding mechanism and substrate processing device employing the same |
-
1993
- 1993-11-19 JP JP31276093A patent/JPH07142556A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008211252A (en) * | 1996-07-30 | 2008-09-11 | Applied Materials Inc | Apparatus for shielding fringe of workpiece |
| JP2016152264A (en) * | 2015-02-16 | 2016-08-22 | 東京エレクトロン株式会社 | Substrate holding mechanism and substrate processing device employing the same |
| KR20160100828A (en) * | 2015-02-16 | 2016-08-24 | 도쿄엘렉트론가부시키가이샤 | Substrate holding mechanism and substrate processing apparatus using the same |
| CN105887047A (en) * | 2015-02-16 | 2016-08-24 | 东京毅力科创株式会社 | Substrate Holding Mechanism And Substrate Processing Apparatus Using The Same |
| US10790182B2 (en) | 2015-02-16 | 2020-09-29 | Tokyo Electron Limited | Substrate holding mechanism and substrate processing apparatus using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101075512B1 (en) | Semiconductor wafer storage case and method of storing wafers | |
| US20070085222A1 (en) | Molded integrated circuit package with exposed active area | |
| US6046073A (en) | Process for producing very thin semiconductor chips | |
| JPH07142556A (en) | Wafer holder for film forming device | |
| US20140376089A1 (en) | window-equipped cover for an optical device and manufacturing method for manufacturing a window-equipped cover for an optical device | |
| JPH10310191A (en) | Substrate container | |
| JPH04267356A (en) | Semiconductor element conveying container | |
| JP2002305233A (en) | Arm for carrying wafer | |
| JP2004273867A (en) | Method of carrying out extremely thin wafer and multistage type storing cassette to be used therefor | |
| US20030102483A1 (en) | Method of manufacturing optical semiconductor device | |
| JP3075398B2 (en) | Ultrasonic bonding collet and bonding method | |
| JPH06255673A (en) | Carrier tape for containing electronic component | |
| JP2002002695A (en) | Substrate storage tray and substrate packaging body using the same | |
| JP2978397B2 (en) | Panel element carrier | |
| JPH05206178A (en) | Semiconductor chip | |
| US5168995A (en) | Pinch clip lid for non-hermetic packages | |
| US11942496B2 (en) | Slanted glass edge for image sensor package | |
| US5718546A (en) | Vial cap and transducer gauge for wire bonding capillaries | |
| JPH06298290A (en) | Chip tray and chip package using the same | |
| US20030075936A1 (en) | Wafer blade equipped with piezoelectric sensors | |
| JPH0617145B2 (en) | Electronic component carrier | |
| JP2000327025A (en) | Carrier tape | |
| JPH0715175A (en) | Supplying tape for semiconductor element and feeding device for the tape | |
| JP4234958B2 (en) | Carrier tape | |
| JP2780210B2 (en) | Jig for holding integrated circuits |