JPH0713964Y2 - 平面研磨装置用キャリヤ - Google Patents

平面研磨装置用キャリヤ

Info

Publication number
JPH0713964Y2
JPH0713964Y2 JP1987088872U JP8887287U JPH0713964Y2 JP H0713964 Y2 JPH0713964 Y2 JP H0713964Y2 JP 1987088872 U JP1987088872 U JP 1987088872U JP 8887287 U JP8887287 U JP 8887287U JP H0713964 Y2 JPH0713964 Y2 JP H0713964Y2
Authority
JP
Japan
Prior art keywords
carrier
work
pores
polishing
work holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987088872U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63197049U (en, 2012
Inventor
和彦 平田
俊邦 清水
Original Assignee
スピ−ドファム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スピ−ドファム株式会社 filed Critical スピ−ドファム株式会社
Priority to JP1987088872U priority Critical patent/JPH0713964Y2/ja
Publication of JPS63197049U publication Critical patent/JPS63197049U/ja
Application granted granted Critical
Publication of JPH0713964Y2 publication Critical patent/JPH0713964Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1987088872U 1987-06-09 1987-06-09 平面研磨装置用キャリヤ Expired - Lifetime JPH0713964Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987088872U JPH0713964Y2 (ja) 1987-06-09 1987-06-09 平面研磨装置用キャリヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987088872U JPH0713964Y2 (ja) 1987-06-09 1987-06-09 平面研磨装置用キャリヤ

Publications (2)

Publication Number Publication Date
JPS63197049U JPS63197049U (en, 2012) 1988-12-19
JPH0713964Y2 true JPH0713964Y2 (ja) 1995-04-05

Family

ID=30947352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987088872U Expired - Lifetime JPH0713964Y2 (ja) 1987-06-09 1987-06-09 平面研磨装置用キャリヤ

Country Status (1)

Country Link
JP (1) JPH0713964Y2 (en, 2012)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007015105A (ja) * 2006-09-25 2007-01-25 Hoya Corp 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法
JP5678724B2 (ja) * 2011-03-02 2015-03-04 旭硝子株式会社 ガラス基板の製造方法及びその方法に用いられるキャリアの反り方向検出装置
MY179417A (en) * 2011-12-27 2020-11-05 Kobe Precision Tech Sdn Bhd Apparatus and method for providing improved grinding lines on an aluminium substrate disc
JP6462348B2 (ja) * 2014-12-16 2019-01-30 大研工業株式会社 薄板ワークの研削方法
JP6513174B2 (ja) * 2017-12-25 2019-05-15 信越半導体株式会社 ウェーハ保持用キャリアの設計方法

Also Published As

Publication number Publication date
JPS63197049U (en, 2012) 1988-12-19

Similar Documents

Publication Publication Date Title
DE102005045081B4 (de) Suszeptor
US4739589A (en) Process and apparatus for abrasive machining of a wafer-like workpiece
EP1852900B1 (en) Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
JPH1110530A (ja) 両面研磨用キャリア
KR20090029270A (ko) 양면 연마 장치용 캐리어 및 이를 이용한 양면 연마 장치 및 양면 연마 방법
US20090311948A1 (en) Method for producing semiconductor wafer
US20070184662A1 (en) Double-side polishing carrier and fabrication method thereof
KR102004705B1 (ko) 양면 연마 방법
JPH0713964Y2 (ja) 平面研磨装置用キャリヤ
JPH11254305A (ja) ウエーハの両面研磨方法と該研磨方法に用いるウエーハキャリア
JPH10329013A (ja) 両面研磨及び両面ラッピング用キャリア
CN109454548B (zh) 两面研磨装置用的被研磨物保持用游星轮
JP2009178806A (ja) 研磨用キャリア、及び、研磨装置
JP4241164B2 (ja) 半導体ウェハ研磨機
JP3821947B2 (ja) ウェーハ研磨装置及びウェーハ研磨方法
JPS58143954A (ja) 精密研磨加工用キヤリア−
JPH0538671A (ja) 両面同時平面研磨機用キヤリヤ
JPH11233462A (ja) 半導体ウエハの両面研磨方法
JP2005238413A (ja) ラップ盤用回転定盤
US6439987B1 (en) Tool and method for the abrasive machining of a substantially planar surface
JP3587505B2 (ja) 研磨用キャリア
CN211565521U (zh) 一种用于晶体抛光的游星轮片
JPS5936368Y2 (ja) 平面研削装置用キヤリア
JPH0217303B2 (en, 2012)
TWM655068U (zh) 一種研拋載具