JPH0713913Y2 - 半田小片 - Google Patents

半田小片

Info

Publication number
JPH0713913Y2
JPH0713913Y2 JP1985158004U JP15800485U JPH0713913Y2 JP H0713913 Y2 JPH0713913 Y2 JP H0713913Y2 JP 1985158004 U JP1985158004 U JP 1985158004U JP 15800485 U JP15800485 U JP 15800485U JP H0713913 Y2 JPH0713913 Y2 JP H0713913Y2
Authority
JP
Japan
Prior art keywords
solder
semiconductor
solder piece
melting point
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985158004U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6267692U (enExample
Inventor
哲朗 辻
忠 黒川
修 宗形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Senju Metal Industry Co Ltd
Original Assignee
Mitsubishi Electric Corp
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Senju Metal Industry Co Ltd filed Critical Mitsubishi Electric Corp
Priority to JP1985158004U priority Critical patent/JPH0713913Y2/ja
Publication of JPS6267692U publication Critical patent/JPS6267692U/ja
Application granted granted Critical
Publication of JPH0713913Y2 publication Critical patent/JPH0713913Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1985158004U 1985-10-16 1985-10-16 半田小片 Expired - Lifetime JPH0713913Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985158004U JPH0713913Y2 (ja) 1985-10-16 1985-10-16 半田小片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985158004U JPH0713913Y2 (ja) 1985-10-16 1985-10-16 半田小片

Publications (2)

Publication Number Publication Date
JPS6267692U JPS6267692U (enExample) 1987-04-27
JPH0713913Y2 true JPH0713913Y2 (ja) 1995-04-05

Family

ID=31081081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985158004U Expired - Lifetime JPH0713913Y2 (ja) 1985-10-16 1985-10-16 半田小片

Country Status (1)

Country Link
JP (1) JPH0713913Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765098B2 (ja) * 2005-10-13 2011-09-07 富士電機株式会社 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155447U (enExample) * 1980-04-17 1981-11-20

Also Published As

Publication number Publication date
JPS6267692U (enExample) 1987-04-27

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