JPH07130948A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To readily stack in multi-stage by a connection method by a solder ball or a solder bump and to be miniatured more, thinned more, and lightened more. CONSTITUTION:In a semiconductor integrated circuit device of a stacked construction that a plurality of pellets are stacked in multi-stage, terminal parts 3, 4 of two pellets 1, 2 are connected with each other by a solder ball 5 and stacked in two stages, and further the solder ball 5 is connected with a lead 6 for an external terminal and the entire pellets 1, 2 stacked in this two-stage construction are sealed with a resin mold 7. In these pellets 1, 2, a front surface, a side surface, and a rear surface of terminal parts 3, 4 are formed with a metal material such as Al, and the terminal parts 3, 4 of these pellets 1, 2 are electrically connected with each other via the solder ball 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and in particular, it is possible to reduce the size of an IC device of a small electronic device by increasing the capacity of a memory and mounting it at a high density, and by stacking pellets in multiple stages and thinly. Thin and lightweight electronic parts,
The present invention relates to a technique effectively applied to a semiconductor integrated circuit device suitable for a memory card and the like.

[0002]

2. Description of the Related Art For example, a conventional pellet is used as a semiconductor integrated circuit device in which pellets are stacked in multiple stages.
TAB technology is used to perform multistage stacking of pellets by melting lead terminals leads in multiple stages, that is, inner leads made of Cu foil in resin mold sealing, by laser welding or the like.

As a technique related to this, "Nikkei Sangyo Shimbun, February 21, 1991, published by Nikkei Inc.
The first page of "Sun" describes the technology for assembling a package with expanded storage capacity.

[0004]

However, in the prior art as described above, although it is possible to stack pellets in multiple stages, it is difficult to reduce the thickness because the internal structure of the package is complicated. In addition, there is a problem that it is difficult to reduce the size of pinpoint laser welding due to the size restriction of the joint.

Further, in the conventional method, laser welding of the inner leads by the TAB technique is required, and the work for stacking pellets in multiple stages is troublesome and the work cost is increased.

Therefore, the object of the present invention is not a TAB method, but a connection method using solder balls or solder bumps. The solder balls and solder bumps make it possible to easily perform multi-stage stacking. It is to provide a semiconductor integrated circuit device that can be realized.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, the semiconductor integrated circuit device of the present invention is a semiconductor integrated circuit device having a stack structure in which a plurality of pellets are stacked in multiple stages, and the terminal portions of the plurality of pellets are connected by solder balls or solder bumps. In addition to stacking in multiple stages, solder balls or solder bumps are connected to leads or metal foils for external terminals.

Further, without connecting the solder balls or solder bumps to leads for external terminals or metal foils,
The solder balls or the solder bumps themselves are used as terminals for external connection.

In this case, the terminal portions of the plurality of pellets are formed from the metal material up to the side surface and the back surface.

In addition, the terminal portion of the plurality of pellets,
Through-hole etching is performed to form a groove shape, and the groove-shaped portion is formed of a metal material to which solder balls or solder bumps can be connected by soldering.

Further, the plurality of stacked pellets may be potted with a resin mold, or the entire plurality of stacked pellets may be sealed with a resin mold.

[0014]

According to the semiconductor integrated circuit device described above, the terminal portion of the pellet is formed of the metal material up to the side surface and the back surface, or the groove-shaped portion formed by the through hole etching process is formed of the metal material. The multi-stage stacking of pellets can be easily performed by connecting the pellet terminals with solder balls or solder bumps, and the semiconductor integrated circuit device having a stack structure can be formed in a small size and a thin shape.

That is, since the pellets are stacked in multiple stages more compactly than in the prior art, not only the TAB method, but also the solder balls and solder bumps can be stacked in multiple stages, and the lead terminals of the pellet terminals or the metal foil can be stacked. The connection must also be possible.

Therefore, the pellet terminals are conventionally formed on the surface of the pellet. However, since the pellet terminals are connected in multiple stages by connecting via solder balls or solder bumps, the terminals of the pellet are extended from the side surface to the back surface of the pellet. As it is formed, the pellet terminal part is provided with a groove-shaped notch in the pellet terminal part by through hole etching processing,
The pellet terminal portion is formed even on the side surface and the back surface of the pellet.

After that, a solder ball or a solder bump is attached to the above-mentioned pellet terminal portion, baking and curing are performed to melt the solder, and a plurality of pellet stages and leads are connected to form a semiconductor integrated circuit device.

In this case, the solder balls or solder bumps used are smaller than the size of the groove shape of the terminal portion of the pellet, and the pellets may stick to each other during soldering. This can be prevented by temporarily fixing the pellets to each other with a temporary fixing agent or a double-sided tape.

As a result, the invention can be favorably applied to electronic parts, memory cards, etc., which are required to be further reduced in size, thickness, and weight, especially in response to the demand for large capacity and high density mounting of memories. it can.

Furthermore, when a plurality of pellets stacked in multiple stages or the entire pellets are sealed with a resin mold, the moisture resistance of the pellets can be improved.

[0021]

EXAMPLES Examples of the present invention will be described in detail below.

(Embodiment 1) FIG. 1 is a sectional view showing an essential part of a semiconductor integrated circuit device which is an embodiment of the present invention, and FIG. 2 is a perspective view showing an essential part of a pellet in the semiconductor integrated circuit device of this embodiment. FIG. 3 is a perspective view showing a resin sheet used for manufacturing the semiconductor integrated circuit device of this embodiment, and FIG. 4 is a cross-sectional view showing a main part of the semiconductor integrated circuit device during manufacturing.

First, the structure of the semiconductor integrated circuit device of this embodiment will be described with reference to FIG.

The semiconductor integrated circuit device of this embodiment is, for example, a semiconductor integrated circuit device having a stack structure in which a plurality of pellets are stacked in multiple stages, and the terminal portions 3 and 4 of the two pellets 1 and 2 are the solder balls 5. And the solder balls 5 are connected to leads 6 for external terminals, and the pellets 1 and 2 stacked in this two-stage structure are entirely sealed by a resin mold 7. ing.

As shown in FIG. 2, in the pellets 1 and 2, the terminal portions 3 and 4 are formed from a metal material 8 such as Al on the front surface, the side surface and the back surface. Are electrically connected via the solder balls 5,
The pellets 1 and 2 are laminated in two stages.

Next, the operation of this embodiment will be described for the case where the pellets 1 and 2 are actually stacked in two stages.

First, in order to make it possible to stack the pellets 1 and 2 in multiple stages, for example, a large etching through hole is formed and Al is deposited on the through hole to form a pellet 1 made of an Al metal material 8 as shown in FIG. The second terminal portions 3 and 4 are formed on the front surface, the side surface, and the back surface.

Then, a resin sheet 9 having holes, for example, the solder balls 5 as shown in FIG. 3 is placed on one pellet 1, and the solder balls 5 are put in the holes of the resin sheet 9 and temporarily fixed. The solder ball 5 is connected to the terminal portion 3 of the pellet 1 by performing a solder bake at a temperature as low as possible for soldering. In some cases, the solder paste may be placed on the pellet terminals by screen printing. After that, the leads 6 fixed with a tape 10 or the like are placed on the pellet 1 to which the solder balls 5 are connected, as shown in FIG. Then, another pellet 2 is placed, the solder balls 5 are melted by baking and curing, and the pellets 1 and 2 are stacked in two stages and the leads 6 are connected.

In this case, the upper and lower pellets 1 and 2 may stick to each other. If necessary, a double-sided tape 11 may be attached to the central surface of the lower pellet 1 before stacking the pellets 1 and 2 in advance. This can be prevented by temporarily fixing the pellets 1 and 2 to each other by solder baking and curing as shown in FIG.

Finally, the two stacked pellets 1 and 2 are entirely sealed with a resin mold 7 to complete a semiconductor integrated circuit device having a stack structure using the solder ball 5 connection method.

Therefore, according to the semiconductor integrated circuit device of this embodiment, the terminal portions 3 and 4 of the pellets 1 and 2 are on the surface,
By forming the side surface and the back surface with the metal material 8, two-stage stacking of the pellets 1 and 2 can be easily performed by connecting the solder balls 5 to the terminal portions 3 and 4.
A small and thin semiconductor integrated circuit device can be formed.

Furthermore, the pellets 1 and 2 laminated in the two-stage structure are entirely sealed by the resin mold 7 at a low temperature that does not melt with solder, so that the moisture resistance of the semiconductor integrated circuit device can be improved.

(Embodiment 2) FIGS. 5 (a) and 5 (b) are sectional views showing a main part of a semiconductor integrated circuit device according to another embodiment of the present invention.
FIG. 6 is a side view of the main part in the molded state, and FIG. 6 is a perspective view showing the main part of the pellet in the semiconductor integrated circuit device of this embodiment.

As shown in FIG. 5, the semiconductor integrated circuit device of this embodiment has two pellets 1a and 2 as in the first embodiment.
The terminal portions 3a and 4a of a are connected by solder balls 5a to be stacked in two stages, and the solder balls 5a are connected to leads 6a for external terminals, and the entire pellets 1a and 2a laminated in this two-stage structure are The structure is sealed by a resin mold 7a, and the difference from the first embodiment is that the structures of the terminal portions 3a and 4a of the pellets 1a and 2a are different.

That is, the pellets 1a, 2a of this embodiment
As shown in FIG. 6, the terminal portions 3a and 4a are formed with a groove-shaped notch 12 by through-hole etching.
The groove-shaped portion of the notch 12 is formed of a metal material 8a such as Al, and the terminal portion 3 of the two pellets 1a and 2a is formed.
The a and 4a are electrically connected to each other through the solder balls 5a, and the pellets 1a and 2a are laminated in two stages.

Therefore, according to the semiconductor integrated circuit device of this embodiment, the solder balls 5a are temporarily fixed to one of the pellets 1a by solder bake as in the case of the first embodiment, and the pellets 1
The pellets 2a on the other side are stacked, the leads 6a are attached, and the solder balls 5a are melted by baking and curing, whereby the terminals 3a and 4a of the stacked pellets 1a and 2a are melted.
Also, the leads 6a can be connected after the resin molding, and a small and thin semiconductor integrated circuit device can be easily formed as in the first embodiment.

Although the invention made by the present inventor has been specifically described based on the first and second embodiments, the present invention is not limited to the above embodiments and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, in the semiconductor integrated circuit device of the above-described embodiment, the terminal portions 3, 4 (3a, 4a) of the pellets 1, 2 (1a, 2a) are connected by the solder balls 5 (5a), and further the solder balls The case where 5 (5a) is connected to the lead 6 (6a) for the external terminal has been described.
The present invention is not limited to the above-described embodiment, and for example, in the case of connecting terminals by solder bumps or connecting to metal foil such as TCP (Tape Carrier Package) in addition to leads for external terminals. Is also widely applicable.

Further, the metal material 8 (8a) of the terminal portions 3, 4 (3a, 4a) in the pellets 1, 2 (1a, 2a).
In addition to Al, other metal materials such as Al alloy can be applied. Further, as a method of temporarily fixing the pellets to each other, other than the double-sided tape, other materials such as a temporary fixing agent can be applied. Needless to say.

Further, regarding the package structure in the above-mentioned embodiment, pellets 1b and 2 are formed as shown in FIG. 7, for example.
Various modified structures are conceivable in which the leads 6b are connected to the solder balls 5b at the side surface position of b, or as shown in FIG. 8, the solder balls 5c are used to stack the pellets 1c, 2c, and 13 in three stages to form the leads 6c. It is also possible to connect or form a multi-layered structure of four or more layers.

Further, regarding the structure of the terminal portions 3 and 4 of the pellets 1 and 2 in the first embodiment, as shown in FIG. 9, for example, the scribe area 1 of the pellet terminal portion of the wafer 14 is used.
The same effect can be obtained even when the side surface and the one main surface are formed of a metal material by forming No. 5 with an Al through hole and then dicing.

Furthermore, in the present embodiment, the solder balls or the solder bumps themselves are used as terminals without connecting the leads to the solder balls or the solder bumps.
It is also possible to form a semiconductor integrated circuit device having a solder ball 5d or a bump structure by stacking the pellets 1d and 2d in multiple stages without using such a lead.

In addition to the case where the whole of the pellets stacked in multiple stages is resin-molded, for example, potting between the pellets is performed in the state shown in FIG. 7, and a plurality of packages are mounted on a printed circuit board and then resin-molded. It is also applicable to the case where the entire printed circuit board on which the package is mounted is coated, or the like.

[0044]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1) The terminals of a plurality of pellets are formed of, for example, a metal material up to the side surface and the back surface, or the groove-shaped portions formed by through-hole etching are formed of a metal material. By connecting with solder bumps or solder bumps to leads or metal foil for external terminals while connecting with bumps, multi-stage stacking of pellets can be easily performed by connecting solder balls or solder bumps to pellet terminals. This enables the semiconductor integrated circuit device having a stack structure to be formed in a small size and a thin shape.

(2). Similar to the above (1), by using the solder balls or solder bumps themselves as terminals for external connection without connecting the solder balls or solder bumps to leads or metal foils for external terminals. Further, it is possible to easily stack the pellets in multiple stages, and it is possible to form the pellet into a smaller and thinner shape.

(3) High potency of pellets is obtained by potting resin molding between a plurality of stacked pellets or sealing the entire plurality of stacked pellets with a resin mold. Therefore, the reliability of the semiconductor integrated circuit device can be improved.

(4) Due to the above (1) to (3), especially in response to the demand for large capacity and high density mounting of the memory, electronic parts and memory which are required to be small, thin and lightweight. It is possible to obtain a highly reliable semiconductor integrated circuit device that can be favorably applied to cards and the like.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a semiconductor integrated circuit device that is Embodiment 1 of the present invention.

FIG. 2 is a perspective view showing a main part of a pellet in the semiconductor integrated circuit device of Example 1.

FIG. 3 is a perspective view showing a resin sheet used for manufacturing the semiconductor integrated circuit device according to the first embodiment.

FIG. 4 is a cross-sectional view showing a main part of the semiconductor integrated circuit device in the process of manufacturing the semiconductor integrated circuit device according to the first embodiment.

5A and 5B are a sectional view showing a main part of a semiconductor integrated circuit device according to a second embodiment of the present invention and a side view of the main part in a molded state.

FIG. 6 is a perspective view showing a main part of a pellet in a semiconductor integrated circuit device of Example 2.

FIG. 7 is a main-portion cross-sectional view showing a modification of the semiconductor integrated circuit device of the present invention.

FIG. 8 is a main-portion cross-sectional view showing a modification of the semiconductor integrated circuit device of the present invention.

FIG. 9 is a cross-sectional view illustrating a pellet forming method in a modification of the semiconductor integrated circuit device according to the present invention.

FIG. 10 is a main-portion cross-sectional view showing a modification of the semiconductor integrated circuit device of the present invention.

[Explanation of symbols]

 1,1a to 1d Pellet 2,2a to 2d Pellet 3,3a Terminal part 4,4a Terminal part 5,5a to 5d Solder ball 6,6a to 6c Lead 7,7a Resin mold 8,8a Metal material 9 Resin sheet 10 Tape 11 Double-sided tape 12 Notch 13 Pellet 14 Wafer 15 Scribing area

Claims (5)

[Claims] 1. A semiconductor integrated circuit device having a stack structure in which a plurality of pellets are stacked in multiple stages, wherein terminal portions of the plurality of pellets are connected by solder balls or solder bumps to form multiple stacks. A semiconductor integrated circuit device characterized in that a solder ball or a solder bump is connected to a lead or a metal foil for an external terminal. 2. The solder ball or solder bump itself is used as an external connection terminal without connecting the solder ball or solder bump to a lead or a metal foil for an external terminal. Semiconductor integrated circuit device. 3. The semiconductor integrated circuit according to claim 1, wherein the terminal portions of the plurality of pellets are formed from a metal material to which the solder balls or solder bumps can be soldered up to the side surface and the back surface. apparatus. 4. The terminal portion of the plurality of pellets is formed into a groove shape by through-hole etching processing, and the groove shape portion is formed of a metal material to which the solder ball or solder bump can be soldered. Claim 1
Alternatively, the semiconductor integrated circuit device according to item 2. 5. The potting resin mold between the plurality of stacked pellets, or the entire plurality of stacked pellets is sealed by a resin mold. 3 or 4
The semiconductor integrated circuit device described.