JPH07128385A - Method and apparatus for inspecting connection of electric component - Google Patents

Abstract

PURPOSE:To provide a method and an apparatus for measuring warp, inclination of a board, quantity of solder at joint, and unevenness in the surface height at the joint of lead of an electric component quantitatively and concluding the cause thereof automatically. CONSTITUTION:To a proper 20 touching the joint 24 between the a lead 12 of an electric component 10 and an electrode 16 of a board 14, specified load and vibration within nondestructive range are applied, and a distortion caused thereby is measured thus determining pass/fail of the joint. The surface height at a specific position on the board 14 is then measured and at least one of warp and inclination of the board 14 is calculated. Subsequently, the height of a specific electrode 16 on the board 14 is measured and that of other electrode 16 is estimated. The surface height at the joint 24 of the lead 12 of the electric component 10 connected with the relevant electrode part of the board 14 is then measured and the surface height of the board electrode 16 and the thickness of the lead 12 are subtracted therefrom thus determining the thickness of solder at the joint 24 quantitatively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of inspecting a connecting portion between a lead and a substrate electrode of an electric component (electronic component), and particularly, after directly contacting the connecting portion of the lead with a probe, a predetermined load is applied to the probe. In the inspection method and device that judge whether the connection state is good or bad based on the output signal correlated with the strength by observing the generated distortion by adding vibration, when the judgment is bad, the main cause of the failure is automatically The present invention relates to an inspection method and an apparatus for making a positive determination.

[0002]

2. Description of the Related Art Today, many flat package type electric parts (hereinafter, used as a concept including electronic parts) are automatically mounted on a board. First, the electric parts are placed at predetermined positions on the board by an automatic mounting device. After the installation, the leads of the electric component and the electrodes formed on the substrate are soldered by the reflow soldering method. This reflow soldering method is a method in which at least the soldered part is heated to melt and connect the solder supplied between the leads of the electric component and the board electrode, and many leads are soldered to the board electrode at one time. To be done. However, since a defective connection may occur in a part of a large number of connection parts, the quality of the connected state is inspected.

This inspection of the connection state is usually performed by a magnifying glass or image processing, but this inspection can only make a qualitative judgment. For this reason, it is almost impossible to detect a connection failure caused by vibration applied during assembly of parts or transportation of a product. Moreover, it was not possible to perform a perfect inspection due to erroneous judgments and oversights.

Therefore, as a result of further research aimed at quantitatively detecting the connection strength at the connection portion, as well as the conventional qualitative inspection described above, Japanese Patent Application No. 5-1113 has been previously applied.
No. 04 was disclosed. In this inspection method, as shown in FIG. 1, first, a board 14 on which an electric component 10 is mounted is conveyed to an inspection position, and typical electrode positions of the board 14 and the electric component 10 are detected and positioned by an image processing device or the like. After doing
The probe 20 is dropped onto the connecting portion 24 of the lead 12 of the electric component 10 as shown in FIGS. 2 (a) and 2 (b). After that, a constant load and vibration are applied to the probe 20 that is in direct contact with the lead 12 in a non-destructive range, and the strain generated by the load and vibration is converted into an electrical signal and connected as an output signal correlated with the strength. The quality of the state is determined.

That is, according to the method disclosed in Japanese Patent Application No. 5-111304, the connection strength between the lead 12 of the electric component 10 and the electrode 16 on the substrate 14 is determined by the lead 12 of the electric component 10.
By measuring the output signal correlated with the intensity obtained by lowering and vibrating the probe 20:
The pass / fail judgment is performed. Therefore, since the quality of the connection strength can be quantitatively obtained, it is possible to reliably select the connection failure due to vibration or the like even if the connection is apparent.

[0006]

However, although this inspection method can judge whether the connection state is good or bad, the warp, the inclination, and the solder in the connection portion of the substrate, which are factors that greatly affect the judgment of the connection state, are found. However, it was not possible to grasp the amount of the electric field and the uniformity of the surface height at the connection part of the lead of the electric component. Moreover, even if it is possible to grasp the content of the defect in the connection part, the defective product should be stored as a means for investigating and analyzing the cause of the defect.
The operator had to measure the various data by observing the appearance and measuring with a precision length measuring machine, and then make a judgment, which required a great deal of man-hours and labor.

Therefore, the inventor of the present invention inspects the connection state between the lead of the electric component and the board electrode to judge whether the connection is good or bad, and warps or tilts the board, which is the cause of the failure of the connection part, or solder in the connection part. Quantity and the unevenness of the surface height at the connection part of the lead of the electric component are quantitatively measured and calculated, and when the connection state is poor, the main cause is automatically determined. And as a result of repeated studies for the purpose of providing a device,
This led to the present invention.

[0008]

The gist of the method for inspecting the connection state of an electric component according to the present invention is that the probe contacted with the connecting portion between the lead of the electric component and the electrode of the substrate is nondestructive. By applying a predetermined load and vibration, by measuring the generated strain, in the inspection method for determining the quality of the connection state, while determining the quality of the connection state by the inspection method, the surface at a specific position on the substrate The height is measured and at least one of the warp and the inclination of the substrate is quantitatively calculated.

Another aspect of the method for inspecting a connection state of an electric component according to the present invention is that a probe contacted with a connecting portion between a lead of an electric component and an electrode of a substrate is predetermined within a non-destructive range. By applying load and vibration and measuring the generated strain, in an inspection method for determining the quality of the connection state, in addition to determining the quality of the connection state by the inspection method, the electrode surface of a specific electrode on the substrate While measuring the surface height of the, the surface height of the electrode surface of the other electrode is estimated based on the measured value, and further, the surface of the connecting portion of the lead of the electric component connected to the electrode portion of the substrate. By measuring the height, by subtracting the surface height of the obtained substrate electrode and the thickness of the lead of the electrical component from the surface height of the connection portion of the lead, quantitatively the thickness of the solder in the connection portion Arithmetic It is to.

Another aspect of the method for inspecting a connection state of an electrical component according to the present invention is that a predetermined load is applied to a probe brought into contact with a connecting portion between a lead of an electrical component and a substrate electrode in a non-destructive range. By applying vibration and measuring the generated strain, in an inspection method for determining the quality of the connection state, in addition to determining the quality of the connection state by the inspection method, the probe on the surface of the connection part of the lead of the electrical component It is to quantitatively calculate the flatness of the surface of the connection part in the lead of the electric component based on the surface height of the connection part measured by contacting with.

Another aspect of the method for inspecting the connection state of an electrical component according to the present invention is that in the inspection method for determining the quality of the connection state, the connection state is determined to be defective by the inspection method. In this case, it is to determine whether the cause of the defect is warpage or inclination of the substrate, excess or deficiency of the amount of solder, or nonuniformity in the height direction of the connection portion in the lead of the electric component.

Next, the gist of the apparatus for inspecting the electrical component connection state according to the present invention is that the probe is brought into contact with the connecting portion between the lead of the electrical component and the electrode of the substrate, and the non-destructive range of the probe. With load excitation means for applying a predetermined load and vibration, strain measurement means for measuring the strain generated in the connection portion by the probe, and the quality of the connection state is determined by the strain measured by the strain measurement means. In an inspection device provided with a judging means, a surface height measuring means for measuring a surface height at a specific position on the substrate, and at least one of the warp and the inclination of the substrate is quantitatively determined by the measured surface height. And a calculating means for calculating.

Another aspect of the inspection apparatus for the electrical component connection state according to the present invention is to provide a probe which is brought into contact with the connection portion between the lead of the electrical component and the electrode of the substrate, and a nondestructive probe. Load excitation means for applying a predetermined load and vibration within a range, strain measurement means for measuring the strain generated in the connection portion by the probe, and judgment of the connection state based on the strain measured by the strain measurement means In the inspection device having a determining means to do, surface height measuring means for measuring the surface height of the electrode surface of the specific electrode on the substrate,
Estimating means for estimating the surface height of the electrode surface of another electrode based on the measured value, and surface height measurement for measuring the surface height of the connecting portion of the lead of the electric component connected to the electrode portion of the substrate. And a calculation for quantitatively calculating the thickness of the solder in the connection portion by subtracting the surface height of the board electrode and the thickness of the lead of the electric component obtained from the surface height of the connection portion of the lead. It is to have means.

Another aspect of the inspection apparatus for the electrical component connection state according to the present invention is to provide a probe that is brought into contact with the connection between the lead of the electrical component and the electrode of the substrate, and a nondestructive probe. Load excitation means for applying a predetermined load and vibration within a range, strain measurement means for measuring the strain generated in the connection portion by the probe, and judgment of the connection state based on the strain measured by the strain measurement means In the inspection device provided with the determining means, the measuring means for measuring the surface height of the connecting portion by contacting the probe with the surface of the connecting portion of the lead of the electric component, and the data of the surface height of the connecting portion. The calculation means is provided to quantitatively calculate the flatness of the surface of the connection portion due to the variation.

[0015]

The method and apparatus for inspecting the connection state of an electric component according to the present invention generate a load by applying a predetermined load and vibration to the probe in a non-destructive range by bringing the probe into contact with the connection between the lead of the electric component and the substrate electrode. In determining the quality of the connection state by measuring the strain applied, first, at a specific position on the substrate, for example, the electrodes formed on both ends of the electrodes formed on the substrate and the electrodes formed on the central portion are formed. The surface height of the formed electrode is measured by the surface height measuring means, and the warp and inclination of the substrate are calculated by the calculating means based on the measured value. By storing and storing the calculated warp and inclination of the substrate, when the result of the quality check of the connection state is defective, is the cause of the defect at that location based on the substrate warp? Alternatively, it can be easily determined whether the inclination is based on the inclination of the substrate.

Further, in another method for inspecting a connection state of an electric component and the apparatus therefor according to the present invention, in determining the quality of the connection state, first, the surface height of a specific electrode on the substrate is measured by a surface height measuring means. The surface heights of the other electrodes whose surface heights are not measured are estimated by the estimating means based on the measured values, and the individual surface heights of the substrate electrodes are obtained. On the other hand, the surface height of the connecting portion of the lead of the electric component connected to each of the substrate electrodes is measured by the surface height measuring means. Here, the means for measuring the surface height of the electrode and the means for measuring the surface height at the connecting portion of the lead may be the same or different, and are not limited. Then, the computing means subtracts the surface height of the electrode and the known lead thickness from the obtained surface height at the connection portion of the lead to calculate the thickness of the solder at the connection portion. By storing and storing the calculated solder thickness, whether or not the cause of the defect at the location is due to the solder thickness when the result of the quality check of the connection state is defective. Will be easily determined.

Further, in another method and apparatus for inspecting a connection state of an electric component of the present invention, in determining the quality of the connection state, first, a probe is brought into contact with the surface of the connecting portion of the lead of the mounted electric component. Then, the surface height of the connecting portion is individually measured by the measuring means. As a result, the flatness of the surface of the connecting portion can be quantitatively calculated by the calculating means based on the measured surface height of each connecting portion.
By storing and holding the calculated flatness of the connection portion surface of the lead, when the result of the pass / fail inspection of the connection state is defective, the cause of the defect at that location is due to the flatness of the connection portion surface. It will be easy to judge whether or not it is a thing.

Next, when the result of the quality inspection of the connection state is defective, the defect is found in the place by appropriately combining the method and the device shown in the above-mentioned method and device for inspecting the connection state of the electric parts. The cause can be determined immediately. That is, the main causes of defects in the connecting portion between the lead of the electric component and the substrate electrode are the warp of the substrate, the inclination of the substrate, the amount of solder in the connecting portion, and the surface height of the connecting portion in the lead of the electric component, Each data is obtained for at least the minimum part necessary to obtain these data, and the necessary data is calculated or estimated. Therefore, a highly accurate inspection result can be obtained and the cause of the defect can be identified with the minimum inspection process.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a method for inspecting a connection state of electric parts and an apparatus therefor according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, a flat package type electric component 10 has a large number of leads 12 on its side surface.
A circuit (not shown) and electrodes 16 connected to the individual leads 12 are formed at predetermined positions on the board 14 on which the electric component 10 is mounted. Lead 1 of this electrical component 10
As shown in FIG. 2, 2 is soldered to the electrode 16 of the substrate 14 via the solder 17 by, for example, a reflow soldering method. The soldered electrical component 10 is usually mounted almost exactly on the substrate 14 due to the self-alignment effect. On the other hand, the inspection device 1 for inspecting the quality of the connection part of the electric component 10
Reference numeral 8 denotes a probe 20 which is brought into contact with a connecting portion between a lead of an electric component and an electrode of a substrate, and a load vibrating means 22 which applies a predetermined load and applies vibration to the probe 20 within a range not breaking the connecting portion. A strain measuring means (not shown) for measuring the strain generated in the connecting portion by the probe and a judging means (not shown) for determining the quality of the connection state based on the strain measured by the strain measuring means.

First, the substrate 14 on which the electric component 10 is mounted
Is supplied to a predetermined inspection position by a transport unit (not shown). At this inspection position, the position detection mark provided on the substrate 14 is detected by the sensor installed at a predetermined position, and the position of the electric component 10 is obtained from the characteristic portion of the electric component 10 by image processing or the like. Further, based on the position data (pitch etc.) of the leads 12 of the electric component 10, the electric component 1 with which the probe 20 should come into contact
Position of the connecting portion 24 of the lead 12 of 0 and the electrode 1 of the substrate 14
The position of 6 is obtained and the lowered position of the probe 20 is set.

Next, as shown in FIG. 3, among the electrodes 16 of the substrate 14 arranged in a straight line to which the electric component 10 is connected, the electrodes 26 and 28 at both ends and the electrode 30 at the center are three places. At the exposed substrate electrode 26, which is a vicinity portion other than the portion to which the lead 12 of the electric component 10 is connected,
The height of the probe 20 at that time is measured by bringing the probe 20 into contact with the surfaces of 28 and 30 and measuring the height of the surface.
4 each of the electrodes 26,30,28 height H _L, H _M, H
Data is stored and held as _R.

Here, the distance between the electrodes 26, 28 at both ends is L, and the heights of the substrate electrodes 26, 30, 28 are H, respectively.
_{As L} , H _M and H _R , the inclination of the substrate 14 is D, and the substrate 1 is
Assuming that the warp amount of 4 is B, the inclination D of the substrate 14 is calculated by the equation (1).
Number 1

[Equation 1] And the warp amount B of the substrate 14
Is the formula (2) number 2

[Equation 2] Can be sought by. These equations (1),
Among (2), the distance L between the opposite electrodes 26 and 28 is a known value determined by the type of electrical component 10 to be mounted, the height H _L of the substrate electrodes 26,30,28, H _M, H _R
Is the value obtained by the above measurement. Therefore, the electrodes 26, 3 at the specific three locations on the substrate 14 measured previously are
According to the surface height data of 0 and 28, the inclination D of the substrate 14
And the warp amount B are calculated by the calculating means, and the value thereof is stored and held.

Next, as shown in FIG. 4, the probe 20 is brought into contact with the surface of the connecting portion 24 of the lead 12 of the electric component 10 by sequentially descending from the end and contacting the surface height h.
Is measured by the surface height measuring means which is linked with the probe 20. Then, the measured connecting portion 24 of the lead 12
The surface height h of the above is sequentially stored from the end by the storage means, and the surface height of the connection part 24 of the lead 12 from the specific end to the Nth lead 12 is stored and held as data h _N.

Next, the measured connection portion 24 of the lead 12
Surface height H _N of the substrate electrode 16 corresponding to the surface height h _N
Ask for. The surface height H _N of the substrate electrode 16 is the heights H _R , H _L , H of the substrate electrodes 26, 28, 30 previously obtained.
The distance L between the _M and opposite electrodes 26 and 28, using the estimating function by such as a computer by a method such as arc approximation or parabolic approximation, the function _{H N (H R, H L} , H M,
L, N).

When the thickness of the lead 12 of the electric component 10 is T, as shown in FIG. 5, the solder 17 in the connecting portion 24 between the lead 12 of the electric component 10 and the board electrode 16 is formed.
The thickness S _N of S _N is calculated as S _N = H _N −h _N −T (3). Therefore, the surface height H _N of the substrate electrode 16 obtained by the above estimation function and the measured lead 1
The thickness S _N of the solder 17 is calculated by the calculating means from the surface height h _N of the second connecting portion 24 and the thickness T of the lead 12, and the value is stored in the storage device.

On the other hand, if the surface height of the N-th connecting portion 24 from the end of the lead 12 of the electric component 10 is h _N and the flatness of the surface of the connecting portion 24 of the lead 12 of the electric component 10 is P, then P = 6 × Sig (h _N ) (4) where 1 < N <the number of leads Sig (h _N ): the standard deviation of h _N , the surface of the connecting portion 24 of the lead 12 of the electrical component 10 can be calculated. The variation in height is P in equation (4).
Will be present in the value. Therefore, this P value is obtained as a height variation of the surface of the connecting portion 24 of the lead 12 by the calculating means, and is stored in the storage device.

As described above, the obtained inclination D of the substrate 14, the warp amount B of the substrate 14, the thickness S _{N of the} solder 17 and the flatness P value of the surface of the connection portion 24 are stored as data representing the connection state. Keep it. On the other hand, for each of the inclination D, the warp amount B, the thickness S _{N of the} solder 17 and the flatness P value, the upper limit value and the lower limit value when the connection is normal are obtained from the experimental data, and the D upper limit is obtained. , D lower limit, B upper limit, B lower limit, S upper limit, S lower limit, P upper limit, and P lower limit. Then, the obtained slope D, the amount of warp B, the thickness S _{N of the} solder 17 and the flatness P value are respectively calculated by the following equation (5).
Each formula of D lower limit <D <D upper limit (5) -1 B lower limit <B <B upper limit (5) -2 S lower limit < _SN <S upper limit (5) -3 P lower limit <P <P upper limit (5) If -4 is satisfied, it is determined to be normal, and if there is a term that does not satisfy any of the above equations (5), it is determined that the item is the cause of the defect. is there.

In the electrical component connection state inspection method and the inspection apparatus thereof having the above-described configuration, first, the board 14 on which the electrical component 10 is mounted is conveyed to a predetermined position of the inspection apparatus and positioned, and then inspected. A group of leads 12 arranged in a row in the electrical component 10 to be selected is selected. And
The electrodes 26 and 28 at both ends of the substrate electrode 16 to which the selected lead 12 is connected and the electrode 30 located at the center
The probe 20 is brought into contact with the surface of the portion, the surface height is measured by the surface height measuring means, the data is stored in the storage means, and further the inclination D of the substrate 14 and the warp amount of the substrate 14 are calculated by the calculating means. B is calculated.

Next, the probe 20 is brought into descending contact with the surface of the connecting portion 24 between the lead 12 of the electric component 10 and the substrate electrode 16 in order from any one end, and the connecting portion 24 of the lead 12 of the electric component 10 at that position. The surface height h _N of the probe is measured by the surface height measuring means linked with the probe 20, and the data h _N is stored in the storage means. After that, a load and a vibration load are applied to the probe 20 by the load vibrating means 22 in a non-destructive range to generate a strain in the connecting portion 24, and the strain is measured for strength by the strain measuring means. Then, based on the measurement result, the quality of the connection state in the connection portion 24 is determined by the determination means, and the determination result of the quality and the measurement data are stored as necessary.

Then, in the same manner, the surface height h _N of each connection portion 24 is measured, the connection state is inspected, and these data are stored and retained. After completion of the inspection, if all the determination results of the connection state of each connection portion 24 are normal, the inspection is performed on the next group of connection portions 24. On the other hand, when the determination result of the connection state includes a defect, the measured surface height h _N of the connecting portion 24 of the lead 12 to the thickness of the solder 17 and the flatness P value of the surface of the connecting portion 24. Is calculated by the calculation means, and the data is stored and held. Then, the inclination D of the substrate 14 and the data of the warp amount B which have already been calculated and stored are combined to determine whether or not each equation of the above equation (5) is satisfied, and each equation of the equation (5) is determined. If there is an item that does not meet the conditions, it is determined that the item is the cause of the defect.

Through the above-described inspection process of the electric component, the connection state between the lead of the electric component and the substrate electrode is inspected, and if there is a connection defect, the defective portion is selected and the cause of the defect is determined. Therefore, the defective portion can be immediately repaired. Further, since the cause of the defect is determined, it becomes possible to take effective measures to prevent the recurrence of the defect. In addition, in the above-mentioned inspection process, a new operation required in addition to the operation for inspecting the connection state by the conventional probe is an operation for measuring the surface height of the electrodes at both ends and the center electrode of the group of substrate electrodes. It does not affect the inspection time or man-hours.

Although the embodiment of the inspection method and the inspection apparatus for the electric component connection state according to the present invention has been described in detail above, the present invention is not limited to the above embodiment.

For example, in order to measure the surface height H _N of the electrodes 16 of the substrate 14 formed in a group of straight lines, the leads 12 of the electric component 10 are used as described above.
The probe 20 may be brought into contact with the vicinity of the electrode 16 (26, 28, 30) to which is connected, and the surface height H _N may be measured as shown in FIG. The surface height may be measured by bringing the probe 20 into contact with the measurement portions having the same height as the surfaces of the electrodes 26, 28, 30 at the three desired positions.

The surface height of the substrate electrode 16 is equal to that of the electrode 16.
All electrodes 16 as well as the three ends of the
May be measured, or may be measured at arbitrary plural points. In particular, when the number of electrodes 16 in the group is an even number, the inclination and the warp of the substrate 14 are calculated by not measuring the surface heights, for example, by measuring the surface heights at both ends and at two or more places between them. You may comprise so that the surface height of the electrode 16 of a location may be estimated with high precision.

Further, although the warp and inclination of the substrate were obtained by measuring the surface height of the substrate electrode at a plurality of points, the surface height of the substrate itself was measured to obtain the warp and inclination of the substrate. It goes without saying that it is good. Further, the warp of the substrate can be obtained as a function similarly to the surface height of the substrate electrode. When the substrate has no warp or inclination or can be neglected, the step of obtaining the warp or inclination can be omitted.

Next, the surface height of the substrate electrode 16 may be measured mechanically or electrically by the probe 20, but it may be measured by using a laser or the like, and is not particularly limited. Absent. When the surface heights of all the electrodes 16 are measured using a laser or the like, it goes without saying that an estimating means for estimating the surface heights of the electrodes 16 is not required.

Next, in measuring the surface height at the connection portion of the substrate electrode and the lead with the probe, when the tip of the probe is sharply pointed, the measurement is made by cutting the probe tip into the inside of the substrate electrode or the like. Errors may occur. Therefore, it is possible to appropriately set the shape of the tip portion of the probe in a concavo-convex shape in accordance with the hardness of the electrode or the like. Also, in the inspection process using the probe, before applying vibration to the probe to inspect the pressure applied to the probe when measuring the surface height of the connection portion of the substrate electrode and the lead and the connection state between the lead and the substrate electrode. It is also possible to appropriately change the pressure applied to each.

Further, in the step of inspecting the connection portion, a predetermined load and vibration were applied to the probe directly contacting the connection portion between the lead and the substrate electrode within a non-destructive range, and the generated strain was measured. If the condition is determined to be bad,
Immediately after that, stop the inspection process and configure it to restart the subsequent inspection process after repairing, or store the quality judgment of the connection state in the storage device together with the inspection position, and after completion of the general inspection, It is also possible to configure so as to repair the defective portion, and the configuration is not limited at all.

In addition, the calculation means, the estimation means, and the storage device include those each having a processing ability including a computer, and the like, and the present invention is various based on the knowledge of those skilled in the art without departing from the spirit of the invention. It can be implemented in a mode in which the following improvements, modifications and variations are added.

[0041]

As described above, the method and apparatus for inspecting the electrical component connection state according to the present invention not only inspects the connection between the substrate electrode and the lead of the electrical component, but also determines the connection state. The tilt of the board that affects the judgment,
It is possible to quantitatively understand the warp of the board, the amount of solder, and the flatness of the surface of the connection part in the lead of the electric component, and when the connection state is poor, it is possible to automatically understand which of the above factors is the cause of the failure. Became. In addition, the above-mentioned inspection can be performed only by adding the measurement of the surface height of at least three specific points on the substrate, that is, the electrode at the both ends and the electrode at the center of the group of substrate electrodes to the conventional measurement points. It was possible to carry out the inspection, and it was possible to perform a qualified inspection and cause estimation quickly with little influence on the inspection time.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part for explaining an embodiment of an inspection method for an electrical component connection state and an apparatus therefor according to the present invention.

2A and 2B are diagrams showing a state in which a probe is in contact with a connecting portion of a lead. FIG. 2A is a sectional view of a main part and FIG. 2B is a perspective view of the main part.

FIG. 3 is a perspective view of an essential part for explaining a method for obtaining a warp and an inclination of a substrate.

FIG. 4 is a cross-sectional view of a main part for explaining a method for obtaining individual surface heights of substrate electrodes.

FIG. 5 is an explanatory diagram for explaining a method of obtaining a solder thickness at a connection portion between a lead of an electric component and a board electrode.

FIG. 6 is a perspective view of a main part for explaining another method of obtaining the individual surface heights of the substrate electrodes.

[Explanation of symbols]

 10: Electric component 12: Lead 14: Substrate 16, 26, 28, 30; Electrode 18; Inspection device 20; Probe 22; Load excitation means 24; Connection part

Claims (7)

[Claims] 1. A good or bad connection state by applying a predetermined load and vibration in a non-destructive range to a probe brought into contact with a connecting portion between a lead of an electric component and an electrode of a substrate and measuring the generated strain. In the inspection method for determining, the quality of the connection state is determined by the inspection method, and at least one of the warp and the inclination of the substrate is quantitatively calculated by measuring the surface height at a specific position on the substrate. And a method for inspecting a connection state of electric parts. 2. The quality of the connected state is measured by applying a predetermined load and vibration to the probe in contact with the connecting portion between the lead of the electric component and the electrode of the substrate within a non-destructive range and measuring the generated strain. In the inspection method for determining, while determining the quality of the connection state by the inspection method, while measuring the surface height of the electrode surface of the specific electrode on the substrate, the electrode in the other electrode based on the measured value. Estimating the surface height of the surface, further measuring the surface height of the connecting portion of the lead of the electrical component connected to the electrode portion of the substrate, the substrate obtained from the surface height of the connecting portion of the lead A method for inspecting a connection state of an electric component, which comprises quantitatively calculating a thickness of a solder at the connection portion by subtracting a surface height of an electrode and a thickness of a lead of the electric component. 3. The connection state is determined by applying a predetermined load and vibration to the probe brought into contact with the connection between the lead of the electric component and the substrate electrode within a non-destructive range and measuring the generated strain. In the inspection method for determining, the quality of the connection state is determined by the inspection method, and based on the surface height of the connection portion measured by bringing the probe into contact with the surface of the connection portion of the lead of the electric component, the lead of the electric component A method of inspecting a connection state of an electric component, which comprises quantitatively calculating a flatness of a surface of a connection portion in the. 4. The inspection method for determining the quality of the connection state according to claim 1, wherein when the inspection method determines that the connection state is poor, the cause of the failure is that of the substrate. A method for inspecting a connection state of an electric component, which comprises determining whether it is due to a warp or an inclination, an excess or deficiency of a solder amount, or nonuniformity in a height direction of a connection portion in a lead of the electric component. 5. A probe which is brought into contact with a connecting portion between a lead of an electric component and an electrode of a substrate, a load vibrating means for applying a predetermined load and vibration to the probe in a non-destructive range, and the connection by the probe. In a testing device comprising a strain measuring means for measuring the strain generated in the part, and a determining means for determining the quality of the connection state by the strain measured by the strain measuring means, the surface height at a specific position on the substrate And a surface height measuring means for measuring the height, and an arithmetic means for quantitatively calculating at least one of the warp and the inclination of the substrate based on the measured surface height. apparatus. 6. A probe that is brought into contact with a connecting portion between a lead of an electric component and an electrode of a substrate, a load vibrating unit that applies a predetermined load and vibration to the probe in a non-destructive range, and the connection by the probe. In a testing device comprising a strain measuring means for measuring the strain generated in the portion, and a judging means for judging the quality of the connection state by the strain measured by the strain measuring means, an electrode in a specific electrode on the substrate Surface height measuring means for measuring the surface height of the surface, estimating means for estimating the surface height of the electrode surface of the other electrode based on the measured value, and of the electrical component connected to the electrode part of the substrate Surface height measuring means for measuring the surface height of the connection portion of the lead, by subtracting the surface height of the substrate electrode and the thickness of the lead of the electrical component obtained from the surface height of the connection portion of the lead,
An inspection device for an electrical component connection state, comprising an arithmetic means for quantitatively calculating the thickness of solder in the connection portion. 7. A probe that is brought into contact with a connecting portion between a lead of an electric component and an electrode of a substrate, a load vibrating unit that applies a predetermined load and vibration to the probe in a non-destructive range, and the connection by the probe. In a testing device comprising a strain measuring means for measuring the strain generated in the portion, and a judging means for judging the quality of the connection state by the strain measured by the strain measuring means, the surface of the connecting portion of the lead of the electric component A measuring means for measuring the surface height of the connecting portion by bringing a probe into contact with the measuring means, and an arithmetic means for quantitatively calculating the flatness of the surface of the connecting portion due to the variation in the surface height data of the connecting portion. An apparatus for inspecting a connection state of electric parts, comprising: