JP2616881B2 - Inspection method and apparatus for electrical component connection state - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection method for a connection portion between a lead of an electric component (electronic component) and a substrate electrode, and more particularly, to a method in which a probe is brought into direct contact with a connection portion of a lead and a predetermined load is applied to the probe. In the inspection method and apparatus that determines the quality of the connection state based on an output signal correlated with the strength by applying vibration and observing the generated distortion, when the determination is poor, the cause of the main failure is automatically determined. The present invention relates to an inspection method and an apparatus for making an assertion.

[0002]

2. Description of the Related Art Today, most of flat package type electric components (hereinafter, referred to as a concept including electronic components) are automatically mounted on a substrate. First, an electric component is arranged at a predetermined position on the substrate by an automatic mounting apparatus. After the installation, the leads of the electric component and the electrodes formed on the substrate are soldered by a reflow soldering method. In this reflow soldering method, at least the soldering part is heated and the solder supplied between the leads of the electrical components and the board electrode is melted and connected, and many leads are soldered to the board electrode at once. Is done. However, since a connection failure may occur in a part of a large number of connection portions, the connection state is inspected.

[0003] Inspection of this connection state is usually performed by a magnifying glass or image processing, but this inspection can only make a qualitative determination. For this reason, when a connection failure occurs due to vibrations applied during assembly of parts or transportation of a product, it has been almost impossible to detect the failure. In addition, there were erroneous determinations and oversights, and the inspection could not be completed perfectly.

[0004] Therefore, as a result of researches aimed at quantitatively detecting the connection strength at the connection portion without being limited to the above-described qualitative inspection as described above, Japanese Patent Application No. 5-1113 has been disclosed.
No. 04 has been disclosed. In this inspection method, as shown in FIG. 1, first, a substrate 14 on which an electric component 10 is mounted is conveyed to an inspection position, and a typical electrode position of the substrate 14 and the electric component 10 is detected by an image processing device or the like to determine the position. After doing
The probe 20 is lowered onto the connecting portion 24 of the lead 12 of the electric component 10 as shown in FIGS. 2 (a) and 2 (b). Thereafter, a constant load and vibration are applied to the probe 20 in direct contact with the lead 12 in a non-destructive range, and the strain generated by the load and vibration is converted into an electric signal and connected as an output signal correlated with the intensity. This is to determine the quality of the state.

That is, in the method disclosed in Japanese Patent Application No. 5-111304, the connection strength between the lead 12 of the electric component 10 and the electrode 16 on the substrate 14 is reduced.
By measuring the output signal correlated with the intensity obtained by lowering and exciting the probe 20 above,
The pass / fail judgment is performed. Therefore, since the quality of the connection strength can be quantitatively determined, even if the connection is apparently made, a connection failure due to vibration or the like can be reliably selected.

[0006]

However, although this inspection method can judge the quality of the connection state, the warpage and inclination of the substrate and the solder at the connection part, which greatly affect the judgment of the quality of the connection state, can be made. And the uniformity of the surface height at the connection part of the lead of the electric component could not be grasped. Moreover, even if the contents of the failure in the connection part can be grasped, as a means of investigating and analyzing the cause of the failure, store the defective product,
The operator has to measure various data by observing the appearance or measuring with a precision length measuring instrument, and then make a judgment, which requires a great deal of man-hour and labor.

Accordingly, the present inventor inspects the connection state between the lead of the electric component and the board electrode to judge whether the connection is good or not, and warps and tilts the board, which causes the connection part to be defective, and solders at the connection part. Inspection method that quantitatively measures and calculates the quantity and non-uniformity of the surface height at the connection part of the lead of the electrical component, and automatically determines the main cause when the connection state is poor. As a result of intensive research aimed at providing and equipment,
This has led to the present invention.

[0008]

SUMMARY OF THE INVENTION The gist of the method for inspecting the connection state of an electric component according to the present invention is that the probe brought into contact with the connection between the lead of the electric component and the electrode of the substrate is in a non-destructive range. By applying a predetermined load and vibration, and measuring the generated strain, in the inspection method for determining the quality of the connection state, while determining the quality of the connection state by the inspection method, the surface at a specific position on the substrate measuring the height quantitatively calculate at least one of the warp and tilt of the substrate, the der connection state defective by the inspection method
Is determined, the cause of the defect is the warpage or tilt of the substrate.
It is to determine whether or not it is due to

Another aspect of the method for inspecting a connection state of an electric component according to the present invention is that a probe brought into contact with a connection portion between a lead of an electric component and an electrode of a board is provided with a predetermined non-destructive range. By applying a load and vibration and measuring the generated strain, in the inspection method for determining the quality of the connection state, the quality of the connection state is determined by the inspection method, and the electrode surface of a specific electrode on the substrate While measuring the surface height of the electrode, the surface height of the electrode surface of the other electrode is estimated based on the measured value, and further, the surface of the connection portion of the lead of the electric component connected to the electrode portion of the substrate By measuring the height and subtracting the obtained surface height of the substrate electrode and the thickness of the lead of the electric component from the surface height of the connection part of the lead, the thickness of the solder at the connection part is quantitatively determined. Arithmetic And the connection state by the test method
When it is determined to be defective, the cause of the defect is the amount of solder
It is to determine whether or not it is due to excess or deficiency .

Another aspect of the method for inspecting a connection state of an electric component according to the present invention is that a probe brought into contact with a connection portion between a lead of an electric component and a substrate electrode has a predetermined load within a nondestructive range. By applying vibration and measuring the generated strain, the quality of the connection state is determined by the inspection method, and the quality of the connection state is determined by the inspection method. based on the surface height of the connecting portion was measured by contacting, electric quantitatively calculating the flatness of the surface of the connecting portion in the component leads, determine the connection state is bad by the inspection method
When specified, the cause of the failure is in the leads of the electrical components.
It is to determine whether or not the connection is caused by unevenness in the height direction of the connection portion .

Another aspect of the method for inspecting the connection state of an electric component according to the present invention is that in the inspection method for judging whether the connection state is good or not, the inspection method determines that the connection state is defective. In this case, it is necessary to determine whether the cause of the failure is a warpage or inclination of the board, an excessive or insufficient amount of solder, or a non-uniformity in the height direction of the connection portion of the lead of the electric component.

[0012] Next, the gist of the inspection apparatus for the connection state of electric parts according to the present invention is that a probe to be brought into contact with a connection part between a lead of an electric part and an electrode of a substrate, and a non-destructive range for the probe. A load vibrating means for applying a predetermined load and vibration, a strain measuring means for measuring a strain generated in the connecting portion by the probe, and judging a connection state based on the strain measured by the strain measuring means. In an inspection apparatus including a determination unit, a surface height measurement unit configured to measure a surface height at a specific position on the substrate, and at least one of warpage and inclination of the substrate is quantitatively determined based on the measured surface height. And a calculation means for calculating the value.

Another aspect of the present invention relates to a device for inspecting a connection state of an electric component, wherein a probe which is brought into contact with a connection portion between a lead of the electric component and an electrode of a substrate is provided with a non-destructive probe. A load vibrating means for applying a predetermined load and vibration within a range, a strain measuring means for measuring a strain generated in the connection portion by the probe, and judging a connection state based on the strain measured by the strain measuring means. In an inspection apparatus including a determination unit that performs, a surface height measurement unit that measures a surface height of an electrode surface of a specific electrode on the substrate,
Estimating means for estimating the surface height of the electrode surface of the other electrode based on the measured value; and surface height measurement for measuring the surface height of a connection portion of a lead of an electric component connected to the electrode portion of the substrate. Means for quantitatively calculating the thickness of the solder at the connection by subtracting the surface height of the obtained substrate electrode and the thickness of the lead of the electric component from the surface height of the connection of the lead. To provide means.

[0014] Further, another aspect of the inspection apparatus for the connection state of an electric component according to the present invention is to provide a probe which is brought into contact with a connection portion between a lead of an electric component and an electrode of a substrate, and a non-destructive probe for the probe. A load vibrating means for applying a predetermined load and vibration within a range, a strain measuring means for measuring a strain generated in the connection portion by the probe, and judging a connection state based on the strain measured by the strain measuring means. And measuring means for measuring the surface height of the connection part by contacting a probe to the surface of the connection part of the lead of the electrical component, and data of the surface height of the connection part. An arithmetic unit for quantitatively calculating the flatness of the surface of the connection portion due to the variation is provided.

[0015]

According to the method and the apparatus for inspecting the connection state of an electric component according to the present invention, a probe is brought into contact with a connection portion between a lead of an electric component and a substrate electrode, and a predetermined load and vibration are applied to the probe within a non-destructive range to generate the probe. In order to determine the quality of the connection state by measuring the applied strain, first, at a specific position on the substrate, for example, the electrodes formed at both ends of the electrodes formed on the substrate and the electrodes formed at the center portion The surface height of the electrode is measured by the surface height measuring means, and the warping and inclination of the substrate are calculated by the calculating means based on the measured value. By storing and storing the calculated warpage and tilt of the board, when the result of the connection state quality check is bad, whether the cause of the failure at that location is based on the warpage of the board, Alternatively, it is easy to determine whether the change is based on the inclination of the substrate.

In order to determine the quality of the connection state, the method and apparatus for inspecting the connection state of an electric component according to the present invention first determine the surface height of a specific electrode on the substrate by measuring the surface height. And the surface height of the other electrode whose surface height is not measured based on the measured value is estimated by the estimating means, and the individual surface height of the substrate electrode is obtained. On the other hand, the surface height of the connection part of the lead of the electric component connected to each of the substrate electrodes is measured by the surface height measuring means. Here, the means for measuring the surface height of the electrode and the means for measuring the surface height at the connection portion of the lead may be the same means or different means, and are not limited. Then, the arithmetic unit calculates the thickness of the solder at the connection by subtracting the surface height of the electrode and the known thickness of the lead from the obtained surface height of the connection at the connection. By storing and storing the calculated thickness of the solder, when the result of the quality check of the connection state is defective, it is determined whether the cause of the defect at the location is due to the thickness of the solder. Is easily determined.

Further, in the method and apparatus for inspecting the connection state of an electric component according to the present invention, a probe is first brought into contact with the surface of the connection portion of the lead of the mounted electric component in order to judge the quality of the connection state. Then, the surface height of the connection portion is individually measured by the measuring means. As a result, the flatness of the surface of the connection portion can be quantitatively calculated by the calculating means based on the measured surface height of each connection portion.
By storing and holding the calculated flatness of the connection portion surface of the lead, if the result of the above-described connection state pass / fail inspection is defective, the cause of the failure at that location depends on the flatness of the connection portion surface. It is easy to determine whether or not they are the same.

Next, by appropriately combining the method and apparatus shown in the method and apparatus for inspecting the connection state of the electric parts, when the result of the inspection of the connection state is defective, the failure of the place is determined. The cause can be determined immediately. That is, the main causes of defects in the connection between the lead of the electric component and the board electrode are the warpage of the board, the inclination of the board, the amount of solder in the connection, and the surface height of the connection in the lead of the electric component, Each data is obtained for at least the minimum part necessary for obtaining these data, and the required data is calculated or estimated. Therefore, a highly accurate inspection result can be obtained with a minimum inspection process, and the cause of the defect can be specified.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a method and an apparatus for inspecting a connection state of an electric component according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, an electric component 10 of a flat package type has a large number of leads 12 on its side.
A circuit (not shown) and electrodes 16 connected to the individual leads 12 are formed at predetermined positions on a substrate 14 on which the electric component 10 is mounted. Lead 1 of this electric component 10
2, is soldered to the electrode 16 of the substrate 14 via a solder 17 by, for example, a reflow soldering method. The soldered electrical component 10 is typically mounted almost exactly to the substrate 14 due to the self-alignment effect. On the other hand, the inspection device 1 for inspecting the quality of the connection portion of the electric component 10
Reference numeral 8 denotes a probe 20 which is brought into contact with the connection between the lead of the electric component and the electrode of the substrate, load applying means 22 for applying a predetermined load to the probe 20 within a range not destroying the connection and applying vibration. And a distortion measuring means (not shown) for measuring the distortion generated at the connection portion by the probe, and a judging means (not shown) for judging the quality of the connection state based on the distortion measured by the distortion measuring means.

First, the substrate 14 on which the electric component 10 is mounted
Is supplied to a predetermined inspection position by a transport unit (not shown). In this inspection position, a position detection mark provided on the substrate 14 is detected by a sensor installed at a predetermined location, and the position of the electric component 10 is obtained from a characteristic portion of the electric component 10 by image processing or the like. Further, based on the position data (such as pitch) of the leads 12 of the electric component 10, the electric component 1 with which the probe 20 contacts
0 of the connection portion 24 of the lead 12 and the electrode 1 of the substrate 14
The position of No. 6 is obtained, and the lowering position of the probe 20 is set.

Next, as shown in FIG. 3, among the electrodes 16 of the substrate 14 arranged on a group of straight lines to which the electric components 10 are connected, three electrodes 26 and 28 at both ends and an electrode 30 at the center. , The exposed substrate electrode 26, which is a portion other than the portion to which the lead 12 of the electric component 10 is connected,
The probe 20 is brought into contact with the surfaces of the substrates 28 and 30 and the surface height is measured.
4, the heights H _L , H _M , H of the electrodes 26, 30, 28
Data is stored and held as _R.

Here, the distance between the electrodes 26, 28 at both ends is L, and the height of the substrate electrodes 26, 30, 28 is H, respectively.
Let _L , H _M and H _R be the inclination of the substrate 14 and D
Assuming that the amount of warpage of B is B, the inclination D of the substrate 14 is given by the following equation (1).
Number 1

(Equation 1) And the amount of warpage B of the substrate 14
Is the equation (2)

(Equation 2) Can be determined by: These equations (1),
In (2), the distance L between the electrodes 26 and 28 at both ends is a known value determined by the type of the electric component 10 to be mounted, and the heights H _L , H _M , H _R
Is a value obtained by the above measurement. Therefore, the three electrodes 26, 3 on the substrate 14 measured earlier
According to the surface height data of 0 and 28, the inclination D of the substrate 14 is calculated.
And the amount of warpage B are calculated by the calculating means, and the values are stored and held.

Next, as shown in FIG. 4, the probe 20 is descended from the end to make contact with the surface of the connection portion 24 of the lead 12 of the electric component 10, and the surface height h at that time.
Is measured by a surface height measuring means linked to the probe 20. Then, the measured connection portion 24 of the lead 12
The surface height h is stored from the end in order by the memory means, stores holding the surface height of the connecting portion 24 of the N-th read 12 from the lead 12 of a particular end as data h _N.

Next, the connection portion 24 of the measured lead 12 is
Surface height H _N of the substrate electrode 16 corresponding to the surface height h _N
Ask for. The surface height H _N of the substrate electrode 16 is determined by the heights H _R , H _L , and H of the substrate electrodes 26, 28, and 30 previously determined.
_{Based on M} and the distance L between the electrodes 26 and 28 at both ends, an estimating function by a computer or the like is used by a method such as arc approximation or parabolic approximation, and a function H _N (H _R , H _L , H _M ,
L, N).

Assuming that the thickness of the lead 12 of the electric component 10 is T, the solder 17 at the connection portion 24 between the lead 12 of the electric component 10 and the substrate electrode 16 is formed as shown in FIG.
The thickness S _N is determined as _{S N = H N -h N -T} (3). Therefore, the surface height H _N of the substrate electrode 16 obtained by the above estimation function and the measured lead 1
Surface height of the second connecting portion 24 h _N, and after calculating the thickness S _N of the solder 17 by the computing means from the thickness T of the lead 12 in advance and stored in the storage device that value.

On the other hand, assuming that the surface height of the N-th connection portion 24 from the end of the lead 12 of the electric component 10 is h _N and the flatness of the surface of the connection portion 24 of the lead 12 of the electric component 10 is P, P = 6 × Sig (h _N ) (4) Here, if it is calculated as 1 < N <the number of leads Sig (h _N ): standard deviation of h _N , the surface of the connection portion 24 in the lead 12 of the electric component 10 is calculated. The variation in height is P in equation (4).
Will be in the value. Therefore, the P value is obtained as a variation in the height of the surface of the connection portion 24 of the lead 12 by the calculating means, and is stored in the storage device.

As described above, the obtained inclination D of the substrate 14, the amount of warpage B of the substrate 14, the thickness _{SN of the} solder 17, and the flatness P value of the surface of the connection portion 24 are stored as data representing the connection state. Keep it. On the other hand, for each value of the slope D, the amount of warpage B, the thickness _{SN of the} solder 17 and the flatness P value, the upper and lower limits when the connection is normal are obtained from experimental data, , D lower limit, B upper limit, B lower limit, S upper limit, S lower limit, P upper limit, and P lower limit. Then, the obtained slope D, the amount of warpage B, the thickness _{SN of the} solder 17 and the flatness P value are respectively expressed by the following equation (5).
D lower limit <D <D upper limit (5) -1 B lower limit <B <B upper limit (5) -2 S lower limit <S _N <S upper limit (5) -3 P lower limit <P <P upper limit (5) -4 is determined to be normal, and when there is a term that does not satisfy any of the above equations (5), it is determined that the item is the cause of the defect. is there.

In the inspection method and the inspection apparatus for the connection state of the electric components according to the above-described configuration, first, the board 14 on which the electric components 10 are mounted is conveyed to a predetermined position of the inspection apparatus and is positioned. A group of leads 12 arranged in a row in the electrical component 10 to be formed is selected. And
The electrodes 26 and 28 at both ends of the substrate electrode 16 to which the selected lead 12 is connected, and the three electrodes 30 at the center.
The probe 20 is brought into contact with the surface of the spot, the surface height is measured by the surface height measuring means, the data is stored by the storage means, and the inclination D of the substrate 14 and the amount of warpage of the substrate 14 are further calculated by the calculating means. B is calculated.

Next, the probe 20 is brought into descending contact with the surface of the connection portion 24 between the lead 12 of the electric component 10 and the substrate electrode 16 in order from any one end, and the connection portion 24 of the lead 12 of the electric component 10 at that position is contacted. surface height h _N determined by surface height measurement means to be in conjunction with the probe 20, it is stored in the storage unit such data h _N. Thereafter, a load and vibration load are applied to the probe 20 in a non-destructive range by the load vibrating means 22 to generate a strain at the connection portion 24, and the strain is measured by the strain measuring means. Then, based on the measurement result, the determination unit determines the quality of the connection state at the connection unit 24, and stores the determination result of the quality and the measurement data as necessary.

Next, in the same manner, the surface height h _N of each connection portion 24 is measured, the connection state is inspected, and the data are stored and stored. After the end of the inspection, if all the determination results of the connection state of each connection unit 24 are normal, the inspection is advanced for the next group of connection units 24. On the other hand, if it contains defective determination result of the connection state, measured the thickness of the solder 17 from the surface height h _N of the connecting portion 24 of the lead 12, flatness P value of the surface of the connecting portion 24 Is calculated by the calculating means, and the data is stored and held. Then, the data of the inclination D of the substrate 14 and the amount of warpage B, which are already calculated and stored, are combined to determine whether or not each of the above equations (5) is satisfied. When there is an item that does not satisfy the condition, the item is determined to be the cause of the defect.

In the above-described electrical component inspection process, the connection state between the lead of the electrical component and the substrate electrode is inspected. If there is a connection failure, the location of the failure is determined and the cause of the failure is determined. Thus, the defective portion can be repaired immediately. Further, since the cause of the defect is determined, it is possible to take effective measures to prevent the recurrence of the defect. In the above-described inspection process, a new operation other than the operation for inspecting the connection state using the conventional probe is an operation for measuring the surface heights of the electrodes at both ends and the center electrode of the group of substrate electrodes. Only has little effect on inspection time or man-hours.

Although the embodiments of the method and the apparatus for inspecting the connection state of electric parts according to the present invention have been described in detail, the present invention is not limited to the above embodiments.

For example, in order to measure the surface height H _N of the electrodes 16 of the substrate 14 formed in a group in a straight line, as described above, the leads 12 of the electric component 10 are used.
The probe 20 may be brought into contact with the vicinity of the electrode 16 (26, 28, 30) to which the probe 20 is connected for measurement, but the surface height _HN is measured as shown in FIG. The surface height may be measured by bringing the probe 20 into contact with a measurement portion having the same height as the surfaces of the three electrodes 26, 28, and 30 to be measured.

The surface height of the substrate electrode 16 is
Not only at both ends and the center of the
May be measured, or may be measured at arbitrary plural locations. In particular, when the number of the electrodes 16 in the group is even, the inclination and the warpage of the substrate 14 are not measured, for example, by measuring the surface height at both ends and at two or more places between them. The configuration may be such that the surface height of the electrode 16 at the location is estimated with high accuracy.

Further, the warpage and inclination of the substrate were determined by measuring the surface height of the substrate electrode at a plurality of locations. However, the surface height of the substrate itself was measured to determine the warpage and inclination of the substrate. Needless to say, it is good. Further, the warpage of the substrate can be obtained as a function similarly to the surface height of the substrate electrode. If the substrate has no warp or tilt or can be neglected, the step of obtaining the warp or tilt can be omitted.

Next, the measurement of the surface height of the substrate electrode 16 may be performed mechanically or electrically by the probe 20, but may be performed by using a laser or the like. Absent. When the surface height of all the electrodes 16 is measured using a laser or the like, it is natural that an estimating means for estimating the surface height of the electrode 16 is not required.

Next, when measuring the surface height of the connection portion between the substrate electrode and the lead using a probe, if the tip of the probe is sharp and sharp, the tip of the probe cuts into the inside of the substrate electrode or the like. An error may occur. Therefore, it is possible to appropriately set according to the hardness of the electrode or the like, for example, by forming the shape of the tip portion of the probe into an uneven shape. Further, in the inspection process using the probe, the pressure applied to the probe when measuring the surface height of the connection portion between the substrate electrode and the lead, and the vibration applied to the probe to inspect the connection state between the lead and the substrate electrode, It is also possible to appropriately change the pressure applied to each of them.

Further, in the inspection step of the connection portion, a predetermined load and vibration are applied to the probe directly in contact with the connection portion between the lead and the board electrode within a non-destructive range, and the generated strain is measured. If the status is determined to be bad,
Immediately after that, the inspection process is stopped, and after the repair, the subsequent inspection process is configured to be restarted. It is also possible to configure so as to repair a defective portion, and there is no limitation.

In addition, the present invention may be implemented based on the knowledge of those skilled in the art without departing from the spirit of the present invention. The present invention can be implemented in a mode in which some improvement, modification, or modification is added.

[0041]

As described above, the method and apparatus for inspecting the connection state of an electric component according to the present invention not only inspect the connection quality between the substrate electrode and the lead of the electric component, but also inspect the connection state. The tilt of the board, which affects the judgment,
In addition to quantitatively grasping the warpage of the board, the amount of solder, and the flatness of the surface of the connection part in the lead of the electric component, if the connection state is bad, it is possible to automatically grasp which of the above factors is the cause of the failure. Became. In addition, the above-described inspection is performed simply by adding at least three specific points on the substrate, that is, for example, measuring the surface heights of the electrodes at both ends and the center electrode of the group of substrate electrodes to the conventional measurement points. And the qualified inspection and the cause estimation could be performed quickly with little effect on the inspection time.

[Brief description of the drawings]

FIG. 1 is a perspective view of an essential part for explaining an embodiment of a method and an apparatus for inspecting an electric component connection state according to the present invention.

FIGS. 2A and 2B are diagrams showing a state in which a probe is in contact with a connection portion of a lead, wherein FIG. 2A is a sectional view of a main part, and FIG. 2B is a perspective view of a main part.

FIG. 3 is a perspective view of an essential part for explaining a method for obtaining the warpage and inclination of the substrate.

FIG. 4 is a cross-sectional view of a main part for describing a method of obtaining individual surface heights of a substrate electrode.

FIG. 5 is an explanatory diagram for explaining a method of obtaining a solder thickness at a connection portion between a lead of an electric component and a substrate electrode.

FIG. 6 is a perspective view of an essential part for explaining another method for obtaining the individual surface heights of the substrate electrode.

[Explanation of symbols]

 10; electrical component 12; lead 14; substrate 16, 26, 28, 30; electrode 18; inspection device 20; probe 22; load vibrating means 24;

Claims (7)

(57) [Claims] 1. A connection between a probe in contact with a connection between a lead of an electric component and an electrode of a substrate is applied with a predetermined load and vibration within a non-destructive range, and the generated strain is measured to determine whether the connection is good or bad. In the inspection method for determining, the quality of the connection state is determined by the inspection method, and the surface height at a specific position on the substrate is measured to quantitatively calculate at least one of the warpage and the inclination of the substrate.
However, according to the inspection method, the connection state is determined to be defective.
The cause of the failure is due to the warpage or tilt of the substrate.
A method for inspecting a connection state of an electric component, comprising determining whether or not the electric component is connected. 2. Applying a predetermined load and vibration within a non-destructive range to a probe brought into contact with a connection portion between a lead of an electric component and an electrode of a substrate, and measuring a generated strain to determine whether the connection state is good or bad. In the inspection method for determining, while the quality of the connection state is determined by the inspection method, while measuring the surface height of the electrode surface of the specific electrode on the substrate, the electrode of the other electrode based on the measurement value Estimating the surface height of the surface, further measuring the surface height of the connection portion of the lead of the electrical component connected to the electrode portion of the substrate, the substrate obtained from the surface height of the connection portion of the lead By subtracting the surface height of the electrode and the thickness of the lead of the electric component, the thickness of the solder at the connection portion is quantitatively calculated, and the connection state is poor according to the inspection method.
If it is determined that the solder is excessive,
A method for inspecting a connection state of an electric component, comprising determining whether or not the shortage is caused by a shortage . 3. Applying a predetermined load and vibration within a non-destructive range to a probe brought into contact with a connection portion between a lead of an electric component and a board electrode, and measuring generated strain to determine whether the connection state is good or bad. In the inspection method, the quality of the connection state is determined by the inspection method, and based on the surface height of the connection part measured by bringing a probe into contact with the surface of the connection part of the lead of the electric part, the lead of the electric part is measured. Quantitatively calculate the flatness of the surface of the connection part in the above, and determine that the connection state is defective by the inspection method
When the failure occurs, the cause of the failure is
A method for inspecting a connection state of an electric component, wherein it is determined whether the connection is caused by unevenness in a height direction of a connection portion . 4. The inspection method according to claim 1, wherein when the connection state is determined to be defective by the inspection method, the cause of the failure is caused by a failure of the substrate. A method for inspecting a connection state of an electric component, comprising determining whether the warpage or inclination is caused by an excessive or insufficient amount of solder, or unevenness in a height direction of a connection portion of a lead of the electric component. 5. A probe which is brought into contact with a connection portion between a lead of an electric component and an electrode of a substrate, load exciting means for applying a predetermined load and vibration to the probe within a non-destructive range, and said probe makes said connection. A strain measuring means for measuring a strain generated in the portion, and a determining means for determining whether the connection state is good or bad based on the strain measured by the strain measuring means, wherein the surface height at a specific position on the substrate is Inspection of an electrical component connection state, comprising: a surface height measuring means for measuring the height of the substrate; and a calculating means for quantitatively calculating at least one of the warpage and the inclination of the substrate based on the measured surface height. apparatus. 6. A probe which is brought into contact with a connection portion between a lead of an electric component and an electrode of a substrate, load applying means for applying a predetermined load and vibration to the probe within a non-destructive range, and the probe makes the connection. A strain measuring means for measuring the strain generated in the portion, and an inspecting apparatus comprising a judging means for judging the quality of the connection state based on the strain measured by the strain measuring means, wherein an electrode in a specific electrode on the substrate Surface height measuring means for measuring the surface height of the surface, estimating means for estimating the surface height of the electrode surface of the other electrode based on the measured value, and an electric component connected to the electrode portion of the substrate. Surface height measuring means for measuring the surface height of the connection portion of the lead, by subtracting the surface height of the obtained substrate electrode and the thickness of the lead of the electrical component from the surface height of the connection portion of the lead,
An inspection device for an electrical component connection state, comprising: an arithmetic unit for quantitatively calculating the thickness of the solder at the connection portion. 7. A probe which is brought into contact with a connection portion between a lead of an electric component and an electrode of a substrate, load exciting means for applying a predetermined load and vibration to the probe within a non-destructive range, and the probe makes the connection. A strain measuring means for measuring a strain generated in the part, and a determining means for determining whether the connection state is good or bad based on the strain measured by the strain measuring means; Measuring means for measuring the surface height of the connecting portion by contacting a probe with the probe, and calculating means for quantitatively calculating the flatness of the surface of the connecting portion by a variation in data of the surface height of the connecting portion. An inspection device for an electrical component connection state, comprising: