JPH0710946U - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH0710946U JPH0710946U JP4162093U JP4162093U JPH0710946U JP H0710946 U JPH0710946 U JP H0710946U JP 4162093 U JP4162093 U JP 4162093U JP 4162093 U JP4162093 U JP 4162093U JP H0710946 U JPH0710946 U JP H0710946U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- adhesive
- protrusions
- case
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 電子部品の角部に接着剤を十分に供給して、
支持板に対するケース片の接着性を向上し、併せて電子
部品のえ内部への異物の侵入を抑制する。
【構成】本考案による電子部品は、支持板（6）とほぼ
並行に且つ互いに間隔をもって支持板（6）の角部付近
から突出する複数本の突起部（31）〜（38）と、接着剤
（5）と一体に突起部をケース片（3）（4）の各々に固
着する延伸接着剤（39）とを備えている。支持板（6）
を挾んで一対のケース片（3）（4）を接着するとき、複
数本の突起部（31）〜（38）はケース片（3）（4）の外
縁側まで接着剤（5）を外側に誘導して延伸接着剤（3
9）を形成し、一対のケース片（3）（4）間の間隙（2
6）を延伸接着剤（39）により充填して、外部からの異
物の侵入を抑制する。
(57) [Abstract] [Purpose] Adequately supplying adhesive to the corners of electronic parts,
The adhesion of the case piece to the support plate is improved, and at the same time, the entry of foreign matter into the inside of the electronic component is suppressed. [Structure] The electronic component according to the present invention is bonded to a plurality of protrusions (31) to (38) protruding from near the corners of the support plate (6) almost in parallel with the support plate (6) and at intervals. A stretching adhesive (39) for fixing the protrusions to the case pieces (3) (4) integrally with the agent (5) is provided. Support plate (6)
When the pair of case pieces (3) and (4) are bonded together by sandwiching, the plurality of protrusions (31) to (38) apply the adhesive (5) to the outer edges of the case pieces (3) and (4). Induce to stretch adhesive (3
9) forming a gap (2) between the pair of case pieces (3) (4).
6) is filled with a stretch adhesive (39) to prevent foreign matter from entering from the outside.
Description
【０００１】[0001]
本考案は支持板を挾んで一対のケース片を接着剤で接着して形成される電子部 品に関連する。 The present invention relates to an electronic component formed by sandwiching a support plate and adhering a pair of case pieces with an adhesive.
【０００２】[0002]
【従来の技術】 図６及び図７は、リードフレーム（2）の支持板（6）にセンサ チップ（半導体素子）（1）を固着し、接着剤（5）によって一対の樹脂製のケー ス片（3）（4）の間にリードフレーム（2）を固着した従来の圧力センサを示す 。ケース片（3）（4）はいずれもポリエステル系熱可塑性樹脂により形成される 。この圧力センサは、固着された一対のケース片（3）（4）の間から導出された 外部リード（7）〜（10）を備えている。１本の外部リード（7）は支持板（6） と一体に形成されるが、他の３本の外部リード（8）〜（10）は支持板（6）から 分離して設けられる。外部リード（7）〜（10）の支持板（6）に接近した端部に は孔部（7a）〜（10a）が設けられる。孔部（7a）〜（10a）内に接着剤（5）が 侵入して固化することにより、外部リード（7）〜（10）を所定の位置に堅固に 固定することができる。6 and 7 show a sensor chip (semiconductor element) (1) fixed to a support plate (6) of a lead frame (2) and a pair of resin cases bonded with an adhesive (5). A conventional pressure sensor in which the lead frame (2) is fixed between the pieces (3) and (4) is shown. Both case pieces (3) and (4) are made of polyester thermoplastic resin. This pressure sensor is provided with external leads (7) to (10) led out from between a pair of case pieces (3) (4) fixed to each other. One external lead (7) is formed integrally with the support plate (6), while the other three external leads (8) to (10) are provided separately from the support plate (6). Holes (7a) to (10a) are provided at the ends of the external leads (7) to (10) close to the support plate (6). The external leads (7) to (10) can be firmly fixed at predetermined positions by the adhesive (5) penetrating into the holes (7a) to (10a) and solidifying.
【０００３】 支持板（6）の上面に固定されたセンサチップ（1）を収容する空洞（13）がケ ース片（3）に形成される。センサチップ（1）上の各電極は対応するリード細線 （11）（１本のみを例示する）により外部リード（8）〜（10）にそれぞれ接続 される。ケース片（4）にも空洞（14）が形成され、空洞（13）は通気孔（12） を通じて外部に連絡され、空洞（14）は通気孔（15）を通じて外部に連絡される 。空洞（13）と（14）はセンサチップ（1）に設けられたダイヤフラム（図示せ ず）を介して分離される。このダイヤフラムは空洞（13）と（14）内の圧力レベ ルによって変形し、ダイヤフラムの変形はセンサチップ（1）の抵抗値の変化を 生ずる。A cavity (13) for housing the sensor chip (1) fixed to the upper surface of the support plate (6) is formed in the case piece (3). The electrodes on the sensor chip (1) are connected to the external leads (8) to (10) by corresponding lead wires (11) (only one is illustrated). A cavity (14) is also formed in the case piece (4), the cavity (13) is communicated with the outside through the ventilation hole (12), and the cavity (14) is communicated with the outside through the ventilation hole (15). The cavities (13) and (14) are separated by a diaphragm (not shown) provided in the sensor chip (1). This diaphragm is deformed by the pressure level in the cavities (13) and (14), and the deformation of the diaphragm causes a change in the resistance value of the sensor chip (1).
【０００４】 図６に示すように、リードフレーム（2）の側縁には４つの突起（16）〜（19 ）が設けられ、突起（16）〜（19）の各々は支持板（6）と同様にケース片（3） （4）間に接着される。As shown in FIG. 6, four protrusions (16) to (19) are provided on the side edge of the lead frame (2), and each of the protrusions (16) to (19) is a support plate (6). It is glued between the case pieces (3) and (4) in the same manner as in.
【０００５】[0005]
図６及び図７に示す従来の圧力センサでは、リードフレーム（2）の角部近傍 の周縁とケース片（3）（4）の周縁との間隔が大きい。このため、図７に示すよ うに角部（20）に形成される間隙（26）では接着剤（5）の量が不足し易かった 。接着剤（5）の量が十分でないと、リードフレーム（2）に対するケース片（3 ）（4）との接着力の低下を招来するし、また短絡事故、導通不良等の原因とな る水分等の異物が空洞（13）と（14）内に侵入し易く、異物が侵入すると、電子 部品の特性劣化を招来する欠点があった。 In the conventional pressure sensor shown in FIGS. 6 and 7, the distance between the peripheral edge of the lead frame (2) near the corner and the peripheral edge of the case pieces (3) (4) is large. Therefore, as shown in FIG. 7, the amount of the adhesive (5) was easily insufficient in the gap (26) formed in the corner (20). If the amount of the adhesive (5) is not sufficient, the adhesive strength between the lead frame (2) and the case pieces (3) (4) will be reduced, and moisture that may cause a short circuit accident, poor conduction, etc. However, there is a drawback that foreign matter, such as, easily enters the cavities (13) and (14), and that if foreign matter enters, the characteristics of the electronic component are deteriorated.
【０００６】 そこで、本考案は支持板の角部に接着剤を十分に供給してケース片の接着性を 向上し併せて内部への異物の侵入を抑制する電子部品を提供することを目的とす る。Therefore, an object of the present invention is to provide an electronic component in which an adhesive is sufficiently supplied to the corners of a support plate to improve the adhesiveness of a case piece and at the same time suppress the entry of foreign matter into the interior. Suru
【０００７】[0007]
本考案による電子部品は、半導体素子を固着した支持板と、支持板を挾んで接 着剤によって互いに固着された一対の樹脂製のケース片と、固着された一対のケ ース片の間から導出された外部リードとを備えている。この電子部品には、支持 板とほぼ並行に且つ互いに間隔をもって支持板の角部付近から突出する複数本の 突起部と、接着剤と一体に突起部をケース片の各々に固着する延伸接着剤とが設 けられる。図示の実施例では、外部リードの対応する角部付近から支持板とほぼ 並行に且つ互いに間隔をもって突出する複数本の突起部と、接着剤と一体に突起 部をケース片の各々に固着する延伸接着剤とを備えている。 The electronic component according to the present invention comprises a support plate to which a semiconductor element is fixed, a pair of resin case pieces sandwiching the support plate and fixed to each other by an adhesive, and a pair of fixed case pieces. The external lead is provided. This electronic component includes a plurality of protrusions that protrude from the corners of the support plate substantially in parallel with the support plate and at intervals from each other, and a stretch adhesive that fixes the protrusions to the case pieces integrally with the adhesive. And are set. In the illustrated embodiment, a plurality of protrusions that protrude from the vicinity of corresponding corners of the external leads substantially in parallel with the support plate and at intervals are provided, and an extension for fixing the protrusions integrally with the adhesive to each of the case pieces. And an adhesive.
【０００８】[0008]
支持板を挾んで一対のケース片を接着するとき、支持板に設けられた複数本の 突起部はケース片の外縁側まで接着剤を外側に誘導して延伸接着剤を形成する。 このため、ケース片の角部にも十分な量の接着剤を供給して、一対のケース片間 の間隙を延伸接着剤により充填して、支持板に対するケース片の接着性を向上し 併せて外部からの異物の侵入を抑制する。 When the support plate is sandwiched and the pair of case pieces are adhered to each other, the plurality of protrusions provided on the support plate guide the adhesive to the outer side of the case piece to form the stretched adhesive. For this reason, a sufficient amount of adhesive is also supplied to the corners of the case piece, and the gap between the pair of case pieces is filled with the stretched adhesive to improve the adhesion of the case piece to the support plate. Suppresses the entry of foreign matter from the outside.
【０００９】[0009]
以下、本考案による電子部品を圧力センサに適用した実施例を図１〜図５につ いて説明する。これらの図面では図６及び図７に示す箇所と同一の部分には同一 の符号を付し、説明を省略する。 An embodiment in which the electronic component according to the present invention is applied to a pressure sensor will be described below with reference to FIGS. In these drawings, the same parts as those shown in FIGS. 6 and 7 are designated by the same reference numerals, and the description thereof will be omitted.
【００１０】 図１に示すように、ケース片（4）の内面には凹部（21）（22）が形成され、 凹部（21）の一部に通気孔（12）が形成される。通気孔（15）は通気孔（12）か ら離間した位置に形成される。リードフレーム（2）は支持板（6）間を連結する 細条として形成される突起（16）〜（19）及び連結細条（22）を所定の位置で切 断する前の状態で示す。ケース片（4）に対向して図２に示すケース片（3）が配 置される。ケース片（3）には浅い凹部（23）と、傾斜部（25）と、浅い凹部（2 3）と傾斜部（25）との間に形成された深い凹部（24）とを備えている。As shown in FIG. 1, recesses (21) and (22) are formed on the inner surface of the case piece (4), and ventilation holes (12) are formed in part of the recesses (21). The ventilation hole (15) is formed at a position separated from the ventilation hole (12). The lead frame (2) is shown in a state before cutting the projections (16) to (19) and the connecting strips (22) formed as strips connecting the support plates (6) at a predetermined position. The case piece (3) shown in FIG. 2 is arranged so as to face the case piece (4). The case piece (3) is provided with a shallow recess (23), a sloped portion (25), and a deep recess (24) formed between the shallow recessed portion (23) and the sloped portion (25). .
【００１１】 図１及び図５に示すように、外部リード（7）〜（10）とは反対側の支持板（6 ）の２つの角部（20）付近から突出する５本の突起部（31）〜（35）が支持板（ 6）とほぼ並行に且つ互いに間隔をもって設けられる。また、外部リード（7）側 の支持板（6）の角部（20）付近から突出する３本の突起部（36）〜（38）が支 持板（6）とほぼ並行に且つ互いに間隔をもって設けられる。更に、外部リード （10）の対応する角部（20）付近から突出する３本の突起部（36）〜（38）が支 持板（6）とほぼ並行に且つ互いに間隔をもって設けられる。外部リード（10） の３本の突起部（36）〜（38）は前記突起部（31）〜（38）と均等の作用効果を 生ずる。即ち、支持板（6）を挾んで一対のケース片（3）（4）を接着するとき 、支持板（6）に設けられた１６本の突起部（31）〜（38）はケース片（3）（4 ）の外縁側まで接着剤（5）を外側に誘導して延伸接着剤［接着剤（5）の延伸部 分］（39）を形成する。延伸接着剤（39）は接着剤（5）と一体に突起部（31） 〜（38）をケース片（3）（4）の各々に固着するから、ケース片（3）（4）の角 部にも十分な量の接着剤（5）を供給して、ケース片（3）（4）間の間隙（26） を延伸接着剤（39）により充填して、支持板（6）に対するケース片（3）（4） の接着性が向上し、外部からの異物の侵入を抑制する。As shown in FIGS. 1 and 5, five protrusions (protruding from the vicinity of two corners (20) of the support plate (6) on the side opposite to the external leads (7) to (10) ( 31) to (35) are provided substantially in parallel with the support plate (6) and spaced from each other. Also, the three protrusions (36) to (38) protruding from the corners (20) of the support plate (6) on the side of the external lead (7) are substantially parallel to the support plate (6) and are spaced apart from each other. It is provided with. Further, three protrusions (36) to (38) protruding from the vicinity of the corresponding corners (20) of the outer lead (10) are provided substantially in parallel with the support plate (6) and at intervals. The three protrusions (36) to (38) of the outer lead (10) have the same effect as the protrusions (31) to (38). That is, when the pair of case pieces (3) and (4) are bonded by sandwiching the support plate (6), the 16 protrusions (31) to (38) provided on the support plate (6) are 3) Guide the adhesive (5) outward to the outer edge side of (4) to form a stretched adhesive [stretched portion of the adhesive (5)] (39). The stretch adhesive (39) fixes the protrusions (31) to (38) to the case pieces (3) and (4) integrally with the adhesive (5), so that the corners of the case pieces (3) and (4) are fixed. A sufficient amount of adhesive (5) is also supplied to the parts, the gap (26) between the case pieces (3) and (4) is filled with the stretch adhesive (39), and the case for the support plate (6) is filled. The adhesiveness of the pieces (3) and (4) is improved, and the entry of foreign matter from the outside is suppressed.
【００１２】 本考案の実施態様は前記の実施例に限定されず、変更が可能である。例えば、 支持板（6）の角部（20）付近から突出する突起部は２本以上であれば、数に制 限されない。また、支持板（6）の４ヵ所の角部のうち、選択された角部にのみ 突起部を設けることができる。The embodiment of the present invention is not limited to the above-mentioned embodiments, and can be modified. For example, the number of protrusions protruding from the vicinity of the corners (20) of the support plate (6) is not limited as long as it is two or more. Further, among the four corners of the support plate (6), the projections can be provided only on the selected corners.
【００１３】 また、突起部はケース片の周縁まで延伸させてもよい。しかしながら、電気的 短絡事故を防止するためには突起部の先端はケース片の周縁よりも内側に位置さ せることが望ましい。Further, the protrusion may extend to the peripheral edge of the case piece. However, in order to prevent electrical short circuit accidents, it is desirable that the tip of the protrusion is located inside the peripheral edge of the case piece.
【００１４】[0014]
本考案によれば、ケース片の角部に十分な量の接着剤を供給して、支持板に対 するケース片の接着性が向上し、短絡事故、導通不良等の原因となる外部からの 異物の侵入を防止できるので、電子部品の信頼性を向上することができる。 According to the present invention, a sufficient amount of adhesive is supplied to the corners of the case piece to improve the adhesiveness of the case piece to the support plate, which may cause short circuit accidents, poor continuity, etc. Since it is possible to prevent foreign matter from entering, it is possible to improve the reliability of the electronic component.
【図１】 圧力センサに適用した本考案による電子部品
の実施例に使用する一方のケース片の平面図FIG. 1 is a plan view of one case piece used in an embodiment of an electronic component according to the present invention applied to a pressure sensor.
【図２】 他方のケース片の平面図FIG. 2 is a plan view of the other case piece.
【図３】 図５のＩＩ−ＩＩ線に沿う断面図3 is a sectional view taken along line II-II of FIG.
【図４】 図５のＩＩＩ−ＩＩＩ線に沿う断面図FIG. 4 is a sectional view taken along line III-III in FIG.
【図５】 圧力センサの製造に使用するリードフレーム
の平面図FIG. 5 is a plan view of a lead frame used for manufacturing a pressure sensor.
【図６】 従来の圧力センサの製造に使用するリードフ
レームの平面図FIG. 6 is a plan view of a lead frame used for manufacturing a conventional pressure sensor.
【図７】 図６のＩ−Ｉ線に沿う断面図FIG. 7 is a sectional view taken along line I-I of FIG.
（1）．．センサチップ（半導体素子）、（3）
（4）．．ケース片、（5）．．接着剤に、（6）．．支
持板、（7）〜（10）．．外部リード、（20）．．角
部、（26）．．間隙、（31）〜（38）．．突起部、（3
9）．．延伸接着剤、(1). ． Sensor chip (semiconductor element), (3)
(Four). ． Case piece, (5). ． For adhesive, (6). ． Support plate, (7) to (10). ． External lead, (20). ． Corner, (26). ． Gap, (31)-(38). ． Protrusion, (3
9). ． Stretch adhesive,
Claims (2)
板を挾んで接着剤によって互いに固着された一対の樹脂
製のケース片と、固着された一対の前記ケース片の間か
ら導出された外部リードとを備えた電子部品において、 前記支持板とほぼ並行に且つ互いに間隔をもって前記支
持板の角部付近から突出する複数本の突起部と、前記接
着剤と一体に前記突起部を前記ケース片の各々に固着す
る延伸接着剤とを備えたことを特徴とする電子部品。1. A support plate to which a semiconductor element is fixed, a pair of resin case pieces sandwiching the support plate and fixed to each other by an adhesive, and a pair of case pieces fixed to each other. In an electronic component including an external lead, a plurality of protrusions protruding from near a corner of the support plate substantially in parallel with the support plate and spaced apart from each other, and the protrusion integrally formed with the adhesive to the case. An electronic component, comprising: a stretch adhesive fixed to each of the pieces.
前記支持板とほぼ並行に且つ互いに間隔をもって突出す
る複数本の突起部と、前記接着剤と一体に前記突起部を
前記ケース片の各々に固着する延伸接着剤とを備えた
「請求項１」に記載の電子部品。2. A plurality of protrusions that protrude from the vicinity of corresponding corners of the external leads substantially in parallel with the support plate and at intervals with each other, and the protrusions integrally with the adhesive in each of the case pieces. The electronic component according to claim 1, further comprising a stretch adhesive that is fixed to the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4162093U JP2575854Y2 (en) | 1993-07-29 | 1993-07-29 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4162093U JP2575854Y2 (en) | 1993-07-29 | 1993-07-29 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0710946U true JPH0710946U (en) | 1995-02-14 |
| JP2575854Y2 JP2575854Y2 (en) | 1998-07-02 |
Family
ID=12613387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4162093U Expired - Fee Related JP2575854Y2 (en) | 1993-07-29 | 1993-07-29 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2575854Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032506A (en) * | 2006-07-28 | 2008-02-14 | Denso Corp | Sensor device and its manufacturing method |
-
1993
- 1993-07-29 JP JP4162093U patent/JP2575854Y2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032506A (en) * | 2006-07-28 | 2008-02-14 | Denso Corp | Sensor device and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2575854Y2 (en) | 1998-07-02 |
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