JPH02307250A - Hybrid integrated circuit package - Google Patents
Hybrid integrated circuit packageInfo
- Publication number
- JPH02307250A JPH02307250A JP12930789A JP12930789A JPH02307250A JP H02307250 A JPH02307250 A JP H02307250A JP 12930789 A JP12930789 A JP 12930789A JP 12930789 A JP12930789 A JP 12930789A JP H02307250 A JPH02307250 A JP H02307250A
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- frame
- top cover
- bottom cover
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 abstract description 9
- 239000004840 adhesive resin Substances 0.000 abstract description 8
- 229920006223 adhesive resin Polymers 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、自動車電装品用ハイブリッドＩＣなどの箱
型パンケージの改良構造に閑Ｔるものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention is directed to an improved structure of a box-shaped pancage such as a hybrid IC for automobile electrical components.
従来、自動車電装品用ハイブリッドＩＣ等のパッケージ
において、耐ヒートシヨツク性及び耐湿性の向上等の目
的から、第４図〜第６図に示す如く箱型構造とし、その
中にゲル状樹脂を注入し・蓋を樹脂接着する方法がとら
れている。Conventionally, in order to improve heat shock resistance and moisture resistance in packages such as hybrid ICs for automobile electrical components, a box-shaped structure was used as shown in Figs. 4 to 6, and gel-like resin was injected into the box-shaped structure. A method of bonding the lid with resin is used.
即ち、第５図〜第７図において、ｌはフレーム、２は上
蓋、３はリードフレーム、４はアルミ放熱板（底蓋）、
５はハイプリントＩＯ基板、６はゲル状樹脂、７は接着
樹脂である。That is, in FIGS. 5 to 7, l is a frame, 2 is a top lid, 3 is a lead frame, 4 is an aluminum heat sink (bottom lid),
5 is a high print IO board, 6 is a gel-like resin, and 7 is an adhesive resin.
ところが以・上のような箱型構造とするためには、底蓋
に相当するアルミ放熱板４またはへイブリット１０−ｉ
板５をフレームｌの内周に接着し、その中にゲル状樹脂
６を注入しても漏れない構造でなければならない。その
ためにはアルミ放熱板又はフレームに十分でかつ均一な
樹脂７が塗布され、又、樹脂の加熱硬化中に変形のない
ようフレームとアルミ放熱板を圧接しなければならない
が、その条件？満たすための作業方法は、生産性を疎外
する要因となっている。即ち、フレームと放熱板を圧着
する治具が大量に必要なこと、又、作業が煩雑で、自動
化が困難なこと等であり・又、上蓋の樹脂接着において
も同様である。However, in order to have a box-like structure as described above, it is necessary to use the aluminum heat sink 4 or hybrid 10-i, which corresponds to the bottom cover.
It must have a structure that will not leak even if the plate 5 is adhered to the inner periphery of the frame l and the gel-like resin 6 is injected therein. To do this, it is necessary to apply enough and uniform resin 7 to the aluminum heat sink or frame, and to press the frame and aluminum heat sink so that there is no deformation during heat curing of the resin, but what are the conditions? The work method used to satisfy these demands is a factor that reduces productivity. That is, a large amount of jigs are required for crimping the frame and the heat sink, and the work is complicated and difficult to automate.The same applies to the resin bonding of the top cover.
この発明は以上のような問題点を解決するためになされ
たもので、従来の治具を不安とし、又、作業方法を簡易
化し、自動化を容易ならしめることを目的とじたもので
あるｎ
〔課題を解決する２めの手段〕
この発明に係るパッケージは、外周フレームの上下部に
各々上蓋と底蓋を嵌合して互いに樹脂接着するものにお
いて、上記両蓋に突片分設け、この突片号フレーム内周
に設けた対向四部に弾性的押圧により「パチン」嵌合さ
れるように構成したものである。[ [Second Means for Solving the Problems] In the package according to the present invention, a top cover and a bottom cover are fitted to the upper and lower parts of the outer circumferential frame and bonded to each other with resin, and both the covers are provided with protrusions, and the protrusions are It is constructed so that it can be "snapped" into four opposing parts provided on the inner periphery of the frame by elastic pressure.
この発明においては、蓋がフレームに簡単に「パチン」
嵌合されることにより、嵌め込み後のガタをなくし、蓋
の樹脂接着封止作業が非常に簡易化される。In this invention, the lid simply "snaps" onto the frame.
By fitting, the looseness after fitting is eliminated, and the resin adhesive sealing work of the lid is greatly simplified.
〔実施例〕
以下この発明の一実施例を第１図〜第４図について説明
する。図において、１〜７は上記従来例のものと同一部
品を示しており、上蓋２とアルミ放熱板（底蓋）４の外
周対向辺に夫々ｑ数の突片２ａと４ａを突設し、これら
と対向下るフレーム１の内、ＩＭ上下部に入口の幅ご比
較的小にし、上記突片２ａ及び４ａが弾性的たわみによ
り、いわゆる「パチン」嵌合される係止口１ｆｌＳ１ａ
、■ｂを設けたものである。[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. In the figure, numerals 1 to 7 indicate the same parts as those of the conventional example, in which q number of protrusions 2a and 4a are provided protrudingly on opposite sides of the outer periphery of the top cover 2 and the aluminum heat sink (bottom cover) 4, respectively. In the lower frame 1 facing these, the width of the entrance is made relatively small at the top and bottom of the IM, and the above-mentioned protrusions 2a and 4a are elastically deflected into a locking opening 1flS1a that is fitted in a so-called "snap" manner.
, ■b are provided.
なお、その他の構成は上記従来例に示し社ものと同様に
つき説明を省略する。Note that the other configurations are the same as those shown in the above-mentioned conventional example and will not be described further.
次に組立方法について説明する。まず、フレーム１側の
下部四部ｌｂに第４図の如く接着樹脂７を塗布し、アル
ミ放熱板４を嵌め込み接着させる。Next, the assembly method will be explained. First, adhesive resin 7 is applied to the lower four parts lb on the frame 1 side as shown in FIG. 4, and the aluminum heat sink 4 is fitted and bonded.
次にゲル状樹脂６２注入して硬化させる。そして外部リ
ードフレーム３との接続が終った後、フレーム１の上部
ＩＩｌ！Ｊ部１ａに接着樹脂７を塗布し、上蓋２を嵌め
込み接着する。Next, gel-like resin 62 is injected and hardened. After the connection with the external lead frame 3 is completed, the upper part IIl of the frame 1! Adhesive resin 7 is applied to J portion 1a, and upper cover 2 is fitted and bonded.
なお応用例として、低消費電力用としてアルミ放熱板が
不要ならば、ハイブリツドＩＣ基板を底蓋としてＭＦｉ
フレームに・ンリコンゴム糸凄看斉りご介して接着して
もよい。又、嵌め込みにより機械的補強がされるため、
接着剤を常温硬化型伏貿樹脂に変更でき、従来加熱硬化
時に必要な盆の空気抜き穴の樹脂封止作業が不要となる
。As an application example, if an aluminum heat sink is not required for low power consumption, a hybrid IC board can be used as a bottom cover for MFi.
It may also be glued to the frame using rubber thread. In addition, mechanical reinforcement is provided by fitting, so
The adhesive can be changed to a room-temperature curing resin, eliminating the need to seal the air vent holes in the tray with resin, which is conventionally required when heating and curing.
従来フレームと上蓋及び底蓋の接着は、ゲル状樹脂が漏
れないよう接Ｒ樹脂塗布の均一性、接着面へのなじみ性
、接着樹脂加熱硬化時の変形防止等のために、バネ等に
より各々Ｆｉ１口圧しなければならなかったが、この発
明によれば、嵌め込み部の形状を工夫することにより、
嵌め込み後のガタを無くし、従来のバネによる圧接と同
等以上の効果を、簡単な作業により得られ、またこのよ
うに作業が簡易化すれば、自動化、省力化が容易となり
、生産効率向上への波及効果が得られる。Conventionally, the frame, top cover, and bottom cover are bonded using springs, etc. to ensure uniformity of the contact resin application so that the gel-like resin does not leak, conformability to the adhesive surface, and prevention of deformation when the adhesive resin is heated and cured. However, according to this invention, by devising the shape of the fitting part,
It eliminates looseness after fitting and achieves an effect equal to or better than that of conventional pressure welding using springs, with a simple operation. Also, if the operation is simplified in this way, automation and labor saving will be easier, which will improve production efficiency. A ripple effect can be obtained.
第１図〜第４図はこの発明の一実施例を示すもので、第
１図は上面図、第２図は第１図の［−ＩＩ線の断面曲、
第３図は下面図、第４図は第２図の■部の拡大図である
。第５図〜第７図は従来のパック−ジを示すもので、第
５図は上面図、第６図は第５図の■−■線の断面図、第
７図は下面図である。
図中、■はフレーム、１ａＡ１ｂＧ！凹部、２は上蓋、
２ａは突片、３は外部リードフレーム、４はアルミ放熱
板、４ａは突片、５はハイブリツドＩＣ基板、６はゲル
状樹脂、７は接着樹脂である。
なお図中同一符号は同一または相当部分を示す。
代理人 大 岩 増 雄
７ 捧１（情1 to 4 show an embodiment of the present invention, in which FIG. 1 is a top view, and FIG. 2 is a cross-sectional curve of
FIG. 3 is a bottom view, and FIG. 4 is an enlarged view of the section ■ in FIG. 2. 5 to 7 show a conventional package, in which FIG. 5 is a top view, FIG. 6 is a sectional view taken along the line ■--■ in FIG. 5, and FIG. 7 is a bottom view. In the figure, ■ is a frame, 1aA1bG! Recessed part, 2 is the upper lid,
2a is a protruding piece, 3 is an external lead frame, 4 is an aluminum heat sink, 4a is a protruding piece, 5 is a hybrid IC board, 6 is a gel-like resin, and 7 is an adhesive resin. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa 7 Takashi 1 (Information
Claims (1)
脂接着シールする箱型構造の混成集積回路パッケージに
おいて、上記上蓋及び底蓋の外周対向辺に各々突片を形
成し、これらの突片と対向する部位のフレーム内周に、
上記突片が外方からの押圧による弾性的たわみにより嵌
合される係止凹部を設けてなる混成集積回路パッケージ
。In a box-shaped hybrid integrated circuit package in which a top cover and a bottom cover are fitted into the upper and lower parts of the inner periphery of the frame and sealed with resin adhesive, protrusions are formed on opposite sides of the outer periphery of the top cover and the bottom cover, and these protrusions On the inner periphery of the frame in the area facing the
A hybrid integrated circuit package comprising a locking recess into which the projecting piece is fitted by elastic deflection due to external pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12930789A JPH02307250A (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12930789A JPH02307250A (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02307250A true JPH02307250A (en) | 1990-12-20 |
Family
ID=15006329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12930789A Pending JPH02307250A (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02307250A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999013516A1 (en) * | 1997-09-09 | 1999-03-18 | Amkor Technology, Inc. | Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device |
| US6448635B1 (en) | 1999-08-30 | 2002-09-10 | Amkor Technology, Inc. | Surface acoustical wave flip chip |
| CN102254878A (en) * | 2010-05-19 | 2011-11-23 | 三菱电机株式会社 | Semiconductor device |
| JP2014123659A (en) * | 2012-12-21 | 2014-07-03 | Shindengen Electric Mfg Co Ltd | Electronic apparatus and manufacturing method of the same |
-
1989
- 1989-05-23 JP JP12930789A patent/JPH02307250A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999013516A1 (en) * | 1997-09-09 | 1999-03-18 | Amkor Technology, Inc. | Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device |
| US5949655A (en) * | 1997-09-09 | 1999-09-07 | Amkor Technology, Inc. | Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device |
| US6448635B1 (en) | 1999-08-30 | 2002-09-10 | Amkor Technology, Inc. | Surface acoustical wave flip chip |
| CN102254878A (en) * | 2010-05-19 | 2011-11-23 | 三菱电机株式会社 | Semiconductor device |
| JP2011243798A (en) * | 2010-05-19 | 2011-12-01 | Mitsubishi Electric Corp | Semiconductor device |
| JP2014123659A (en) * | 2012-12-21 | 2014-07-03 | Shindengen Electric Mfg Co Ltd | Electronic apparatus and manufacturing method of the same |
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