JPH01206528A - Sealing of relay - Google Patents

Abstract

PURPOSE:To eliminate the thermal effect on relay constituting components and realize the automation of the manufacture by protruding the junction portion between the base and case of a sealed type relay over the whole periphery respectively. CONSTITUTION:The junction portion between a base 1 and a case 2 is protruded over the whole periphery respectively to form a protruded section 5. The protruded section 5 is separated from the position of constituting components such as terminals 3 installed on the base 1 by the required length. The protruded section 5 is heated and sealed to form a sealed type relay. Automation is allowed for this method, no thermal effect is applied to relay constituting components, the stuck section is not required to be glued, and a relay can be simply manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a sealing method for a sealed relay.

[Conventional Technique JFT1 Most conventional sealed relays were sealed using adhesives. This method requires heating time to harden the adhesive, and there is a problem in that it is difficult to incorporate this heating step into an automated manufacturing process. In addition, heating the adhesive also heats the components of the relay, causing problems such as fluctuations in the relay characteristics.

[Problem to be Solved by the Invention 1] The present invention has been made in view of the above-mentioned points, and its purpose is to provide a method that can be incorporated into an automated manufacturing process and that provides thermal stimulation to the component parts of a relay. An object of the present invention is to provide a relay sealing force method that gives less t9.

[Means for Solving the Problem 1] In order to achieve the above purpose, in a relay where the case is attached to the base covering the components arranged on the upper surface of the base, the case is attached to the base. The mating surfaces of the base and the case are made to protrude over the entire circumference, and the protrusions are heated to thermally bond the base and the case.

(Function) As described above, in the present invention, when the case is attached to the base, the mating surface portions of the base and the case protrude over the entire circumference, and the protruding portions are heated to bond the base and the case together. Thermal bonding eliminates the time-consuming process of heating and hardening the adhesive, which is the case when sealing with adhesives, and allows the sealing process to be incorporated into automated manufacturing processes. Heat bonding prevents heat from being applied to the relay as a whole, unlike when sealing with adhesive, and prevents heat from being applied to the relay components, causing fluctuations in relay characteristics. It was designed to reduce the number of things.

(Example) FIG. 1 shows an example of the present invention. This embodiment has a base 1 in which components such as a fill, a yoke, an armature, etc. are arranged on the upper surface side and a plurality of terminals 3 are protruded from the lower surface, and a structure in which components such as a fill, a yoke, and an armature are arranged on the upper surface of the base 1. The present invention is applied to a relay consisting of a box-shaped case 2 with an opening at the bottom, which is assembled from parts and attached to a base 1. Note that the base 1 and case 2 are made of thermoplastic resin.

On the outer peripheral edge of the lower surface of the base 1, a protrusion 4 is formed around the entire circumference, and protrudes slightly downward from the lower surface, which serves as a mounting surface of the base 1 to a printed circuit board or the like. Further, the opening edge of the case 2 has a length that extends slightly from the bottom surface of the base 1 when the case 2 is attached to the base 1, forming the length of the wall 911. In other words, when the case 2 is attached to the base 1, the outer peripheral edge of the base 1 and the opening edge of the case 2 are slightly protruded from the lower surface of the base 1, and the mating surfaces of the base 1 and the case 2 are The protrusion 5 is formed over the entire circumference. In this state, the protrusion 5 is melted and fixed, that is, thermally bonded, using a heating plate (not shown) or the like that heats the protrusion 5 in substantially the same shape as the mating surfaces of the base 1 and the case 2. As a result, the storage space surrounded by the case 2 on the base 1 and containing the components can be sealed. If the protrusion 5 protruding from the lower surface of the base 1, which is formed around the entire circumference of the mating surfaces of the base 1 and the case 2, is thermally bonded in this way, it will not be heated as in the case of sealing with adhesive. It is possible to eliminate the time-consuming process of hardening the adhesive by applying the sealing process, and the sealing process can be incorporated into the automated manufacturing process. This simplifies the work and also
Mass production is improved, making it possible to reduce manpower and costs. Moreover, when the protrusion 5 is thermally bonded, there is no need to heat the entire relay as is the case when sealing with adhesive, so the amount of heat applied to the relay components can be reduced, which improves the relay's performance characteristics. It is also possible to reduce the amount of fluctuation.

[Effects of the Invention] As described above, the present invention allows the mating surfaces of the base and the case to protrude over the entire circumference when the case is attached to the base, and heats these protruding parts to separate the base and the case. Because it is heat-bonded, there is no need for the time-consuming process of heating and hardening the adhesive, which is the case when sealing with adhesive.This allows the sealing process to be incorporated into the automated manufacturing process. It has the advantage of simplifying work, improving mass production, and reducing manpower and costs.Also, since the protrusions formed on the mating surfaces of the base and case are heat-bonded, There is no need to heat the entire relay as in the case of sealing with adhesive, so there is an advantage that the heat spreads to the components of the relay and therefore there is less variation in the relay characteristics.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing the structure of the main part to be thermally bonded according to an embodiment of the present invention. 1 is a base, 2 is a case, and 5 is a protrusion. Agent Patent Attorney Ishi 1) Ai 7th Figure 1 1...Base 2...Case 5...Protrusion

Claims (1)

[Claims] (1) For relays in which the case is attached to the base while covering the components arranged on the upper surface of the base, the mating surfaces of the base and case with the case attached to the base can be A relay sealing method characterized in that the base and the case are thermally bonded by making each protrude and heating the protrusions.