JPH05114503A - Electronic parts sealing method and electronic parts - Google Patents

Abstract

PURPOSE:To improve airtightness, simplify sealing work, and enhance massproductivity, by fusion-bonding mutually abutting surfaces of a package member, bonding them with adhesive agent, and forming a fusion-bonded closed part by fusion bonding and an adhesion closed part with adhesive agent, on a bond surface. CONSTITUTION:A recessed part for accommodating an electronic element 2 is formed in the central part of two resin package members 1a, 1b which form a resin package 1. Each of the bond surfaces 6 of the package members 1a, 1b is coated with adhesive agent 5, and the electronic element 2 is accommodated and arranged in the recessed part of the package 1a. The package members 1a, 1b are brought into contact with each other and pressed with pressure. In this state, a current is applied to a frame 4 for element connection, in which heat is generated. Thereby the bond surfaces 6 of the two package members 1a, 1b are fused and bonded. It is made unnecessary for package members to be pressed and fixed while the adhesive agent 5 cures.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for hermetically sealing an electronic component element in a resin package and a package type electronic component.

[0002]

2. Description of the Related Art As shown in FIG. 2, for example, in a resin package 1 formed by bonding two resin package members 1a and 1b which are divided and formed, In an electronic component in which the electronic component element 2 (FIGS. 3 and 4) is housed and only the terminal frame 3 is exposed, as a conventional resin package sealing method, a method by heat welding or an adhesive is generally used. The method of adhesion is used.

As shown in FIG. 3, a sealing method by heat welding is performed by using a metal heating element (heat welding) between two package members to be joined (FIG. 3 shows only one package member 1b). Is a metal element connecting frame which also serves as a heating element, and the exposed portion of which is the terminal frame 3) 4 is inserted to energize the joint surface 6 of the resin package members 1a, 1b. This is a method of welding the two package members 1a and 1b by heat melting.

This method has an advantage that welding, that is, sealing can be performed in a short time, but the molten state of the resin (package member) is likely to vary, and the hermeticity of the resin package after welding is low. There is a problem.

In addition, as shown in FIG. 4, the sealing method using the adhesive is performed by joining surfaces of the package members 1a and 1b (see FIG. 4).
Is a method of applying adhesive 5 to one package member 1b) 6 to bond the package members 1a and 1b to each other, and adhering and sealing with the adhesive 5.
When the airtightness of the resin package is emphasized, an epoxy resin-based adhesive or a silicone resin-based adhesive is generally used as the adhesive.

However, this method requires a long time (usually several hours) until the adhesive is cured, and during that time, the two package members 1a and 1b are pressed and fixed by using a jig or a tool. Therefore, there is a problem that workability is poor and it is not suitable for mass production.

The present invention solves the above problems and improves the airtightness of a resin package.
An object of the present invention is to provide an electronic component sealing method and an electronic component capable of simplifying the sealing work and mass-producing the electronic component.

[0008]

In order to achieve the above-mentioned object, a method of sealing an electronic component according to the present invention is a method of sealing an electronic component element in a resin package. After housing the electronic component elements in the member, the joint surfaces of the package members that are in contact with each other are welded by heat welding and adhered by an adhesive, and the welded sealed portion by heat welding and the adhesive seal by the adhesive By forming the portion and the portion, the electronic component element is hermetically sealed in the resin package.

Further, the electronic component of the present invention is an electronic component in which an electronic component element is hermetically sealed in a resin package formed by joining separately formed resin package members, and the resin package is welded by heat welding. It is characterized by having a double sealing structure of a hermetically sealed portion and an adhesively hermetically sealed portion by an adhesive.

[0010]

In the method of sealing an electronic component of the present invention, not only welding by heat but also bonding by an adhesive is performed. First, the package members divided and formed by heat welding are fixed and integrally joined, and further, the airtightness is imparted by the adhesion with the adhesive. Also, since the heat welding causes the welding in a short time, it is not necessary to press and fix the package member until the adhesive is hardened, which enables simplification of the production process and mass production. Become.

The electronic component of the present invention has a double seal structure in which the resin package is sealed by two parts, that is, a hermetically sealed part by heat welding and an adhesively sealed part by an adhesive. The seal structure provides the resin package with sufficient airtightness and bonding strength to improve reliability.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a method of sealing an electronic component (FIG. 2) according to an embodiment of the present invention. In this embodiment, the two resin package members 1a and 1b (FIG. 2) forming the resin package 1 are provided with a recess for accommodating the electronic component element 2 in the center thereof, and the peripheral surface 6 However, the two package members 1a and 1b (see FIG.
Is a joint surface 6 for joining one package member 1b).

When the two package members 1a and 1b are joined and sealed, first, the adhesive 5 is applied to each joint surface 6 of the package members 1a and 1b, and the electronic component element 2 is housed in the recess of the package member 1a. Deploy. Then, the element connecting frame (metal heating element) 4 made of metal, which also serves as a heating element for heat welding, is assembled at a predetermined position on the joint surface 6. The exposed portion of the element connecting frame 4 from the resin package 1 becomes the terminal frame 3 (FIG. 2).

Then, in a state where the package members 1a and 1b are joined to each other and the two package members 1a and 1b are pressed against each other, an element connecting frame (metal heating element)
4 is energized to generate heat and the two package members 1
The joint surfaces 6 of a and 1b are melted and welded. After that, by stopping energization to the element connecting frame 4, leaving the heat-welded electronic component in that state, or by heating it under a predetermined temperature condition to cure the adhesive 5,
The electronic component element 2 is reliably hermetically sealed in the resin package 1.

According to the sealing method of the above-described embodiment, the welding by heat and the bonding by the adhesive are simultaneously performed, the package members 1a and 1b are fixed by the thermal welding, and the adhesive 5 is sufficiently hardened. Airtight sealing is performed. Moreover, since the package members 1a and 1b are welded in a short time by heat welding, it is not necessary to press and fix the package members 1a and 1b until the adhesive 5 is cured, and the production process is greatly simplified. Be converted.

Further, in the electronic component manufactured by using the sealing method of the above-mentioned embodiment, the resin package 1 is sealed at two portions, that is, the welded hermetically sealed portion by heat welding and the adhesively hermetically sealed portion by the adhesive (ie, 2). It is heavy-sealed) and has sufficient airtightness and bonding strength.

In the above embodiment, the adhesive 5 is applied to both the joint surfaces 6 of the two package members 1a and 1b. However, the adhesive 5 is applied to one of the package members 1a and 1b. You may make it apply only to the joining surface 6. Further, it is possible to further improve the mass productivity by applying the adhesive 5 by printing.

In the above embodiment, the case where the electronic component element 2 is housed and the element connecting frame (metal heating element) 4 is incorporated after the adhesive 5 is applied has been described. Coating, housing of electronic component element 2, element connecting frame (metal heating element) 4
There is no particular restriction on the order of incorporation of, and the order can be changed as necessary.

[0019]

As described above, according to the method for sealing an electronic component of the present invention, the sealing surfaces of the divided package members, which are in contact with each other, are welded and sealed by heat welding and adhesively sealed by an adhesive. So that both sealing parts of
Since the welding by heat welding and the adhesion by the adhesive are used together, the heat welding and the adhesion are combined to provide an excellent airtight performance. Also, since the package members are welded in a short time by heat welding, until the adhesive is cured,
There is no need to press and fix the package member, the production process is simplified, and mass production is possible.

Further, in the electronic component of the present invention, the resin package has a double seal structure comprising a heat-welded sealing portion and an adhesive sealing portion.
The heavy seal structure provides sufficient airtightness and joint strength,
The reliability of electronic components can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a method of sealing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component according to the present invention and a conventional example.

FIG. 3 is a diagram showing a conventional method for sealing an electronic component.

FIG. 4 is a diagram showing another conventional method for sealing electronic components.

[Explanation of symbols]

1 Resin Package 1a, 1b Package Member 2 Electronic Component Element 4 Element Connecting Frame (Metal Heating Element) 5 Adhesive

Claims (2)

[Claims] 1. A method of sealing an electronic component element in a resin package, wherein the electronic component element is housed in a resin-made package member that is divided and formed, and then the joint surfaces of the package members that contact each other are heated. Characterized by hermetically sealing an electronic component element in a resin package by forming a welded sealing portion by heat welding and an adhesive sealing portion by an adhesive on the joint surface by welding together with welding And a method for sealing electronic components. 2. An electronic component in which an electronic component element is hermetically sealed in a resin package formed by joining separately formed resin package members, wherein the resin package is
An electronic component having a double-sealing structure of a welded closed portion by heat welding and an adhesive closed portion by an adhesive.