JPH0380561A - Semiconductor device provided with battery unit - Google Patents

Abstract

PURPOSE:To simplify the positioning of a battery unit and a semiconductor device, eliminate potting work, and facilitate the exchange of a device, by inserting battery unit positioning cover blocks into recessed parts formed on both ends of a semiconductor device. CONSTITUTION:Battery unit positioning cover blocks 17, 18 formed so as to have a plane dimension corresponding to the recessed parts 4, 5 of a semiconductor device 1 are simultaneously made in a unified body by using resin constituting a battery unit 10, and arranged on both ends of a battery unit 10. By inserting said blocks 17, 18 into the recessed parts 4, 5 of a semiconductor device 1, the positioning of the semiconductor device 1 and the battery unit 10 can be achieved in the plane direction. In this case, the length direction positioning is done by the inside surfaces 21, 22 of the battery unit positioning cover blocks 17, 18, and the width direction positioning is done by the outside surfaces 23, 24. The battery unit positioning cover blocks 17, 18 have U-shapes wherein said blocks face each other. Unarmed joining work between connection lead terminals 7, 8 of the semiconductor element 1 and battery lead plates 11, 12 of the battery unit 10 is enabled while protecting short generated at the time of contact.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to the structure of a battery unit of a semiconductor device with a battery unit.

[Prior Art] As shown in the front cross-sectional view of FIG. 4, a conventional semiconductor device with a battery unit has battery lead plates 51 and 52 whose ends are bonded or in contact with the two poles of the battery 50 and the battery lead plates 51 and 52 made of resin. The semiconductor device 55 is molded with other resin to form the battery unit 60, and the semiconductor device 55 is molded with other resin.
is placed on the top of the. The battery lead plates 51 and 52 are projected outward from near both ends of the resin forming the battery unit 60, and are provided in recesses 57 provided at both ends of the semiconductor device 55.
Inside, connection lead terminals 58 and 59 drawn out from the resin forming the semiconductor device 55 are joined by soldering, welding, or the like. Furthermore, the joint portion within the recess 57 is
Covered by botting with epoxy resin, etc. (Not shown) [Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, it is difficult to align the battery unit and the semiconductor device in the planar direction, and the work must be done using a jig or the like for positioning. It was necessary and inefficient. Furthermore, in the conventional technology, as a measure against short circuits between the two joint points of the battery lead plate and the connecting lead terminals, which occur when a semiconductor device with a battery unit is held with bare hands, a resin botting process is performed to cover the joint parts. However, this method has problems such as not being able to replace the battery unit and semiconductor device and requiring zero man-hours for botting. Therefore, the present invention aims to solve these problems, and its purpose is to simplify the positioning of the battery unit and the semiconductor device, and to eliminate the botting work, thereby achieving external precision at a low cost. An object of the present invention is to provide a semiconductor device with a battery unit that has improved characteristics.

[Means for Solving the Problems] A semiconductor device with a battery unit of the present invention has a recessed portion provided at both ends of the semiconductor device which contains at least a semiconductor element and is packaged in a resin together with a lead frame, and a connection drawn out into the recessed portion. A lead terminal for the semiconductor device and a battery lead plate of a battery unit equipped with a battery for supplying power to the semiconductor device are joined in the recess, and a battery unit positioning cover block provided in the battery unit is connected to the recess. 6. Also, the battery unit and the battery unit positioning cover block are integrally molded from resin constituting the battery unit.

[Embodiment] An embodiment of a semiconductor device with a battery unit according to the structure of the present invention is shown in FIGS. 1 and 2 and will be described.

FIG. 1 is a perspective view, and FIG. 2 is a perspective view of the battery unit from the rear side. Backup power is supplied to the semiconductor device 1 in recesses 4.5 provided at both ends of the semiconductor device 1 mold-packaged with resin. A lead terminal 7.8 for connection with the battery 6 (hereinafter referred to as battery) is pulled out. On the top surface of the semiconductor device 1 is a battery unit lO molded with resin.
are placed on the (+) and (-) battery lead plates 11.
Reference numeral 12 contacts and connects each electrode of the battery 6, is extended while being bent in the middle, passes through a through hole 19, 20 provided in the battery unit 10, and connects the semiconductor device near the other end (not shown). It is connected to the connection lead terminal 7.8 of No. 1 by soldering. At both ends of the battery unit 1O, battery unit positioning cover blocks 17.18 formed with a flat surface corresponding to the recess 4.5 of the semiconductor device 1 are simultaneously integrally molded with resin constituting the battery unit 10. By inserting the battery unit 10 into the recess 4.5 of the semiconductor device 1, the semiconductor device 1 and the battery unit 1O can be positioned in the planar direction. At this time, the inner surface 2 of the battery unit positioning cover block 17.
1.22 determines the position in the longitudinal direction, and the outer surface 23.24 determines the width direction. As mentioned above, the battery unit positioning cover block 17.18 is simultaneously integrated with the resin constituting the battery unit IO. Up to 6 to mold
Although it is desirable, if simultaneous integral molding is difficult, the effect will not change even if the battery unit and battery unit positioning cover block are made separately and fixed to the battery unit with screws or adhesive, etc. The battery unit positioning cover blocks 17 and 18 are U-shaped facing each other, and have connection lead terminals 7 for the semiconductor element l.
．． It is possible to perform the joining work while preventing short circuits that would occur when the joining portions of the battery lead plates 11 and 12 of the battery unit 10 and the battery lead plates 11 and 12 of the battery unit 10 are touched with bare hands. In this example, we used a U-shape, but as shown in Fig. 3, various shapes such as semicircular and triangular shapes can be used6, and there is a space necessary for the joining work and it is possible to cover both ends. It's good to have. Also, although the shape of the ARAQUID lead of the semiconductor device is not shown in the figure, any type of ARAQUID lead shape can be applied to a semiconductor device with a battery unit configured as in the 6-wire example, and the effect will not change. Even if other elements such as a capacitor or a crystal resonator are housed instead, the effect remains the same.

[Effects of the Invention] As explained above, in the semiconductor device with a battery unit of the present invention, by providing the battery unit with the battery unit positioning cover unit, the battery unit and the semiconductor device can be positioned in the planar direction using a jig or the like. It can be done easily. Furthermore, it is possible to prevent short circuits between electrodes due to contact between elements and the like. It also has the advantage that the battery unit and semiconductor device can be easily attached and detached, and replacement can be easily performed in the event of a failure.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a semiconductor device with a battery unit according to the present invention. FIG. 2 is a perspective view from the back side of the battery unit of the semiconductor device with a battery unit of the present invention, and FIG. 3 is a diagram showing another example of the battery unit positioning cover block of the semiconductor device with a battery unit of the present invention. FIG. 4 is a front sectional view showing the configuration of a conventional semiconductor device with a battery unit. l ・ ・ ・ 4, 5 ・ 6 ・ ・ 7, 8 ・ 10 ・ ・ 1 l , 12 17, 18 19, 0 ・Semiconductor device・Recessed part of semiconductor device・Battery・Lead terminal for connection・Battery unit・Battery Lead plate/battery unit positioning cover block/battery unit through hole or more

Claims (2)

[Claims] (1) A semiconductor device containing at least a semiconductor element and packaged in resin together with a lead frame has recesses at both ends, and a connection lead terminal pulled out into the recess and a battery for supplying power to the semiconductor device are mounted. A semiconductor with a battery unit, characterized in that a battery lead plate of the battery unit is joined within the recess, and a battery unit positioning cover block provided in the battery unit is inserted into the recess. Device. (2) The semiconductor device with a battery unit according to claim 1, wherein the battery unit positioning cover block is formed integrally with a resin constituting the battery unit.