JPH07106766A - Flexible-rigid multilayered board and its manufacture - Google Patents
Flexible-rigid multilayered board and its manufactureInfo
- Publication number
- JPH07106766A JPH07106766A JP27505293A JP27505293A JPH07106766A JP H07106766 A JPH07106766 A JP H07106766A JP 27505293 A JP27505293 A JP 27505293A JP 27505293 A JP27505293 A JP 27505293A JP H07106766 A JPH07106766 A JP H07106766A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- flexible
- sections
- layers
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は情報通信機器などの高周
波回路用フレックスリッジド多層板とその製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexridged multilayer board for high frequency circuits such as information communication equipment and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】高周波信号を伝送する場合、回路の特性
インピーダンスが途中で変化すると、そこで信号の一部
が反射を生じ損失の原因となるため、従来より同軸ケー
ブルなどでは特定の特性インピーダンスを有するよう設
計されてきた。また最近ではリッジド多層板，フレキシ
ブルプリント配線板単体においても特性インピーダンス
を制御し、ニーズに合った構造をとるような工夫がなさ
れつつある。2. Description of the Related Art When transmitting a high-frequency signal, if the characteristic impedance of the circuit changes in the middle, a part of the signal will be reflected and cause loss, so that a coaxial cable or the like has a specific characteristic impedance. Has been designed to. In addition, recently, the ridged multilayer board and the flexible printed wiring board alone are being devised to control the characteristic impedance and take a structure that meets the needs.
【０００３】[0003]
【発明が解決しようとする課題】ところでフレックスリ
ッジド多層板は、可撓部と硬質板部間でコネクタを必要
としないため高密度化が可能であり、また接続部からの
信号の放射を防ぐことも可能である。しかし、可撓部と
硬質板部を一体化する場合、両者における信号回路とシ
ールド層間の絶縁層の厚みが異なるため、特性インピー
ダンスが変化してしまう。そのため、高周波信号を伝送
するにはフレックスリッジド多層板は不向きであると考
えられてきた。By the way, the flex-ridged multi-layer board does not require a connector between the flexible portion and the hard board portion, so that the density can be increased and the signal emission from the connection portion can be prevented. It is also possible. However, when the flexible portion and the hard plate portion are integrated, the characteristic impedance changes due to the difference in the thickness of the signal circuit and the insulating layer between the shield layers in the both. Therefore, it has been considered that the flexridged multilayer board is not suitable for transmitting high frequency signals.
【０００４】[0004]
【課題を解決するための手段】本発明はこのような課題
を解消するためになされたもので、その特徴は可撓部の
信号回路の厚みを硬質板部の信号回路の厚みよりも薄く
したことにある。そして、このような多層板を製造する
には、銅張樹脂フィルムのうち先に可撓部に当たる部分
の銅層を薄くしておいてから回路を形成する方法と、回
路を形成してから可撓部に当たる部分の銅層を薄くする
方法がある。その他、銅張樹脂フィルムの銅層の硬質板
部に当たる部分を電解メッキにより厚くした後、回路形
成を行ってもよい。The present invention has been made in order to solve such a problem, and is characterized in that the thickness of the signal circuit of the flexible portion is made thinner than the thickness of the signal circuit of the hard plate portion. Especially. In order to manufacture such a multilayer board, a method of forming a circuit after thinning the copper layer of the portion corresponding to the flexible portion of the copper-clad resin film first, and a method of forming the circuit and then forming the circuit. There is a method of thinning the copper layer in the portion corresponding to the flexible portion. In addition, after forming a portion of the copper layer of the copper-clad resin film, which corresponds to the hard plate portion, by electrolytic plating, the circuit may be formed.
【０００５】[0005]
【作用】図５に示すように最外層のシールド層３と内部
の信号回路４とが絶縁層５で隔絶されたストリップライ
ン回路において、特性インピーダンスと回路構造との間
には次の関係がある。 シールド層間の絶縁層の厚みＬを一定とした場合 回路幅ｗが小さいほど、或は回路の厚みｔが小さいほど
特性インピーダンスが大きくなる。 信号回路の構成（厚みと幅）を一定とした場合 シールド層間の絶縁層の厚みＬが大きいほど特性インピ
ーダンスが大きくなる。 このため、フレックスリッジド多層板のように信号回路
とシールド層間における絶縁層の厚みが可撓部と硬質板
部で異なる場合、信号回路の断面積を変更することで特
性インピーダンスを制御することができる。即ち、一般
に絶縁層の厚みＬは可撓部の方が硬質板部より薄いた
め、回路構成が等しいとすれば硬質板部の方が可撓部よ
りも特性インピーダンスが大きい。そこで可撓部の信号
回路の厚みｔを硬質板部のそれよりも薄くすれば特性イ
ンピーダンスの整合をとることができるのである。In the stripline circuit in which the outermost shield layer 3 and the internal signal circuit 4 are isolated by the insulating layer 5 as shown in FIG. 5, the characteristic impedance and the circuit structure have the following relationship. . When the thickness L of the insulating layer between the shield layers is constant, the smaller the circuit width w or the smaller the circuit thickness t, the larger the characteristic impedance. When the configuration (thickness and width) of the signal circuit is constant, the larger the thickness L of the insulating layer between the shield layers, the larger the characteristic impedance. For this reason, when the thickness of the insulating layer between the signal circuit and the shield layer is different between the flexible portion and the hard plate portion as in the flex-ridged multilayer board, the characteristic impedance can be controlled by changing the cross-sectional area of the signal circuit. it can. That is, in general, the thickness L of the insulating layer is smaller in the flexible portion than in the hard plate portion, so that if the circuit configurations are the same, the hard plate portion has a larger characteristic impedance than the flexible portion. Therefore, the characteristic impedance can be matched by making the thickness t of the signal circuit of the flexible portion thinner than that of the hard plate portion.
【０００６】ここで、特性インピーダンスの整合には回
路の厚みｔを減少させることの他、回路幅ｗを減少させ
たり、シールド層を硬質板部の内側に設け、信号回路と
シールド層との間の絶縁層の厚みを一定にすることなど
も考えられる。しかし、回路幅０．２ｍｍ，厚み３５μ
ｍの場合のフレキシブル配線板の特性インピーダンスが
３０Ωであるのに対し、搭載する素子の入出力インピー
ダンスや接続するケーブルの特性インピーダンスは一般
に５０Ωとなっており、回路幅の減少で特性インピーダ
ンスの整合をとるにはかなり微小な回路形成が要求され
る。従って、回路幅は硬質板部と可撓部で同一とし、回
路の厚みを減少する方が回路形成が容易に行える。Here, in order to match the characteristic impedance, in addition to reducing the thickness t of the circuit, the circuit width w is reduced, or a shield layer is provided inside the hard plate portion so that the signal circuit and the shield layer are connected to each other. It is also possible to make the thickness of the insulating layer constant. However, circuit width 0.2mm, thickness 35μ
In the case of m, the characteristic impedance of the flexible wiring board is 30Ω, whereas the input / output impedance of the mounted element and the characteristic impedance of the cable to be connected are generally 50Ω, and the characteristic impedance matching is achieved by reducing the circuit width. In order to obtain it, a very minute circuit formation is required. Therefore, it is easier to form the circuit if the hard plate portion and the flexible portion have the same circuit width and the thickness of the circuit is reduced.
【０００７】このような構成のフレックスリッジド多層
板を製造するには、銅張樹脂フィルムの可撓部に当たる
部分の銅層のみを予めエッチングして薄くしておき、そ
の後回路形成を行えばよい。或は、銅張樹脂フィルムに
回路を形成してから硬質板部に当たる部分にレジストを
形成してエッチングし、可撓部に当たる部分の信号回路
（銅層）を薄くしてもよい。なお、回路形成時に、回路
の厚みだけでなく回路幅も部分的に変更する方法を併用
することも可能である。In order to manufacture the flex-ridged multi-layer board having such a structure, only the copper layer in the portion corresponding to the flexible portion of the copper clad resin film is etched and thinned in advance, and then the circuit is formed. . Alternatively, after forming a circuit on the copper clad resin film, a resist may be formed on a portion corresponding to the hard plate portion and etching may be performed to thin the signal circuit (copper layer) on the portion corresponding to the flexible portion. When forming the circuit, it is possible to use a method of partially changing not only the thickness of the circuit but also the circuit width.
【０００８】[0008]
【実施例】以下、本発明の一実施例について説明する。
本発明フレックスリッジド多層板は図１に示されるよう
に、硬質多層プリント配線板である２枚の硬質板部１が
フレキシブルプリント配線板の可撓部２により一体化さ
れたものである。EXAMPLES An example of the present invention will be described below.
As shown in FIG. 1, the flexridged multilayer board of the present invention is one in which two hard board portions 1 which are hard multilayer printed wiring boards are integrated by a flexible portion 2 of a flexible printed wiring board.
【０００９】ここで硬質板部１と可撓部２は共に最外層
（両面）にシールド層３を具え、内部の信号回路４との
間を絶縁層５で隔絶している。シールド層３は内部から
の電磁波の放射や外部からの電磁波の侵入を防ぐもの
で、信号入出力部分を除いて硬質板部１及び可撓部２の
全面に設けられ、両部のシールド層３はスルーホール６
を介して接続されている。Here, both the hard plate portion 1 and the flexible portion 2 are provided with a shield layer 3 on the outermost layers (both sides), and an insulating layer 5 separates them from the internal signal circuit 4. The shield layer 3 is for preventing the emission of electromagnetic waves from the inside and the invasion of electromagnetic waves from the outside, and is provided on the entire surface of the hard plate portion 1 and the flexible portion 2 except the signal input / output portion, and the shield layers 3 of both portions are provided. Is through hole 6
Connected through.
【００１０】一方、信号回路４は可撓部２を介して一方
の硬質板部１から他方の硬質板部１へ及び、その回路幅
は図２に示すように硬質板部１と可撓部２において同一
で、厚さは図１のように可撓部２の方が硬質板部１より
も薄く形成されている。そしてこれらシールド層３と信
号回路４の間における絶縁層５は、硬質板部１で厚く、
可撓部２で薄く形成されているのである。尚、図１にお
いて、11はガラスエポキシ基板、12は接着剤層、13はＦ
ＰＣである。On the other hand, the signal circuit 4 extends from one hard plate portion 1 to the other hard plate portion 1 via the flexible portion 2, and the circuit width thereof is as shown in FIG. 2, the flexible portion 2 is formed thinner than the hard plate portion 1 as shown in FIG. The insulating layer 5 between the shield layer 3 and the signal circuit 4 is thick in the hard plate portion 1,
The flexible portion 2 is thinly formed. In FIG. 1, 11 is a glass epoxy substrate, 12 is an adhesive layer, and 13 is F.
It is a PC.
【００１１】次にこのような多層板の製造方法を説明す
る。図３に示すように、市販の銅張ポリイミドフィルム
７の銅層８のうち、可撓部に当たる部分以外にレジスト
マスクを形成しておき、可撓部に当たる部分の銅層８を
塩化第二鉄を含む溶液により約２０μｍエッチングを施
した（同図Ａ）。続いて電着レジストを塗布し、エッチ
ングして回路９を形成する（同図Ｂ）。そしてそれ以降
は以下に述べる従来の製造工程に従って同図（Ｃ）に示
すフレックスリッジド多層板作製した。Next, a method for manufacturing such a multilayer board will be described. As shown in FIG. 3, a resist mask is formed on the copper layer 8 of the commercially available copper-clad polyimide film 7 except for the portion corresponding to the flexible portion, and the copper layer 8 corresponding to the flexible portion is replaced with ferric chloride. About 20 μm was etched by a solution containing (FIG. A). Then, an electrodeposition resist is applied and etched to form a circuit 9 (FIG. 9B). After that, the flex-ridged multilayer board shown in FIG. 1C was manufactured according to the conventional manufacturing process described below.
【００１２】回路が形成された上記の銅張ポリイミド
フィルムに接着剤を介してポリイミドのカバーレイを被
せ、プレスしてＦＰＣを作製する。 所要枚数の上記ＦＰＣを接着剤を介して硬質板部とな
る銅張ガラス・エポキシ板で挟みこれらをプレスする。
このとき可撓部となる箇所にはプレス工程前に予め接着
剤を除去しておく。 次にスルーホールの孔開け，スルーホールメッキを行
い、さらに硬質板部に回路を形成する。 そして可撓部に対応する箇所の銅張ガラス・エポキシ
板を除去し、保護膜を塗布する。The copper clad polyimide film having the circuit formed thereon is covered with a polyimide cover lay via an adhesive and pressed to fabricate an FPC. A required number of the above FPCs are sandwiched between copper clad glass / epoxy plates which will be hard plates through an adhesive agent, and these are pressed.
At this time, the adhesive agent is removed in advance from the pressing step before the pressing step. Next, through holes are formed and through holes are plated, and circuits are formed on the hard plate. Then, the copper clad glass / epoxy plate at the portion corresponding to the flexible portion is removed, and a protective film is applied.
【００１３】本発明多層板の製造方法は以上の通りであ
るが、さらに比較のため硬質板部，可撓部で回路の厚さ
が同一の従来の多層板も作製し、信号を入射して硬質板
部−可撓部間における反射係数を測定した。その結果、
従来の多層板では反射係数が−０．２０であったのに対
し、本発明による多層板では反射係数を−０．０５に減
少することができた。エッチング条件などを検討するこ
とで特性インピーダンスの差をさらに減少させ、より厳
密なインピーダンス整合をとることも可能であると考え
られる。The method of manufacturing the multilayer board of the present invention is as described above. Further, for comparison, a conventional multilayer board in which the hard plate portion and the flexible portion have the same circuit thickness is prepared, and a signal is input. The reflection coefficient between the hard plate portion and the flexible portion was measured. as a result,
While the reflection coefficient of the conventional multilayer board was -0.20, the reflection coefficient of the multilayer board according to the present invention could be reduced to -0.05. It is considered possible to further reduce the difference in characteristic impedance and to achieve more strict impedance matching by examining the etching conditions and the like.
【００１４】尚、上記の例では可撓部に当たる銅層を薄
くしてから回路を形成したが、先ず銅張ポリイミドフィ
ルムをエッチングして回路９を形成した後、図４（Ａ）
に示すように硬質板部に当たる部分にレジスト10をコー
ティングし、再度エッチングを行って可撓部に相当する
部分の回路を薄く形成しても良い（同図Ｂ）。In the above example, the copper layer corresponding to the flexible portion was thinned to form the circuit. However, the copper-clad polyimide film was first etched to form the circuit 9, and then the circuit shown in FIG.
As shown in FIG. 7, the portion corresponding to the hard plate portion may be coated with the resist 10 and etched again to thinly form the circuit corresponding to the flexible portion (FIG. 9B).
【００１５】[0015]
【発明の効果】以上説明したように、本発明によるフレ
ックスリッジド多層板は最外層にシールド層を有するた
め、外部からのノイズの浸入や回路から外部への信号の
放射を防止することができる。さらに、硬質板部と可撓
部との間で特性インピーダンスのずれがないため、損失
なく信号を伝送することができる。従って、高周波の信
号を伝送する情報通信機器の伝送線路として利用すると
効果的である。As described above, since the flexridged multilayer board according to the present invention has the shield layer as the outermost layer, it is possible to prevent the intrusion of noise from the outside and the radiation of the signal from the circuit to the outside. . Furthermore, since there is no deviation in the characteristic impedance between the hard plate portion and the flexible portion, it is possible to transmit signals without loss. Therefore, it is effective when used as a transmission line of an information communication device that transmits a high frequency signal.
【図１】本発明フレックスリッジド多層板の断面図であ
る。FIG. 1 is a cross-sectional view of a flexridged multilayer board of the present invention.
【図２】本発明フレックスリッジド多層板の平面透視図
である。FIG. 2 is a plan perspective view of a flexridged multilayer board of the present invention.
【図３】本発明フレックスリッジド板の製造方法を示す
説明図で、（Ａ）は銅層の一部を薄く形成した段階、
（Ｂ）は回路形成を行った段階を示す。FIG. 3 is an explanatory view showing a method for manufacturing a flex-ridged plate of the present invention, in which (A) is a stage in which a part of a copper layer is formed thin,
(B) shows a stage where a circuit is formed.
【図４】図３とは別の本発明フレックスリッジド板の製
造方法を示す説明図で、（Ａ）は回路形成後レジストを
形成した段階、（Ｂ）はエッチングにより可撓部に当た
る回路を薄く形成した段階を示す。4A and 4B are explanatory views showing a method for manufacturing a flex-ridged plate of the present invention different from FIG. 3, in which FIG. 4A is a stage in which a resist is formed after circuit formation, and FIG. The stage of thin formation is shown.
【図５】ストリップライン回路の断面図である。FIG. 5 is a cross-sectional view of a stripline circuit.
１ 硬質板部 ２ 可撓部 ３ シールド層 ４ 信号
回路 ５ 絶縁層 ６ スルーホール ７ 銅張ポリイミドフィルム ８
銅層 ９ 回路 10 レジスト 11 ガラスエポキシ基板 12 接着剤層
13 ＦＰＣ Ｌ 絶縁層の厚み ｗ 回路幅 ｔ 回路の厚み1 Hard Plate Part 2 Flexible Part 3 Shield Layer 4 Signal Circuit 5 Insulating Layer 6 Through Hole 7 Copper Clad Polyimide Film 8
Copper layer 9 Circuit 10 Resist 11 Glass epoxy substrate 12 Adhesive layer
13 FPC L Insulating layer thickness w Circuit width t Circuit thickness
Claims (3)
に絶縁層で隔絶されたシールド層と信号回路とを具える
フレックスリッジド多層板であって、可撓部の信号回路
の厚みが硬質板部の信号回路の厚みよりも薄いことを特
徴とするフレックスリッジド多層板。1. A flex-ridged multilayer board comprising a flexible portion and a hard plate portion, and a shield layer and a signal circuit which are separated from each other by an insulating layer, and a flexible circuit and a hard plate portion. A flexridged multilayer board having a thickness smaller than that of the signal circuit of the hard board.
部分の銅層を予め薄く形成しておき、その後回路形成を
行う工程を有することを特徴とするフレックスリッジド
多層板の製造方法。2. A method for producing a flexridged multilayer board, which comprises the step of forming a thin copper layer in a portion corresponding to the flexible portion of the copper-clad resin film in advance and then forming a circuit.
可撓部に当たる部分を薄く形成する工程を有することを
特徴とするフレックスリッジド多層板の製造方法。3. After forming a circuit on the copper clad resin film,
A method of manufacturing a flex-ridged multilayer board, comprising a step of forming a thin portion corresponding to a flexible portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27505293A JP3259873B2 (en) | 1993-10-05 | 1993-10-05 | Flex-rigid multilayer board for high frequency circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27505293A JP3259873B2 (en) | 1993-10-05 | 1993-10-05 | Flex-rigid multilayer board for high frequency circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07106766A true JPH07106766A (en) | 1995-04-21 |
| JP3259873B2 JP3259873B2 (en) | 2002-02-25 |
Family
ID=17550181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27505293A Expired - Lifetime JP3259873B2 (en) | 1993-10-05 | 1993-10-05 | Flex-rigid multilayer board for high frequency circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3259873B2 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6143990A (en) * | 1996-06-25 | 2000-11-07 | Fuji Xerox Co., Ltd. | Printed wiring board with two ground planes connected by resistor |
| FR2858746A1 (en) * | 2003-08-08 | 2005-02-11 | Siemens Ag | ELECTRONIC DEVICE |
| JP2005236153A (en) * | 2004-02-23 | 2005-09-02 | Sumitomo Bakelite Co Ltd | Multilayer circuit board, and manufacturing method thereof |
| JP2007059645A (en) * | 2005-08-25 | 2007-03-08 | Sony Chemical & Information Device Corp | Composite wiring board |
| WO2008035416A1 (en) | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| JP2009099773A (en) * | 2007-10-17 | 2009-05-07 | Fujikura Ltd | Circuit board with shield |
| JP2009111309A (en) * | 2007-11-01 | 2009-05-21 | Nec Corp | Wiring board and semiconductor device |
| WO2009131182A1 (en) * | 2008-04-25 | 2009-10-29 | ソニーケミカル＆インフォメーションデバイス株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| JP2009277692A (en) * | 2008-05-12 | 2009-11-26 | Fujitsu Ltd | Multilayer printed wiring board, electronic device, and production method of electronic device |
| JP2010010217A (en) * | 2008-06-24 | 2010-01-14 | Sumitomo Electric Printed Circuit Inc | Multilayer printed wiring board and method of manufacturing the same |
| JP2012094646A (en) * | 2010-10-26 | 2012-05-17 | Daisho Denshi Co Ltd | Printed wiring board corresponding to characteristic impedance control |
| JP2012169688A (en) * | 2012-06-15 | 2012-09-06 | Sumitomo Electric Printed Circuit Inc | Method for manufacturing multilayer printed wiring board |
| CN111566748A (en) * | 2017-12-28 | 2020-08-21 | 爱惜康有限责任公司 | Surgical instrument with flexible circuit |
| WO2020218267A1 (en) * | 2019-04-22 | 2020-10-29 | 株式会社村田製作所 | Transmission line substrate and electronic apparatus |
-
1993
- 1993-10-05 JP JP27505293A patent/JP3259873B2/en not_active Expired - Lifetime
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| EP2071907A4 (en) * | 2006-09-21 | 2009-12-09 | Daisho Denshi Co Ltd | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| WO2008035416A1 (en) | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| US9155209B2 (en) | 2006-09-21 | 2015-10-06 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
| EP2071907A1 (en) * | 2006-09-21 | 2009-06-17 | Daisho Denshi Co. Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| US8188372B2 (en) | 2006-09-21 | 2012-05-29 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
| US20100051325A1 (en) * | 2006-09-21 | 2010-03-04 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
| JP2009099773A (en) * | 2007-10-17 | 2009-05-07 | Fujikura Ltd | Circuit board with shield |
| JP2009111309A (en) * | 2007-11-01 | 2009-05-21 | Nec Corp | Wiring board and semiconductor device |
| WO2009131182A1 (en) * | 2008-04-25 | 2009-10-29 | ソニーケミカル＆インフォメーションデバイス株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| US8604346B2 (en) | 2008-04-25 | 2013-12-10 | Sony Corporation | Flex-rigid wiring board and method for manufacturing the same |
| JP2009277692A (en) * | 2008-05-12 | 2009-11-26 | Fujitsu Ltd | Multilayer printed wiring board, electronic device, and production method of electronic device |
| JP2010010217A (en) * | 2008-06-24 | 2010-01-14 | Sumitomo Electric Printed Circuit Inc | Multilayer printed wiring board and method of manufacturing the same |
| JP2012094646A (en) * | 2010-10-26 | 2012-05-17 | Daisho Denshi Co Ltd | Printed wiring board corresponding to characteristic impedance control |
| JP2012169688A (en) * | 2012-06-15 | 2012-09-06 | Sumitomo Electric Printed Circuit Inc | Method for manufacturing multilayer printed wiring board |
| CN111566748A (en) * | 2017-12-28 | 2020-08-21 | 爱惜康有限责任公司 | Surgical instrument with flexible circuit |
| JP2021509309A (en) * | 2017-12-28 | 2021-03-25 | エシコン エルエルシーＥｔｈｉｃｏｎ ＬＬＣ | Surgical instruments with flexible circuits |
| WO2020218267A1 (en) * | 2019-04-22 | 2020-10-29 | 株式会社村田製作所 | Transmission line substrate and electronic apparatus |
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