JPH10135713A - Laminated waveguide line - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated waveguide line through which a high frequency signal is transmitted in a stacked direction by employing the lamination technology used for a conventional ceramic multi-layer wiring board. SOLUTION: The laminated waveguide line is provided with a plurality of via-hole groups 3 arranged to be penetrated through a plurality of dielectric layers stacked with each other and a plurality of conductor layer groups 2 connected electrically to the via-hole groups 3 and formed between the dielectric layers, and an electric signal is transmitted in the stacked direction of the dielectric layers through regions surrounded by the via-hole groups 3 and the conductor layer groups 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric waveguide line mainly for transmitting microwave and millimeter wave signals and configured in a wiring board or a semiconductor housing package. The present invention relates to an improvement in a waveguide line capable of transmitting a signal in a stacking direction.

[0002]

2. Description of the Related Art Conventionally, strip lines, microstrip lines, and coplanar lines have been known as lines for transmitting high-frequency signals such as microwaves or millimeter waves in a wiring board or a package for housing semiconductors. Have been. In addition, a waveguide line whose side surface is surrounded by a via hole as disclosed in Japanese Patent Application Laid-Open No. 6-53711 is also known.

These can be formed by printing a conductor forming a line on the surface of the dielectric substrate, or by using a general laminating technique of laminating the conductors.

[0004]

However, most of these transmission lines are limited to transmission of electric signals in a plane direction. However, in the case of a multilayer wiring board or a semiconductor storage package, it is necessary to transmit a high-frequency signal in a method of laminating dielectric substrates, in other words, in a direction perpendicular to the substrate.

[0005] Such signal transmission in the vertical direction is almost always performed by electrically connecting a line to another line by a via hole.

However, the frequency of the electric signal used is high,
In the microwave or millimeter wave region, there is a problem in that signal reflection occurs due to impedance mismatch in the via hole, and electromagnetic waves are radiated in the via hole, and transmission characteristics are rapidly deteriorated. In particular, in the case where connection is made with via holes through ten or more dielectric layers in the stacking direction of a plurality of stacked dielectric layers, the deterioration of transmission characteristics is particularly large.

Accordingly, it is an object of the present invention to provide a laminated waveguide line capable of transmitting a high-frequency signal in a laminating direction without deteriorating a signal by using a laminating technique used for a conventional ceramic multilayer wiring board or the like. It is.

[0008]

As a result of repeated investigations on the above-mentioned problems, the present inventor has found that a waveguide line is used as a transmission means in a wiring board on which a plurality of dielectric layers are laminated. The waveguide line is formed by a plurality of via holes arranged so as to penetrate the dielectric layer in the stacking direction, and a conductor layer group electrically connected to the via holes and formed in parallel with each other. The present inventors have found that by forming the region as an enclosed region, it is possible to transmit a signal in the stacking direction without using a conventional electrical connection by a via hole.

According to the structure of the present invention, a plurality of via holes penetrating the dielectric layer in the stacking direction and a plurality of via holes electrically connected to the via holes and formed in parallel with each other are formed. Since it is composed of conductor layers, it can be easily manufactured by conventional lamination techniques, that is, via hole formation, conductor layer formation, and lamination integration. A line having excellent transmission characteristics, which can be used for a package for an electronic device, can be obtained.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view for explaining one embodiment of the laminated waveguide of the present invention. 1 and 2, reference numeral 1 denotes a dielectric layer, 2 denotes a conductor layer, 3 denotes a via hole, and 4 denotes a waveguide line having this structure.
In FIG. 1, the dielectric layer is omitted for convenience of description of the structure.

According to FIG. 1, a plurality of dielectric layers each having a thickness c are laminated, and each of the dielectric layers follows the contour of the cross-sectional shape of the waveguide line, in the laminating direction of the dielectric layers. A large number of via holes 3 are formed at predetermined intervals. In the via hole group 3, a plurality of conductor layers 2 are formed in parallel with each other so as to be electrically connected to all the via hole group 3 and surround the via hole group 3. In the conductive layer 2 group, the formation interval of the via hole 3 group and the dielectric thickness c, that is, the interval between the conductive layer 2 groups are formed at intervals smaller than the cutoff wavelength of the propagated high-frequency signal. With such a configuration, in the waveguide line of the present invention, the waveguide wall is formed by the lattice plane of the three groups of via holes extending in the stacking direction and the two groups of the plurality of conductor layers formed in parallel. In FIG. 1, the dielectric layer is omitted for convenience of explanation,
Naturally, the space of the conductor portion (the third group of via holes and the second group of conductor layers) of FIG. 1 functions as a line by being filled with a dielectric layer.

According to the above configuration, the high-frequency signal (electromagnetic wave) input into the waveguide line does not leak to the outside from between the three via holes and between the two conductor layers. 4. Thereby, in the case of FIG. 1, a rectangular waveguide line having a cross section of a × b can be formed in the laminating direction.

The cross-sectional shape of the waveguide line is not limited to the rectangular shape in FIG. 1, but may be a polygonal shape, a circular shape or an elliptical shape. In that case, the via hole group 3 is formed along the criticality of the sectional shape, and the conductor layer 2 group is formed in the via hole 3.
The waveguide line 4 having any cross section can be formed only by forming it so as to surround the group.

FIG. 2 is a view for explaining one embodiment of a method for manufacturing a laminated waveguide according to the present invention. In this embodiment, a ceramic dielectric is used as the dielectric layer.

First, a plurality of ceramic green sheets 5 having a predetermined thickness c are produced by using a ceramic powder by a doctor blade method, a rolling method, or the like. Then, a plurality of holes are formed in the green sheet 5 using a laser, a micro drill, or the like at the outline of the target waveguide line cross-sectional shape, and conductive ink is buried in the holes to form via holes. Thereafter, a conductive ink is printed on a region surrounding the via hole group 3 so as to be electrically connected to the via hole group 3, thereby forming the conductive layer 2.

In this way, the ceramic green sheets 5 on which the via holes 3 and the conductor layers 2 are formed are aligned and laminated so that the via holes 3 are connected to each other in the vertical direction. It can be manufactured by firing the laminate at a predetermined temperature.

In the above method, when the dielectric layer is made of alumina (Al ₂ O ₃ ) made of ceramics, the conductor paste and the conductor ink are made of a high melting point metal such as W or Mo, and are used at 1500 to 1700 ° C. Formed by baking. When the dielectric layer is formed of glass ceramic, the conductive paste and conductive ink can be formed by baking at 800 to 1000 ° C. using copper, silver, gold, or the like.

In the above embodiment, three groups of via holes formed in each green sheet are connected in the vertical direction. However, if the green sheets are slightly shifted and stacked, not only in the vertical direction, As shown in the sectional view of FIG.
The waveguide line can be formed in a direction slightly inclined with respect to the lamination direction.

Further, the cross-sectional shape of the waveguide line in each green sheet, that is, the formation position of the via hole group 3 may be gradually changed in the laminating direction. For example, if the horn antenna is gradually widened in the stacking direction (upward), a horn antenna can be formed as shown in FIG.

Although the above manufacturing method has been described using ceramics as an example, the waveguide line of the present invention may use a dielectric material containing at least an organic resin as a dielectric, for example, a ceramic-organic resin composite material. it can. In this case, a hole is formed in the dielectric layer by a microdrill, a laser, or the like on each organic resin-containing dielectric sheet, and the inner surface of the hole is subjected to metal plating, or a metal paste is filled to form a via hole group, and A conductor layer is formed by applying a resist method by attaching a metal foil to the surface of the dielectric sheet, or only the conductor layer is transferred from the resin sheet on which the conductor layer is formed to the dielectric sheet, or the conductor layer is formed using a conductor paste. Can be also produced by forming a conductor layer by a method such as printing, producing a plurality of dielectric sheets, aligning them, and laminating and integrating them as described in FIG. .

[0021]

As described in detail above, the laminated waveguide according to the present invention is a waveguide capable of transmitting a microwave or millimeter wave signal in a plurality of laminated dielectric layers. Can be formed in the direction of lamination of the dielectric layers, whereby the degree of freedom in designing a microwave circuit or a millimeter wave circuit in a multilayer wiring board, a package for storing a high-frequency element, or the like can be increased. In addition, it can be easily manufactured by applying the conventional lamination technology.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating one embodiment of a laminated waveguide according to the present invention.

FIG. 2 is a perspective view illustrating a manufacturing method of one embodiment of FIG. 1;

FIG. 3 is a cross-sectional view for explaining another embodiment of the laminated waveguide of the present invention.

FIG. 4 is a cross-sectional view for explaining still another embodiment of the laminated waveguide of the present invention.

[Explanation of symbols]

 Reference Signs List 1 dielectric layer 2 conductor layer 3 via hole 4 waveguide line 5 ceramic green sheet

Claims (1)

[Claims] 1. A plurality of via holes arranged in a plurality of stacked dielectric layers so as to penetrate the dielectric layers in the stacking direction, and electrically connected to the via holes,
A plurality of conductor layers formed between dielectric layers, wherein an area surrounded by the via holes and the conductor layers transmits an electric signal in a direction in which the dielectric layers are stacked. Laminated waveguide line.