JPH07106607A - Optical receiver module - Google Patents
Optical receiver moduleInfo
- Publication number
- JPH07106607A JPH07106607A JP5246566A JP24656693A JPH07106607A JP H07106607 A JPH07106607 A JP H07106607A JP 5246566 A JP5246566 A JP 5246566A JP 24656693 A JP24656693 A JP 24656693A JP H07106607 A JPH07106607 A JP H07106607A
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- package
- optical
- wiring pattern
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は各種光通信機分野すなわ
ち光ファイバを伝送路として用いた幹線系通信、ファク
トリーオートメーション（ＦＡ）、オフィスオートメー
ション（ＯＡ）、構内通信網（ＬＡＮ）、ＣＡＴＶシス
テム、無線アナログ伝送システム等、また装置間を多心
の光ファイバでつなぐ光インタコネクトシステム等、更
に将来の広帯域サービスを狙ったＢ−ＩＳＤＮサービス
を各家庭まで提供するための加入者システム等において
用いられる光半導体モジュール及びその製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various optical communication equipment fields, that is, trunk line communication using optical fibers as transmission lines, factory automation (FA), office automation (OA), on-premises communication network (LAN), CATV system, It is used in wireless analog transmission systems, etc., optical interconnect systems in which devices are connected by multi-core optical fibers, and subscriber systems for providing B-ISDN services aimed at future broadband services to each home. The present invention relates to an optical semiconductor module and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図１に一般的な並列伝送光モジュールの
構造を示す。図１において、角柱状のサブマウント表面
には外部に信号を引き出すための配線パターンが形成さ
れている。またサブマウントの上面または側面には、サ
ブマウント上に形成した配線パターン１つ１つの電極と
各々接続した受信素子が搭載されている。配線板には光
素子駆動回路の少なくとも一部を担うＩＣが搭載され、
配線パターンも形成されている。前記サブマウントと配
線板はパッケージにはんだもしくはろう付けによって固
定され、Ａｕ線を用いて電気的接続が行われている。な
おこの種のモジュール構造としては例えば特開平３−２
６３３７７号公報がある。2. Description of the Related Art FIG. 1 shows the structure of a general parallel transmission optical module. In FIG. 1, a wiring pattern for extracting a signal to the outside is formed on the surface of the prismatic submount. Further, on the upper surface or the side surface of the submount, a receiving element connected to each electrode of each wiring pattern formed on the submount is mounted. An IC that carries at least a part of the optical element drive circuit is mounted on the wiring board.
A wiring pattern is also formed. The submount and the wiring board are fixed to the package by soldering or brazing, and are electrically connected using Au wires. As a module structure of this type, for example, Japanese Patent Application Laid-Open No. 3-2
There is a 63377 publication.
【０００３】[0003]
【発明が解決しようとする課題】従来の光受信モジュー
ルでは、上記したように受光素子をサブマウント上に搭
載し、サブマウントをパッケージにはんだ等を用いて固
定していた。また電気的には、光素子とサブマウントの
電気接続をワイヤ（Ａｕ線）で行い、サブマウントから
光素子駆動回路へもワイヤを用いて接続していた。この
為サブマウント上には光素子搭載用のパッド及び配線パ
ターンを形成する必要があった。これによりサブマウン
トの価格が高価となり、価格の低減にも支障を来すこと
になる。また、サブマウントを用いることにより部品点
数が増え、作業工程、作業時間の縮少の障害となる。In the conventional optical receiver module, the light receiving element is mounted on the submount as described above, and the submount is fixed to the package by using solder or the like. Further, electrically, the optical element and the submount are electrically connected by a wire (Au wire), and the submount is also connected to the optical element drive circuit by the wire. Therefore, it is necessary to form a pad and a wiring pattern for mounting an optical element on the submount. As a result, the price of the submount becomes expensive, and the reduction in price will also be hindered. Further, the use of the submount increases the number of parts, which is an obstacle to the reduction of the work process and the work time.
【０００４】本発明は、上記問題点を解決し、サブマウ
ントを用いず部品点数を減らし、作業工程を減らし、組
立時間の短縮をはかり安価な光受信モジュールを提供す
ることを目的とする。An object of the present invention is to solve the above problems, to reduce the number of parts without using a submount, to reduce the work steps, to shorten the assembly time, and to provide an inexpensive optical receiving module.
【０００５】[0005]
【課題を解決するための手段】上記目的を果たすため、
サブマウントを使用せずに、受光素子を内部にもつパッ
ケージ内部に配線パターンを設け、受光素子を直にパッ
ケージ内部の配線パターンに電気的接続を取りながら、
はんだ固定した。[Means for Solving the Problems] To achieve the above object,
Without using a submount, a wiring pattern is provided inside the package that has the light receiving element inside, and while directly connecting the light receiving element to the wiring pattern inside the package,
Solder fixed.
【０００６】またパッケージ内部の配線パターンに電気
的接続を取りながら、はんだ固定した受光素子を光導波
路と一体形成した。Further, the solder-fixed light receiving element is integrally formed with the optical waveguide while electrically connecting to the wiring pattern inside the package.
【０００７】[0007]
【作用】本発明では従来光素子を搭載していたサブマウ
ントの使用を取りやめ、光素子を直接パッケージに取り
付けることによって、光受信モジュールの構成部材を削
減し、組立時間の向上をはかり、安価な光受信モジュー
ルを提供することが可能となる。また受光素子に一体形
成された光導波路は受光素子の取扱いを容易にし、モジ
ュールの組立作業性を向上した上記受信モジュールを提
供することが可能となる。According to the present invention, the use of the submount, which has conventionally been equipped with an optical element, is discontinued and the optical element is directly attached to the package, so that the number of components of the optical receiver module is reduced, the assembly time is improved, and the cost is low. It is possible to provide an optical receiver module. Further, the optical waveguide formed integrally with the light receiving element makes it easy to handle the light receiving element, and it is possible to provide the receiving module in which the assembly workability of the module is improved.
【０００８】[0008]
【実施例】以下本発明の実施例を図２，３を用いて詳細
に説明する。図２には本発明の一実施例の斜視図を示
す。同図において光受信モジュールの内部には、複数個
の受光素子と受光素子駆動回路の少なくとも一部を担う
ＩＣ、及び受光素子に光を伝達する光ファイバアレイ
（図示していない）が設置してある。パッケージには受
光素子アレイと、受光素子駆動ＩＣを電気的に接続する
配線パターンを形成しておき、ＩＣ及び受光素子アレイ
をパッケージに搭載固定後、Ａｕ線ワイヤを用いて電気
的接続を行う。またパッケージに受光素子アレイを搭載
する際には、パッケージに設けた配線パターンの各々の
電極に複数個の受光素子の１つ１つの電極が接続するよ
うにはんだ付けする。はんだ固定した受光素子アレイと
光ファイバアレイとの間において、受光素子と光ファイ
バが１つ１つ対応して光伝達が行えるように光軸調整
し、光ファイバアレイを固定する。またここでは、受光
素子と光ファイバの直接結合に付いて述べたが、レンズ
を介した光結合の場合も同様である。Embodiments of the present invention will be described in detail below with reference to FIGS. FIG. 2 shows a perspective view of an embodiment of the present invention. In the figure, inside the light receiving module, a plurality of light receiving elements, an IC that carries at least a part of the light receiving element drive circuit, and an optical fiber array (not shown) for transmitting light to the light receiving elements are installed. is there. A wiring pattern for electrically connecting the light receiving element array and the light receiving element driving IC is formed in the package, and after the IC and the light receiving element array are mounted and fixed in the package, they are electrically connected using Au wire. When the light receiving element array is mounted on the package, soldering is performed so that each electrode of the plurality of light receiving elements is connected to each electrode of the wiring pattern provided on the package. Between the light receiving element array and the optical fiber array fixed by soldering, the optical axis is adjusted so that the light receiving element and the optical fiber correspond to each other and the optical transmission is performed, and the optical fiber array is fixed. Although the direct coupling between the light receiving element and the optical fiber has been described here, the same applies to the case of optical coupling through a lens.
【０００９】図３に本発明の一実施例である光導波路一
体形成受光素子モジュールの断面図を示す。同図におい
てＩＣをパッケージ内部に固定し、パッケージ内部に形
成した配線パターンとＡｕ線を用いて電気的接続を行
う。またパッケージには窓が設けてあり、前記窓に光を
伝達するための光導波炉を一体形成した受光素子を挿入
し、パッケージ内に形成した配線パターンの電極１つ１
つと受光素子の各々の電極とを接続する。受光素子に一
体形成された光導波路は受光素子に効率よく光を伝達す
るものとする。また受光素子に一体形成された光導波路
はパッケージと接着剤等により固定する。FIG. 3 is a sectional view of a light receiving element module having an integrated optical waveguide according to an embodiment of the present invention. In the figure, the IC is fixed inside the package, and the wiring pattern formed inside the package and the Au line are used for electrical connection. A window is provided in the package, and a light receiving element integrally formed with an optical waveguide furnace for transmitting light is inserted into the window, and each electrode of the wiring pattern formed in the package 1
And one of the electrodes of the light receiving element. The optical waveguide integrally formed with the light receiving element efficiently transmits light to the light receiving element. The optical waveguide integrally formed with the light receiving element is fixed to the package with an adhesive or the like.
【００１０】[0010]
【発明の効果】本発明では従来光素子を搭載していたサ
ブマウントの使用を取りやめることによって、サブマウ
ント製造原価を削除し、光素子を直接パッケージに取り
付けることによって、光受信モジュールの構成部材を削
減し、組立時間の向上をはかり、安価な光受信モジュー
ルを提供することが可能となる。また受光素子に一体形
成された光導波路は、受光素子の取扱いを容易にし、作
業性を向上する。According to the present invention, the cost of manufacturing the submount is eliminated by canceling the use of the submount, which has conventionally been mounted with the optical element, and the optical element is directly attached to the package, so that the constituent members of the optical receiving module are removed. It is possible to reduce the number of the optical receiver modules, improve the assembly time, and provide an inexpensive optical receiver module. Further, the optical waveguide formed integrally with the light receiving element facilitates handling of the light receiving element and improves workability.
【図１】従来のサブマウントを用いた並列光モジュール
の断面図である。FIG. 1 is a cross-sectional view of a parallel optical module using a conventional submount.
【図２】本発明の一実施例の並列伝送受信モジュールの
斜視図である。FIG. 2 is a perspective view of a parallel transmission / reception module according to an embodiment of the present invention.
【図３】本発明の一実施例の光導波路を受信素子に一体
形成した光モジュールを示す図である。FIG. 3 is a diagram showing an optical module in which an optical waveguide according to an embodiment of the present invention is integrally formed with a receiving element.
１…受光素子アレイ、 ２…配線板、 ３…パッケージ、 ４…サブマウント、 ５…ＩＣ、 ６…ワイヤ（Ａｕ線）、 ７…配線パターン、 ８…光導波路。 DESCRIPTION OF SYMBOLS 1 ... Light receiving element array, 2 ... Wiring board, 3 ... Package, 4 ... Submount, 5 ... IC, 6 ... Wire (Au wire), 7 ... Wiring pattern, 8 ... Optical waveguide.
フロントページの続き (72)発明者 ▲高 ▼山 和俊 神奈川県横浜市戸塚区戸塚町216番地株式 会社日立製作所情報通信事業部内Continuation of the front page (72) Inventor ▲ Taka ▼ Yamatoshi Kazutoshi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock company Hitachi Information & Communication Division
Claims (4)
載され、光信号の受信機能を有する光受信モジュールに
おいて、パッケージ内部に直接配線パターンを設け、前
記受光素子をサブマウントを介さずに、前記パッケージ
内の配線パターンに、電気的接続を取りながら固定する
ことを特徴とする光受信モジュール。1. An optical receiving module having a plurality of light receiving elements mounted in the same package and having an optical signal receiving function, wherein a wiring pattern is directly provided inside the package, and the light receiving elements are not provided via a submount, An optical receiver module, which is fixed to a wiring pattern in the package while making an electrical connection.
一体形成し、導波路と一体化した複数個の受光素子をサ
ブマウントを介さずに、上記パッケージ内の配線パター
ンと電気的接続を取りながら直接固定することを特徴と
する請求項１の光受信モジュール。2. The plurality of light receiving elements are integrally formed with an optical waveguide, and the plurality of light receiving elements integrated with the waveguide are electrically connected to the wiring pattern in the package without using a submount. The optical receiving module according to claim 1, wherein the optical receiving module is directly fixed while being taken.
ルにおいて、パッケージ内部に配線パターンを設け、１
ｃｈの受光素子をサブマウントを介さずに、前記パッケ
ージ内の配線パターンに、電気的接続を取りながら固定
することを特徴とする光受信モジュール。3. An optical receiving module having an optical signal receiving function, wherein a wiring pattern is provided inside a package, and 1
An optical receiving module, characterized in that a light receiving element of ch is fixed to a wiring pattern in the package while making an electrical connection without using a submount.
一体形成し、導波路と一体化した１ｃｈの受光素子をサ
ブマウントを介さずに、上記パッケージ内の配線パター
ンと電気的接続を取りながら直接固定することを特徴と
する請求項３の光受信モジュール。4. The 1-ch light receiving element is integrally formed with an optical waveguide, and the 1-ch light receiving element integrated with the waveguide is electrically connected to a wiring pattern in the package without a submount. The optical receiving module according to claim 3, wherein the optical receiving module is fixed directly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5246566A JPH07106607A (en) | 1993-10-01 | 1993-10-01 | Optical receiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5246566A JPH07106607A (en) | 1993-10-01 | 1993-10-01 | Optical receiver module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07106607A true JPH07106607A (en) | 1995-04-21 |
Family
ID=17150325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5246566A Pending JPH07106607A (en) | 1993-10-01 | 1993-10-01 | Optical receiver module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07106607A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0893861A3 (en) * | 1997-07-25 | 2000-01-12 | Oki Electric Industry Co., Ltd. | Optical module |
-
1993
- 1993-10-01 JP JP5246566A patent/JPH07106607A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0893861A3 (en) * | 1997-07-25 | 2000-01-12 | Oki Electric Industry Co., Ltd. | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20020226 |