JPH07101667B2 - Proximity exposure system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial field of application) The present invention relates to a proximity exposure apparatus in which a mask and an image-receiving member are arranged at a distance such that they do not touch each other.

(Conventional technology) Examples of exposure technology include thin liquid crystal display (TFT-LC
Some of them are applied to the manufacturing process of solid-state devices having a large area such as D), TFD, and thermal printer head. Such exposure technology includes a lens projection method, a proximity method, and a reflection mirror projection method.

FIG. 9 is a block diagram of an exposure apparatus to which the lens projection method is applied. An ultra-high pressure mercury lamp 2 is arranged inside the elliptic mirror 1, and light emitted from the lamp 2 is reflected by a mirror 3, passes through a lens 4, a filter 5, and a fly-eye lens 6 and is sent to a mirror 7. The mirror 7 is arranged above the XY stage 8, and the light reflected by the mirror 7 passes through the condenser lens 9, the mask 10 and the projection lens 11, and is applied to the plate 12 on the XY stage 8. Thus, the pattern formed on the mask 10 is transferred to the plate 12.

Next, FIG. 10 is a configuration diagram of an exposure apparatus to which the proximity method is applied. In this method, the mask 20 and the plate 21 are arranged with a space such that they do not touch each other. Elliptical mirror
An ultra-high pressure mercury lamp 23 is arranged inside 22. Light emitted from this lamp 23 is reflected by a mirror 24, and further passes through a lens 25, a filter 26 and a fly-eye lens 27 to form a concave mirror.
Sent to 28. Since the concave mirror 28 is arranged above the mask 20 and the plate 21, the light reflected by the concave mirror 28 passes through the mask 20 and is applied to the plate 21. Thus, the pattern formed on the mask 20 is transferred to the plate 21.

FIG. 11 is a configuration diagram of an exposure apparatus to which the reflection mirror projection system is applied. This method masks the exposure light 3
0, then send to concave mirror 33 through optical system 31, lens 32,
Further, the reflected light from the concave mirror 33 is guided to the plate 34 by the optical system 31. As a result, the pattern formed on the mask 30 is transferred to the plate 34.

Although the three methods have been described above, in these methods, the plates 12, 21, 34 are subject to the influence of various processes, for example, semiconductor processes, and thus expansion, contraction, distortion, and bending occur. Therefore, the patterns of the masks 10, 20, and 30 on the plates 12, 21, and 34 cannot be accurately transferred unless some correction is performed. For example, if the plate is a glass used in a liquid crystal display, the transfer to this glass is repeated 3 to 8 times. Therefore, if the plate is stretched or contracted, it is not possible to perform accurate overbaking. In particular, the liquid crystal display is large, so it is required that it is not affected by stretching or shrinking.

(Problems to be Solved by the Invention) When the plate is stretched, contracted, distorted, or bent as described above, the mask pattern cannot be accurately transferred.

Therefore, it is an object of the present invention to provide a proximity exposure apparatus capable of accurately transferring a mask pattern even when a plate is deformed such as expansion, contraction, distortion, and bending.

[Structure of the Invention] (Means for Solving the Problem) The present invention provides an XY table for holding a transfer target, and an exposure pattern formed in proximity to the transfer target held by the XY table. Each time the exposure light is moved by one scanning width in the Y direction with respect to the transfer target via the mask, the transfer target is repeatedly scanned to scan the transfer target, and the exposure pattern is transferred to the transfer target. The exposure light scanning means for transferring to the transfer target, the deformation amount detection means for detecting the deformation amount of the transfer object in the exposure light scanning direction, and the XY value based on the deformation amount of the transfer object detected by the deformation amount detection means. A proximity exposure apparatus for achieving the above object, comprising: a transfer-body-deformation correction unit that drives a table in synchronization with one scan in the X direction by the exposure light scanning unit to correct the amount of deformation of the transfer-source member. Is.

Further, according to the present invention, the exposure light is moved in the X direction each time the scanning light is moved in the Y direction with respect to the transfer target through the mask which is arranged close to the transfer target and on which the exposure pattern is formed. The optical scanning means for exposure, which scans the transferred material by repeating one scanning step to transfer the exposure pattern to the transferred material, the mask support means for supporting the mask in a stretchable manner, and the exposure light for the transferred material. Deformation amount detection means for detecting the deformation amount in the scanning direction, and the mask support means for the X-ray scanning means for exposing the mask support means based on the deformation amount of the transferred body detected by the deformation amount detection means.
And a transfer-body-deformation correcting unit that expands and contracts in synchronization with one scan in a direction to correct the amount of deformation of the transfer-receiving body, and is a proximity exposure apparatus that achieves the above object.

Further, the present invention is the proximity exposure apparatus in which the mask support means is an electrostrictive element or a magnetostrictive element.

Further, according to the present invention, the exposure light is moved in the X direction each time the scanning light is moved in the Y direction with respect to the transfer target through the mask which is arranged close to the transfer target and on which the exposure pattern is formed. The exposure light is provided between the mask and the exposure light scanning unit, and the exposure light scanning unit that scans the transfer target by repeating one scanning step to transfer the exposure pattern to the transfer target and opens the exposure light. A shutter unit that adjustably shields light, a deformation amount detection unit that detects a deformation amount of a transfer target in the exposure light scanning direction, and a shutter unit that is based on the deformation amount of the transfer target detected by the deformation amount detection unit. And a transfer-body-deformation-correcting unit that adjusts the opening degree of the transfer light in synchronization with one scan in the X direction to correct the amount of deformation of the transfer-receiving body. It is an exposure device.

In addition, the present invention transfers the exposure light through an XY table that holds the transferred material and a mask that is arranged close to the transferred material that is held by the XY table and that has an exposure pattern formed. An exposure light scanning unit that scans the transferred object by repeating one scanning in the X direction each time the object moves by one scanning width in the Y direction and transfers the exposure pattern to the transferred object, and a mask. A mask support unit that supports the contraction and expansion, a shutter unit that is provided between the mask and the exposure light scanning unit and that shields the exposure light with adjustable opening, and a deformation amount of the transfer target in the exposure light scanning direction. Based on the deformation amount of the transferred object detected by the deformation amount detecting means, the XY table is driven in synchronization with one scanning in the X direction by the exposure light scanning means. First transferred body for correcting the amount of deformation of Based on the deformation amount of the transferred object detected by the shape correction means and the deformation amount detecting means, the mask supporting means is expanded and contracted in synchronization with one scanning in the X direction by the exposure light scanning means to change the transferred amount of the transferred object. A second transfer-body-deformation correcting unit that corrects the opening amount of the shutter unit based on the deformation amount of the transfer-subject detected by the deformation amount detecting unit, and the X-axis of the exposure light scanning unit.
A proximity exposure apparatus for achieving the above-mentioned object, comprising: a third transfer-body-deformation correcting unit that adjusts in synchronization with one scan in the direction to correct the amount of deformation of the transfer-receiving body.

(Operation) According to the proximity exposure apparatus having such means, the XY table is moved in the X direction by the exposure light scanning means based on the deformation amount of the transferred material by the first transferred material deformation correcting means. Since the amount of deformation of the transferred material is corrected by driving in synchronization with scanning, the exposure error due to the deformation of the transferred material is corrected on the order of μm, and deformation such as elongation, distortion, and bending of the transferred material is prevented. Even if it occurs, it becomes possible to accurately transfer the pattern of the transferred material, and as a result, the product yield is remarkably improved and the cost can be reduced.

Further, according to the proximity exposure apparatus including the above-mentioned means, the mask supporting means is exposed to the optical scanning for exposure on the basis of the deformation amount of the transferred material detected by the deformation amount detecting means by the second transferred material deformation correcting means. Since the amount of deformation of the transferred material is corrected by expanding and contracting in synchronization with one scan in the X direction by the means, the exposure error due to the deformation of the transferred material is corrected in the order of μm in the same manner as described above. Even if deformations such as stretching, distortion, and bending occur, the pattern of the transfer target can be accurately transferred.

Further, according to the proximity exposure apparatus having the above-mentioned means, the opening degree of the shutter means is exposed for exposure based on the deformation amount of the transferred body detected by the deformation amount detecting means by the third transferred body deformation correcting means. Since the amount of deformation of the transferred material is corrected by adjusting in synchronization with one scan in the X direction by the optical scanning means, the exposure error due to the deformation of the transferred material is corrected in the order of μm in the same manner as described above. Even if the transfer body is deformed, such as stretched, distorted, or bent, the pattern of the transferred body can be accurately transferred.

Further, according to the proximity exposure apparatus having the above means, the deformation amount of the transferred body is corrected by any of the first, second or third transferred body deformation correcting means. The exposure error due to the deformation of the transferred material is corrected in the order of μm, and the pattern of the transferred material can be accurately transferred even if the transferred material is deformed such as elongation, distortion, and bending.

(Example) Hereinafter, one example of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of a proximity exposure apparatus. An X table 41 is provided on the Y table 40, and a Z / tilt / θ / vertical / tilt and rotary table (hereinafter abbreviated as a table) 42 is provided on the X table 41. Then, the plate 43 is placed on the table 42. In this case, the plate 43 is attracted by a vacuum or an electrostatic chuck provided on the table 42.

A pedestal system 44 is provided above the table 42.
This pedestal system 44 holds a mask 45 and a condenser lens 46.
Are arranged. The mask 45 is adsorbed and supported by an adsorption pad 45a as shown in FIG. A stretchable pad 45b is provided around the mask 45. The expansion / contraction pad 45b is formed of a piezoelectric element and expands / contracts the mask 45. The expansion / contraction pad 45b may be any electrostrictive element or magnetostrictive element. Also, mask 45
And the plate 43 are arranged at a distance of 10 to 50 μm.
A laser oscillator 45c and its light receiver 45d are provided to detect the gap between the mask 45 and the plate 43, the bending of the mask 45, and the like. These laser oscillator 45c and light receiver 45
Is arranged so that the laser beam is incident on and reflected from the mask 45 and the plate 43 at a predetermined angle.

Further, a shutter mechanism 47 is provided above the gantry system 44. This shutter mechanism 47 is specifically shown in FIG. 3 (a).
The configuration is shown in (b). The figure (a) is the figure seen from the upper side, and the figure (b) is the figure seen from the side. The slide supports 48, 49 are provided, and the shutter bodies 50, 51 are provided on the slide supports 48, 49 so as to be slidable in parallel with the arrow (a) direction, that is, the X direction. The shutter bodies 50, 51 are formed so that the thickness of their tip portions is thin and arranged so as to overlap with each other, and they slide. When the shutter bodies 50 and 51 overlap, a slit-shaped hole 52 is formed as shown in FIG.

Incidentally, alignment marks 53 and 54 are formed on the plate 43 and the mask 45, respectively, as an example. An alignment mark 53 is formed on the plate 43 in the Y direction,
Alignment marks 54 are formed in two rows on the mask 45 discontinuously at predetermined intervals in the Y direction.
FIG. 4 is a view showing a state in which the alignment marks 53 and 54 are superposed when viewed from above the mask 45 and the plate 43. Although these alignment marks 53 and 54 are shown only on one side in the drawing, the mask 45 and the plate are actually shown.
It is formed on both end sides of the X direction of 43, respectively.

Also, an alignment detection system 55 is provided. The alignment detection system 55 detects the position of each of the alignment marks 53, 54 and detects the state of the alignment between the mask 45 and the plate 43. The specific configuration is that an alignment light source 56 is provided, the light emitted from this alignment light source 56 is reflected by mirrors 57 and 58, and a half mirror 59 is also provided.
The plate 43 is irradiated therethrough, and the light reflected from the plate 43 is reflected by the half mirror 59 and guided to the light receiving element 60. A slit is provided in front of the light receiving element 60.
60a is arranged and vibrates in a predetermined cycle. That is, the vibration slit method is used to detect the alignment signal.

On the other hand, for example, a laser oscillator 61 is provided. A phase plate 62, a compound eye lens 63 and a collimator 64 are arranged in the laser output direction of the laser oscillator 61. Further, a polygon mirror 65 is arranged in the output direction of the collimated light from the collimator 64. The polygon mirror 65 is arranged above the condenser lens 46 and rotates in the arrow (b) direction at a predetermined rotation speed to scan the laser light in the X direction to condense the lens.
The mask 45 and the plate 43 are irradiated through 46.

Further, the table position measuring system 66 is provided close to the X table 41.
Is provided. As will be described later, the table position measuring system 66 has a laser interferometer as its main body, and irradiates the reference mirror 80 erected on the X table 41 with laser light, and reflects the reflected laser light. The position of the X table 41 is measured based on the above. Then, the position measurement signal from the table position measurement system 66 is output to the controller 67, and the controller 67 performs precise positioning of the X table 41 based on the position measurement result of the X table 41. Although not shown, the table position measuring system 66 is similar to the X table 41 and is similar to the Y table 40.
It also has a position measuring means.

The controller 67 receives a deformation amount of the plate 43, moves the X table 41 based on the deformation amount to correct the deformation of the plate 43, and expands / contracts the expansion / contraction pad 45b based on the deformation amount. It has a second correction function for correcting the deformation of the plate 43 and a third correction function for adjusting the opening / closing of the shutter mechanism 47 based on the deformation amount to correct the deformation of the plate 43. The controller 67 executes one of the correction functions described above. The correction drive signal obtained by the correction function of the controller 67 is sent to the driver 68.

The driver 68 synchronizes the movement of the Y table 40 and the rotation of the polygon mirror 56, operates the X table 41 in response to a correction drive signal, or expands or contracts the expansion pad 45b, or opens or closes the shutter mechanism 47. It works.

Next, the operation of the apparatus configured as described above will be described.

First, a case where the plate 43 is not deformed such as stretched, contracted, distorted, or bent will be described.

When the alignment light source 56 of the alignment detection system 55 is turned on, the light emitted from this light source 5 is reflected by the reflection mirrors 57, 58.
Is reflected on the mask 45 and the plate 43 through the half mirror 59. The light radiated to this plate 43 is reflected and returns to the half mirror 59 again.
It is reflected by 59 and reaches the light receiving element 60 through the slit 60a. At this time, since the slit 60a is vibrating, the amount of deviation of the alignment mark 53 of the plate 43 from each alignment mark 54 of the mask 45 can be measured, and the amount can be corrected. In this way, the mask 45 and the plate 43 are aligned.

When the alignment is completed, the controller 67 sends a drive control signal for rotating the polygon mirror 65 at a predetermined rotation speed to the driver 68, which causes the polygon mirror 65 to rotate. At the same time, the laser oscillator 61 outputs a laser. This laser is shaped into parallel light by an optical system (not shown), and the phase thereof is randomized by the next phase plate 62. That is, the laser is shaped so that interference does not occur when it is irradiated on the plate 43. The laser having passed through the phase plate 62 has a uniform light intensity by passing through the compound eye lens 63, and is shaped into a parallel beam by passing through the next collimator 64. This parallel beam is sent to the polygon mirror 65 and scanned by the polygon mirror 65 in the X direction. This scanned parallel beam is a condenser lens
The mask 45 scans the mask 45 in the X direction. When one scan of the parallel beam is completed, the controller 57 moves the Y table 40
A drive control signal for moving the scanning direction by one scanning width in the Y direction is transmitted. As a result, the Y table 40 moves in the Y direction by one scanning width. Again, the parallel beam is scanned on the mask 45 in the X direction. By repeating the above operation, the parallel beam is scanned over the entire surface of the mask 45, and as a result, the pattern of the mask 45 is transferred to the plate 43.

Then, on the plate 43, as shown in FIG.
A case where deformation such as bending occurs will be described.

Alignment marks 54 and 53 are formed on the mask 45 and the plate 43 at both ends in the X direction. Of these, alignment marks 54 and 53 on one side, such as alignment marks 54 and 53 shown on the left side of the drawing, are used for alignment. Is done. The table position measuring system 66 uses, for example, a laser interferometer, laser measurement can be performed by the reference mirror 80 on the X table, and positioning can be performed by the controller 67. The controller 67 sends a drive control signal to the X and Y tables 41, 40 according to the amount of deviation calculated by the alignment measurement. As a result, the alignment mark 53 is arranged in the middle of the alignment mark 54, and the mask 45 and the plate 43 are aligned on one side.

Next, the alignment detection system determines the positional relationship between the alignment marks 54 and 53 on the other surface of the mask 46 and the plate 43. The positions of the alignment marks 54, 53 are displaced in the X direction because the plate 43 is deformed as shown in FIG. The table position measuring system 66 measures this deviation, that is, the relative deformation amount of the plate 43 with respect to the mask 45. The measurement of the deformation amount of the plate 43 in the X direction is sequentially performed along the Y direction, and the measurement result of the deformation amount is stored in the controller 67. Then,
In this state, the polygon mirror 65 rotates in the same manner as described above, and the laser is output from the laser oscillator 61. Therefore, the parallel beam is scanned by the polygon mirror 65, and the parallel beam is irradiated onto the plate 43 through the mask 45. The Y table 40 is moved in the Y direction by one scanning width each time one scanning is performed.

By the way, since the controller 67 stores the deformation amount of the plate 43, the X table 40 is corrected and moved in the X direction by an amount corresponding to the deformation amount for each scanning. This correction movement is performed in synchronization with one scanning of the parallel beam. For example, if the plate 43 extends, the X table 40 moves by the length of this extension. This will be scanned longer than the normal scan length. In this way, the correction in the X direction is performed for each scanning, and when the scanning of the entire surface of the plate 43 is completed, the pattern of the mask 45 is transferred to the plate 43.

Next, another correction technique will be described.

As described above, the deformation amount of the plate 43 is obtained by the table position measuring system 66, and this deformation amount is sent to the controller 67. In this state, the polygon mirror 65 is rotated in the same manner as above, and a laser is output from the laser oscillator 61. This laser is scanned by the polygon mirror 65 as a parallel beam, and the parallel beam is irradiated onto the plate 43 through the mask 45. It The Y table 40 is moved in the Y direction by one scanning width each time one scanning is performed.

By the way, since the controller 67 stores the deformation amount of the plate 43, the expansion / contraction pad 45b is finely moved by a distance corresponding to the deformation amount each time one scanning is performed. This fine movement is performed in synchronization with one scanning of the parallel beam. In this way, the correction in the X direction is performed for each scanning, and when the scanning of the entire surface of the mask 43 is completed, the pattern of the mask 45 is transferred to the plate 43.

Still another correction technique will be described.

As described above, the deformation amount of the plate 43 is obtained by the table position measuring system 66, and this deformation amount is sent to the controller 67. In this state, the polygon mirror 65 is rotated in the same manner as above, and a laser is output from the laser oscillator 61. This laser is scanned by the polygon mirror 65 as a parallel beam, and the parallel beam is irradiated onto the plate 43 through the mask 45. It The Y table 40 is moved in the Y direction by one scanning width each time one scanning is performed.

By the way, since the controller 67 stores the amount of deformation of the plate 43, each shutter body 50, 51 of the shutter mechanism 47 is synchronized with one scan and the opening degree of the hole 52 corresponds to the amount of deformation every one scan. Be adjusted. In this way, the opening degree of the shutter mechanism 47 is adjusted for each scanning, and the pattern of the mask 45 is transferred to the plate 43.

As described above, the present invention detects the amount of deformation of the plate 43 and mounts the plate 43 on the basis of the amount of deformation.
To move the plate 43 to correct the deformation,
Further, since the expansion / contraction pad 45b corrects the deformation of the plate 43 based on the deformation amount, and further the opening / closing of the shutter mechanism 47 is adjusted based on the deformation amount to correct the deformation of the plate 43, the expansion to the plate 43 occurs. The pattern of the mask 45 can be accurately transferred even if deformation such as shrinkage, distortion, and bending occurs. For example, the resolution of the transfer pattern can be about 5 μm if the distance between the mask 45 and the plate 43 is 20 to 50 μm. or,
Alignment enables resolution of 0.5 μm. on the other hand,
Although the exposure time depends on the area of the plate 43 and the resist sensitivity, it is almost the same as that of the conventional proximity method. Also, by varying the length of the hole 52 of the shutter mechanism 47 in the longitudinal direction, transfer can be performed according to the size of the plate 43. Therefore, it is possible to correct the plate distortion of about 10 μm with a high resolution of 10 μm or less by utilizing the high throughput and low cost optical system which is the characteristic of the proximity method.

It should be noted that the present invention is not limited to the above-described embodiment, and may be modified without departing from the spirit of the invention. For example, the scanning of the laser light is not limited to the polygon mirror, and may be changed to an acoustic effect element, a galvano mirror, or the like. Further, as shown in FIG. 7, the concave mirror 70 is arranged above the mask 45 and the plate 43, and the shutter mechanism 47 is arranged between the concave mirror 70 and the mask 45. The exposure light is masked via the concave mirror 70.
The light is thrown so that it irradiates the entire surface of 45, and in this state, the length in the longitudinal direction of the hole 52 of the shutter mechanism 47 is adjusted according to the deformation amount of the plate 43 while moving the shutter mechanism 47. 8th
The figure shows the movement of the shutter mechanism 47 and the length of the hole 52 in the longitudinal direction. On the other hand, the configuration of the alignment detection system 55 is not limited to the laser oscillator 61.

[Effect of the Invention] As described above, in the present invention, the transfer target is corrected by driving the XY table in synchronization with the scanning of the light for exposure based on the deformation of the transfer target. In accordance with the amount of deformation of the exposure light, the mask support means is expanded and contracted to correct the amount of deformation of the transfer target, or in synchronization with the scanning of the exposure light based on the amount of deformation of the transfer target. Since the opening amount of the shutter means is adjusted to correct the deformation amount of the transferred material, the deformation can be corrected in synchronization with one scanning of the exposure light, and the exposure error due to the deformation of the subject can be corrected in the order of μm. It is possible to accurately transfer the pattern of the transferred material even if the transferred material is deformed such as stretched, distorted or bent.
As a result, it is possible to provide a proximity exposure apparatus that can significantly improve the product yield and contribute to cost reduction.

[Brief description of drawings]

1 to 6 are views for explaining one embodiment of a proximity exposure apparatus according to the present invention, wherein FIG. 1 is a configuration diagram, FIG. 2 is a diagram showing peripheral members of a mask, and FIG. 3 is a configuration diagram of a shutter mechanism, FIG. 4 is a diagram showing an alignment mark, FIG. 5 is a diagram showing scanning with respect to the alignment mark, FIG. 6 is a diagram showing expansion and contraction of a plate, and FIGS. FIG. 9 and FIG. 11 which show a modified example are configuration diagrams of a conventional technique. 40 …… Y table, 41 …… X table, 42 …… Zθ tilt table, 43 …… Plate, 44 …… Stand system, 45 …… Mask, 45a …… Suction pad, 45b …… Expansion pad, 46… …
Condenser lens, 47 ... Shutter mechanism, 53, 54 ... Alignment mark, 55 ... Alignment detection system, 61 ... Laser oscillator, 62 ... Phase plate, 63 ... Compound eye lens, 64 ... Collimator, 65 ... … Polygon mirror, 66 …… Table position measurement system, 67 …… Controller, 68 …… Driver.

 ─────────────────────────────────────────────────── --Continued from the front page (56) Reference JP-A-50-158345 (JP, A) JP-A-56-88319 (JP, A) JP-A-55-48489 (JP, A) JP-A-62- 122216 (JP, A) JP 58-118648 (JP, A) JP 63-283022 (JP, A) JP 62-69519 (JP, A) JP 56-55042 (JP, A) Japanese Patent Publication Sho 51-5539 (JP, B1)

Claims (5)

[Claims] 1. An exposure light is passed through an XY table for holding a transfer target and a mask having an exposure pattern formed in proximity to the transfer target held by the XY table. An optical scanning means for exposure that scans the transfer target by repeating one scan in the X direction each time the transfer member moves by one scanning width in the Y direction, and transfers the exposure pattern to the transfer target. A deformation amount detecting means for detecting a deformation amount of the transferred object in the exposure light scanning direction, and the XY table is exposed based on the deformation amount of the transferred object detected by the deformation amount detecting means. A proximity exposure apparatus comprising: a transfer member deformation correction unit that is driven in synchronization with one scanning in the X direction by the optical scanning unit to correct the amount of deformation of the transfer member. 2. The X-direction is moved every time the exposure light is moved by one scanning width in the Y-direction with respect to the transferred body through a mask which is arranged close to the transferred body and has an exposure pattern formed thereon. An optical scanning unit for exposure that scans the transfer target by repeating one scanning step to transfer the exposure pattern to the transfer target; a mask supporting unit that supports the mask in a stretchable manner; Deformation amount detection means for detecting the deformation amount of the body in the exposure light scanning direction, and the mask support means for exposing light scanning means based on the deformation amount of the transferred body detected by the deformation amount detection means. And a transfer-body-deformation-correction unit that expands and contracts in synchronization with one scan in the X direction to correct the amount of deformation of the transfer-receiving body, the proximity exposure apparatus. 3. The proximity exposure apparatus according to claim 2, wherein the mask support means is an electrostrictive element or a magnetostrictive element. 4. The X-direction is moved every time the exposure light is moved by one scanning width in the Y-direction with respect to the transferred body via a mask which is arranged close to the transferred body and has an exposure pattern formed thereon. Is provided between the mask and the exposure light scanning unit, and the exposure light scanning unit that scans the transfer target by repeating one scanning step to transfer the exposure pattern to the transfer target. A shutter means for blocking the exposure light so that its opening can be adjusted freely, a deformation amount detecting means for detecting a deformation amount of the transferred object in the exposure light scanning direction, and the transferred object detected by the deformation amount detecting means. A transfer-body-deformation correction unit that adjusts the opening of the shutter unit in synchronization with one scan in the X direction by the exposure light scanning unit based on the deformation amount of the body and corrects the amount of deformation of the transfer-subject; A proxy characterized by having Miti exposure equipment. 5. An exposure light is passed through an XY table holding a transfer target and a mask having an exposure pattern formed in proximity to the transfer target held by the XY table. An optical scanning means for exposure that scans the transfer target by repeating one scan in the X direction each time the transfer member moves by one scanning width in the Y direction, and transfers the exposure pattern to the transfer target. A mask supporting unit that supports the mask in a stretchable manner; a shutter unit that is provided between the mask and the exposure light scanning unit and that shields the exposure light with an adjustable opening. Of deformation amount detecting means for detecting the deformation amount of the exposure light scanning direction, and the XY table is moved by the exposure light scanning means based on the deformation amount of the transferred body detected by the deformation amount detecting means. In one scan of direction A first transfer-body-deformation correction unit that drives the transfer-target member in time to correct the deformation amount of the transfer-target member; and the mask support unit based on the deformation amount of the transfer-target member detected by the deformation amount detection unit. Second transferred member deformation correction means for expanding and contracting in synchronization with one scanning in the X direction by the exposure light scanning means to correct the amount of deformation of the transferred material, and the transferred material detected by the deformation amount detecting means. Third transfer-body-deformation correction for correcting the amount of deformation of the transferred body by adjusting the opening degree of the shutter means in synchronization with one scan in the X direction by the exposure light scanning means based on the amount of deformation of the body. A proximity exposure apparatus comprising: