JPS6269519A - Irradiation method for ultraviolet ray laser - Google Patents
Irradiation method for ultraviolet ray laserInfo
- Publication number
- JPS6269519A JPS6269519A JP60209849A JP20984985A JPS6269519A JP S6269519 A JPS6269519 A JP S6269519A JP 60209849 A JP60209849 A JP 60209849A JP 20984985 A JP20984985 A JP 20984985A JP S6269519 A JPS6269519 A JP S6269519A
- Authority
- JP
- Japan
- Prior art keywords
- ultraviolet ray
- reflection mirror
- reflecting mirror
- mask
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Optical Scanning Systems (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、透光性のフィルム等に形成された回路パター
ンのマスクを介してプリント基板等の上に塗布された紫
外線硬化型レジスト」−に紫外線レーザーからの紫外線
を照射してマスクに形成されている回路パターンを焼付
【ノる露光装置の紫外線レーザー照射方法に関するもの
で、微細な画像を形成する必要のある分野で利用するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention applies ultraviolet rays to an ultraviolet curing resist coated onto a printed circuit board or the like through a circuit pattern mask formed on a translucent film or the like. This relates to the ultraviolet laser irradiation method of exposure equipment and is used in fields where it is necessary to form fine images.
さらに本発明照射方法は、紫外線硬化型m filある
いは印刷インキなどの焼付(1分野にも利用できるもの
である。Furthermore, the irradiation method of the present invention can also be used in the printing of ultraviolet curing type mfil or printing ink.
従来の技術
プリン]へ基板製造等においては、回路パターンが微細
化の傾向にあり、露光装置の解像力をトげる必要がある
。マスクに形成された微細な回路パターンを紫外線硬化
型の■ツヂングレジストあるいはソルダーレジスト等の
レジストをI Wiしたプリント基板に露光して焼付け
るためには、解像力の点から平行光が必要なので、従来
は点光源に近い超高圧放電灯と光学系とを組合せて平行
光をつくる照a4方法が促案されている。BACKGROUND OF THE INVENTION In circuit board manufacturing and the like, there is a trend toward miniaturization of circuit patterns, and it is necessary to improve the resolution of exposure equipment. In order to expose and print a fine circuit pattern formed on a mask onto a printed circuit board coated with an ultraviolet curing resist, such as a soldering resist or solder resist, parallel light is required from the viewpoint of resolution. Conventionally, a lighting A4 method has been proposed in which parallel light is created by combining an ultra-high pressure discharge lamp, which is close to a point light source, and an optical system.
第2図は従来のこの種の露光装置の照射方法の一例を示
すものである。図において、6は超高圧水銀灯等の超高
圧放電灯、7は楕円面鏡、8は第一次反射鏡、9はイン
チグレーター、10は第二次段銅鏡、IN、を回路パタ
ーンが形成されているマスク、12はレジス1〜が塗布
さねでいるプリント基板である。超高圧放電灯6からの
紫外線光は、楕円面鏡7を介して第一次反射鏡8に集光
され、その光がほぼ90度向きを変えて反射され、複数
の小さいレンズで構成されているインチグレーター9を
透過して第二次反射鏡10に照射される。第二次反射鏡
10はプリン1一基板12に対してほぼ45度の傾斜を
持たせて設置されており、第二次反!)J鏡10で反射
された光はマスク11を介してプリント基板12に照射
され、マスク11の回路パターンがプリント基板12の
上に塗布されたレンズ(へに焼付けられる。FIG. 2 shows an example of a conventional irradiation method of this type of exposure apparatus. In the figure, 6 is an ultra-high-pressure discharge lamp such as an ultra-high-pressure mercury lamp, 7 is an ellipsoidal mirror, 8 is a primary reflecting mirror, 9 is an inch grater, and 10 is a second-stage copper mirror, IN, on which a circuit pattern is formed. The mask 12 is a printed circuit board on which the resists 1 to 1 are coated. The ultraviolet light from the ultra-high pressure discharge lamp 6 is focused on the primary reflecting mirror 8 via the ellipsoidal mirror 7, and the light is reflected by changing the direction approximately 90 degrees, and is composed of a plurality of small lenses. The light passes through the inch grater 9 and is irradiated onto the secondary reflecting mirror 10. The secondary reflecting mirror 10 is installed with an inclination of approximately 45 degrees with respect to the printer 1 and the substrate 12, and the secondary reflecting mirror 10 is installed at an angle of approximately 45 degrees with respect to the printer 1 and the substrate 12. ) The light reflected by the J mirror 10 is irradiated onto the printed circuit board 12 through the mask 11, and the circuit pattern of the mask 11 is printed onto the lens coated on the printed circuit board 12.
第一次反射鏡8には超高圧政電灯6からの熱線を透過さ
せるためにコールドミラーを使用する。インチグレータ
ー9は紫外線光の透過率を良くするため、石英製の小さ
な凸レンズを組合せて構成しである。A cold mirror is used as the primary reflecting mirror 8 in order to transmit the heat rays from the ultra-high pressure electric lamp 6. The inch grater 9 is constructed by combining small convex lenses made of quartz in order to improve the transmittance of ultraviolet light.
発明が解決しようとする問題点
プリント基板等の被照射物の焼付けのための露光時間は
被照射物の紫外線強度の最小値のところで決まるので、
出来るだけ高い値で均一に照射することが必要である。Problems to be Solved by the Invention Since the exposure time for printing an irradiated object such as a printed circuit board is determined by the minimum value of the ultraviolet intensity of the irradiated object,
It is necessary to uniformly irradiate at a value as high as possible.
しかるに上記したような従来の方式では、インチグレー
タ一部やR終段の反射鏡を工夫して均斉度を改善してい
るが、インチグレータ一部を出た紫外線光は拡がりがあ
るので、どうしても紫外線強度の分布は中心部が端部よ
り高(なる。均斉瓜をより良くするため、光路長を長く
したり、あるいは被照射物の大きさに対して照射面積を
太き(するなどの方法もあるが、いずれも紫外線強度が
低下し、露光時間(焼付時間)が艮(なるという問題が
あった。さらに解像力の改善のために平行度を改善し1
.> LJればむらないが、その方法として最終段の反
射鏡を平面鏡から放物面鏡にするなどの方法があるが、
放物面鏡の(t J:げが不充分であると部分的に平行
度が悪くなり、プリント基板等の製品の品質に影響り−
るという問題が生じる。また良質の鏡面に仕上げると価
格が非常に高くなるなどの問題が生じる。However, in the conventional method described above, the degree of uniformity is improved by devising a part of the inch grater and the reflector at the final stage of R, but since the ultraviolet light that exits the part of the inch grater is spread out, The distribution of ultraviolet light intensity is higher at the center than at the edges.To improve the uniformity, the optical path length may be lengthened, or the irradiation area may be increased relative to the size of the object to be irradiated. However, in both cases, the intensity of ultraviolet rays decreased and the exposure time (printing time) became longer.Furthermore, in order to improve resolution, parallelism was improved.
.. > LJ would be fine, but there are ways to do this, such as changing the final stage reflecting mirror from a plane mirror to a parabolic mirror.
If the parabolic mirror (tJ:) is insufficient, the parallelism will deteriorate in some areas, which will affect the quality of products such as printed circuit boards.
The problem arises that Furthermore, if the mirror surface is finished to a high quality, there will be problems such as an extremely high price.
本発明は−に記した如き問題点を解消した、露光装置等
にお(′、Iる紫外線シー1j−照射方法を提供するも
のである。The present invention provides a method of irradiating ultraviolet light to an exposure apparatus, etc., which solves the problems described in (1) and (1) above.
問題点を解決するための手段
即ち本発明は、光源として平行光線である紫外線レーザ
ーを使用し、微細化のための解像力の改善は図り、かつ
広い被照射面に、被照射物を動かすことなく、紫外線レ
ーザーからの紫外線光を均一に照射させるために、長方
形の平面反射鏡と多面体の回転反射鏡との2種類の反射
鏡を組合せ、この2つの反射鏡を対向して配置し、かつ
前記平面反射鏡を回転反射鏡に対して直角的関係で前後
に移動させることにより、紫外線レーザーからの紫外線
光を被照射物に均一に照射できるようにしたものである
。A means to solve the problem, that is, the present invention, uses a parallel ultraviolet laser as a light source, improves resolution for miniaturization, and illuminates a wide irradiated surface without moving the irradiated object. In order to uniformly irradiate the ultraviolet light from the ultraviolet laser, two types of reflecting mirrors, a rectangular plane reflecting mirror and a polyhedral rotating reflecting mirror, are combined, and these two reflecting mirrors are arranged facing each other. By moving the flat reflecting mirror back and forth at right angles to the rotating reflecting mirror, the object to be irradiated can be uniformly irradiated with ultraviolet light from the ultraviolet laser.
作 用
プリント基板等の被照射物の面」−に設置した多面体の
回転反射鏡で、紫外線レーザーからの紫外線光を受けて
その紫外線光を該回転反射鏡に対向して配置された長方
形の平面反射鏡に向けて反射させる。このようにすると
平面反射鏡の面一トには回転反射鏡で左右に散らされた
紫外線光が紫外線レーザーのスポット径の大きさに相当
16幅で帯状に照射される。さらに平面反射鏡を被照射
物の面上に、被照射物に対して約45度の角度の傾きを
持たせて配置し、かつ回転反!iJ4鏡に対して直角的
関係で被照射物面上を前後に移動さける。このようにす
ると前記の平面反射鏡に帯状に照射された紫外線光は平
面反射鏡により下向き方向に反射されて、被照射物面上
に帯状に照射され、かつこの被照射物面上の帯状の紫外
線光は平面反l)1鏡の移動にともなって被照射面上を
移動するので、固定された被照射物の全面に紫外線レー
ザーからの平行度の高い紫外線光を均一に照射すること
ができる。A polyhedral rotating reflector installed on the surface of the object to be irradiated, such as a printed circuit board, receives ultraviolet light from an ultraviolet laser and directs the ultraviolet light to a rectangular plane placed opposite the rotating reflector. Reflect it towards the reflector. In this way, the entire surface of the flat reflecting mirror is irradiated with the ultraviolet light scattered left and right by the rotating reflecting mirror in a band shape with a width of 16, which corresponds to the spot diameter of the ultraviolet laser. Furthermore, a flat reflecting mirror is placed on the surface of the irradiated object at an angle of about 45 degrees with respect to the irradiated object, and rotated in the opposite direction! Avoid moving back and forth on the surface of the irradiated object at right angles to the iJ4 mirror. In this way, the ultraviolet light irradiated onto the flat reflecting mirror in a band-like manner is reflected downward by the flat reflecting mirror and is irradiated onto the surface of the irradiated object in a band-like manner, and Since the ultraviolet light moves over the irradiated surface as the mirror moves, the entire surface of the fixed object can be uniformly irradiated with highly parallel ultraviolet light from the ultraviolet laser. .
実施例 以下、本発明の一実施例を第1図を用いて説明する。Example An embodiment of the present invention will be described below with reference to FIG.
図において、1は紫外線レーザー、2は紫外線レーザー
1からの入射光Cを左右に振らしながら前方向に反射さ
せる多面体の回転反IJ1iff、3は回転反射鏡2に
よって形成された幅が紫外線レーザーのスポット径にほ
ぼ相当する帯状の紫外線光をほぼ90度垂直下方向に反
射させる長方形の平面反射鏡、4はプリント基板用の回
路パターンを構いたマスク、5はレジストを塗布したプ
リント基板である。また多面体の回転反射鏡2と長方形
の平面反射鏡3とはマスク4十に対向して配置されてお
り、さらに平面反射鏡3はマスク4に対して45磨の角
度に傾斜しCいて、かつ回転反射鏡2と直角的関係でB
−8’方向に前後移動するようになっている。In the figure, 1 is an ultraviolet laser, 2 is a rotating inverse IJ1iff of a polyhedron that reflects the incident light C from the ultraviolet laser 1 in the front direction while swinging it from side to side, and 3 is the width formed by the rotating reflector 2 of the ultraviolet laser. A rectangular plane reflecting mirror reflects a band of ultraviolet light approximately equivalent to the spot diameter vertically downward by approximately 90 degrees, 4 is a mask with a circuit pattern for a printed circuit board, and 5 is a printed circuit board coated with resist. Further, the polyhedral rotary reflecting mirror 2 and the rectangular plane reflecting mirror 3 are arranged opposite to the mask 40, and the plane reflecting mirror 3 is inclined at an angle of 45 degrees C with respect to the mask 4, and B in a perpendicular relationship with the rotating reflector 2
It is designed to move back and forth in the -8' direction.
かかる本発明実施例において、紫外線レーザー1から出
た紫外線光Cは多面体の回転反射鏡2で水平方向に反射
されて、長方形の平面反射鏡3に照(ト)される。この
とき紫外線光Cは多面体の回転反射鏡2により左右に振
られ、平面反射813のΔ一へ面上に、紫外線光Cのス
ポット径の大きさにほぼ相当する幅で帯状に照射される
。平面反射鏡3に照射された帯状の紫外線光は、45度
に傾斜した平面反射鏡3によって90r!1向きを変え
られ垂直下方向に反射され、被照射面であるマスク4の
上に照射される。さらに平面反射鏡3はBからB′力方
向移動させることにより、マスク4の面子に、帯状の紫
外線光を移動させることができ、これによりマスク4に
形成された回路パターンをプリン1〜基板5に焼付ける
ことができる。In this embodiment of the present invention, the ultraviolet light C emitted from the ultraviolet laser 1 is reflected in the horizontal direction by a polyhedral rotating reflector 2, and is then illuminated by a rectangular plane reflector 3. At this time, the ultraviolet light C is swung left and right by the polyhedral rotating reflecting mirror 2, and is irradiated onto the surface of the plane reflection 813 in the form of a band with a width approximately corresponding to the spot diameter of the ultraviolet light C. The band-shaped ultraviolet light irradiated onto the flat reflecting mirror 3 is reflected by the flat reflecting mirror 3 tilted at 45 degrees at 90r! The direction of the light is changed, the light is reflected vertically downward, and the light is irradiated onto the mask 4, which is the surface to be irradiated. Further, by moving the flat reflecting mirror 3 in the force direction from B to B', it is possible to move the band-shaped ultraviolet light onto the face of the mask 4, thereby transferring the circuit pattern formed on the mask 4 to the printed circuit board 1 to the substrate 5. It can be burned into.
また回転位Ij1繞2及びりI面反射鏡3の鏡面t1上
げは紫外線の波長に合った什1−げにすることにより効
率的に反射さぼることができる。また紫外線強電や積咋
光吊を大ぎくづるためには平面反射鏡3の移動速度を減
速させるか、あるいはn −8’間を反復移動させるな
どによって行なう。またマスク4とレジストを塗布した
プリン1〜基板5とは、密着でも、非密着でも、紫外線
レーザーは良質の平行光であるのぐ高[1力の焼付けが
できる。また同一構成のものをプリント基板5に対して
−V、下に配置することにより、両面露光もできる。Further, the rotational position Ij1 of the roof 2 and the raising of the mirror surface t1 of the I-plane reflecting mirror 3 can be efficiently reflected by using a beam that matches the wavelength of ultraviolet rays. Further, in order to greatly reduce the intensity of ultraviolet rays and light beams, the moving speed of the plane reflecting mirror 3 is reduced, or the plane reflecting mirror 3 is moved repeatedly between n-8'. In addition, whether the mask 4 and the resist-coated prints 1 to 5 are in close contact or not, the ultraviolet laser can perform high-power printing using high-quality parallel light. Further, by placing a device having the same configuration at −V below the printed circuit board 5, double-sided exposure can be performed.
なお、本発明の方式は、プリント其板、スクリーン印刷
板、エツチングなどの微細な画像形成に応用できるほか
、塗料、インキなどの全面照射による焼付けなどにも利
用できるものである。The method of the present invention can be applied to fine image formation on printed boards, screen printing boards, etching, etc., and can also be used for printing paints, inks, etc. by irradiating the entire surface.
発明の効果
以上jホべたように本発明による紫外線レーザー照射方
法を用いると、紫外線レーザーの特徴である平行光線を
そのまま利用でき、高度の平行度が4、’l Iうれ、
解像力が向上し、微細な回路のプリント基板等の製造が
容易になり、かつ被照射面に均一な@剖ができ、良質の
画像を形成することができると共に、紫外線レーザーか
らの強力な紫外線光により焼付は速度を早めることがで
き、露光時間の短縮が図れ、その実用的効果は大きい。Effects of the Invention As mentioned above, by using the ultraviolet laser irradiation method according to the present invention, the parallel rays that are a characteristic of ultraviolet lasers can be used as they are, and the degree of parallelism is 4.
The resolution has been improved, making it easier to manufacture printed circuit boards with minute circuits, etc., making it possible to form uniform images on the irradiated surface, and forming high-quality images. As a result, the printing speed can be increased and the exposure time can be shortened, which has great practical effects.
【図面の簡単な説明】
第1図は本発明紫外線レーザー照射方法の一実施例を示
す立体図、第2図は従来の照射方式の一例を示す断面図
である。
1・・・紫外線レーザー、2・・・多面体の回転反射鏡
、3・・・長方形の平面反射鏡、4・・・マスク、5・
・・プリント基板BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a three-dimensional view showing an embodiment of the ultraviolet laser irradiation method of the present invention, and FIG. 2 is a sectional view showing an example of a conventional irradiation method. 1... Ultraviolet laser, 2... Polyhedral rotating reflector, 3... Rectangular plane reflector, 4... Mask, 5...
··Printed board
Claims (1)
紫外線レーザー照射方法において、長方形の平面反射鏡
と多面体の回転反射鏡とを対向して配置し、前記長方形
の平面反射鏡を前記回転反射鏡に対して直角的関係で前
後に移動させることにより、被照射物を動かすことなく
、均一に照射する紫外線レーザー照射方法。In an ultraviolet laser irradiation method in an exposure device or the like that irradiates ultraviolet rays from an ultraviolet laser, a rectangular plane reflecting mirror and a polyhedral rotating reflecting mirror are arranged facing each other, and the rectangular plane reflecting mirror is opposed to the rotating reflecting mirror. An ultraviolet laser irradiation method that irradiates the object uniformly by moving it back and forth at right angles, without moving the object.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60209849A JPS6269519A (en) | 1985-09-20 | 1985-09-20 | Irradiation method for ultraviolet ray laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60209849A JPS6269519A (en) | 1985-09-20 | 1985-09-20 | Irradiation method for ultraviolet ray laser |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6269519A true JPS6269519A (en) | 1987-03-30 |
Family
ID=16579638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60209849A Pending JPS6269519A (en) | 1985-09-20 | 1985-09-20 | Irradiation method for ultraviolet ray laser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6269519A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0473766A (en) * | 1990-07-16 | 1992-03-09 | Toshiba Corp | Proximity exposure device |
-
1985
- 1985-09-20 JP JP60209849A patent/JPS6269519A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0473766A (en) * | 1990-07-16 | 1992-03-09 | Toshiba Corp | Proximity exposure device |
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