JPH028473B2 - - Google Patents
Info
- Publication number
- JPH028473B2 JPH028473B2 JP60154409A JP15440985A JPH028473B2 JP H028473 B2 JPH028473 B2 JP H028473B2 JP 60154409 A JP60154409 A JP 60154409A JP 15440985 A JP15440985 A JP 15440985A JP H028473 B2 JPH028473 B2 JP H028473B2
- Authority
- JP
- Japan
- Prior art keywords
- reflecting mirror
- ultraviolet
- printed circuit
- ultraviolet laser
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、紫外線レーザーからの紫外線を透光
性のフイルム等に形成された回路パターンのマス
クを介してプリント基板等の上に塗布された紫外
線硬化型レジストに照射し、マスクに形成されて
いる回路パターンを焼付ける露光装置等における
紫外線レーザー照射方法に関するもので、微細な
画像を形成する必要のある分野で利用するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is an ultraviolet curing method that applies ultraviolet rays from an ultraviolet laser to a printed circuit board or the like through a circuit pattern mask formed on a translucent film or the like. This relates to an ultraviolet laser irradiation method in an exposure device or the like that irradiates a mold resist and prints a circuit pattern formed on a mask, and is used in fields where it is necessary to form fine images.
従来の技術
プリント基板製造等においては、回路パターン
が微細化の傾向にあり、露光装置の解像力を上げ
る必要がある。マスクに形成された微細な回路パ
ターンを紫外線硬化型のエツチングレジストある
いはソルダーレジスト等のレジストを塗布したプ
リント基板に露光して焼付けるためには、解像力
の点から平行光が必要なので、従来は点光源に近
い超高圧放電灯と光学系とを組合せて疑似平行光
をつくる照射方法が提案されている。2. Description of the Related Art In the manufacturing of printed circuit boards, etc., there is a trend toward miniaturization of circuit patterns, and it is necessary to increase the resolution of exposure equipment. In order to expose and print a fine circuit pattern formed on a mask onto a printed circuit board coated with a resist such as an ultraviolet curing etching resist or solder resist, parallel light is required from the viewpoint of resolution. An irradiation method has been proposed in which pseudo-parallel light is created by combining an ultra-high pressure discharge lamp close to the light source and an optical system.
第２図は従来のこの種の露光装置の照射方法の
一例を示したものである。図において、６は超高
圧水銀灯などの超高圧放電灯、７は楕円面鏡、８
は第一次反射鏡、９はインテグレーター、１０は
第二次反射鏡、１１は回路パターンが形成されて
いるマスク、１２はレジストが塗布されているプ
リント基板である。超高圧放電灯６からの紫外線
の光は、楕円面鏡７を介して第一次反射鏡８に集
光され、その光がほぼ90度向きを変えて反射さ
れ、インテグレーター９を透過して第二次反射鏡
１０に照射される。第二次反射鏡１０はプリント
基板１２に対してほぼ45度の傾斜を持たせて設置
されており、第二次反射鏡１０で反射された光は
マスク１１を介してプリント基板１２の全面に照
射され、マスク１１の回路パターンがプリント基
板１２の上に塗布されたレジストに焼付けられ
る。第一次反射鏡８には超高圧放電灯６からの熱
線を吸収させるためにコールドミラーを使用す
る。インテグレーター９は紫外線の透過率をよく
するため石英製の小さな凸レンズを組合せて構成
してある。 FIG. 2 shows an example of a conventional irradiation method of this type of exposure apparatus. In the figure, 6 is an ultra-high pressure discharge lamp such as an ultra-high pressure mercury lamp, 7 is an ellipsoidal mirror, and 8 is an ellipsoidal mirror.
1 is a primary reflecting mirror, 9 is an integrator, 10 is a secondary reflecting mirror, 11 is a mask on which a circuit pattern is formed, and 12 is a printed circuit board coated with resist. The ultraviolet light from the ultra-high pressure discharge lamp 6 is focused on the primary reflecting mirror 8 via the ellipsoidal mirror 7, the light is reflected by changing its direction by approximately 90 degrees, and transmitted through the integrator 9 to the primary reflecting mirror 8. The secondary reflecting mirror 10 is irradiated with light. The secondary reflecting mirror 10 is installed at an angle of approximately 45 degrees with respect to the printed circuit board 12, and the light reflected by the secondary reflecting mirror 10 is directed onto the entire surface of the printed circuit board 12 via a mask 11. The circuit pattern of the mask 11 is printed onto the resist coated on the printed circuit board 12. A cold mirror is used as the primary reflecting mirror 8 in order to absorb heat rays from the ultra-high pressure discharge lamp 6. The integrator 9 is constructed by combining small convex lenses made of quartz in order to improve the transmittance of ultraviolet rays.
発明が解決しようとする問題点
プリント基板等の被照射物の焼付けのための露
光時間は被照射物の紫外線強度の最小値のところ
で決まるので、出来るだけ高い値で均一に照射す
ることが必要である。しかるに上記したような従
来の方式では、インテグレーター部や最終段の反
射鏡を工夫して均斉度を改善しているが、インテ
グレーター部を出た紫外線は拡がりがあるので、
どうしても紫外線強度の分布は中心部が端部より
高くなる。均斉度をよりよくするため、光路長を
長くしたり、あるいは被照射物の大きさに対して
照射面積を大きくするなどの方法もあるが、いづ
れも紫外線強度が低下し、露光時間が長くなると
いう問題があつた。また平行度の改善対策とし
て、最終段の反射鏡を放物面鏡にするなどの方法
があるが、放物面鏡の仕上げが不完全であると、
部分的に平行度が悪くなり、プリント基板等の製
品の品質に影響するという問題が生じる。また良
質の放物面鏡にすると、価格が非常に高くなるな
どの問題が生じる。さらに平行度についても光路
長を長くすると改善できるが、均斉度の場合と同
様に紫外線強度が低下し、露光時間が長くなると
いう問題が生じる。Problems to be Solved by the Invention Since the exposure time for printing an object to be irradiated such as a printed circuit board is determined by the minimum value of the ultraviolet intensity of the object to be irradiated, it is necessary to uniformly irradiate the object with as high a value as possible. be. However, in the conventional method described above, the degree of uniformity is improved by devising the integrator section and the final stage reflector, but the ultraviolet rays leaving the integrator section are spread out.
Inevitably, the distribution of ultraviolet light intensity will be higher at the center than at the edges. In order to improve uniformity, there are methods such as increasing the optical path length or increasing the irradiation area relative to the size of the object to be irradiated, but either method reduces the UV intensity and increases the exposure time. There was a problem. In addition, there are methods to improve parallelism, such as using a parabolic mirror as the final stage reflecting mirror, but if the finishing of the parabolic mirror is incomplete,
A problem arises in that the parallelism deteriorates in some parts, affecting the quality of products such as printed circuit boards. Moreover, using a high-quality parabolic mirror causes problems such as an extremely high price. Furthermore, although parallelism can be improved by increasing the optical path length, similar to the case of symmetry, the problem arises that the ultraviolet intensity decreases and the exposure time becomes longer.
本発明は上記したような問題点を解消した露光
装置における紫外線の照射方法を提供するもので
ある。 The present invention provides a method for irradiating ultraviolet rays in an exposure apparatus that solves the above-mentioned problems.
問題点を解決するための手段
即ち、本発明は、光源として平行光源である紫
外線レーザーを使用し、且つ良質の平行度を得る
ために、紫外線レーザーからの紫外線を回転する
多面体反射鏡等でスキヤニングするのではなく、
対向した２枚の反射鏡を直角的位置関係でそれぞ
れ移動させることにより、固定したプリント基板
等の被照射物に紫外線レーザーからの紫外線を有
効に照射するようにして、紫外線レーザーからの
高平行度の紫外線を被照射物に均一に照射できる
ようにしたものである。Means for Solving the Problems That is, the present invention uses an ultraviolet laser, which is a collimated light source, as a light source, and scans the ultraviolet rays from the ultraviolet laser with a rotating polyhedral reflector or the like in order to obtain good parallelism. rather than
By moving two opposing reflecting mirrors in a perpendicular positional relationship, the ultraviolet rays from the ultraviolet laser can be effectively irradiated onto fixed objects such as printed circuit boards, and the ultraviolet rays can be highly parallelized. It is designed to uniformly irradiate the object with ultraviolet rays.
作 用
紫外線レーザーからの紫外線のスポツト径より
大きい面積の第一次反射鏡で紫外線レーザーから
の紫外線を受け、その紫外線を被照射面に水平に
90度向きを変えて反射させる。次にこの第一次反
射鏡で反射された紫外線を、第一次反射鏡と同一
面上で、被照射物に対して45度の角度に傾斜させ
て第一次反射鏡に対向して配置され、且つ幅が紫
外線のスポツト径よりも大きく、長さが被照射物
より長い長方形の第二次反射鏡で受け、垂直方向
に90度向きを変えて反射させることにより、、紫
外線レーザーからの紫外線を被照射物に照射す
る。さらに第一次反射鏡を紫外線レーザーからの
入射光軸と同一方向に連続的に前後移動させ、か
つ第二次反射鏡を第一次反射鏡からの反射光の光
軸方向に移動させることにより、即ち、第一次反
射鏡と第二次反射鏡とを直角的位置関係でそれぞ
れ移動させることにより、固定された被照射物の
全面に紫外線レーザーから発振された平行度の高
い紫外線を均一に照射することができる。Function The primary reflector, which has an area larger than the spot diameter of the ultraviolet rays from the ultraviolet laser, receives the ultraviolet rays from the ultraviolet laser and directs the ultraviolet rays horizontally onto the irradiated surface.
Turn it 90 degrees and reflect it. Next, the ultraviolet rays reflected by this primary reflecting mirror are placed on the same surface as the primary reflecting mirror and facing the primary reflecting mirror at an angle of 45 degrees to the irradiated object. The ultraviolet rays are reflected by a rectangular secondary reflector whose width is larger than the spot diameter of the ultraviolet rays and whose length is longer than the object to be irradiated. Irradiate the object with ultraviolet light. Furthermore, by continuously moving the primary reflecting mirror back and forth in the same direction as the incident optical axis from the ultraviolet laser, and moving the secondary reflecting mirror in the optical axis direction of the reflected light from the primary reflecting mirror. In other words, by moving the primary reflecting mirror and the secondary reflecting mirror in a perpendicular positional relationship, highly parallel ultraviolet rays emitted from an ultraviolet laser can be uniformly applied to the entire surface of a fixed object to be irradiated. It can be irradiated.
実施例
以下、本発明の一実施例を第１図に基いて説明
する。Embodiment An embodiment of the present invention will be described below with reference to FIG.
図において、１は紫外線レーザー、２は紫外線
レーザーからの入射光を90度向きを変えて水平に
反射させる第一次反射鏡、３は第一次反射鏡２か
らの反射光を垂直方向に90度向きを変えて反射さ
せる第二次反射鏡、４はプリント基板用の回路を
描いたマスク、５はレジストを塗布したプリント
基板である。第一次反射鏡２と第二次反射鏡３と
はマスク４の上方に配置されていて、第一次反射
鏡２は紫外線レーザー１からの入射光Ｃに対して
45度の傾斜を持たせて設置され、入射光Ｃと同一
方向であるＡ−A′方向に連続的に前後移動する。
第二次反射鏡３はマスク４に対して45度の傾斜を
持たせて設置され、第一次反射鏡２からの反射光
を垂直方向に90度向きを変えて反射させながら、
第一次反射鏡２からの反射光と同一方向であるＢ
−B′方向に移動する。第一次反射鏡２の大きさ
は紫外線レーザー１からの紫外線のスポツト径よ
り大きな形状とし、第二次反射鏡３の大きさは、
幅は紫外線のスポツト径より若干大きく、長さは
被照射物の幅より大きくした長方形とする。 In the figure, 1 is an ultraviolet laser, 2 is a primary reflector that changes the direction of the incident light from the ultraviolet laser by 90 degrees and reflects it horizontally, and 3 is a primary reflector that reflects the reflected light from the primary reflector 2 by 90 degrees in the vertical direction. A secondary reflecting mirror changes the direction of reflection, 4 is a mask on which a circuit for a printed circuit board is drawn, and 5 is a printed circuit board coated with resist. The primary reflecting mirror 2 and the secondary reflecting mirror 3 are arranged above the mask 4, and the primary reflecting mirror 2 is configured to reflect the incident light C from the ultraviolet laser 1.
It is installed with an inclination of 45 degrees and continuously moves back and forth in the direction A-A', which is the same direction as the incident light C.
The secondary reflecting mirror 3 is installed with an inclination of 45 degrees with respect to the mask 4, and reflects the reflected light from the primary reflecting mirror 2 by changing its direction by 90 degrees in the vertical direction.
B is in the same direction as the reflected light from the primary reflecting mirror 2.
Move in the −B′ direction. The size of the primary reflecting mirror 2 is larger than the spot diameter of the ultraviolet rays from the ultraviolet laser 1, and the size of the secondary reflecting mirror 3 is as follows.
The rectangle has a width slightly larger than the ultraviolet spot diameter and a length larger than the width of the object to be irradiated.
かかる本発明実施例において、紫外線レーザー
１から出た紫外線Ｃは第一次反射鏡２で水平方向
に90度向きを変えて反射されて第二次反射鏡３に
照射され、さらに第二次反射鏡３で垂直下方向に
90度向きを変えて反射されて、マスク４を介して
プリント基板５にスポツト状で照射される。第一
次反射鏡２をＡからA′方向に移動させることに
より、紫外線のスポツトはマスク４上をａから
a′方向に移動しながら帯状に照射していく。紫外
線のスポツトがa′方向の端部に達すると、第二次
反射鏡３を紫外線のスポツト径の大きさより若干
少ない幅でＢからB′方向に移動させ、かつ第一
次反射鏡２をA′からＡ方向に移動させることに
より、マスク４上のスポツトはa′からａ方向に移
動し、再び帯状に照射していく。この状態を繰り
返すことにより、スポツト部の帯はｂからb′方向
に移動し、マスク４を介してプリント基板５にマ
スク４に描かれた回路のパターンを焼付けること
ができる。 In this embodiment of the present invention, the ultraviolet C emitted from the ultraviolet laser 1 is reflected by the primary reflecting mirror 2 by changing its direction by 90 degrees in the horizontal direction, and is irradiated onto the secondary reflecting mirror 3, and then the ultraviolet rays C emitted from the ultraviolet laser 1 are Vertically downward with mirror 3
The light is turned 90 degrees and reflected, and is irradiated onto the printed circuit board 5 through the mask 4 in the form of a spot. By moving the primary reflecting mirror 2 from A to A' direction, the ultraviolet ray spot moves from a to a on the mask 4.
It irradiates in a strip while moving in the a′ direction. When the ultraviolet ray spot reaches the end in the a' direction, the secondary reflecting mirror 3 is moved from B to the B' direction by a width slightly smaller than the diameter of the ultraviolet ray spot, and the primary reflecting mirror 2 is moved from A to A. By moving the spot from 'a' in the direction A, the spot on the mask 4 moves from a' in the direction a, and irradiates again in a band-like manner. By repeating this state, the band of the spot portion moves from direction b to b', and the circuit pattern drawn on the mask 4 can be printed onto the printed circuit board 5 through the mask 4.
また第一次反射鏡２と第二次反射鏡３の鏡面仕
上げを紫外線の波長に合つた仕上げにすることに
より、効率的に反射させることができる。またマ
スク４とレジストを塗布したプリント基板５とは
密着でも、非密着でも、紫外線レーザーは良質の
平行光であるので、高解像力の焼付けができる。
また同一構成のものをプリント基板５に対して
上、下に配置することにより両面露光もできる。 Further, by giving the primary reflecting mirror 2 and the secondary reflecting mirror 3 a mirror finish that matches the wavelength of ultraviolet rays, it is possible to reflect the ultraviolet rays efficiently. Furthermore, regardless of whether the mask 4 and the printed circuit board 5 coated with the resist are in close contact with each other or not, since the ultraviolet laser is a high-quality parallel beam, high-resolution printing can be performed.
Further, by arranging the same configuration above and below the printed circuit board 5, double-sided exposure can be performed.
なお、本発明の照射方法は、プリント基板への
回路パターンの焼付けの他、スクリーン印刷板、
エツチングなどの微細な画像形成にも応用できる
ものである。 The irradiation method of the present invention can be applied to screen printing boards, in addition to printing circuit patterns on printed circuit boards.
It can also be applied to fine image formation such as etching.
発明の効果
以上述べたような本発明による紫外線レーザー
の照射方法を用いると、紫外線レーザーの特徴で
ある平行光線をそのまま利用でき、高度の平行光
が得られ、解像力が向上し、微細な回路のプリン
ト基板等の製造が容易になり、かつ被照射面に均
一な照射ができ、良質な画像が得られるととも
に、紫外線レーザーからの強力な紫外線により焼
付速度を早めることができ、露光時間の短縮がは
かれ、その実用的効果は大きい。Effects of the Invention By using the ultraviolet laser irradiation method according to the present invention as described above, it is possible to directly utilize the parallel beams that characterize ultraviolet lasers, obtain highly parallel beams, improve resolution, and improve the precision of fine circuits. It simplifies the production of printed circuit boards, etc., and allows for uniform irradiation of the irradiated surface, resulting in high-quality images.In addition, the powerful ultraviolet light from the ultraviolet laser can speed up the printing speed, shortening the exposure time. However, its practical effects are great.
第１図は本発明紫外線レーザー照射方法の一実
施例を示す立体図、第２図は従来の照射方法の一
例を示す断面図である。
１……紫外線レーザー、２……第一次反射鏡、
３……第二次反射鏡、４……マスク、５……プリ
ント基板。
FIG. 1 is a three-dimensional view showing an embodiment of the ultraviolet laser irradiation method of the present invention, and FIG. 2 is a sectional view showing an example of the conventional irradiation method. 1... Ultraviolet laser, 2... Primary reflecting mirror,
3... Secondary reflecting mirror, 4... Mask, 5... Printed circuit board.
Claims (1)
における紫外線レーザー照射方法において、対向
して配置した２枚の反射鏡を直角的関係で移動さ
せることにより、被照射物を移動させることな
く、均一に照射する紫外線レーザー照射方法。1. In an ultraviolet laser irradiation method in an exposure device that irradiates ultraviolet rays from an ultraviolet laser, two reflecting mirrors placed opposite each other are moved in a perpendicular relationship to uniformly irradiate the irradiated object without moving it. Ultraviolet laser irradiation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60154409A JPS6214494A (en) | 1985-07-12 | 1985-07-12 | Ultraviolet laser irradiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60154409A JPS6214494A (en) | 1985-07-12 | 1985-07-12 | Ultraviolet laser irradiation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6214494A JPS6214494A (en) | 1987-01-23 |
| JPH028473B2 true JPH028473B2 (en) | 1990-02-23 |
Family
ID=15583517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60154409A Granted JPS6214494A (en) | 1985-07-12 | 1985-07-12 | Ultraviolet laser irradiation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2501027Y2 (en) * | 1993-01-26 | 1996-06-12 | 輝実 太田 | Gate ball passage confirmation device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0255330A (en) * | 1988-08-22 | 1990-02-23 | Matsushita Electric Ind Co Ltd | Production of oriented film for liquid crystal |
-
1985
- 1985-07-12 JP JP60154409A patent/JPS6214494A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2501027Y2 (en) * | 1993-01-26 | 1996-06-12 | 輝実 太田 | Gate ball passage confirmation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6214494A (en) | 1987-01-23 |
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