JPH07100799A - Cutting for glass basic plate - Google Patents

Abstract

PURPOSE:To prevent the generation of the cut disorder in the manufacturing process for a glass base plate such as liquid crystal panel. CONSTITUTION:V-shaped grooves 12 and 10 each of which has an arcuate section are formed by a rotary cutter, on the cut lines 8 and 9 on the outside surfaces of the upper and lower side base plates 2 and 3 of a liquid crystal panel 1, and cracks 13 and 11 are generated, accompanied with the formation of the grooves 12 and 10. A cutting piece 15 which has the cutting edge shape corresponding to each shape of the grooves 10 and 12 and are heated by a heater is pressed to the grooves 12 and 10. Cracks 13 and 11 permeate to the inner side of the upper and lower base plates 2 and 3 by the thermal expansion force generated by the heat of the cutting piece 15, and cutting work is carried out. Accordingly, the correct and stable cut on the cut lines 8 and 9 is realized, and the cutting disorder of the liquid crystal panel 1 can be prevented. Further, the stage difference cut for the so-called terminal taking is enabled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a glass substrate, which is preferably used in the stage of manufacturing a liquid crystal panel.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view showing in simplified form a pre-processing step for a glass substrate 21 for cutting with a conventional technique as described later, and FIG. 5 is an enlarged view of part of FIG. FIG. A rotary blade 24 having a blade 23 formed at an acute angle close to a right angle is mounted on, for example, an elevating means of an NC milling machine and supported by the glass substrate 21 so as to be capable of moving toward and away from the glass substrate 21, and a mounting table 27 of the NC milling machine.
The position is determined so as to abut the cutting line of the glass substrate 21 fixed to the. Then, as shown in FIG. 5A, the rotary blade 24 moves the glass substrate 21 about 0.5 to 5.0 k.
Displace the elevating means so as to press at g / cm ² ,
By further moving at a relative speed of about 20 to 1000 mm / sec, as shown in FIG. 5 (2), a groove 25 having a V-shaped cross section is formed on the cutting line, and a shallow crack 26 is formed along with it. appear.

In the prior art, the glass substrate 21 in which the groove 25 and the crack 26 are formed in this manner is subjected to a force impact with a hammer on one piece sandwiching the groove 25, or a glass plate 21 of a hot plate. The glass substrate 21 is placed on the glass substrate 21 to heat the entire glass substrate 21 to give a thermal shock, or the glass substrate 21 is placed on a vibrating table to vibrate the entire glass substrate 21. It is cut by giving a shock of.

Further, second and third prior arts are disclosed in Japanese Utility Model Laid-Open No. 5-51592. These conventional techniques are mainly used for cutting ceramic substrates. In the second conventional technique, a substrate having a V-shaped groove formed in advance on a cutting line is provided between a pair of upper and lower rotary blades having wedge-shaped blades continuously formed at an outer peripheral edge thereof, and the blade is provided with the groove. The groove is inserted into the substrate so that even stress is applied to the vicinity of the groove, and the blade is continuously bitten into the substrate by the rotation of the rotary blade, whereby the substrate is cut.

The third prior art has substantially the same structure as the second prior art, but at least one of the rotary blade and the vicinity of the cut portion of the substrate is, for example, a micro torch. It is characterized by heating to a temperature near the transition point of the constituent material of the substrate. in this way,
By softening the cut portion of the substrate, the substrate is cut without applying stress.

[0006]

In the first prior art described above, in the method of cutting by the impact of force, when the generation of the crack is insufficient, the impact must be strongly applied. In particular, when the substrate to be cut is a liquid crystal panel that is composed of an upper substrate and a lower substrate, the impact on electrodes and seal resin provided between the upper substrate and the lower substrate is caused by the impact. Since stress is generated around the electrodes and the seal resin as a fulcrum, a cut defect such as peeling of the seal resin or deviation from the cutting line and cutting at an undesired position is likely to occur. In addition, the method of heating the substrate on a hot plate by a heat shock or the method of applying a vibration shock on a vibrating table may accelerate deterioration of durability and performance due to heat and vibration.

The second prior art is suitable for cutting the upper substrate and the lower substrate into the same size, but the step cutting for terminal removal, which is performed when the liquid crystal panel is cut, is not suitable. It is possible.

Further, in the third conventional technique, when the substrate is made of a material having a high transition point such as glass, it is not easy to heat the rotary blade or the cut portion to such a high temperature.

An object of the present invention is to provide a method of cutting a glass substrate used for a liquid crystal panel or the like so that the glass substrate can be cut accurately and stably on a desired cutting line.

[0010]

According to the present invention, a groove having a cross section perpendicular to the cutting line and having an acute angle is formed in advance on the surface of a glass substrate, and the groove corresponds to the shape of the groove. The method for cutting a glass substrate is characterized in that the ridged cut piece is brought into contact with the cut piece, and the cut piece is heated to utilize the thermal expansion force generated in the glass substrate.

Further, in the present invention, the glass substrate comprises an upper substrate and a lower substrate, and the grooves are formed on the respective surfaces of the upper substrate and the lower substrate so as to be offset from each other. It is characterized by

[0012]

According to the present invention, a groove formed in advance along the cutting line on the surface of the glass substrate and having a sharp cross section perpendicular to the cutting line has a shape of the groove heated by, for example, a heater. Corresponding ridge-shaped cut pieces are abutted. The thermal expansion force generated in the vicinity of the groove thus heated is transmitted to the inside from the vicinity of the groove, and the glass substrate is cut. This makes it possible to accurately and stably cut the glass substrate on a desired cutting line.

Preferably, the glass substrate is composed of an upper substrate and a lower substrate such as a liquid crystal panel, and the grooves are formed on the respective surfaces so as to be offset from each other. For example, the lower substrate including the driving electrodes of the liquid crystal panel is formed larger than the upper substrate including the common electrode. As a result, it is possible to perform step cutting capable of forming terminals required for driving the liquid crystal panel, so-called terminal cutting or the like.

[0014]

1 is a perspective view showing a simplified method of cutting a liquid crystal panel 1 according to an embodiment of the present invention, FIG. 2 is a plan view of the liquid crystal panel 1, and FIG. It is sectional drawing which shows the cutting process of. The liquid crystal panel 1 is generally made of glass, and is composed of an upper substrate 2 having a common electrode 4 and a lower substrate 3 having a driving electrode 5 in which a liquid crystal 6 is sealed with a sealing resin 7. It

As shown in FIGS. 4 and 5, N
A disc-shaped rotary blade 24 having an acute-angled blade 22 formed on the outer periphery is attached to the elevating means of the C milling machine so as to be rotatable, and the liquid crystal panel 1 is mounted on a mounting table 27 of the NC milling machine. The machining surface is fixed so as to face the rotary blade 24. Further, desired cutting lines 8 and 9 of the upper substrate 2 and the lower substrate 3 are shown by solid lines and broken lines in FIG. 3, respectively.

The liquid crystal panel 1 is fixed to the mounting table 27 of the NC milling machine so that the outer surface of the lower substrate 3 faces the rotary blade 24, and the rotation is performed on the cutting line 9 of the lower substrate 3. The rotary blade 24 is positioned by displacing the lifting member so that the blade 24 abuts. While pressing the rotary blade 24 on the cutting line 9 with a pressure of about 0.5 kgf / cm ² , the mounting table 27 is set to 20 to 1000 mm / se.
By moving at a speed of c, a groove 10 having a V-shaped cross section is formed on the cutting line 9. This groove 10
Simultaneously with the formation of, the shallow crack 11 derived from the groove 10 is formed. The groove 10 and the crack 11 as described above are formed on all the cutting lines 9 of the lower substrate 3.

When the formation of the groove 10 and the crack 11 in the lower substrate 3 is completed, the liquid crystal panel 1 is fixed on the mounting table 27 so that the upper substrate 2 faces the rotary blade 24. Grooves 12 and cracks 13 are formed on the cutting line 8 of the upper substrate 2 as described above.

Thus, the grooves 10 and 12 and the crack 1
The liquid crystal panel 1 on which 1 and 13 are formed is next shown in FIG.
As shown by, the lower substrate 3 is fixed to the mounting table 16 of the cutting device so as to face the cutting piece 15. Further, a cutting piece 15 having a shape of a cutting edge corresponding to the shape of the grooves 10 and 12 is attached to the elevating means of the cutting device, and is supported by the liquid crystal panel 1 so as to be movable toward and away from the liquid crystal panel 1. A heater built in the base end portion 14 of the cutting piece 15 is used for about 40
The cut piece 15 heated to 0 ° C. is placed in the groove 10 for about 5 k.
When pressed for 5 to 10 seconds while applying a pressure of gf / cm ^2, the crack 11 penetrates into the inner side of the lower substrate 3 and is cut by the thermal expansion force generated in the vicinity of the groove 10. .

When the cutting of the lower substrate 3 is completed, the liquid crystal panel 1 is fixed to the mounting table 16 so that the upper substrate 2 faces the cutting piece 15 and is cut along the cutting line 8 in the same manner. .

As described above, in the present embodiment, the cutting of the substrates 2 and 3, which are glass substrates, is performed by utilizing the local pressing force and the thermal expansion force of the glass substrate without applying an impact. So, along the desired cutting lines 8 and 9,
In addition, stable cutting is realized, and step cutting for terminal removal is also possible. Further, since the stress applied to the common electrode 4 and the drive electrode 5 and the seal resin 7 by the upper substrate 2 and the lower substrate 3 at the time of cutting can be extremely small, the occurrence of defective cutting such as peeling of the seal resin 7 is prevented. can do.

[0021]

As described above, according to the present invention, when cutting a glass substrate, a heated cutting piece is brought into contact with a groove formed in advance on the cutting line, and the thermal expansion force generated thereby is utilized. Therefore, accurate and stable cutting can be performed on the cutting line.

Further, preferably, the glass substrate comprises a lower substrate and an upper substrate, and both substrates are cut along cutting lines which are offset from each other, so that terminaling of electrodes in a liquid crystal panel, etc. It is possible to perform step cutting capable of cutting.

[Brief description of drawings]

FIG. 1 is a perspective view showing a simplified method of cutting a liquid crystal panel 1 according to an embodiment of the present invention.

FIG. 2 is a plan view of the liquid crystal panel 1.

FIG. 3 is a cross-sectional view showing in detail the structure of the liquid crystal panel 1 during the cutting process of the liquid crystal panel 1.

FIG. 4 is a perspective view showing a simplified pre-processing step for cutting the glass substrate 21.

5 is a cross-sectional view of FIG.

[Explanation of symbols]

 1 Liquid Crystal Panel 2 Upper Substrate 3 Lower Substrate 4 Common Electrode 5 Drive Electrode 6 Liquid Crystal 7 Seal Resin 8,9 Cutting Line 10,12 Groove 11,13 Crack 15 Cutting Piece 24 Rotating Blade

Claims (2)

[Claims] 1. A surface of a glass substrate is previously formed with a groove having a sharp cross section perpendicular to the cutting line along a cutting line, and a ridge-shaped cutting piece corresponding to the shape of the groove is formed in the groove. A method for cutting a glass substrate, which is brought into contact with the glass substrate, wherein the cutting piece is heated by utilizing a thermal expansion force generated in the glass substrate. 2. The glass substrate comprises an upper substrate and a lower substrate, and the grooves are formed on the respective surfaces of the upper substrate and the lower substrate so as to be offset from each other. The method for cutting a glass substrate according to claim 1.